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PUSBMXX4-TL_15 [NXP]

High-speed USB OTG ESD protection diode arrays;
PUSBMXX4-TL_15
型号： PUSBMXX4-TL_15
厂家： NXP    NXP
描述：

High-speed USB OTG ESD protection diode arrays
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PUSBMxX4-TL series  
High-speed USB OTG ESD protection diode arrays  
HXSON6  
Rev. 3 — 14 June 2012  
Product data sheet  
1. Product profile  
1.1 General description  
PUSBMxX4-TL is a series of four 4-channel ElectroStatic Discharge (ESD) diode arrays  
for USB 2.0 (On-The-Go (OTG)) interfaces. The devices provide protection to  
downstream components from ESD voltages up to 8 kV contact discharge. They offer  
three low capacitance ESD protection pins and one VBUS protection diode. They are  
encapsulated in an ultra thin DFN1616-6 (SOT1189-1/XSON6) plastic package with  
0.5 mm pitch. These features make the devices ideal for use in applications requiring  
component miniaturization, such as mobile phone handsets.  
1.2 Features and benefits  
Pb-free, Restriction of Hazardous Substances (RoHS) and Dark Green compliant  
ESD protection according to IEC 61000-4-2 level 4: 8 kV contact discharge  
Electrical Fast Transients (EFT) protection according to IEC 61000-4-4 40A (5/50 ns)  
Three pairs of ultra low capacitance (1.1 pF typ.) rail-to-rail ESD protection diodes  
Ultra thin DFN1616-6 (SOT1189-1/XSON6) plastic package; 0.5 mm pitch  
1.3 Applications  
High-speed USB 2.0 and USB OTG connector ESD protection in:  
Cellular phone and Personal Communication System (PCS) mobile handsets  
Mobile internet devices  
Digital still cameras  
Portable media players  
2. Pinning information  
Table 1.  
Pinning  
Description  
Pin  
1
Simplified outline  
Graphic symbol  
low capacitance ESD protection  
low capacitance ESD protection  
low capacitance ESD protection  
not connected  
6
6
5
7
2
4
3
2
3
1
2
3
4
5
not connected  
1
center pad  
6
VBUS ESD protection  
ground (GND)  
018aaa140  
7
Transparent top view  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
3. Ordering information  
Table 2.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
DFN1616-6  
plastic, thermal enhanced extremely thin small outline package;  
no leads; 6 terminals; body 1.6 × 1.6 × 0.5 mm  
SOT1189-1  
4. Marking  
Table 3.  
Marking codes  
Type number  
Marking code  
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
XE  
XL  
XO  
30  
5. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
−0.5  
−0.5  
−0.5  
−0.5  
−0.5  
-
Max  
+5.5  
+5.5  
+12  
+15  
+30  
8
Unit  
V
VRWM  
reverse standoff voltage  
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
pins 1, 2, 3  
pin 6 (VBUS  
pin 6 (VBUS  
pin 6 (VBUS  
pin 6 (VBUS  
)
V
)
)
)
V
V
V
[1]  
VESD  
PPP  
electrostatic discharge  
voltage  
IEC 61000-4-2, level 4; pins 1, 2, 3, 6 to GND;  
contact discharge  
kV  
peak pulse power  
tp = 8/20 μs  
pins 1, 2, 3; VCL = 12 V  
pin 6 (VBUS); VCL = 9.2 V  
pin 6 (VBUS); VCL = 16 V  
pin 6 (VBUS); VCL = 22 V  
pin 6 (VBUS); VCL = 43 V  
tp = 8/20 μs  
-
-
-
-
-
35  
W
W
W
W
W
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
peak pulse current  
100  
100  
100  
100  
IPP  
pins 1, 2, 3  
-
-
-
-
-
3
A
A
A
A
A
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
pin 6 (VBUS  
pin 6 (VBUS  
pin 6 (VBUS  
pin 6 (VBUS  
)
)
)
)
12  
6
3
2
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
2 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
Table 4.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Treflow(peak)  
Tamb  
Parameter  
Conditions  
Min  
-
Max  
+260  
+85  
Unit  
°C  
peak reflow temperature tp ≤ 10 s  
ambient temperature  
−30  
−55  
°C  
Tstg  
storage temperature  
+150  
°C  
[1] Device is qualified with 1000 pulses of 8 kV contact discharges each, according to IEC61000-4-2 far exceeding level 4 ( 8 kV contact  
discharge).  
6. Characteristics  
Table 5.  
Characteristics  
Tamb = 25 °C unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VF  
forward voltage  
0.6  
-
1.2  
V
Low capacitance ESD protection  
VBRzd  
Zener diode breakdown  
voltage  
Itest = 1 mA  
6
-
-
10  
V
[1]  
C(I/O-GND)  
input/output to ground  
capacitance  
Vbias(DC) = 0.5 V; f = 1 MHz;  
pins 1, 2, 3 to GND  
1.1  
0.02  
0.5  
100  
1.3  
pF  
pF  
pF  
nA  
ΔC(I/O-GND) input/output to ground  
Vbias(DC) = 0.5 V; f = 1 MHz  
-
-
capacitance variation  
C(I/O-I/O)  
input/output to input/output  
capacitance  
Vbias(DC) = 0.5 V; f = 1 MHz;  
pins 1 to 2, 1 to 3, 2 to 3  
-
-
IRM  
reverse leakage current  
pins 1, 2, 3 to GND; VRWM = 5.5 V  
-
1000  
VBUS ESD protection  
VBR breakdown voltage  
pin 6 (VBUS) to GND; Itest = 1 mA  
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
diode capacitance  
6.4  
12.5  
17  
6.8  
14.5  
18  
7.2  
16  
19  
40  
V
V
V
V
32  
36  
Cd  
Vbias(DC) = 0.5 V; f = 1 MHz;  
pin 6 (VBUS) to GND  
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
