PMBTA92/T3 [NXP]

TRANSISTOR 100 mA, 300 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB, PLASTIC PACKAGE-3, BIP General Purpose Small Signal;


型号：	PMBTA92/T3
厂家：	NXP
描述：	TRANSISTOR 100 mA, 300 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB, PLASTIC PACKAGE-3, BIP General Purpose Small Signal 光电二极管晶体管
文件：	总6页 (文件大小：100K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DISCRETE SEMICONDUCTORS

DATA SHEET

PMBTA92

PNP high-voltage transistor

Product data sheet

2004 Jan 22

Supersedes data of 1999 Apr 13

NXP Semiconductors

Product data sheet

PNP high-voltage transistor

PMBTA92

FEATURES

PINNING

• Low current (max. 100 mA)

• High voltage (max. 300 V).

DESCRIPTION

base

emitter

collector

APPLICATIONS

• Telephony

• Professional communication equipment.

DESCRIPTION

handbook, halfpage

PNP high-voltage transistor in a SOT23 plastic package.

NPN complement: PMBTA42.

MARKING

TYPE NUMBER

PMBTA92

MARKING CODE⁽¹⁾

*2D

Top view

MAM256

Note

1. * = p : Made in Hong Kong.

* = t : Made in Malaysia.

* = W : Made in China.

Fig.1 Simplified outline (SOT23) and symbol.

ORDERING INFORMATION

TYPE

PACKAGE

DESCRIPTION

plastic surface mounted package; 3 leads

NUMBER

NAME

VERSION

PMBTA92

−

SOT23

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL

PARAMETER

CONDITIONS

open emitter

MIN.

MAX.

−300

UNIT

V_CBO

V_CEO

V_EBO

I_C

collector-base voltage

collector-emitter voltage

emitter-base voltage

collector current (DC)

peak collector current

peak base current

−

open base

−300

−5

open collector

−100

−200

−100

250

°C

I_CM

I_BM

P_tot

T_stg

T_j

total power dissipation

storage temperature

junction temperature

operating ambient temperature

T_amb≤ 25 °C; note 1

−65

−

+150

150

T_amb

−65

+150

Note

1. Transistor mounted on an FR4 printed-circuit board.

2004 Jan 22

NXP Semiconductors

Product data sheet

PNP high-voltage transistor

PMBTA92

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

note 1

VALUE

UNIT

R_th(j-a)

thermal resistance from junction to ambient

500

K/W

Note

1. Transistor mounted on an FR4 printed-circuit board.

CHARACTERISTICS

T_amb= 25 °C unless otherwise specified.

SYMBOL

I_CBO

I_EBO

h_FE

PARAMETER

CONDITIONS

I_E= 0; V_CB= −200 V

MIN.

MAX.

−250

UNIT

collector cut-off current

emitter cut-off current

DC current gain

−

I_C= 0; V_EB= −3 V

V_CE= −10 V; note 1

I_C= −1 mA

−100

−

I_C= −10 mA

−

I_C= −30 mA

−

V_CEsat

V_BEsat

C_c

collector-emitter saturation voltage I_C= −20 mA; I_B= −2 mA

−500

−900

base-emitter saturation voltage

collector capacitance

I_C= −20 mA; I_B= −2 mA

−

I_E= I_e= 0; V_CB= −20 V; f = 1 MHz

−

f_T

transition frequency

I_C= −10 mA; V_CE= −20 V;

−

MHz

f = 100 MHz

Note

1. Pulse test: t_p≤ 300 µs; δ ≤ 0.02.

2004 Jan 22

NXP Semiconductors

Product data sheet

PNP high-voltage transistor

PMBTA92

PACKAGE OUTLINE

Plastic surface-mounted package; 3 leads

SOT23

w M

detail X

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

max.

1.1

0.9

0.48

0.38

0.15

0.09

3.0

2.8

1.4

1.2

2.5

2.1

0.45

0.15

0.55

0.45

0.1

1.9

0.95

0.2

0.1

REFERENCES

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

JEDEC

JEITA

04-11-04

06-03-16

SOT23

TO-236AB

2004 Jan 22

NXP Semiconductors

Product data sheet

PNP high-voltage transistor

PMBTA92

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DISCLAIMERS

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

General ⎯ Information in this document is believed to be

accurate and reliable. However, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequences of use of such information.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any inconsistency or conflict between information

in this document and such terms and conditions, the latter

will prevail.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

2004 Jan 22

NXP Semiconductors

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimers. No changes were made to the technical content, except for package outline

drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

R75/05/pp6

Date of release: 2004 Jan 22

Document order number: 9397 750 12526

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