PESD12VS1UJ,115 [NXP]
PESD5V0S1UJ; PESD12VS1UJ - Unidirectional ESD protection for transient voltage suppression SOD 2-Pin;
| 型号： | PESD12VS1UJ,115 |
| 厂家： | 
NXP |
| 描述： | PESD5V0S1UJ; PESD12VS1UJ - Unidirectional ESD protection for transient voltage suppression SOD 2-Pin |
| 文件： | 总14页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PESD5V0S1UJ; PESD12VS1UJ
Unidirectional ESD protection for transient voltage
suppression
Rev. 01 — 3 June 2009
Product data sheet
1. Product profile
1.1 General description
Unidirectional ElectroStatic Discharge (ESD) protection diodes in a very small
Surface-Mounted Device (SMD) plastic package designed to protect one signal line
from the damage caused by ESD and transient overvoltage.
Table 1.
Product overview
Type number
Package
NXP
Configuration
JEITA
PESD5V0S1UJ
PESD12VS1UJ
SOD323F
SC-90
single
1.2 Features
I Transient Voltage Suppression (TVS)
protection of one line
I ESD protection up to 30 kV
I Max. peak pulse power: PPP = 890 W
I Low clamping voltage: VCL = 19 V
I Low leakage current: IRM = 300 nA
I IEC 61000-4-2; level 4 (ESD)
I IEC 61000-4-5 (surge); IPP = 47 A
I AEC-Q101 qualified
1.3 Applications
I Computers and peripherals
I Audio and video equipment
I Cellular handsets and accessories
I Communication systems
I Portable electronics
I Medical and industrial equipment
1.4 Quick reference data
Table 2.
Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
VRWM reverse standoff voltage
Min
Typ
Max
Unit
PESD5V0S1UJ
PESD12VS1UJ
diode capacitance
PESD5V0S1UJ
PESD12VS1UJ
-
-
-
-
5
V
V
12
Cd
f = 1 MHz; VR = 0 V
-
-
480
160
530
180
pF
pF
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
2. Pinning information
Table 3.
Pinning
Pin
1
Description
cathode
Simplified outline
Graphic symbol
[1]
1
2
2
anode
2
1
006aaa152
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
PESD5V0S1UJ
PESD12VS1UJ
SC-90
plastic surface-mounted package; 2 leads
SOD323F
4. Marking
Table 5.
Marking codes
Type number
PESD5V0S1UJ
PESD12VS1UJ
Marking code
1Q
1R
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
[1][2]
PPP
peak pulse power
PESD5V0S1UJ
PESD12VS1UJ
peak pulse current
PESD5V0S1UJ
PESD12VS1UJ
tp = 8/20 µs
-
-
890
600
W
W
[1][2]
IPP
tp = 8/20 µs
-
-
47
A
A
22.5
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
2 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
amb ≤ 25 °C
Min
Max
420
Unit
mW
mW
°C
[3]
[4]
Ptot
total power dissipation
T
-
-
720
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
−55
−65
+150
+150
°C
°C
[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[2] Soldering point of cathode tab.
[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Table 7.
ESD maximum ratings
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Max Unit
[1]
VESD
electrostatic discharge voltage
IEC 61000-4-2
-
30
kV
(contact discharge)
machine model
-
-
400
16
V
MIL-STD-883 (human
body model)
kV
[1] Device stressed with ten non-repetitive ESD pulses.
Table 8.
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 15 kV (air); > 8 kV (contact)
> 4 kV
MIL-STD-883; class 3 (human body model)
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
3 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
001aaa631
I
PP
001aaa630
120
100 %
90 %
100 % I ; 8 µs
PP
I
PP
(%)
80
−t
e
50 % I ; 20 µs
PP
40
10 %
t
t = 0.7 ns to 1 ns
r
0
30 ns
60 ns
0
10
20
30
40
t (µs)
Fig 1. 8/20 µs pulse waveform according to
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
IEC 61000-4-5
6. Thermal characteristics
Table 9.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
[1]
[2]
[3]
thermal resistance from
junction to ambient
in free air
-
-
-
-
-
-
290
170
35
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3] Soldering point of cathode tab.
