PMEG2005BELD,315 [NXP]
PMEG2005BELD - 20 V, 0.5 A low VF MEGA Schottky barrier rectifier DFN 2-Pin;
| 型号： | PMEG2005BELD,315 |
| 厂家： | 
NXP |
| 描述： | PMEG2005BELD - 20 V, 0.5 A low VF MEGA Schottky barrier rectifier DFN 2-Pin 光电二极管 |
| 文件： | 总13页 (文件大小：180K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
4 July 2012
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with
an integrated guard ring for stress protection, encapsulated in a leadless ultra small
SOD882D (DFN1006D-2) Surface-Mounted Device (SMD) plastic package with visible
and solderable side pads.
1.2 Features and benefits
Average forward current: IF(AV) ≤ 0.5 A
Reverse voltage: VR ≤ 20 V
•
•
•
•
•
•
•
Low forward voltage VF ≤ 390 mV
AEC-Q101 qualified
Ultra small and leadless SMD plastic package
Solderable side pads
Package height typ. 0.37 mm
1.3 Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Reverse polarity protection
Low power consumption applications
Ultra high-speed switching
•
•
•
•
•
•
•
LED backlight for mobile application
1.4 Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
IF(AV)
average forward
current
δ = 0.5 ; f = 20 kHz; Tsp ≤ 140 °C;
square wave
-
-
0.5
A
δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;
square wave
[1]
-
-
0.5
A
VR
VF
reverse voltage
forward voltage
Tj = 25 °C
-
-
-
20
V
IF = 500 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
353
390
mV
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IR
reverse current
VR = 10 V; Tj = 25 °C
-
28
50
µA
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
2. Pinning information
Table 2.
Pin
Pinning information
Symbol Description
Simplified outline
Graphic symbol
1
2
K
A
cathode[1]
anode
1
2
1
2
sym001
Transparent
top view
DFN1006D-2 (SOD882D)
[1] The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PMEG2005BELD
DFN1006D-2 Leadless ultra small plastic package; 2 terminals
SOD882D
4. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG2005BELD
0010 1000
CATHODE BAR
READING DIRECTION
READING EXAMPLE:
0111
1011
MARKING CODE
(EXAMPLE)
READING DIRECTION
006aac927
Fig. 1. SOD882D binary marking code description
PMEG2005BELD
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Product data sheet
4 July 2012
2 / 13
NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VR
Parameter
Conditions
Tj = 25 °C
Min
Max
20
Unit
V
reverse voltage
forward current
average forward current
-
-
-
IF
Tsp ≤ 140 °C
0.5
0.5
A
IF(AV)
δ = 0.5 ; f = 20 kHz; Tsp ≤ 140 °C;
square wave
A
δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;
square wave
[1]
-
0.5
A
IFRM
IFSM
repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25
-
-
3
6
A
A
non-repetitive peak forward
current
tp = 8 ms; Tj(init) = 25 °C; square wave
Ptot
total power dissipation
Tamb ≤ 25 °C
[2][3]
[1][3]
[4][3]
-
370
735
1135
150
150
150
mW
mW
mW
°C
-
-
Tj
junction temperature
ambient temperature
storage temperature
-
Tamb
Tstg
-55
-65
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Reflow soldering is the only recommended soldering method.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Min
[1][2][3] -
Typ
Max
340
170
110
25
Unit
K/W
K/W
K/W
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
-
-
-
-
[1][4][3] -
[1][5][3] -
Rth(j-sp)
thermal resistance
from junction to solder
point
[6]
-
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
[5] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[6] Soldering point of cathode tab.
PMEG2005BELD
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aac928
3
10
duty cycle =
Z
th(j-a)
(K/W)
1
0.75
0.5
0.25
0.1
0.33
0.2
2
10
0.05
0
0.02
0.01
10
-3
10
-2
-1
2
3
10
10
1
10
10
10
t
p
(s)
FR4 PCB, standard footprint
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac929
3
10
Z
th(j-a)
(K/W)
duty cycle =
1
0.75
2
10
0.5
0.1
0.33
0.2
0.25
0.05
0.02
0.01
0
10
-3
10
-2
-1
2
3
10
10
1
10
10
10
t
p
(s)
FR4 PCB, mounting pad for cathode 1 cm2
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG2005BELD
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aac930
3
10
Z
th(j-a)
(K/W)
duty cycle =
2
1
10
0.75
0.5
0.33
0.2
0.25
0.1
0.05
0.02
0.01
0
10
-3
10
-2
-1
2
3
10
10
1
10
10
10
t
p
(s)
Ceramic PCB, Al2O3, standard footprint
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 0.1 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
-
79
105
mV
IF = 1 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
-
-
-
-
137
197
266
353
170
235
310
390
mV
mV
mV
mV
IF = 10 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
IF = 100 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
IF = 500 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tj = 25 °C
IR
reverse current
VR = 10 V; Tj = 25 °C
-
-
-
-
28
87
31
1.6
50
200
40
-
µA
µA
pF
ns
VR = 20 V; Tj = 25 °C
Cd
trr
diode capacitance
VR = 1 V; f = 1 MHz; Tj = 25 °C
reverse recovery time IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A;
Tj = 25 °C
VFRM
peak forward recovery IF = 0.5 A; dIF/dt = 20 A/µs; Tj = 25 °C
voltage
-
565
-
mV
PMEG2005BELD
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aac931
006aac932
-1
1
10
R
I
I
(A)
10
(1)
(2)
F
-2
-3
-4
-5
-6
-7
-8
(A)
-1
-2
-3
-4
(1)
(2)
10
10
10
10
10
10
10
10
10
10
(3)
(4)
(5)
(3)
(4)
10
0.0
0.1
0.2
0.3
0.4
0.5
0
5
15
20
V
(V)
V (V)
R
F
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = −40 °C
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = −40 °C
Fig. 6. Reverse current as a function of reverse
voltage; typical values
Fig. 5. Forward current as a function of forward
voltage; typical values
006aac933
006aac934
70
0.25
C
(pF)
60
d
P
F(AV)
(W)
(4)
0.20
(3)
50
40
30
20
10
0
(2)
0.15
0.10
0.05
0.00
