PUMB2,115 [NXP]
PEMB2; PUMB2 - PNP/PNP resistor-equipped transistors; R1 = 47 kΩ, R2 = 47 kΩ TSSOP 6-Pin;
| 型号： | PUMB2,115 |
| 厂家： | 
NXP |
| 描述： | PEMB2; PUMB2 - PNP/PNP resistor-equipped transistors; R1 = 47 kΩ, R2 = 47 kΩ TSSOP 6-Pin 开关 光电二极管 晶体管 |
| 文件： | 总14页 (文件大小：590K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PEMB2; PUMB2
PNP/PNP resistor-equipped transistors;
R1 = 47 k, R2 = 47 k
Rev. 3 — 17 November 2011
Product data sheet
1. Product profile
1.1 General description
PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted
Device (SMD) plastic packages.
Table 1.
Product overview
Type number Package
NXP
NPN/PNP
complement
NPN/NPN
complement
Package
configuration
JEITA
PEMB2
SOT666
-
PEMD12
PUMD12
PEMH2
PUMH2
ultra small and flat
lead
PUMB2
SOT363
SC-88
very small
1.2 Features and benefits
100 mA output current capability
Built-in bias resistors
Reduces component count
Reduces pick and place costs
AEC-Q101 qualified
Simplifies circuit design
1.3 Applications
Low current peripheral driver
Control of IC inputs
Replaces general-purpose transistors in digital applications
1.4 Quick reference data
Table 2.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
VCEO collector-emitter voltage
IO
open base
-
-
50
100
61
V
output current
-
-
mA
k
R1
bias resistor 1 (input)
bias resistor ratio
33
0.8
47
1
R2/R1
1.2
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
2. Pinning information
Table 3.
Pinning
Pin
1
Description
Simplified outline
Graphic symbol
GND (emitter) TR1
input (base) TR1
output (collector) TR2
GND (emitter) TR2
input (base) TR2
output (collector) TR1
6
5
4
6
5
4
2
3
R1 R2
4
TR2
TR1
5
1
2
3
R2 R1
6
001aab555
1
2
3
006aaa212
3. Ordering information
Table 4.
Ordering information
Type number Package
Name
Description
Version
SOT666
SOT363
PEMB2
PUMB2
-
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
SC-88
4. Marking
Table 5.
Marking codes
Type number
PEMB2
Marking code[1]
B2
PUMB2
B*2
[1] * = placeholder for manufacturing site code
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
2 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
VCEO
VEBO
VI
collector-base voltage
open emitter
open base
-
-
-
50
50
10
V
V
V
collector-emitter voltage
emitter-base voltage
input voltage
open collector
positive
-
-
-
-
+10
V
negative
40
V
IO
output current
100
100
mA
mA
ICM
peak collector current
single pulse;
tp 1 ms
Ptot
total power dissipation
PEMB2 (SOT666)
PUMB2 (SOT363)
Tamb 25 C
[1][2]
[1]
-
-
200
200
mW
mW
Per device
Ptot
total power dissipation
PEMB2 (SOT666)
Tamb 25 C
[1][2]
[1]
-
300
mW
mW
C
PUMB2 (SOT363)
junction temperature
ambient temperature
storage temperature
-
300
Tj
-
150
Tamb
Tstg
65
65
+150
+150
C
C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
3 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
006aac749
400
P
tot
(mW)
300
200
100
0
-75
-25
25
75
125
175
(°C)
T
amb
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve for SOT363 (SC-88) and SOT666
6. Thermal characteristics
Table 7.
Symbol
Per transistor
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
Rth(j-a)
thermal resistance from
in free air
junction to ambient
PEMB2 (SOT666)
PUMB2 (SOT363)
[1][2]
[1]
-
-
-
-
625
625
K/W
K/W
Per device
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
[1]
PEMB2 (SOT666)
PUMB2 (SOT363)
-
-
-
-
417
417
K/W
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
4 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
006aac751
3
10
duty cycle = 1
Z
th(j-a)
0.75
0.33
(K/W)
0.5
0.2
2
10
0.1
0.02
0
0.05
0.01
10
1
10
-5
-4
-3
-2
-1
2
3
10
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB, standard footprint
Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration for
PEMB2 (SOT666); typical values
006aac750
3
10
duty cycle = 1
Z
th(j-a)
0.75
0.33
(K/W)
0.5
0.2
2
10
0.1
0.05
0.01
0.02
0
10
1
10
-5
-4
-3
-2
-1
2
3
10
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB, standard footprint
Fig 3. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration for
PUMB2 (SOT363); typical values
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
5 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
7. Characteristics
Table 8.
Characteristics
T
amb = 25 C unless otherwise specified.
