PMBFJ175TRL [NXP]

TRANSISTOR 30 V, P-CHANNEL, Si, SMALL SIGNAL, JFET, FET General Purpose Small Signal;
PMBFJ175TRL
型号: PMBFJ175TRL
厂家: NXP    NXP
描述:

TRANSISTOR 30 V, P-CHANNEL, Si, SMALL SIGNAL, JFET, FET General Purpose Small Signal

开关 光电二极管 晶体管
文件: 总6页 (文件大小:31K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
PMBFJ174 to 177  
P-channel silicon field-effect  
transistors  
April 1995  
Product specification  
File under Discrete Semiconductors, SC07  
Philips Semiconductors  
Product specification  
P-channel silicon field-effect transistors  
PMBFJ174 to 177  
DESCRIPTION  
Silicon symmetrical p-channel  
junction FETs in plastic  
microminiature SOT23  
envelopes.They are intended for  
application with analogue switches,  
choppers, commutators etc. using  
SMD technology. A special feature is  
3
handbook, halfpage  
the interchangeability of the drain and  
source connections.  
d
g
s
PINNING  
1
2
1
2
3
= drain  
= source  
= gate  
Top view  
MAM386  
Note  
1. Drain and source are  
interchangeable.  
Fig.1 Simplified outline and symbol, SOT23.  
Marking codes:  
174 : p6X  
175 : p6W  
176 : p6S  
177 : p6Y  
QUICK REFERENCE DATA  
Drain-source voltage  
Gate-source voltage  
Gate current  
± VDS  
VGSO  
IG  
max.  
max.  
max.  
30  
30  
50  
V
V
mA  
Total power dissipation  
up to Tamb = 25 °C  
Ptot  
max.  
300  
mW  
PMBFJ174  
175  
176 177  
Drain current  
>
20  
7
70  
2
1,5 mA  
20 mA  
VDS = 15 V; VGS = 0  
IDSS  
<
135  
35  
Drain-source ON-resistance  
VDS = 0,1 V; VGS = 0  
RDS on  
<
85  
125  
250  
300 Ω  
April 1995  
2
Philips Semiconductors  
Product specification  
P-channel silicon field-effect transistors  
PMBFJ174 to 177  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Drain-source voltage  
Gate-source voltage  
Gate-drain voltage  
± VDS  
VGSO  
VGDO  
IG  
max.  
max.  
max.  
max.  
30  
30  
30  
50  
V
V
V
Gate current (d.c.)  
mA  
Total power dissipation  
up to Tamb = 25 °C(1)  
Storage temperature range  
Junction temperature  
Ptot  
Tstg  
Tj  
max.  
max.  
300  
65 to + 150  
150  
mW  
°C  
°C  
THERMAL RESISTANCE  
From junction to ambient in free air  
Rth j-a  
=
430  
K/W  
STATIC CHARACTERISTICS  
Tj = 25 °C unless otherwise specified  
PMBFJ174 175 176 177  
Gate cut-off current  
VGS = 20 V; VDS = 0  
Drain cut-off current  
VDS = 15 V; VGS = 10 V  
Drain current  
IGSS  
<
<
1
1
1
1
1
1
1 nA  
1 nA  
IDSX  
>
<
20  
135  
7
70  
2
35  
1,5 mA  
20 mA  
VDS = 15 V; VGS = 0  
IDSS  
Gate-source breakdown voltage  
IG = 1 µA; VDS = 0  
V(BR)GSS  
>
30  
30  
30  
30 V  
Gate-source cut-off voltage  
ID = 10 nA; VDS = 15 V  
>
<
5
10  
3
6
1
4
0,8 V  
2,25 V  
VGS off  
Drain-source ON-resistance  
VDS = 0,1 V; VGS = 0  
RDS on  
<
85  
125 250 300 Ω  
Note  
1. Mounted on a ceramic substrate of 8 mm × 10 mm × 0,7 mm.  
April 1995  
3
Philips Semiconductors  
Product specification  
P-channel silicon field-effect transistors  
PMBFJ174 to 177  
DYNAMIC CHARACTERISTICS  
Tj = 25 °C unless otherwise specified  
Input capacitance, f = 1 MHz  
V
GS = 10 V; VDS = 0 V  
Cis  
Cis  
typ.  
typ.  
8
pF  
pF  
VGS = VDS = 0  
30  
Feedback capacitance, f = 1 MHz  
VGS = 10 V; VDS = 0 V  
Crs  
typ.  
4
pF  
Switching times (see Fig.2 + 3)  
Delay time  
PMBFJ174 175  
176  
15  
177  
td  
tr  
typ.  
typ.  
typ.  
typ.  
typ.  
typ.  
2
5
5
20 ns  
25 ns  
45 ns  
20 ns  
25 ns  
45 ns  
Rise time  
10  
15  
10  
20  
30  
20  
35  
15  
20  
35  
Turn-on time  
ton  
ts  
7
Storage temperature  
Fall time  
5
tf  
10  
15  
Turn-off time  
toff  
Test conditions:  
VDD  
VGS off  
RL  
10  
12  
6
8
6
6
6 V  
3 V  
560 1200 2000  
2900 Ω  
0 V  
VGS on  
0
0
0
V
GSoff  
90%  
V  
handbook, halfpage  
DD  
50 Ω  
INPUT  
10%  
V
out  
R
10%  
10%  
90%  
L
OUTPUT  
V
D.U.T  
in  
90%  
50 Ω  
t
t
f
r
t
t
MBK293  
s
d
MBK292  
Rise time input voltage < 1 ns  
Fig.3 Input and output waveforms  
td + tr = ton  
Fig.2 Switching times test circuit  
ts + tf = toff  
April 1995  
4
Philips Semiconductors  
Product specification  
P-channel silicon field-effect transistors  
PMBFJ174 to 177  
PACKAGE OUTLINE  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M  
B
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT23  
April 1995  
5
Philips Semiconductors  
Product specification  
P-channel silicon field-effect transistors  
PMBFJ174 to 177  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
Short-form specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
The data in this specification is extracted from a full data sheet with the same type  
number and title. For detailed information see the relevant data sheet or data handbook.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
April 1995  
6

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