PUMD16,115 [NXP]
PEMD16; PUMD16 - NPN/PNP resistor-equipped transistors; R1 = 22 k Ohm, R2 = 47 k Ohm TSSOP 6-Pin;
| 型号： | PUMD16,115 |
| 厂家： | 
NXP |
| 描述： | PEMD16; PUMD16 - NPN/PNP resistor-equipped transistors; R1 = 22 k Ohm, R2 = 47 k Ohm TSSOP 6-Pin |
| 文件： | 总11页 (文件大小：86K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PEMD16; PUMD16
NPN/PNP resistor-equipped transistors;
R1 = 22 k, R2 = 47 k
Rev. 3 — 28 June 2011
Product data sheet
1. Product profile
1.1 General description
NPN/PNP resistor-equipped transistors.
Table 1. Product overview
Type number
Package
NXP
PNP/PNP
complement
NPN/NPN
complement
JEITA
-
PEMD16
PUMD16
SOT666
SOT363
PEMB16
PUMB16
PEMH16
PUMH16
SC-88
1.2 Features and benefits
Built-in bias resistors
Simplifies circuit design
Reduces component count
Reduces pick and place cost
1.3 Applications
Low current peripheral driver
Control of IC inputs
Replacement of general-purpose transistors in digital applications
1.4 Quick reference data
Table 2.
Symbol
VCEO
IO
Quick reference data
Parameter
Conditions
Min
-
Typ
-
Max
50
Unit
V
collector-emitter voltage
output current
open base
-
-
100
28.6
2.6
mA
k
R1
bias resistor 1 (input)
bias resistor ratio
15.4
1.7
22
2.1
R2/R1
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
2. Pinning information
Table 3.
Pinning
Pin
1
Description
Simplified outline
Graphic symbol
GND (emitter) TR1
input (base) TR1
output (collector) TR2
GND (emitter) TR2
input (base) TR2
output (collector) TR1
6
5
4
6
5
4
2
3
R1
R2
4
TR2
5
TR1
1
2
3
6
R2
R1
001aab555
1
2
3
006aaa143
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
-
Description
Version
SOT666
SOT363
PEMD16
PUMD16
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
SC-88
4. Marking
Table 5.
Marking codes
Type number
PEMD16
Marking code[1]
5H
PUMD16
D1*
[1] * = placeholder for manufacturing site code
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
2 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor; for the PNP transistor with negative polarity
VCBO
VCEO
VEBO
VI
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage TR1
positive
open emitter
open base
-
-
-
50
50
5
V
V
V
open collector
-
-
+40
V
V
negative
7
input voltage TR2
positive
-
-
-
-
+7
V
negative
40
100
100
V
IO
output current
mA
mA
ICM
Ptot
peak collector current
total power dissipation
SOT363
Tamb 25 C
[1]
-
200
mW
mW
C
[1][2]
SOT666
-
200
Tstg
storage temperature
junction temperature
ambient temperature
65
-
+150
150
Tj
C
Tamb
65
+150
C
Per device
Ptot
total power dissipation
SOT363
Tamb 25 C
[1]
-
-
300
300
mW
mW
[1][2]
SOT666
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
3 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
6. Thermal characteristics
Table 7.
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
Rth(j-a)
thermal resistance from
in free air
junction to ambient
[1]
SOT363
-
-
-
-
625
625
K/W
K/W
[1][2]
SOT666
Per device
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1]
SOT363
SOT666
-
-
-
-
416
416
K/W
K/W
[1][2]
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Per transistor; for the PNP transistor with negative polarity
ICBO
collector-base cut-off VCB = 50 V; IE = 0 A
current
-
-
100
nA
ICEO
collector-emitter
cut-off current
VCE = 30 V; IB = 0 A
-
-
-
-
1
A
A
VCE = 30 V; IB = 0 A;
50
Tj = 150 C
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A
-
-
120
A
hFE
DC current gain
VCE = 5 V; IC = 5 mA
80
-
-
-
-
VCEsat
collector-emitter
IC = 10 mA; IB = 0.5 mA
150
mV
saturation voltage
VI(off)
VI(on)
R1
off-state input voltage VCE = 5 V; IC = 100 A
on-state input voltage VCE = 0.3 V; IC = 2 mA
bias resistor 1 (input)
-
0.8
1.1
22
0.5
-
V
2
V
15.4
1.7
28.6
2.6
k
R2/R1
Cc
bias resistor ratio
2.1
collector capacitance VCB = 10 V;
IE = ie = 0 A; f = 1 MHz
TR1 (NPN)
TR2 (PNP)
-
-
-
-
2.5
3
pF
pF
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
4 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
006aaa174
006aaa175
3
3
10
10
(1)
h
FE
V
(2)
(3)