Symbol Parameter
Per transistor
Conditions
Min
Typ
Max Unit
ICBO
collector-base cut-off
current
VCB = 50 V; IE = 0 A
-
-
100 nA
ICEO
collector-emitter cut-off VCE = 30 V; IB = 0 A
-
-
-
-
1
5
A
A
current
VCE = 30 V; IB = 0 A;
Tj = 150 C
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A
-
-
90
A
hFE
DC current gain
VCE = 5 V; IC = 5 mA
80
-
-
-
-
VCEsat
collector-emitter
IC = 10 mA; IB = 0.5 mA
150 mV
saturation voltage
VI(off)
VI(on)
R1
off-state input voltage
on-state input voltage
bias resistor 1 (input)
bias resistor ratio
VCE = 5 V; IC = 100 A
VCE = 0.3 V; IC = 2 mA
-
1.2 0.8
V
3
33
0.8
-
1.6
47
1
-
V
61
1.2
3
k
R2/R1
Cc
collector capacitance
VCB = 10 V; IE = ie = 0 A;
-
pF
f = 1 MHz
[1]
fT
transition frequency
VCE = 5 V; IC = 10 mA;
-
180
-
MHz
f = 100 MHz
[1] Characteristics of built-in transistor
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
6 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
006aac758
006aac759
3
10
-1
h
FE
(1)
(2)
(3)
V
CEsat
(V)
2
10
-1
-10
(1)
(2)
(3)
10
-2
1
-10
-10
-1
2
-1
2
-1
-10
-10
-10
-1
-10
-10
I
C
(mA)
I (mA)
C
VCE = 5 V
amb = 100 C
IC/IB = 20
(1) Tamb = 100 C
(1)
T
(2) Tamb = 25 C
(3) Tamb = 40 C
(2) Tamb = 25 C
(3) Tamb = 40 C
Fig 4. DC current gain as a function of collector
current; typical values
Fig 5. Collector-emitter saturation voltage as a
function of collector current; typical values
006aac760
006aac761
-10
-10
V
(V)
V
I(off)
(V)
I(on)
(1)
(2)
(3)
(1)
(2)
(3)
-1
-1
-1
-1
-10
-10
-1
2
-1
-10
-1
-10
-10
-10
-1
-10
I
C
(mA)
I (mA)
C
VCE = 0.3 V
(1) Tamb = 40 C
(2) amb = 25 C
(3) Tamb = 100 C
VCE = 5 V
(1) Tamb = 40 C
(2) amb = 25 C
(3) Tamb = 100 C
T
T
Fig 6. On-state input voltage as a function of
collector current; typical values
Fig 7. Off-state input voltage as a function of
collector current; typical values
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
7 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
006aac762
006aac763
3
9
10
C
c
(pF)
f
T
(MHz)
6
3
0
2
10
10
-10
-1
2
0
-10
-20
-30
-40
V
-50
(V)
-1
-10
-10
I (mA)
C
CB
f = 1 MHz; Tamb = 25 C
VCE = 5 V; Tamb = 25 C
Fig 8. Collector capacitance as a function of
collector-base voltage; typical values of
built-in transistor
Fig 9. Transition frequency as a function of collector
current; typical values of built-in transistor
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
2.2
1.8
1.1
0.8
1.7
1.5
0.6
0.5
0.45
0.15
6
5
4
6
5
4
0.3
0.1
2.2 1.35
2.0 1.15
1.7 1.3
1.5 1.1
pin 1
index
pin 1 index
1
2
3
1
2
3
0.25
0.10
0.3
0.2
0.18
0.08
0.27
0.17
0.65
0.5
1.3
1
Dimensions in mm
04-11-08
Dimensions in mm
06-03-16
Fig 10. Package outline PEMB2 (SOT666)
Fig 11. Package outline PUMB2 (SOT363)
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
8 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type
Package Description
Packing quantity
number
3000 4000 8000 10000
PEMB2
PUMB2
SOT666 2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-
-
-315
-
-
-115
-
-
-
-
[2]
[3]
SOT363 4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-115
-125
-
-
-135
-165
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
11. Soldering
2.75
2.45
2.1
1.6
solder lands
0.4
(6×)
0.3
(2×)
0.25
(2×)
placement area
0.538
0.55
(2×)
1.075
1.7
2
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint PEMB2 (SOT666)
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
9 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
2.65
solder lands
0.4 (2×)
1.5
2.35
0.6
(4×)
0.5
(4×)
solder resist
solder paste
0.5
(4×)
0.6
(2×)
occupied area
0.6
(4×)
Dimensions in mm
1.8
sot363_fr
Fig 13. Reflow soldering footprint PUMB2 (SOT363)
1.5
solder lands
solder resist
occupied area
2.5
0.3
4.5
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
1.3
2.45
5.3
sot363_fw
Fig 14. Wave soldering footprint PUMB2 (SOT363)
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
10 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
12. Revision history
Table 10. Revision history
Document ID
Release date
20111117
Data sheet status
Change notice
Supersedes
PEMB2_PUMB2 v.3
Modifications:
Product data sheet
-
PEMB2_PUMB2 v.2
• The format of this document has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 1 “Product profile”: updated
• Section 4 “Marking”: updated
• Figure 1 to 9: added
• Section 5 “Limiting values”: updated
• Section 6 “Thermal characteristics”: updated
• Table 8 “Characteristics”: Vi(on) redefined to VI(on) on-state input voltage, Vi(off) redefined
to VI(off) off-state input voltage, ICEO updated, fT added
• Section 8 “Test information”: added
• Section 9 “Package outline”: superseded by minimized package outline drawing
• Section 10 “Packing information”: added
• Section 11 “Soldering”: added
• Section 13 “Legal information”: updated
PEMB2_PUMB2 v.2
20031015
Product data sheet
-
PUMB2 v.1
PEMB2 v.1
PEMB2 v.1
PUMB2 v.1
20010914
19910803
Product specification
Product specification
-
-
-
-
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
11 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
13.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
12 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PEMB2_PUMB2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
13 of 14
PEMB2; PUMB2
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2011
Document identifier: PEMB2_PUMB2
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明