PEMI8QFN/LK,132_技术文档

PEMIxQFN; PEMI2STD family

Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network

with ESD protection

Rev. 2 — 3 November 2011

Product data sheet

1. Product profile

1.1 General description

The devices are a family of RC low pass filters. They are designed to provide filtering of

undesired RF signals on the I/O ports of portable communication or computing devices.

The devices incorporate diodes to provide protection to downstream components from

ElectroStatic Discharge (ESD) voltages up to 25 kV.

The devices are fabricated using monolithic silicon technology in lead-free plastic

packages.

Table 1.

Product overview

Type number Package

Number of

channels

Package

pitch (mm)

Package configuration

PEMI1QFN

PEMI2QFN

PEMI2STD

PEMI4QFN

PEMI6QFN

PEMI8QFN

SOT883

1

2

1

4

6

8

-

3-pin MicroPak (QFN compatible)

6-pin MicroPak (QFN compatible)

5-pin microlead

SOT886

0.5

-

SOT665

SOT1157-1

SOT1158-1

SOT1159-1

0.4

8-pin extremely thin leadless

12-pin extremely thin leadless

16-pin extremely thin leadless

1.2 Features and benefits

 Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen

and antimony (Dark Green compliant)

 Integrated 1-, 2-, 4-, 6- and 8-channel -type RC filter network

 ESD protection up to 25 kV contact discharge according to IEC 61000-4-2,

far exceeding level 4

1.3 Applications

General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency

Interference (RFI) filtering and downstream ESD protection for:

 Cellular phone and Personal Communication Systems (PCS) mobile handsets

 Cordless telephones

 Wireless data (WAN/LAN) systems

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

1.4 Quick reference data

Table 2.

Quick reference data

Parameter

Symbol

Conditions

Typ

Unit

R_s(ch)

channel series resistance

PEMIxxxx/Cx

20



PEMIxxxx/Hx

45

PEMIxxxx/Lx

65

PEMIxxxx/Rx

100

200

PEMIxxxx/Wx

C_ch

channel capacitance

for the total channel;

f = 100 kHz; V_bias(DC)= 0 V

PEMIxxxx/xE

PEMIxxxx/xG

PEMIxxxx/xK

PEMIxxxx/xM

PEMIxxxx/xP

PEMIxxxx/xR

PEMIxxxx/xT

15

19

23

28

32

36

40

pF

2. Pinning information

Table 3.

Pinning

Description

Simplified outline

Graphic symbol

PEMI1QFN (SOT883)

1 and 2

3

filter channel

ground (GND)

R

s(ch)

1

2

1

2

3

C

ch

C

ch

2

Transparent

top view

3

018aaa042

PEMI2QFN (SOT886)

1 and 6

2 and 5

3 and 4

filter channel 1

R

6

1

5

2

4

3

s(ch)

ground (GND)

filter channel 2

1,3

4,6

C

ch

C

ch

2

2,5

018aaa044

Transparent

top view

PEMIXQFN_PEMI2STD_FAM

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Product data sheet

Rev. 2 — 3 November 2011

2 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Table 3.

PEMI2STD (SOT665)

Pinning …continued

Description

Simplified outline

Graphic symbol

1 and 5

2

filter channel 1

R

s(ch)

5

1

4

3

ground (GND)

filter channel 2

1,3

4,5

C

ch

C

ch

2

3 and 4

2

018aaa043

PEMI4QFN (SOT1157-1)

1 and 8

2 and 7

3 and 6

4 and 5

filter channel 1

filter channel 2

filter channel 3

filter channel 4

ground (GND)

R

8

5

s(ch)

1 to 4

5 to 8

C

ch

C

ch

2

1

4

Transparent

top view

ground

pad

GND

018aaa071

PEMI6QFN (SOT1158-1)

1 and 12

2 and 11

3 and 10

4 and 9

5 and 8

6 and 7

filter channel 1

filter channel 2

filter channel 3

filter channel 4

filter channel 5

filter channel 6

ground (GND)

R

s(ch)

12

7

6

1 to 6

7 to 12

C

ch

C

2

ch

2

1

Transparent

top view

GND

018aaa072

ground

pad

PEMI8QFN (SOT1159-1)

1 and 16

2 and 15

3 and 14

4 and 13

5 and 12

6 and 11

7 and 10

8 and 9

filter channel 1

filter channel 2

filter channel 3

filter channel 4

filter channel 5

filter channel 6

filter channel 7

filter channel 8

ground (GND)

R

s(ch)

16

1

9

8

1 to 8

9 to 16

C

ch

2

C

ch

2

Transparent top view

GND

018aaa073

ground

pad

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Product data sheet

Rev. 2 — 3 November 2011

3 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

3. Ordering information

Table 4.

