PUMH19,115 [NXP]

PEMH19; PUMH19 - NPN/NPN resistor-equipped transistors; R1 = 22 kOhm, R2 = open TSSOP 6-Pin;


型号：	PUMH19,115
厂家：	NXP
描述：	PEMH19; PUMH19 - NPN/NPN resistor-equipped transistors; R1 = 22 kOhm, R2 = open TSSOP 6-Pin
文件：	总8页 (文件大小：85K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PEMH19; PUMH19

NPN/NPN resistor-equipped transistors;

R1 = 22 kΩ, R2 = open

Rev. 03 — 15 November 2009

Product data sheet

1. Product profile

1.1 General description

NPN/NPN Resistor-Equipped Transistors (RET).

Table 1. Product overview

Type number

Package

NXP

NPN/PNP

complement

PNP/PNP

complement

JEITA

PEMH19

PUMH19

SOT666

SOT363

PEMD19

PUMD19

PEMB19

PUMB19

SC-88

1.2 Features

Built-in bias resistor

Simplifies circuit design

Reduces component count

Reduces pick and place costs

1.3 Applications

Low current peripheral driver

Control of IC inputs

Replaces general-purpose transistors in digital applications

1.4 Quick reference data

Table 2.

Symbol

V_CEO

I_O

Quick reference data

Parameter

Conditions

Min

Typ

Max

Unit

collector-emitter voltage

output current (DC)

bias resistor 1 (input)

open base

100

28.6

kΩ

15.4

PEMH19; PUMH19

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 22 kΩ, R2 = open

2. Pinning information

Table 3.

Pinning

Description

Simplified outline

Symbol

GND (emitter) TR1

input (base) TR1

output (collector) TR2

GND (emitter) TR2

input (base) TR2

output (collector) TR1

TR2

TR1

001aab555

sym090

3. Ordering information

Table 4.

Ordering information

Type number Package

Name

Description

Version

SOT666

SOT363

PEMH19

PUMH19

plastic surface mounted package; 6 leads

SC-88

4. Marking

Table 5.

Marking codes

Type number

PEMH19

Marking code^[1]

PUMH19

H6*

[1] * = -: made in Hong Kong

* = p: made in Hong Kong

* = t: made in Malaysia

* = W: made in China

PEMH19_PUMH19_3

Product data sheet

Rev. 03 — 15 November 2009

2 of 8

PEMH19; PUMH19

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 22 kΩ, R2 = open

5. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Per transistor

V_CBO

V_CEO

V_EBO

I_O

collector-base voltage

open emitter

open base

collector-emitter voltage

emitter-base voltage

output current (DC)

peak collector current

total power dissipation

SOT363

open collector

100

I_CM

P_tot

T_amb≤ 25 °C

[1]

200

°C

[1][2]

SOT666

200

T_stg

storage temperature

junction temperature

ambient temperature

−65

+150

150

T_j

°C

T_amb

−65

+150

°C

Per device

P_tot

total power dissipation

SOT363

T_amb≤ 25 °C

[1]

300

[1][2]

SOT666

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Reflow soldering is the only recommended soldering method.

6. Thermal characteristics

Table 7.

Symbol

Per transistor

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

Unit

R_th(j-a)

thermal resistance from in free air

junction to ambient

[1]

SOT363

SOT666

625

K/W

[1][2]

Per device

R_th(j-a)

thermal resistance from in free air

junction to ambient

[1]

SOT363

SOT666

416

K/W

[1][2]

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Reflow soldering is the only recommended soldering method.

PEMH19_PUMH19_3

Product data sheet

Rev. 03 — 15 November 2009

3 of 8

PEMH19; PUMH19

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 22 kΩ, R2 = open

7. Characteristics

Table 8.

Characteristics

_amb= 25 °C unless otherwise specified.

Symbol Parameter Conditions

Per transistor

I_CBO

Min

Typ

Max

Unit

collector-base cut-off V_CB= 50 V; I_E= 0 A

current

100

I_CEO

collector-emitter

cut-off current

V_CE= 30 V; I_B= 0 A

μA

V_CE= 30 V; I_B= 0 A;

T_j= 150 °C

I_EBO

emitter-base cut-off

current

V_EB= 5 V; I_C= 0 A

100

h_FE

DC current gain

V_CE= 5 V; I_C= 1 mA

100

V_CEsat

collector-emitter

I_C= 10 mA; I_B= 0.5 mA

150

saturation voltage

C_c

bias resistor 1 (input)

15.4

28.6

2.5

kΩ

collector capacitance V_CB= 10 V; I_E= i_e= 0 A;

f = 1 MHz

006aaa172

006aaa173

500

(1)

(2)

CEsat

400

300

200

100

(mV)

(2) (1)

(3)

−1

(mA)

I (mA)

V_CE= 5 V

I_C/I_B= 20

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= −40 °C

Fig 1. DC current gain as a function of collector

current; typical values

Fig 2. Collector-emitter saturation voltage as a

function of collector current; typical values

PEMH19_PUMH19_3

Product data sheet

Rev. 03 — 15 November 2009

4 of 8

PEMH19; PUMH19

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 22 kΩ, R2 = open

8. Package outline

2.2

1.8

1.1

0.8

1.7

1.5

0.6

0.5

0.45

0.15

0.3

0.1

2.2 1.35

2.0 1.15

1.7 1.3

1.5 1.1

pin 1

index

pin 1 index

0.25

0.10

0.3

0.2

0.18

0.08

0.27

0.17

0.65

0.5

1.3

Dimensions in mm

06-03-16

Dimensions in mm

04-11-08

Fig 3. Package outline SOT363 (SC-88)

Fig 4. Package outline SOT666

9. Packing information

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number Package Description Packing quantity

3000 4000 8000 10000

PEMH19

SOT666 2 mm pitch, 8 mm tape and reel

-315

4 mm pitch, 8 mm tape and reel

SOT363 4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

-115

[2]

[3]

PUMH19

-115

-125

-135

-165

[1] For further information and the availability of packing methods, see Section 12.

[2] T1: normal taping

[3] T2: reverse taping

PEMH19_PUMH19_3

Product data sheet

Rev. 03 — 15 November 2009

5 of 8

PEMH19; PUMH19

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 22 kΩ, R2 = open

10. Revision history

Table 10. Revision history

Document ID

Release date

20091115

Data sheet status

Change notice

Supersedes

PEMH19_PUMH19_3

Modifications:

Product data sheet

PEMH19_PUMH19_2

• This data sheet was changed to reflect the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technical

content.

• Figure 3 “Package outline SOT363 (SC-88)”: updated

PEMH19_PUMH19_2

PUMH19_1

20050502

Product data sheet

PUMH19_1

20031016

Product specification

PEMH19_PUMH19_3

Product data sheet

Rev. 03 — 15 November 2009

6 of 8

PEMH19; PUMH19

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 22 kΩ, R2 = open

11. Legal information

11.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between information in this document and such

terms and conditions, the latter will prevail.

11.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

PEMH19_PUMH19_3

Product data sheet

Rev. 03 — 15 November 2009

7 of 8

PEMH19; PUMH19

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 22 kΩ, R2 = open

13. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

Packing information . . . . . . . . . . . . . . . . . . . . . 5

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.1

11.2

11.3

11.4

Contact information. . . . . . . . . . . . . . . . . . . . . . 7

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 November 2009

Document identifier: PEMH19_PUMH19_3

PUMH19,115 [NXP]

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