PRTR5V0U4Y,125 [NXP]
PRTR5V0U4Y - Integrated quad ultra-low capacitance ESD protection TSSOP 6-Pin;
| 型号： | PRTR5V0U4Y,125 |
| 厂家： | 
NXP |
| 描述： | PRTR5V0U4Y - Integrated quad ultra-low capacitance ESD protection TSSOP 6-Pin 光电二极管 |
| 文件： | 总10页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRTR5V0U4Y
Integrated quad ultra-low capacitance ESD protection
Rev. 01 — 8 May 2008
Product data sheet
1. Product profile
1.1 General description
The PRTR5V0U4Y is designed to protect Input/Output (I/O) ports that are sensitive to
capacitive load, such as USB 2.0, Ethernet and DVI from destruction by ElectroStatic
Discharge (ESD). It provides protection to downstream signal and supply components
from ESD voltages as high as ±8 kV (contact discharge).
The PRTR5V0U4Y incorporates four pairs of ultra-low capacitance rail-to-rail diodes plus
a Zener diode. The rail-to-rail diodes are connected to the Zener diode which allows ESD
protection to be independent of supply voltage. The PRTR5V0U4Y is fabricated using thin
film-on-silicon technology integrating four ultra-low capacitance rail-to-rail ESD protection
diodes in a miniature 6-lead SOT363 package.
1.2 Features
I Pb-free and RoHS compliant
I ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge
I Four ultra-low input capacitance (1 pF typical) rail-to-rail ESD protection diodes
I Low-voltage clamping due to integrated Zener diode
I Small 6-lead SOT363 package
1.3 Applications
I General-purpose downstream ESD protection high frequency analog signals and
high-speed serial data transmission for ports inside:
N Cellular and PCS mobile handsets
N PC-/notebook USB 2.0/IEEE 1394 ports
N DVI/HDMI interfaces
N Cordless telephones
N Wireless data (WAN/LAN) systems
N PDAs
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
2. Pinning information
Table 1.
Pinning
Pin
1
Description
Simplified outline
Graphic symbol
ESD protection I/O 1
ground (GND)
2
6
5
4
6
5
4
3
ESD protection I/O 2
ESD protection I/O 3
4
5
supply voltage (VCC
)
1
2
3
6
ESD protection I/O 4
1
2
3
001aag273
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
plastic surface-mounted package; 6 leads
Version
PRTR5V0U4Y
SC-88
SOT363
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min
Max
Unit
input voltage
−0.5
+5.5
V
Vesd
electrostatic discharge all pins; IEC 61000-4-2;
voltage
level 4
contact discharge
air discharge
−8
+8
kV
kV
°C
−15
−55
+15
+125
Tstg
storage temperature
5. Recommended operating conditions
Table 4.
Symbol
Tamb
Operating conditions
Parameter
Conditions
Min
Max
+85
Unit
ambient temperature
−40
°C
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
2 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
6. Characteristics
Table 5.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
C(I/O-GND)
input/output to ground
capacitance
pins 1, 3, 4 and 6; VI = 0 V; f = 1 MHz;
-
1.0
-
pF
VCC = 3.0 V
ILR
VBR
VF
reverse leakage current pins 1, 3, 4 and 6 to ground; VI = 3.0 V
-
-
100
nA
V
breakdown voltage
forward voltage
Zener diode; I = 1 mA
6
-
-
9
-
0.7
V
7. Application information
7.1 IEEE 1394a/b protection
The PRTR5V0U4Y is optimized to protect both the IEEE 1394 physical layer and the
IEEE 1394 connector ports against ESD.
TPBIAS
Shld1
PWR
7
1
1 µF
BUS PWR
56 Ω
56 Ω
TPA+
TPA+
6
5
TPA−
TPA−
IEEE 1394
PHYSICAL
LAYER
1
2
3
6
5
4
1394
CONNECTOR
TPB+
TPB+
TPB−
GND
4
TPB−
3
2
56 Ω
56 Ω
Shld2
8
220 pF
5 kΩ
1 nF
10 nF
1 MΩ
001aag050
Fig 1. Typical application for IEEE 1394a/b ESD protection
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
3 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
7.2 Universal serial bus 2.0 protection
The PRTR5V0U4Y is optimized to protect USB 2.0 ports with or without OTG functionality
against ESD.
VBUS
DAT+
DAT−
USB OTG
RECEPTACLE
CARKIT
to phone
ID
GND
Shld GND
mini B receptacle
mini A receptacle
1
2
3
6
5
4
001aag051
The device is capable of protecting the USB data lines as well as VBUS supply and the ID pin.
Fig 2. Typical application for USB OTG ESD protection
7.3 Universal SIM-card protection
The PRTR5V0U4Y protects the SIM-card interfaces against ESD.
I/O
CLOCK
RESET
SIM
V
CC
GND
1
2
3
6
5
4
001aag052
This device also protects VCC
.
Fig 3. Typical application for universal SIM-card ESD protection
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
4 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
7.4 Gigabit Ethernet transceiver protection
The PRTR5V0U4Y protects the gigabit Ethernet transceiver against ESD.
TPOPA
C1
C5
R1
TPONA
1
2
3
6
5
4
TPOPB
C2
C3
C6
C7
R2
R3
TPONB
TPOPC
GIGABIT
ETHERNET
TRANSCEIVER
QUAD
TRANSFORMER
RJ45
TPONC
1
2
3
6
5
4
TPOPD
TPOND
C4
C8
R4
001aag053
Fig 4. Typical application for gigabit Ethernet transceiver ESD protection
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
5 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
7.5 Universal microSD/TransFlash and SD-memory card protection
The PRTR5V0U4Y protects each data line of the microSD/TransFlash device against
ESD.
DAT0
DAT1
DAT2
DAT3/CD
TRANSFLASH
CMD
CLK
V
CC
GND
1
2
3
6
5
4
1
2
3
6
5
4
001aag054
Fig 5. Typical application for universal microSD/TransFlash and SD-memory card ESD
protection
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
6 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
8. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
Fig 6. Package outline SOT363 (SC-88)
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
7 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
9. Abbreviations
Table 6.
Abbreviations
Description
Acronym
DVI
Digital Video Interface
ESD
ElectroStatic Discharge
High Definition Multimedia interface
Local Area Network
HDMI
LAN
OTG
PCS
On-The-Go
Personal Computing System
Personal Digital Assistant
Restriction of Hazardous Substances
Subscriber Identity Module
Universal Serial Bus
PDA
RoHS
SIM
USB
WAN
Wide Area Network
10. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PRTR5V0U4Y_1
20080508
Product data sheet
-
-
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
8 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PRTR5V0U4Y_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 8 May 2008
9 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Recommended operating conditions. . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Application information. . . . . . . . . . . . . . . . . . . 3
IEEE 1394a/b protection. . . . . . . . . . . . . . . . . . 3
Universal serial bus 2.0 protection . . . . . . . . . . 4
Universal SIM-card protection . . . . . . . . . . . . . 4
Gigabit Ethernet transceiver protection . . . . . . 5
Universal microSD/TransFlash and
7.1
7.2
7.3
7.4
7.5
SD-memory card protection . . . . . . . . . . . . . . . 6
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 May 2008
Document identifier: PRTR5V0U4Y_1
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