Ordering information

Type number Package

Name

Description

leadless ultra small plastic package; 3 solder lands; body 1.0  0.6  0.5 mm

Version

PEMI1QFN

PEMI2QFN

SC-101

XSON6

SOT883

SOT886

plastic extremely thin small outline package; no leads; 6 terminals;

body 1  1.45  0.5 mm

PEMI2STD

PEMI4QFN

-

plastic surface-mounted package; 5 leads

SOT665

HXSON8 plastic thermal enhanced extremely thin small outline package; no leads;

SOT1157-1

8 terminals; body 1.2  1.7  0.5 mm

PEMI6QFN

PEMI8QFN

HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;

SOT1158-1

SOT1159-1

12 terminals; body 1.2  2.5  0.5 mm

HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;

16 terminals; body 1.2  3.3  0.5 mm

4. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min

Max

Unit

V_CC

supply voltage

0.5

+5.6

V

V_ESD

electrostatic discharge

voltage

IEC 61000-4-2, level 4

all pins to ground

contact discharge

air discharge

-

15

20

25

60

kV

mW

PEMIxxxx/xM;

PEMIxxxx/xP

contact discharge

air discharge

PEMIxxxx/xR;

PEMIxxxx/xT

contact discharge

air discharge

P_ch

P_tot

channel power dissipation continuous power;

T_amb= 85 C

total power dissipation

continuous power;

-

120

mW

T_amb= 85 C

T_stg

storage temperature

ambient temperature

55

40

+150

+85

C

T_amb

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Product data sheet

Rev. 2 — 3 November 2011

4 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

5. Characteristics

Table 6.

Channel characteristics

T_amb= 25 C; unless otherwise specified.

Symbol Parameter

Conditions

Min

Typ

Max Unit

R_s(ch)

channel series resistance

PEMIxxxx/Cx

18

40

20

22



PEMIxxxx/Hx

45

50

PEMIxxxx/Lx

58

65

72

PEMIxxxx/Rx

90

180

100

200

110

220

PEMIxxxx/Wx

C_ch

channel capacitance

for the total channel;

f = 100 kHz

PEMIxxxx/xE

PEMIxxxx/xG

PEMIxxxx/xK

PEMIxxxx/xM

PEMIxxxx/xP

PEMIxxxx/xR

PEMIxxxx/xT

V_bias(DC)= 0 V

V_bias(DC)= 2.5 V

V_bias(DC)= 0 V

-

15

8.5

19

11

23

13.5

28

16

32

18.5

36

21

40

23

-

pF

V

-

V_bias(DC)= 2.5 V

V_bias(DC)= 0 V

-

V_bias(DC)= 2.5 V

V_bias(DC)= 0 V

-

V_bias(DC)= 2.5 V

V_bias(DC)= 0 V

-

V_bias(DC)= 2.5 V

V_bias(DC)= 0 V

-

V_bias(DC)= 2.5 V

V_bias(DC)= 0 V

-

V_bias(DC)= 2.5 V

positive clamp; I_I= 1 mA

negative clamp; I_F= 1 mA

per channel; V_I= 3.5 V

-

V_BR

V_F

breakdown voltage

forward voltage

5.8

1.5

-

9

-

0.4

0.1

V

I_LR

reverse leakage current

-

A

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Product data sheet

Rev. 2 — 3 November 2011

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Table 7.

Frequency characteristics

T_amb= 25 C; unless otherwise specified; R_source= 50 ; R_L= 50 .

Symbol

Parameter

Conditions

C_ch= 15 pF

R_s(ch)= 20 

Min

Typ

Max Unit

_il

insertion loss

PEMIxxxx/CE

800 MHz < f < 3 GHz

7

-

dB

f = 5 GHz

R_s(ch)= 45 

30

PEMIxxxx/HE

PEMIxxxx/LE

PEMIxxxx/RE

PEMIxxxx/WE

800 MHz < f < 3 GHz

f = 4 GHz

9

-

dB

31

R_s(ch)= 65 

800 MHz < f < 3 GHz

f = 3.5 GHz

11

-

dB

32

R_s(ch)= 100 

800 MHz < f < 3 GHz

f = 3 GHz

13

-

dB

33

R_s(ch)= 200 

800 MHz < f < 3 GHz

f = 2.2 GHz

18

-

dB

34

_il

insertion loss

PEMIxxxx/CG

C_ch= 19 pF

R_s(ch)= 20 

800 MHz < f < 3 GHz

f = 4 GHz

9

-

dB

32

PEMIxxxx/HG

PEMIxxxx/LG

PEMIxxxx/RG

PEMIxxxx/WG

R_s(ch)= 45 

800 MHz < f < 3 GHz

f = 3.2 GHz

11

-

dB

33

R_s(ch)= 65 

800 MHz < f < 3 GHz

f = 2.8 GHz

13

-

dB

33.5

R_s(ch)= 100 

800 MHz < f < 3 GHz

f = 2.5 GHz

15

-

dB

34

R_s(ch)= 200 

800 MHz < f < 3 GHz

f = 1.9 GHz

21

-

dB

35.5

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Product data sheet

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Table 7.

