PRTR5V0U6AS [NXP]

High speed interface ESD protection to IEC 61000-4-2 level 4; 高速接口ESD保护符合IEC 61000-4-2 4级


型号：	PRTR5V0U6AS
厂家：	NXP
描述：	High speed interface ESD protection to IEC 61000-4-2 level 4 高速接口ESD保护符合IEC 61000-4-2 4级
文件：	总7页 (文件大小：51K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PRTR5V0U6AS

High speed interface ESD protection to IEC 61000-4-2 level 4

Rev. 01 — 18 February 2008

Product data sheet

1. Product proﬁle

1.1 General description

The PRTR5V0U6AS is designed to protect Input/Output (I/O) ports that are sensitive to

capacitive load, such as USB 2.0, Ethernet, DVI and HDMI from destruction by

ElectroStatic Discharge (ESD). It provides protection to downstream signal and supply

components from ESD voltages as high as ±8 kV (contact discharge).

The PRTR5V0U6AS incorporates six pairs of ultra-low capacitance rail-to-rail diodes plus

a Zener diode. The rail-to-rail diodes are connected to the Zener diode which allows ESD

protection to be independent of supply voltage with any ESD voltage discharged locally

within the device. The PRTR5V0U6AS is fabricated using monolithic silicon technology

integrating six ultra-low capacitance rail-to-rail ESD protection diodes in a miniature 8-lead

SO8 (SOT96) package.

1.2 Features

I Pb-free and RoHS compliant, dark green

I ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge

I Six ultra-low input capacitance (1 pF typical) ESD rail-to-rail ESD protection diodes

I Supply voltage independent clamping due to integrated Zener diode

I Small 8-lead SO8 (SOT96) package

1.3 Applications

I General-purpose downstream ESD protection high frequency analog signals and

high-speed serial data transmission for ports inside:

N Cellular and PCS mobile handsets

N PC/Notebook USB2.0/IEEE1394 ports

N DVI/HDMI interfaces

N Cordless telephones

N Wireless data (WAN/LAN) systems

N PDAs

PRTR5V0U6AS

NXP Semiconductors

High speed interface ESD protection to IEC 61000-4-2 level 4

2. Pinning information

Table 1.

Pinning

Description

Simpliﬁed outline

Symbol

ESD protection I/O 1

ESD protection I/O 2

ground (GND)

ESD protection I/O 3

ESD protection I/O 4

ESD protection I/O 5

supply voltage (V_CC

)

ESD protection I/O 6

001aah388

3. Ordering information

Table 2.

Ordering information

Type number

Package

Name

Description

Version

PRTR5V0U6AS SO8

plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

4. Limiting values

Table 3.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_I

Parameter

Conditions

Min

Max

Unit

input voltage

5.5

V_esd

electrostatic discharge voltage

all pins; IEC 61000-4-2; level 4

contact discharge

−8

T_stg

storage temperature

−55

+125

°C

5. Recommended operating conditions

Table 4.

Symbol Parameter

T_ambambient temperature

Operating conditions

Conditions

Min

Typ

Max

Unit

−40

+85

°C

PRTR5V0U6AS_1

Product data sheet

Rev. 01 — 18 February 2008

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PRTR5V0U6AS

NXP Semiconductors

High speed interface ESD protection to IEC 61000-4-2 level 4

6. Characteristics

Table 5.

Characteristics

T_amb= 25 °C unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

C_(I/O-GND)

input/output to ground

capacitance

V_I= 0 V; f = 1 MHz; V_CC= 3 V

1.0

[1]

[2]

I_LR

reverse leakage current

breakdown voltage

V_I= 3 V

100

V_BR

C_sup

V_F

Zener diode; I_I= 1 mA

supply pin to ground capacitance V_I= 0 V; f = 1 MHz; V_CC= 3 V

forward voltage

0.7

[1] Measured from pin 1, 2, 4, 5, 6 and 8 to ground.

[2] Measured from pin 7 to ground.

PRTR5V0U6AS_1

Product data sheet

Rev. 01 — 18 February 2008

3 of 7

PRTR5V0U6AS

NXP Semiconductors

High speed interface ESD protection to IEC 61000-4-2 level 4

7. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

(A )

pin 1 index

detail X

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

(2)

UNIT

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 1. Package outline SOT96-1 (SO8)

PRTR5V0U6AS_1

Product data sheet

Rev. 01 — 18 February 2008

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PRTR5V0U6AS

NXP Semiconductors

High speed interface ESD protection to IEC 61000-4-2 level 4

8. Abbreviations

Table 6.

Abbreviations

Description

Acronym

DVI

Digital Video Interface

ESD

ElectroStatic Discharge

High Deﬁnition Multimedia interface

Local Area Network

HDMI

LAN

PCS

Personal Computing System

Personal Digital Assistant

Restriction of Hazardous Substances

Universal Serial Bus

PDA

RoHS

USB

WAN

Wide Area Network

9. Revision history

Table 7.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PRTR5V0U6AS_1

20080218

Product data sheet

PRTR5V0U6AS_1

Product data sheet

Rev. 01 — 18 February 2008

5 of 7

PRTR5V0U6AS

NXP Semiconductors

High speed interface ESD protection to IEC 61000-4-2 level 4

10. Legal information

10.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

10.2 Deﬁnitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

10.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

10.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

11. Contact information

For additional information, please visit: http://www.nxp.com

For sales ofﬁce addresses, send an email to: salesaddresses@nxp.com

PRTR5V0U6AS_1

Product data sheet

Rev. 01 — 18 February 2008

6 of 7

PRTR5V0U6AS

NXP Semiconductors

High speed interface ESD protection to IEC 61000-4-2 level 4

12. Contents

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Recommended operating conditions. . . . . . . . 2

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

10.1

10.2

10.3

10.4

Contact information. . . . . . . . . . . . . . . . . . . . . . 6

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 18 February 2008

Document identifier: PRTR5V0U6AS_1

PRTR5V0U6AS [NXP]

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