reverse leakage current  
PUSBM5V5X4-TL  
PUSBM12VX4-TL  
PUSBM15VX4-TL  
PUSBM30VX4-TL  
-
-
-
-
165  
73  
220  
100  
90  
pF  
pF  
pF  
pF  
60  
50  
70  
IRM  
pin 6 (VBUS) to GND  
VRWM = 5.5 V  
VRWM = 12 V  
-
-
-
-
200  
1
500  
100  
100  
100  
nA  
nA  
nA  
nA  
VRWM = 15 V  
1
VRWM = 30 V  
1
[1] Guaranteed by design.  
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
3 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
7. Application information  
7.1 Typical application  
The devices are designed to protect USB interfaces from downstream ESD. They offer  
three low capacitance ESD protection channels for D−, D+ and ID and a high-voltage  
ESD protection channel for VBUS  
.
1
2
3
4
5
V
BUS  
D–  
D+  
ID  
GND  
PUSBMxX4-TL  
MICRO-USB  
1
2
3
6
5
4
7
018aaa141  
Fig 1. Application diagram (transparent package top view)  
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
4 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
7.2 Insertion loss  
The setup for measuring frequency response curves in a 50 Ω system is shown in  
Figure 2. The frequency response curves for the low capacitance ESD protection  
channels (pins 1 to 3) are depicted in Figure 3.  
018aaa166  
5
α
il  
(dB)  
0
(2)  
(3)  
-5  
-10  
-15  
DUT  
(1)  
IN  
OUT  
50 Ω  
50 Ω  
TEST BOARD  
V
gen  
2
3
4
1
10  
10  
10  
10  
f (MHz)  
018aaa016  
(1) Pin 1  
(2) Pin 2  
(3) Pin 3  
Fig 2. Frequency response setup  
Fig 3. Frequency response curves  
8. Package outline  
ꢈꢉꢎ  
ꢈꢉꢍ  
ꢋꢉꢍ  
ꢂꢏꢐ  
ꢋꢉꢋꢍ  
ꢂꢏꢐ  
ꢋꢉꢒ  
ꢋꢉꢓ  
ꢋꢉꢊ  
ꢋꢉꢌ  
ꢊ
ꢓ
ꢈꢉꢊ  
ꢈꢉꢈ  
ꢈꢉꢎ  
ꢈꢉꢍ  
ꢈ
ꢋꢉꢍ  
ꢈ
ꢒ
ꢋꢉꢌ  
ꢂꢁꢄ  
ꢋꢉꢊꢍ  
ꢋꢉꢌꢍ  
ꢋꢉꢈꢌꢎ  
ꢀꢁꢂꢃꢄꢅꢁꢆꢄꢅꢇꢁꢄꢇꢂꢂ  
ꢈꢌꢑꢋꢍꢑꢈꢒ  
Fig 4. Package outline DFN1616-6 (SOT1189-1/XSON6)  
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
5 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
9. Soldering  
Footprint information for reflow soldering of HXSON6 package  
SOT1189-1  
Hx  
Gx  
P
D
By  
Hy Ay  
SPy  
SLy  
Gy  
SPx  
SLx  
solder land  
solder land plus solder paste  
occupied area  
solder resist  
DIMENSIONS in mm  
Ay By  
P
D
SLx SLy  
SPx  
0.4  
SPy  
0.2  
Gx  
Gy  
Hx  
Hy  
0.50 1.85 1.05 0.25 1.3  
0.8  
1.5 1.85 1.85 2.1  
11-06-27  
Issue date  
sot1189-1_fr  
11-07-06  
Fig 5. Reflow soldering footprint DFN1616-6 (SOT1189-1/XSON6)  
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
6 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
10. Revision history  
Table 6.  
Document ID  
PUSBMXX4-TL_SER v.3 20120614  
Modifications:  
Revision history  
Release date  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
PUSBMXX4-TL_SER v.2  
• Section 2 “Pinning information”: simplified outline graph updated  
• Figure 1 updated  
• Figure 4 replaced by minimized package outline  
PUSBMXX4-TL_SER v.2 20120416  
Preliminary data sheet  
-
PUSBMXX4-TL_SER v.1  
-
PUSBMXX4-TL_SER v.1 20111209  
Preliminary data sheet  
-
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
7 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
11. Legal information  
11.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
11.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
11.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
8 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
11.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
12. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
PUSBMXX4-TL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 14 June 2012  
9 of 10  
PUSBMxX4-TL series  
NXP Semiconductors  
High-speed USB OTG ESD protection diode arrays  
13. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
2
3
4
5
6
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
7.1  
7.2  
Application information. . . . . . . . . . . . . . . . . . . 4  
Typical application . . . . . . . . . . . . . . . . . . . . . . 4  
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7  
9
10  
11  
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
11.1  
11.2  
11.3  
11.4  
12  
13  
Contact information. . . . . . . . . . . . . . . . . . . . . . 9  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 14 June 2012  
Document identifier: PUSBMXX4-TL_SER  

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SI9135LG-T1-E3

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SI9135_11

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SI9136_11

 Multi-Output Power-Supply Controller

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SI9130CG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

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SI9130LG-T1-E3

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SI9130_11

 Pin-Programmable Dual Controller - Portable PCs

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SI9137

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

 500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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VISHAY
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