Frequency characteristics …continued

T_amb= 25 C; unless otherwise specified; R_source= 50 ; R_L= 50 .

Symbol

Parameter

Conditions

C_ch= 23 pF

R_s(ch)= 20 

Min

Typ

Max Unit

_il

insertion loss

PEMIxxxx/CK

800 MHz < f < 3 GHz

10

-

dB

f = 3.6 GHz

R_s(ch)= 45 

33

PEMIxxxx/HK

PEMIxxxx/LK

PEMIxxxx/RK

PEMIxxxx/WK

800 MHz < f < 3 GHz

f = 2.8 GHz

13

-

dB

34

R_s(ch)= 65 

800 MHz < f < 3 GHz

f = 2.5 GHz

15

-

dB

35

R_s(ch)= 100 

800 MHz < f < 3 GHz

f = 2.1 GHz

18

-

dB

36

R_s(ch)= 200 

800 MHz < f < 3 GHz

f = 1.6 GHz

24

-

dB

37

_il

insertion loss

PEMIxxxx/CM

C_ch= 28 pF

R_s(ch)= 20 

800 MHz < f < 3 GHz

f = 3.2 GHz

12

-

dB

34

PEMIxxxx/HM

PEMIxxxx/LM

PEMIxxxx/RM

PEMIxxxx/WM

R_s(ch)= 45 

800 MHz < f < 3 GHz

f = 2.5 GHz

15

-

dB

35

R_s(ch)= 65 

800 MHz < f < 3 GHz

f = 2.1 GHz

17

-

dB

36

R_s(ch)= 100 

800 MHz < f < 3 GHz

f = 1.8 GHz

21

-

dB

37

R_s(ch)= 200 

800 MHz < f < 3 GHz

f = 1.4 GHz

27

-

dB

38

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Product data sheet

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Table 7.

Frequency characteristics …continued

T_amb= 25 C; unless otherwise specified; R_source= 50 ; R_L= 50 .

Symbol

Parameter

Conditions

C_ch= 32 pF

R_s(ch)= 20 

Min

Typ

Max Unit

_il

insertion loss

PEMIxxxx/CP

800 MHz < f < 3 GHz

13

-

dB

f = 2.9 GHz

R_s(ch)= 45 

36

PEMIxxxx/HP

PEMIxxxx/LP

PEMIxxxx/RP

PEMIxxxx/WP

800 MHz < f < 3 GHz

f = 2.2 GHz

17

-

dB

36

R_s(ch)= 65 

800 MHz < f < 3 GHz

f = 1.9 GHz

19

-

dB

37

R_s(ch)= 100 

800 MHz < f < 3 GHz

f = 1.6 GHz

23

-

dB

38

R_s(ch)= 200 

800 MHz < f < 3 GHz

f = 1.2 GHz

30

-

dB

39

_il

insertion loss

PEMIxxxx/CR

C_ch= 36 pF

R_s(ch)= 20 

800 MHz < f < 3 GHz

f = 2.6 GHz

14

-

dB

36

PEMIxxxx/HR

PEMIxxxx/LR

PEMIxxxx/RR

PEMIxxxx/WR

R_s(ch)= 45 

800 MHz < f < 3 GHz

f = 2.0 GHz

18

-

dB

37

R_s(ch)= 65 

800 MHz < f < 3 GHz

f = 1.8 GHz

21

-

dB

38

R_s(ch)= 100 

800 MHz < f < 3 GHz

f = 1.6 GHz

25

-

dB

39

R_s(ch)= 200 

800 MHz < f < 3 GHz

f = 1.2 GHz

32

-

dB

40

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Product data sheet

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Table 7.

Frequency characteristics …continued

T_amb= 25 C; unless otherwise specified; R_source= 50 ; R_L= 50 .

Symbol

Parameter

Conditions

C_ch= 40 pF

R_s(ch)= 20 

Min

Typ

Max Unit

_il

insertion loss

PEMIxxxx/CT

800 MHz < f < 3 GHz

16

-

dB

f = 2.5 GHz

36

PEMIxxxx/HT

PEMIxxxx/LT

PEMIxxxx/RT

PEMIxxxx/WT

R_s(ch)= 45 

800 MHz < f < 3 GHz

f = 1.9 GHz

20

-

dB

38

R_s(ch)= 65 

800 MHz < f < 3 GHz

f = 1.6 GHz

23

-

dB

39

R_s(ch)= 100 

800 MHz < f < 3 GHz

f = 1.4 GHz

27

-

dB

40

R_s(ch)= 200 

800 MHz < f < 3 GHz

f = 1.0 GHz

32

-

dB

41

6. Application information

6.1 Use cases

The selection of one of the filter devices has to be performed in dependence of the

maximum clock frequency, the driver strength, the capacitive load of the sink and the

maximum applicable rise and fall times.

6.2 LCD interfaces, medium-speed interfaces

For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock

speeds between 10 MHz and 25 MHz or more, the devices can be used in dependence of

the sink load, the clock speed, the driver strength and the rise and fall time requirements.