CEsat
(mV)
2
10
2
10
(2) (1)
(3)
10
1
10
10
−1
2
2
1
10
10
1
10
10
I
(mA)
I (mA)
C
C
VCE = 5 V
amb = 100 C
IC/IB = 20
(1)
T
(1) Tamb = 100 C
(2) Tamb = 25 C
(3) Tamb = 40 C
(2) Tamb = 25 C
(3) Tamb = 40 C
Fig 1. TR1 (NPN): DC current gain as a function of
collector current; typical values
Fig 2. TR1 (NPN): Collector-emitter saturation
voltage as a function of collector current;
typical values
006aaa176
006aaa177
10
10
V
I(on)
V
I(off)
(V)
(V)
(1)
(1)
1
1
(2)
(3)
(2)
(3)
−1
10
−1
10
10
10
−1
2
−2
−1
10
1
10
10
1
10
I
(mA)
I (mA)
C
C
VCE = 0.3 V
amb = 40 C
VCE = 5 V
amb = 40 C
(2) Tamb = 25 C
(3) Tamb = 100 C
(1)
T
(1) T
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 3. TR1 (NPN): On-state input voltage as a
function of collector current; typical values
Fig 4. TR1 (NPN): Off-state input voltage as a
function of collector current; typical values
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
5 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
006aaa198
006aaa199
3
3
10
−10
h
FE
(1)
V
(mV)
CEsat
(2)
(3)
2
10
2
−10
(1)
(2)
(3)
10
1
−10
−10
−1
2
−1
2
−1
−10
−10
−10
−1
−10
−10
I
(mA)
I (mA)
C
C
VCE = 5 V
amb = 100 C
IC/IB = 20
(1) Tamb = 100 C
(1)
T
(2) Tamb = 25 C
(3) Tamb = 40 C
(2) Tamb = 25 C
(3) Tamb = 40 C
Fig 5. TR2 (PNP): DC current gain as a function of
collector current; typical values
Fig 6. TR2 (PNP): Collector-emitter saturation
voltage as a function of collector current;
typical values
006aaa200
006aaa201
4
4
−10
−10
V
I(on)
V
I(off)
(mV)
(mV)
(1)
(2)
3
3
(1)
(2)
−10
−10
(3)
(3)
2
2
−10
−10
−1
2
−2
−1
−10
−1
−10
−10
−10
−10
−1
−10
I
(mA)
I (mA)
C
C
VCE = 0.3 V
amb = 40 C
VCE = 5 V
amb = 40 C
(2) Tamb = 25 C
(3) Tamb = 100 C
(1)
T
(1) T
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 7. TR2 (PNP): On-state input voltage as a
function of collector current; typical values
Fig 8. TR2 (PNP): Off-state input voltage as a
function of collector current; typical values
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
6 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
8. Package outline
2.2
1.8
1.1
0.8
1.7
1.5
0.6
0.5
0.45
0.15
6
5
4
6
5
4
0.3
0.1
2.2 1.35
2.0 1.15
1.7 1.3
1.5 1.1
pin 1
index
pin 1 index
1
2
3
1
2
3
0.25
0.10
0.3
0.2
0.18
0.08
0.27
0.17
0.65
0.5
1.3
1
Dimensions in mm
06-03-16
Dimensions in mm
04-11-08
Fig 9. Package outline SOT363 (SC-88)
Fig 10. Package outline SOT666
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number
Package Description
Packing quantity
3000
-
4000
10000
-
PEMD16
PUMD16
SOT666 4 mm pitch, 8 mm tape and reel
SOT363 4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-115
[2]
[3]
-115
-125
-
-
-135
-165
[1] For further information and the availability of packing methods, see Section 12.
[2] T1: normal taping
[3] T2: reverse taping
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
7 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
10. Revision history
Table 10. Revision history
Document ID
Release date
20110628
Data sheet status
Change notice
Supersedes
PEMD16_PUMD16 v.3
Modifications:
Product data sheet
-
PEMD16_PUMD16 v.2
• The format of this document has been redesigned to comply with the new identity
guidelines of NXP Semiconductor.
• Legal texts have been adapted to the new company name where appropriate.
• Figure 9 “Package outline SOT363 (SC-88)” is updated.
• Section 11 “Legal information” is updated.
PEMD16_PUMD16 v.2
PUMD16 v.1
20050607
Product data sheet
-
PUMD16 v.1
20031022
Product specification
-
-
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
8 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
9 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PEMD16_PUMD16
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 28 June 2011
10 of 11
PEMD16; PUMD16
NXP Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 June 2011
Document identifier: PEMD16_PUMD16
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SI9122E
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