(1)
0
5
10
15
20
0.00
0.25
0.50
0.75
V
(V)
I
(A)
F(AV)
R
f = 1 MHz; Tamb = 25 °C
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Fig. 7. Diode capacitance as a function of reverse
voltage; typical values
Fig. 8. Average forward power dissipation as a
function of average forward current; typical
values
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aac935
006aac936
1.2
0.75
(1)
P
R(AV)
(W)
I
F(AV)
(A)
(2)
0.8
0.4
0.0
0.50
(1)
(2)
(3)
(3)
(4)
0.25
0.00
(4)
0
5
10
15
20
0
25
50
75
100
125
150
T (°C)
amb
175
V
(V)
R
Tj = 125 °C
FR4 PCB, standard footprint
Tj = 150 °C
(1) δ = 1 (DC)
(2) δ = 0.9; f = 20 kHz
(3) δ = 0.8; f = 20 kHz
(4) δ = 0.5; f = 20 kHz
(1) δ = 1
(2) δ = 0.5
(3) δ = 0.2
(4) δ = 0.1
Fig. 9. Average reverse power dissipation as a
function of reverse voltage; typical values
Fig. 10. Average forward current as a function of
ambient temperature; typical values
006aac937
006aac938
0.75
0.75
(1)
(1)
I
I
F(AV)
(A)
F(AV)
(A)
(2)
(2)
0.50
0.50
(3)
(4)
(3)
(4)
0.25
0.00
0.25
0.00
0
25
50
75
100
125
150
(°C)
175
0
25
50
75
100
125
150
T (°C)
amb
175
T
amb
FR4 PCB, mounting pad for cathode 1 cm2
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1
Tj = 150 °C
(1) δ = 1
(2) δ = 0.5
(3) δ = 0.2
(4) δ = 0.1
(2) δ = 0.5
(3) δ = 0.2
(4) δ = 0.1
Fig. 12. Average forward current as a function of
ambient temperature; typical values
Fig. 11. Average forward current as a function of
ambient temperature; typical values
PMEG2005BELD
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aac939
0.75
(1)
(2)
I
F(AV)
(A)
0.50
(3)
(4)
0.25
0.00
0
25
50
75
100
125
150
(°C)
175
T
sp
Tj = 150 °C
(1) δ = 1
(2) δ = 0.5
(3) δ = 0.2
(4) δ = 0.1
Fig. 13. Average forward current as a function of solder point temperature; typical values
8. Test information
I
F
I
R(meas)
time
I
R
006aad022
t
rr
Fig. 14. Reverse recovery definition
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
I
F
time
V
F
V
FRM
V
F
time
001aab912
Fig. 15. Forward recovery definition
t
p
P
duty cycle δ =
t
cy
t
cy
t
p
t
006aac658
Fig. 16. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations:
IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with
IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PMEG2005BELD
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
9. Package outline
0.65
0.55
0.4
max
2
0.30
0.22
1.05
0.95
0.65
1
0.30
0.22
0.55
0.45
cathode marking on top side (if applicable)
12-05-01
Dimensions in mm
Fig. 17. DFN1006D-2 (SOD882D)
10. Soldering
1.4
0.2
solder lands
solder resist
solder paste
0.8
(2×)
0.6 0.7
(2×) (2×)
Dimensions in mm
0.3
0.4
1
1.3
sod882d_fr
Fig. 18. Reflow soldering footprint for SOD882D (DFN1006D-2)
11. Revision history
Table 8.
Revision history
Document ID
Release date
Document status
Change notice
Supersedes
PMEG2005BELD v.3
Modifications:
20120704
Product document
-
PMEG2005BELD v.2
Characteristics: VFRM added; changed conditions of trr.
•
PMEG2005BELD v.2
PMEG2005BELD v.1
20120312
20120111
Product document
-
-
PMEG2005BELD v.1
-
Preliminary document
PMEG2005BELD
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Product data sheet
4 July 2012
10 / 13
NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
12. Legal information
12.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
Product
Definition
status [1][2] status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.2 Definitions
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
12.3 Disclaimers
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
PMEG2005BELD
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
PMEG2005BELD
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Product data sheet
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NXP Semiconductors
PMEG2005BELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
13. Contents
1
Product profile ....................................................... 1
General description .............................................. 1
Features and benefits ...........................................1
Applications ..........................................................1
Quick reference data ............................................ 1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
Pinning information ...............................................2
Ordering information .............................................2
Marking ...................................................................2
Limiting values .......................................................3
Thermal characteristics .........................................3
Characteristics .......................................................5
8
Test information .....................................................8
8.1
Quality information .........................................
9
Package outline ................................................... 10
Soldering .............................................................. 10
Revision history ...................................................10
10
11
12
Legal information .................................................11
Data sheet status ............................................... 11
Definitions ...........................................................11
Disclaimers .........................................................11
Trademarks ........................................................ 12
12.1
12.2
12.3
12.4
© NXP B.V. 2012. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 July 2012
PMEG2005BELD
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
4 July 2012
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