The minimum EMI filter requirements may be an important factor, too.

6.3 Keypad, low-speed interfaces

Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and

low-speed control signals, the devices offer a very robust ESD protection and strong

suppression of unwanted frequencies (EMI filtering). Due to their small size the devices

can easily be spread on a Printed-Circuit Board (PCB) in order to move the ESD and EMI

protection close to the part of the design which shall be protected.

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Product data sheet

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

6.4 Insertion loss

The devices are designed as EMI/RFI filters for multichannel interfaces.

All measurements were performed in a typical 50  NetWork Analyzer (NWA) setup as

shown in Figure 1. The insertion loss was measured with a test Printed-Circuit

Board (PCB) utilizing laser-drilled micro-via holes which connect the PCB ground plane to

the devices ground pins.

DUT

IN

OUT

50 Ω

V

gen

018aaa074

Fig 1. Frequency response setup

018aaa161

018aaa162

0

S

(dB)

S

21

(dB)

(1)

(2)

(3)

(1)

(2)

(3)

21

–10

–20

–30

–40

–50

–10

–20

–30

–40

–50

(4)

(5)

(6)

(4)

(5)

(6)

(7)

2

3

4

2

3

4

1

10

1

10

f (MHz)

R_s(ch)= 20 

R_s(ch)= 45 

(1) PEMIxxxx/CE

(2) PEMIxxxx/CG

(3) PEMIxxxx/CK

(4) PEMIxxxx/CM

(5) PEMIxxxx/CP

(6) PEMIxxxx/CR

(7) PEMIxxxx/CT

(1) PEMIxxxx/HE

(2) PEMIxxxx/HG

(3) PEMIxxxx/HK

(4) PEMIxxxx/HM

(5) PEMIxxxx/HP

(6) PEMIxxxx/HR

(7) PEMIxxxx/HT

Fig 2. PEMIxxxx/Cx: Frequency response curves

Fig 3. PEMIxxxx/Hx: Frequency response curves

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Product data sheet

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

018aaa163

(1)

018aaa164

0

S

(dB)

S

21

(dB)

21

(1)

(2)

(3)

(2)

(3)

–10

–20

–30

–40

–50

(4)

(5)

(6)

(4)

(5)

(6)

–20

–30

–40

–50

(7)

2

3

4

2

3

4

1

10

1

10

f (MHz)

R_s(ch)= 65 

(1) PEMIxxxx/LE

(2) PEMIxxxx/LG

(3) PEMIxxxx/LK

(4) PEMIxxxx/LM

(5) PEMIxxxx/LP

(6) PEMIxxxx/LR

(7) PEMIxxxx/LT

R_s(ch)= 100 

(1) PEMIxxxx/RE

(2) PEMIxxxx/RG

(3) PEMIxxxx/RK

(4) PEMIxxxx/RM

(5) PEMIxxxx/RP

(6) PEMIxxxx/RR

(7) PEMIxxxx/RT

Fig 4. PEMIxxxx/Lx: Frequency response curves

Fig 5. PEMIxxxx/Rx: Frequency response curves

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Product data sheet

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

018aaa165

0

S

21

(dB)

–10

–20

–30

–40

–50

(1)

(2)

(3)

(4)

(5)

(6)

(7)

2

3

4

1

10

f (MHz)

R_s(ch)= 200 

(1) PEMIxxxx/WE

(2) PEMIxxxx/WG

(3) PEMIxxxx/WK

(4) PEMIxxxx/WM

(5) PEMIxxxx/WP

(6) PEMIxxxx/WR

(7) PEMIxxxx/WT

Fig 6. PEMIxxxx/Wx: Frequency response curves

All important values of the RF behavior such as relative 3dB frequency, insertion loss at

800 MHz and above and also the DC attenuation in an NWA environment can be derived

from the insertion loss response curves depicted in Figure 2 to 6.

Note: insertion loss at low frequencies (1 MHz) is nearly independent from the channel

capacitance values available within the PEMI family.

6.4.1 Relative 3dB frequency (-filter structure)

Table 8.

Relative 3dB frequency (MHz) per RC combination; typical values

T_amb= 25 C; unless otherwise specified.

PEMIxxxx/

xE

15

xG

19

xK

23

xM

28

xP

32

xR

36

xT

40

C_ch(pF)

PEMIxxxx/ R_s(ch)

Cx

Hx

Lx

20

397 MHz 317 MHz 264 MHz 218 MHz 194 MHz 170 MHz 153 MHz

376 MHz 300 MHz 249 MHz 206 MHz 185 MHz 161 MHz 145 MHz

361 MHz 288 MHz 239 MHz 197 MHz 176 MHz 155 MHz 139 MHz

343 MHz 272 MHz 227 MHz 187 MHz 166 MHz 145 MHz 131 MHz

311 MHz 247 MHz 205 MHz 169 MHz 150 MHz 132 MHz 119 MHz

45

65

Rx

Wx

100

200

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Product data sheet

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PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

6.4.2 Insertion loss (dB) at 800 MHz (-filter structure)

Table 9.