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
4 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
7. Characteristics
Table 10. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VRWM
reverse standoff voltage
PESD5V0S1UJ
PESD12VS1UJ
reverse leakage current
PESD5V0S1UJ
PESD12VS1UJ
breakdown voltage
PESD5V0S1UJ
PESD12VS1UJ
diode capacitance
-
-
-
-
5
V
V
12
IRM
VBR
Cd
VRWM = 5 V
VRWM = 12 V
IR = 5 mA
-
-
0.3
< 1
4
µA
100
nA
6.2
6.8
7.3
V
V
13.3
14.5
15.75
f = 1 MHz;
VR = 0 V
PESD5V0S1UJ
PESD12VS1UJ
clamping voltage
PESD5V0S1UJ
-
-
480
160
530
180
pF
pF
[1]
VCL
IPP = 47 A
IPP = 25 A
IPP = 5 A
-
-
-
-
-
-
-
-
-
-
-
-
19
V
V
V
V
V
V
13.5
9.8
27
PESD12VS1UJ
IPP = 22.5 A
IPP = 15 A
IPP = 5 A
23.5
19
rdif
differential resistance
PESD5V0S1UJ
IR = 5 mA
-
-
2
5
100
100
Ω
Ω
PESD12VS1UJ
[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
5 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
006aab414
001aaa193
4
10
1.2
P
PP
P
PP
(W)
P
PP(25°C)
3
2
1
10
0.8
(1)
(2)
10
10
0.4
0
1
2
3
4
10
10
10
10
0
50
100
150
200
t
(µs)
T (°C)
j
p
Tamb = 25 °C
(1) PESD5V0S1UJ
(2) PESD12VS1UJ
Fig 3. Peak pulse power as a function of exponential
pulse duration; typical values
Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical
values
006aab415
006aab416
3
500
10
C
(pF)
d
(1)
I
RM
(nA)
400
2
10
300
200
100
0
10
(2)
(1)
(2)
1
−1
10
0
4
8
12
−75
−25
25
75
125
T
175
(°C)
V
(V)
R
amb
f = 1 MHz; Tamb = 25 °C
(1) PESD5V0S1UJ
(2) PESD12VS1UJ
(1) PESD5V0S1UJ
(2) PESD12VS1UJ
Fig 5. Diode capacitance as a function of reverse
voltage; typical values
Fig 6. Reverse leakage current as a function of
ambient temperature; typical values
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
6 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
I
−V
−V
−V
V
CL
BR
RWM
−I
−I
RM
R
−
+
P-N
−I
PP
006aaa407
Fig 7. V-I characteristics for a unidirectional ESD protection diode
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
7 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
ESD TESTER
acc. to IEC 61000-4-2
= 150 pF; R = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
C
Z
Z
RG 223/U
50 Ω coax
R
Z
450 Ω
10×
ATTENUATOR
C
Z
50 Ω
DUT
(DEVICE
UNDER
TEST)
vertical scale = 10 V/div
vertical scale = 10 A/div
horizontal scale = 10 ns/div
horizontal scale = 15 ns/div
PESD12VS1UJ
PESD5V0S1UJ
GND
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 10 V/div
horizontal scale = 10 ns/div
vertical scale = 10 A/div
horizontal scale = 15 ns/div
GND
PESD12VS1UJ
PESD5V0S1UJ
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
006aab532
Fig 8. ESD clamping test setup and waveforms
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
8 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
8. Application information
PESD5V0S1UJ and PESD12VS1UJ are designed for the protection of one unidirectional
data or signal line from the damage caused by ESD and transient overvoltage.
The devices may be used on lines where the signal polarities are either positive or
negative with respect to ground.
The PESD5V0S1UJ provides a surge capability of 890 W and the PESD12VS1UJ
provides a surge capability of 600 W per line for an 8/20 µs waveform.
line to be protected
line to be protected
(positive signal polarity)
(negative signal polarity)
DUT
GND
DUT
GND
unidirectional protection of one line
006aab251
Fig 9. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD and Electrical Fast
Transient (EFT). The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
9 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
10. Package outline
1.35
1.15
0.80
0.65
0.5
0.3
1
2.7 1.8
2.3 1.6
2
0.40
0.25
0.25
0.10
Dimensions in mm
04-09-13
Fig 10. Package outline PESDxS1UJ (SOD323F/SC-90)
11. Packing information
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000
-115
10000
PESD5V0S1UJ SOD323F 4 mm pitch, 8 mm tape and reel
PESD12VS1UJ
-135
[1] For further information and the availability of packing methods, see Section 15.
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
10 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
12. Soldering
3.05
2.2
2.1
solder lands
solder resist
1.65 0.95
0.5 (2×) 0.6 (2×)
solder paste
occupied area
0.5
(2×)
0.6
(2×)
Dimensions in mm
sod323f_fr
Fig 11. Reflow soldering footprint PESDxS1UJ (SOD323F/SC-90)
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
11 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
13. Revision history
Table 12. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PESD5V0S1UJ_PESD12VS1UJ_1 20090603
Product data sheet
-
-
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
12 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PESD5V0S1UJ_PESD12VS1UJ_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 3 June 2009
13 of 14
PESD5V0S1UJ; PESD12VS1UJ
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
16. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 9
Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
Quality information . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information. . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
3
4
5
6
7
8
9
9.1
10
11
12
13
14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.1
14.2
14.3
14.4
15
16
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 June 2009
Document identifier: PESD5V0S1UJ_PESD12VS1UJ_1
相关型号：
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