PESD5V0L1BSF [NXP]

Ultra low profile bidirectional low capacitance; 超低调的双向低电容


型号：	PESD5V0L1BSF
厂家：	NXP
描述：	Ultra low profile bidirectional low capacitance 超低调的双向低电容瞬态抑制器二极管局域网
文件：	总13页 (文件大小：154K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PESD5V0L1BSF

Ultra low profile bidirectional low capacitance

ESD protection diode

Rev. 1 — 18 February 2011

Product data sheet

1. Product profile

1.1 General description

Low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a

SOD962 leadless ultra small Surface-Mounted Device (SMD) package designed to

protect one signal line from the damage caused by ESD and other transients.

1.2 Features and benefits

Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen

and antimony (Dark Green compliant)

Bidirectional ESD protection of one line

Low diode capacitance C_d= 12 pF

ESD protection up to ±30 kV according to IEC 61000-4-2

Ultra small SMD package

Symmetrical breakdown voltage

1.3 Applications

Cellular handsets and accessories

Portable electronics

Communication systems

Computers and peripherals

1.4 Quick reference data

Table 1.

Quick reference data

T_amb= 25 °C unless otherwise specified.

Symbol Parameter Conditions

Min

−5

Typ

Max

Unit

V_RWM

C_d

reverse standoff voltage

diode capacitance

[1]

f = 1 MHz; V_R= 0 V

15.4

[1] This parameter is guaranteed by design.

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

2. Pinning information

Table 2.

Pinning

Description

Simplified outline

Graphic symbol

cathode (diode 1)

cathode (diode 2)

sym045

Transparent

top view

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

PESD5V0L1BSF -

leadless ultra small package; 2 terminals;

SOD962

body 0.6 × 0.3 × 0.3 mm

4. Marking

Table 4.

Marking codes

Type number

PESD5V0L1BSF

Marking code

none

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

P_PP

Parameter

Conditions

t_p= 8/20 μs

Min

Max

Unit

[1][2]

peak pulse power

peak pulse current

junction temperature

ambient temperature

storage temperature

I_PP

T_j

150

+150

°C

T_amb

T_stg

−55

−65

[1] Non-repetitive current pulse 8/20 μs exponentially decaying waveform according to IEC 61000-4-5;

see Figure 1.

[2] Measured from pin 1 to pin 2.

PESD5V0L1BSF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 18 February 2011

2 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

Table 6.

ESD maximum ratings

Parameter

Symbol

Conditions

Min

Max

Unit

[1][2]

V_ESD

electrostatic

IEC 61000-4-2

discharge voltage

(contact discharge)

IEC 61000-4-2

(air discharge)

MIL-STD-883 (human

body model)

[1] Measured from pin 1 to pin 2.

[2] Device stressed with ten non-repetitive ESD pulses; see Figure 2.

Table 7.

ESD standards compliance

Standard

Conditions

IEC 61000-4-2, level 4 (ESD)

> 15 kV (air); > 8 kV (contact)

> 4 kV

MIL-STD-883; class 3 (human body model)

001aaa191

mle218

120

100 %

90 %

100 % I ; 8 μs

(%)

−t

50 % I ; 20 μs

10 %

t = 0.7 to 1 ns

30 ns

t (μs)

60 ns

Fig 1. 8/20 μs pulse waveform according to

Fig 2. ESD pulse waveform according to

IEC 61000-4-2

IEC 61000-4-5

PESD5V0L1BSF

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Product data sheet

Rev. 1 — 18 February 2011

3 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

6. Characteristics

Table 8.

Characteristics

T_amb= 25 °C unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

V_RWM

reverse standoff

voltage

−5

I_RM

reverse leakage

current

V_RWM= 5 V

100

[1][2]

[3]

V_CL

clamping voltage

breakdown voltage

diode capacitance

I_PP= 1 A

I_PP= 3 A

I_R= 1 mA

I_R= −1 mA

f = 1 MHz

V_R= 0 V

V_R= 2.5 V

V_R= 5 V

11.5

13.5

V_BR

C_d

[3]

−10

−6

[4]

8.9

15.4

11.4

10.2

[5]

[6]

L_S

series inductance

dynamic resistance

0.05

R_dyn

[1] Non-repetitive current pulse 8/20 μs exponentially decaying waveform according to IEC 61000-4-5;

see Figure 1.

[2] Measured from pin 1 to pin 2.

[3] Breakdown voltage is always symmetrical within the characterized range, which means no difference in

breakdown voltage from pin 1 to pin 2 and vice versa.

[4] This parameter is guaranteed by design.

[5] Calculated from S-parameter values.

[6] Non-repetitive current pulse, Transmission Line Pulse (TLP) t_p= 100 ns; square pulse;

ANS/IESD STM5.1-2008.