Insertion loss (dB) at 800 MHz per RC combination; typical values

T_amb= 25 C; unless otherwise specified.

PEMIxxxx/

xE

15

xG

19

xK

23

xM

28

xP

32

xR

36

xT

40

C_ch(pF)

PEMIxxxx/ R_s(ch)

Cx

Hx

Lx

20

9 dB

11 dB

14 dB

17 dB

20 dB

26 dB

13 dB

17 dB

19 dB

23 dB

29 dB

15 dB

19 dB

22 dB

26 dB

34 dB

16 dB

21 dB

25 dB

29 dB

36 dB

18 dB

23 dB

27 dB

32 dB

39 dB

19 dB

25 dB

29 dB

35 dB

41 dB

45

12 dB

14 dB

17 dB

22 dB

65

Rx

Wx

100

200

6.4.3 Insertion loss (dB) at frequencies lower than 1 MHz (-filter structure)

Table 10. Insertion loss (dB) at  1 MHz per RC combination; typical values

T_amb= 25 C; unless otherwise specified.

PEMIxxxx/

xE

15

xG

19

xK

23

xM

28

xP

32

xR

36

xT

40

C_ch(pF)

PEMIxxxx/ R_s(ch)

Cx

Hx

Lx

20

1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB

3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB

4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB

6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB

9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB

45

65

Rx

Wx

100

200

7. Marking

Table 11. Marking codes

Type number

Marking Type number

code

Marking

code

Type number

Marking

code

Type number

Marking

code

PEMI1QFN/CE

CE

PEMI2QFN/LP

PEMI2QFN/LR

PEMI2QFN/LT

PEMI2QFN/RE

LP

LR

LT

PEMI4QFN/CE

CE

PEMI6QFN/LP

PEMI6QFN/LR

PEMI6QFN/LT

PEMI6QFN/RE

LP

LR

LT

PEMI1QFN/CG CG

PEMI1QFN/CK CK

PEMI1QFN/CM CM

PEMI4QFN/CG CG

PEMI4QFN/CK CK

PEMI4QFN/CM CM

RE

PEMI1QFN/CP

PEMI1QFN/CR

PEMI1QFN/CT

PEMI1QFN/HE

CP

CR

CT

HE

PEMI2QFN/RG RG

PEMI2QFN/RK RK

PEMI2QFN/RM RM

PEMI4QFN/CP

PEMI4QFN/CR

PEMI4QFN/CT

PEMI4QFN/HE

CP

CR

CT

HE

PEMI6QFN/RG RG

PEMI6QFN/RK RK

PEMI6QFN/RM RM

PEMI2QFN/RP

PEMI2QFN/RR

PEMI2QFN/RT

RP

RR

RT

PEMI6QFN/RP

PEMI6QFN/RR

PEMI6QFN/RT

RP

RR

RT

PEMI1QFN/HG HG

PEMI1QFN/HK HK

PEMI1QFN/HM HM

PEMI4QFN/HG HG

PEMI4QFN/HK HK

PEMI4QFN/HM HM

PEMI2QFN/WE WE

PEMI2QFN/WG WG

PEMI2QFN/WK WK

PEMI2QFN/WM WM

PEMI6QFN/WE WE

PEMI6QFN/WG WG

PEMI6QFN/WK WK

PEMI6QFN/WM WM

PEMI1QFN/HP

PEMI1QFN/HR

PEMI1QFN/HT

HP

HR

HT

PEMI4QFN/HP

PEMI4QFN/HR

PEMI4QFN/HT

HP

HR

HT

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

13 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Table 11. Marking codes …continued

