PMEG3020EH [NXP]
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers; 30 V ，2 A超低VF MEGA肖特基势垒整流器
| 型号： | PMEG3020EH |
| 厂家： | 
NXP |
| 描述： | 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers |
| 文件： | 总9页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
Rev. 03 — 31 May 2005
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection encapsulated in small SMD plastic packages.
Table 1:
Product overview
Type number
Package
Philips
Configuration
JEITA
-
PMEG3020EH
PMEG3020EJ
SOD123F
SOD323F
single isolated diodes
single isolated diodes
SC-90
1.2 Features
■ Forward current: 2 A
■ Reverse voltage: 30 V
■ Ultra low forward voltage
■ Small and flat lead SMD package
1.3 Applications
■ Low voltage rectification
■ High efficiency DC-to-DC conversion
■ Switched-mode power supply
■ Inverse polarity protection
■ Low power consumption applications
1.4 Quick reference data
Table 2:
Symbol
IF
Quick reference data
Parameter
Conditions
sp ≤ 55 °C
Min
Typ
Max
2
Unit
A
forward current
reverse voltage
forward voltage
T
-
-
-
-
VR
-
30
V
[1]
VF
IF = 2000 mA
510
620
mV
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3:
Pinning
Pin
1
Description
cathode
Simplified outline
Symbol
[1]
1
2
2
anode
1
2
sym001
001aab540
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4:
Ordering information
Type number
Package
Name
-
Description
Version
PMEG3020EH
PMEG3020EJ
plastic surface mounted package; 2 leads
plastic surface mounted package; 2 leads
SOD123F
SOD323F
SC-90
4. Marking
Table 5:
Marking codes
Type number
PMEG3020EH
PMEG3020EJ
Marking code
A7
E9
9397 750 15077
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 May 2005
2 of 9
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
30
Unit
V
VR
IF
reverse voltage
-
-
-
forward current
Tsp ≤ 55 °C
2
A
IFRM
repetitive peak forward
current
tp ≤ 1 ms; δ ≤ 0.25
4.5
A
[1]
IFSM
Ptot
non-repetitive peak forward t = 8 ms; square
-
9
A
current
wave
total power dissipation
PMEG3020EH
Tamb ≤ 25 °C
[1]
[2]
[1]
[2]
-
375
830
mW
mW
mW
mW
°C
-
PMEG3020EJ
-
360
-
830
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
−65
−65
+150
+150
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 7:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1] [2]
[2] [3]
[1] [2]
[2] [3]
PMEG3020EH
-
-
-
-
-
-
-
-
330
150
350
150
K/W
K/W
K/W
K/W
PMEG3020EJ
Rth(j-sp)
thermal resistance from
junction to solder point
PMEG3020EH
PMEG3020EJ
-
-
-
-
60
55
K/W
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating will be available on request.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
9397 750 15077
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 May 2005
3 of 9
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
7. Characteristics
Table 8:
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
Min
Typ
Max
Unit
[1]
VF
forward voltage
IF = 1 mA
-
-
-
-
-
-
-
-
-
125
185
255
330
400
510
60
160
220
290
380
480
620
150
1000
72
mV
mV
mV
mV
mV
mV
µA
IF = 10 mA
IF = 100 mA
IF = 500 mA
IF = 1000 mA
IF = 2000 mA
VR = 10 V
IR
reverse current
VR = 30 V
400
60
µA
Cd
diode capacitance VR = 1 V; f = 1 MHz
pF
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
006aaa293
006aaa294
4
3
2
6
5
4
3
2
10
10
10
10
10
10
I
R
I
F
(µA)
(mA)
10
(1)
(2)
(3)
(1)
(2)
(3)
(4)
(5)
10
(4)
(5)
10
10
1
1
−1
10
−1
−2
10
10
0
0.1
0.2
0.3
0.4
0.5
(V)
0.6
0
5
10
15
20
25
30
(V)
35
V
V
F
R
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
9397 750 15077
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 May 2005
4 of 9
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
006aaa295
140
120
100
80
C
d
(pF)
60
40
20
0
0
5
10
15
20
25
V
30
(V)
R
Tamb = 25 °C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
8. Package outline
1.7
1.5
1.2
1.0
1.35
1.15
0.80
0.65
0.5
0.3
1
1
0.55
0.35
2.7 1.8
2.3 1.6
3.6 2.7
3.4 2.5
2
2
0.40
0.25
0.25
0.10
0.70
0.55
0.25
0.10
Dimensions in mm
04-11-29
Dimensions in mm
04-09-13
Fig 4. Package outline SOD123F
Fig 5. Package outline SOD323F (SC-90)
9. Packing information
Table 9:
Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
3000
-115
-115
10000
-135
PMEG3020EH
PMEG3020EJ
SOD123F
SOD323F
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-135
[1] For further information and the availability of packing methods, see Section 16.
9397 750 15077
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 May 2005
5 of 9
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
10. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Reflow soldering footprint SOD123F
3.05
2.80
2.10
1.60
solder lands
solder resist
occupied area
solder paste
1.65 0.95
0.50 0.60
msa433
0.50
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD323F (SC-90)
9397 750 15077
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 May 2005
6 of 9
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
11. Revision history
Table 10: Revision history
Document ID
Release date Data sheet status Change notice Doc. number
Supersedes
PMEG3020EH_EJ_3
Modifications:
20050531
Product data sheet
-
9397 750 15077 PMEG3020EH_EJ_2
• Table 6 “Limiting values” IFSM value changed to 9 A
PMEG3020EH_EJ_2
PMEG3020EJ_1
20050404
20050125
Product data sheet
Product data sheet
-
-
9397 750 14883 PMEG3020EJ_1
9397 750 13917
-
9397 750 15077
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 May 2005
7 of 9
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
12. Data sheet status
Level Data sheet status[1] Product status[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
15. Trademarks
Notice — All referenced brands, product names, service names and
14. Disclaimers
trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 15077
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 May 2005
8 of 9
PMEG3020EH; PMEG3020EJ
Philips Semiconductors
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
17. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Contact information . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
12
13
14
15
16
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 31 May 2005
Document number: 9397 750 15077
Published in The Netherlands
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