PESD5V0L1BSF

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Product data sheet

Rev. 1 — 18 February 2011

4 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

018aaa055

15.0

(pF)

12.0

9.0

6.0

3.0

0.0

−V −V

−V

RWM

−I

RWM BR CL

−

−I

0.0

1.0

2.0

3.0

4.0

5.0

(V)

006aaa676

f = 1 MHz; T_amb= 25 °C

Fig 3. Diode capacitance as a function of reverse

voltage; typical values

Fig 4. V-I characteristics for a bidirectional

ESD protection diode

ESD TESTER

4 GHz DIGITAL

OSCILLOSCOPE

RG 223/U

50 Ω coax

450 Ω

10×

ATTENUATOR

50 Ω

PESD5V0x1BSF

IEC 61000-4-2 network

= 150 pF; R = 330 Ω

018aaa037

Fig 5. ESD clamping test setup

PESD5V0L1BSF

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Product data sheet

Rev. 1 — 18 February 2011

5 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

018aaa056

018aaa057

(V)

−5

−10

−15

−20

−5

−50

160

230

300

−50

160

230

300

t (ns)

f = 1 MHz; T_amb= 25 °C

Fig 6. Clamped +1 kV ESD pulse waveform

(IEC 61000-4-2 network)

Fig 7. Clamped −1 kV ESD pulse waveform

(IEC 61000-4-2 network)

018aaa058

018aaa059

(V)

−10

−30

−10

−50

160

230

300

−50

160

230

300

t (ns)

f = 1 MHz; T_amb= 25 °C

Fig 8. Clamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

Fig 9. Clamped −8 kV ESD pulse waveform

(IEC 61000-4-2 network)

PESD5V0L1BSF

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Product data sheet

Rev. 1 — 18 February 2011

6 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

7. Application information

The PESD5V0L1BSF is designed for the protection of one data or signal line from the

damage caused by ESD and/or other surge pulses. The device may be used on lines

where the signal polarities are both, positive and negative with respect to ground.

It provides protection against surges with up to 35 W per line.

line to be protected

PESD5V0L1BSF

GND

018aaa060

Fig 10. Application diagram

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD and Electrical Fast

Transient (EFT). The following guidelines are recommended:

1. Place the device as close to the input terminal or connector as possible

2. The path length between the device and the protected line should be minimized

3. Avoid running protected conductors in parallel with unprotected conductors

4. Minimize all Printed-Circuit Board (PCB) conductive loops including power and

ground loops

5. Minimize the length of the transient return path to ground

6. Avoid using shared transient return paths to a common ground point

7. Ground planes should be used whenever possible. For multilayer PCBs, use ground

vias.

PESD5V0L1BSF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 18 February 2011

7 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

8. Package outline

Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm

SOD962

(2)

0.5 mm

scale

Dimensions

Unit

(1)

max 0.32 0.0076 0.25 0.325 0.625

mm nom

min 0.28

0.15

0.13

0.4

0.23 0.275 0.575

Note

1. Dimension A is including coating foil thickness.

2. The marking bar indicates the cathode.

sod962_po

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

10-11-03

10-11-11

SOD962

Fig 11. Package outline PESD5V0L1BSF (SOD962)

PESD5V0L1BSF

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Product data sheet

Rev. 1 — 18 February 2011

8 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

9. Packing information

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number

Package

Description

Packing quantity

9000

PESD5V0L1BSF

SOD962

2 mm pitch, 8 mm tape and reel

-315

[1] For further information and the availability of packing methods, see Section 13.

10. Soldering

Footprint information for reflow soldering of leadless ultra small package; 2 terminals

SOD962

0.85

0.4

R0.025 (8×)

0.22

0.4

(2×)

0.12

(2×)

0.2

(2×)

solder land

solder land plus solder paste

solder paste deposit

solder resist

Dimensions in mm

sod962_fr

Reflow soldering is the required soldering method.

Fig 12. Required reflow soldering footprint PESD5V0L1BSF (SOD962)

Based on results of board mount testing, NXP Semiconductors requires the following

soldering guidelines:

1. Soldering footprint as indicated in Figure 12: solder paste has to cover the whole

solder land area.

2. Non-solder mask defined (copper-defined) solder lands.

3. Minimum stencil thickness of 100 μm.

4. Paste type 4 or smaller sphere size.

5. Pick and placement accuracy of ±50 μm.

PESD5V0L1BSF

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Product data sheet

Rev. 1 — 18 February 2011

9 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

11. Revision history

Table 10. Revision history

Document ID

Release date

20110218

Data sheet status

Change notice

Supersedes

PESD5V0L1BSF v.1

Product data sheet

PESD5V0L1BSF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 18 February 2011

10 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

12. Legal information

12.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

12.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

12.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

PESD5V0L1BSF

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Product data sheet

Rev. 1 — 18 February 2011

11 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

PESD5V0L1BSF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 18 February 2011

12 of 13

PESD5V0L1BSF

NXP Semiconductors

Bidirectional low capacitance ESD protection diode

14. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Application information. . . . . . . . . . . . . . . . . . . 7

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

Packing information . . . . . . . . . . . . . . . . . . . . . 9

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

12.1

12.2

12.3

12.4

Contact information. . . . . . . . . . . . . . . . . . . . . 12

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 18 February 2011

Document identifier: PESD5V0L1BSF

PESD5V0L1BSF [NXP]

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