Type number

Marking Type number

code

Marking

code

Type number

Marking

code

Type number

Marking

code

PEMI1QFN/LE

PEMI1QFN/LG

PEMI1QFN/LK

PEMI1QFN/LM

PEMI1QFN/LP

PEMI1QFN/LR

PEMI1QFN/LT

PEMI1QFN/RE

LE

LG

LK

LM

LP

LR

LT

PEMI2QFN/WP WP

PEMI2QFN/WR WR

PEMI2QFN/WT WT

PEMI4QFN/LE

PEMI4QFN/LG

PEMI4QFN/LK

PEMI4QFN/LM

PEMI4QFN/LP

PEMI4QFN/LR

PEMI4QFN/LT

PEMI4QFN/RE

LE

LG

LK

LM

LP

LR

LT

PEMI6QFN/WP WP

PEMI6QFN/WR WR

PEMI6QFN/WT WT

PEMI2STD/CE

PEMI2STD/CG

PEMI2STD/CK

PEMI2STD/CM

PEMI2STD/CP

PEMI2STD/CR

PEMI2STD/CT

PEMI2STD/HE

PEMI2STD/HG

PEMI2STD/HK

PEMI2STD/HM

PEMI2STD/HP

PEMI2STD/HR

PEMI2STD/HT

PEMI2STD/LE

PEMI2STD/LG

PEMI2STD/LK

PEMI2STD/LM

PEMI2STD/LP

PEMI2STD/LR

PEMI2STD/LT

PEMI2STD/RE

PEMI2STD/RG

PEMI2STD/RK

PEMI2STD/RM

PEMI2STD/RP

PEMI2STD/RR

PEMI2STD/RT

CE

CG

CK

CM

CP

CR

CT

HE

HG

HK

HM

HP

HR

HT

LE

PEMI8QFN/CE

PEMI8QFN/CG CG

PEMI8QFN/CK CK

PEMI8QFN/CM CM

CE

RE

PEMI8QFN/CP

PEMI8QFN/CR

PEMI8QFN/CT

PEMI8QFN/HE

CP

CR

CT

HE

PEMI1QFN/RG RG

PEMI1QFN/RK RK

PEMI1QFN/RM RM

PEMI4QFN/RG RG

PEMI4QFN/RK RK

PEMI4QFN/RM RM

PEMI1QFN/RP

PEMI1QFN/RR

PEMI1QFN/RT

RP

RR

RT

PEMI4QFN/RP

PEMI4QFN/RR

PEMI4QFN/RT

RP

RR

RT

PEMI8QFN/HG HG

PEMI8QFN/HK HK

PEMI8QFN/HM HM

PEMI1QFN/WE WE

PEMI1QFN/WG WG

PEMI1QFN/WK WK

PEMI1QFN/WM WM

PEMI1QFN/WP WP

PEMI1QFN/WR WR

PEMI1QFN/WT WT

PEMI4QFN/WE WE

PEMI4QFN/WG WG

PEMI4QFN/WK WK

PEMI4QFN/WM WM

PEMI4QFN/WP WP

PEMI4QFN/WR WR

PEMI4QFN/WT WT

PEMI8QFN/HP

PEMI8QFN/HR

PEMI8QFN/HT

PEMI8QFN/LE

PEMI8QFN/LG

PEMI8QFN/LK

PEMI8QFN/LM

PEMI8QFN/LP

PEMI8QFN/LR

PEMI8QFN/LT

PEMI8QFN/RE

HP

HR

HT

LE

LG

LK

LM

LP

LR

LT

LG

LK

LM

LP

PEMI2QFN/CE

PEMI2QFN/CG CG

PEMI2QFN/CK CK

PEMI2QFN/CM CM

CE

PEMI6QFN/CE

PEMI6QFN/CG CG

PEMI6QFN/CK CK

PEMI6QFN/CM CM

CE

LR

LT

RE

RG

RK

RM

RP

RR

RT

RE

PEMI2QFN/CP

PEMI2QFN/CR

PEMI2QFN/CT

PEMI2QFN/HE

CP

CR

CT

HE

PEMI6QFN/CP

PEMI6QFN/CR

PEMI6QFN/CT

PEMI6QFN/HE

CP

CR

CT

HE

PEMI8QFN/RG RG

PEMI8QFN/RK RK

PEMI8QFN/RM RM

PEMI8QFN/RP

PEMI8QFN/RR

PEMI8QFN/RT

RP

RR

RT

PEMI2QFN/HG HG

PEMI2QFN/HK HK

PEMI2QFN/HM HM

PEMI6QFN/HG HG

PEMI6QFN/HK HK

PEMI6QFN/HM HM

PEMI2STD/WE WE

PEMI2STD/WG WG

PEMI2STD/WK WK

PEMI2STD/WM WM

PEMI2STD/WP WP

PEMI2STD/WR WR

PEMI8QFN/WE WE

PEMI8QFN/WG WG

PEMI8QFN/WK WK

PEMI8QFN/WM WM

PEMI8QFN/WP WP

PEMI8QFN/WR WR

PEMI8QFN/WT WT

PEMI2QFN/HP

PEMI2QFN/HR

PEMI2QFN/HT

PEMI2QFN/LE

PEMI2QFN/LG

PEMI2QFN/LK

PEMI2QFN/LM

HP

HR

HT

LE

LG

LK

LM

PEMI6QFN/HP

PEMI6QFN/HR

PEMI6QFN/HT

PEMI6QFN/LE

PEMI6QFN/LG

PEMI6QFN/LK

PEMI6QFN/LM

HP

HR

HT

LE

LG

LK

LM

PEMI2STD/WT

-

WT

-

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

14 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

8. Package outline

Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm

SOT883

L

1

2

b

3

b

e

1

e

1

A

1

E

D

0

0.5

1 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

1

UNIT

A

b

D

E

e

L

1

max.

0.50

0.46

0.20 0.55 0.62 1.02

0.12 0.47 0.55 0.95

0.30 0.30

0.22 0.22

mm

0.03

0.35 0.65

Note

1. Including plating thickness

REFERENCES

JEDEC

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEITA

03-02-05

03-04-03

SOT883

SC-101

Fig 7. Package outline PEMI1QFN (SOT883/SC-101)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

15 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

SOT886

b

1

2

3

4×

(2)

L

1

e

6

5

4

e

1

e

1

6×

A

(2)

A

1

D

E

terminal 1

index area

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

A

1

UNIT

b

D

E

e

L

1

max max

0.25

0.17

1.5

1.4

1.05

0.95

0.35 0.40

0.27 0.32

mm

0.5 0.04

0.6

0.5

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

REFERENCES

JEDEC JEITA

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

04-07-15

04-07-22

SOT886

MO-252

Fig 8. Package outline PEMI2QFN (SOT886/XSON6)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

16 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Plastic surface-mounted package; 5 leads

SOT665

D

A

E

X

Y

S

H

E

5

4

A

c

1

2

3

e

b

w M

1

A

p

L

p

e

detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

b

c

D

E

e

H

L

w

y

A

p

1

E

0.6

0.5

0.27

0.17

0.18

0.08

1.7

1.5

1.3

1.1

1.7

1.5

0.3

0.1

mm

1.0

0.5

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

04-11-08

06-03-16

SOT665

Fig 9. Package outline PEMI2STD (SOT665)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

17 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;

8 terminals; body 1.2 x 1.7 x 0.5 mm

SOT1157-1

X

D

B

A

E

A

1

A

3

terminal 1

index area

detail X

e

1

C

terminal 1

index area

v

C A

C

B

e

b

y

1

y

w

C

1

4

L

k

E

2

8

5

D

2

0

1

2 mm

v

scale

Dimensions

(1)

Unit

A

b

D

2

E

e

1

k

L

w

y

1

3

2

max 0.5 0.05

mm nom

min

0.25 1.8 1.25 1.3 0.35

0.127 0.20 1.7 1.20 1.2 0.30 0.4 1.2 0.2 0.25 0.1 0.05 0.05 0.05

0.15 1.6 1.15 1.1 0.25 0.20

0.30

0.00

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

sot1157-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

- - -

JEITA

- - -

09-12-16

09-12-17

SOT1157-1

Fig 10. Package outline PEMI4QFN (SOT1157-1/HXSON8)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

18 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

HXSON12: plastic thermal enhanced extremely thin small outline package; no leads;

12 terminals; body 1.2 x 2.5 x 0.5 mm

SOT1158-1

X

D

B

A

E

A

1

A

3

terminal 1

index area

detail X

e

1

C

terminal 1

index area

v

C A

C

B

e

b

y

w

C

1

6

L

k

E

2

12

7

D

2

0

1

2 mm

v

scale

Dimensions

(1)

Unit

A

b

D

2

E

e

1

k

L

w

y

1

3

2

max 0.5 0.05

mm nom

min

0.25 2.6 2.1 1.3 0.35

0.127 0.20 2.5 2.0 1.2 0.30 0.4

0.15 2.4 1.9 1.1 0.25

0.30

2

0.2 0.25 0.1 0.05 0.05 0.05

0.20

0.00

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

sot1158-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

- - -

JEITA

- - -

09-12-16

09-12-17

SOT1158-1

Fig 11. Package outline PEMI6QFN (SOT1158-1/HXSON12)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

19 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

HXSON16: plastic thermal enhanced extremely thin small outline package; no leads;

16 terminals; body 1.2 x 3.3 x 0.5 mm

SOT1159-1

X

D

B

A

E

A

1

A

3

terminal 1

index area

detail X

e

1

C

terminal 1

index area

v

C A

C

B

e

b

y

w

C

1

8

L

k

E

2

16

9

D

2

0

1

2 mm

v

scale

Dimensions

(1)

Unit

A

b

D

2

E

e

1

k

L

w

y

1

3

2

max 0.5 0.05

mm nom

min

0.25 3.4 2.9 1.3 0.35

0.30

0.127 0.20 3.3 2.8 1.2 0.30 0.4 2.8 0.2 0.25 0.1 0.05 0.05 0.05

0.15 3.2 2.7 1.1 0.25 0.20

0.00

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

sot1159-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

- - -

JEITA

- - -

09-12-16

09-12-17

SOT1159-1

Fig 12. Package outline PEMI8QFN (SOT1159-1/HXSON16)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

20 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

9. Soldering

1.3

0.7

R0.05 (12×)

solder lands

solder resist

0.9

0.6 0.7

solder paste

0.25

(2×)

occupied area

0.3

(2×)

0.4

(2×)

0.3

0.4

Dimensions in mm

sot883_fr

Reflow soldering is the only recommended soldering method.

Fig 13. Reflow soldering PEMI1QFN (SOT883/SC-101)

1.250

0.675

0.370

(6×)

0.500

1.700

0.500

solder resist

solder paste = solderland

occupied area

0.270

(6×)

Dimensions in mm

0.325

0.425

(6×)

sot886_fr

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering PEMI2QFN (SOT886/XSON6)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

21 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

2.45

2.1

1.6

solder lands

0.4

0.7

(5×)

(2×)

placement area

1

0.25 0.3 0.55

2

solder paste

0.45 0.4

(2×) (2×)

0.538

occupied area

0.325 0.375

(2×) (2×)

Dimensions in mm

1.7

0.6

0.45

(4×)

0.65

0.5

(4×)

sot665_fr

Reflow soldering is the only recommended soldering method.

Fig 15. Reflow soldering PEMI2STD (SOT665)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

22 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Footprint information for reflow soldering of HXSON8 package

SOT1157-1

Hx

Gx

P

D

0.025

Hy Ay Gy By

SPy

SLy

nSPx

SPx

SLx

Generic footprint pattern

Refer to the package outline drawing for actual layout

solder land

solder paste deposit

solder land plus solder paste

occupied area

solder resist

DIMENSIONS in mm

Ay By

P

D

Slx

Sly

SPx SPy

Gx

Gy

Hx

Hy

0.40 1.75 0.75 0.22 1.25 0.35

0.6 0.2 1.65 1.45 1.95 2.0

11-06-27

Issue date

sot1157-1_fr

11-07-06

Reflow soldering is the only recommended soldering method.

Fig 16. Reflow soldering PEMI4QFN (SOT1157-1/HXSON8)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

23 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Footprint information for reflow soldering of HXSON12 package

SOT1158-1

Hx

Gx

D

P

0.025

Hy Ay Gy By

SPy SPy tot SLy

nSPx

SPx

SLx

Generic footprint pattern

Refer to the package outline drawing for actual layout

solder land

solder paste deposit

solder land plus solder paste

occupied area

solder resist

DIMENSIONS in mm

Ay By

P

D

Slx

Sly

SPx SPy

Gx

Gy

Hx

Hy

0.40 1.75 0.75 0.22 2.1 0.35

0.9 0.2 2.45 1.45 2.75 2.0

11-06-27

Issue date

sot1158-1_fr

11-07-06

Reflow soldering is the only recommended soldering method.

Fig 17. Reflow soldering PEMI6QFN (SOT1158-1/HXSON12)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

24 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Footprint information for reflow soldering of HXSON16 package

SOT1159-1

Hx

Gx

D

P

0.025

Hy Ay Gy By

SPy SPy tot SLy

nSPx

SPx

SLx

Generic footprint pattern

Refer to the package outline drawing for actual layout

solder land

solder paste deposit

solder land plus solder paste

occupied area

solder resist

DIMENSIONS in mm

Ay By

P

D

Slx

Sly

SPx SPy

Gx

Gy

Hx

Hy

0.40 2.15 0.75 0.21 2.9 0.35

1.3 0.2 3.25 1.45 3.55 2.4

11-06-27

Issue date

sot1159-1_fr

11-07-06

Reflow soldering is the only recommended soldering method.

Fig 18. Reflow soldering PEMI8QFN (SOT1159-1/HXSON16)

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

25 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

10. Revision history

Table 12. Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PEMIXQFN_PEMI2STD_ 20111103

FAM v.2

Product data sheet

-

PEMIXQFN_PEMI2STD_

FAM v.1

Modifications:

• Table 3 “Pinning”: corrected pinning description for PEMI8QFN (SOT1159-1); updated

simplified outline of SOT886

• Section 11 “Legal information”: updated

PEMIXQFN_PEMI2STD_ 20110729

FAM v.1

Product data sheet

-

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

26 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

11. Legal information

11.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

11.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

11.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

27 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

PEMIXQFN_PEMI2STD_FAM

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 3 November 2011

28 of 29

PEMIxQFN; PEMI2STD family

NXP Semiconductors

1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection

13. Contents

1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 2

1.1

1.2

1.3

1.4

2

3

4

5

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 4

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

6

Application information. . . . . . . . . . . . . . . . . . . 9

Use cases. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

LCD interfaces, medium-speed interfaces . . . . 9

Keypad, low-speed interfaces. . . . . . . . . . . . . . 9

Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . 10

Relative -3dB frequency (p-filter structure). . . 12

Insertion loss (dB) at 800 MHz (p-filter

6.1

6.2

6.3

6.4

6.4.1

6.4.2

structure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Insertion loss (dB) at frequencies lower than

1 MHz (p-filter structure). . . . . . . . . . . . . . . . . 13

6.4.3

7

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 26

8

9

10

11

Legal information. . . . . . . . . . . . . . . . . . . . . . . 27

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28

11.1

11.2

11.3

11.4

12

13

Contact information. . . . . . . . . . . . . . . . . . . . . 28

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 3 November 2011

Document identifier: PEMIXQFN_PEMI2STD_FAM


型号：	PEMI8QFN/LK,132
厂家：	NXP
描述：	PEMIxQFN; PEMI2STD family - Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
文件：	总30页 (文件大小：1173K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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