SA3600DH [NXP]
IC SPECIALTY TELECOM CIRCUIT, PDSO24, PLASTIC, SOT-355-1, TSSOP-24, Telecom IC:Other;型号: | SA3600DH |
厂家: | NXP |
描述: | IC SPECIALTY TELECOM CIRCUIT, PDSO24, PLASTIC, SOT-355-1, TSSOP-24, Telecom IC:Other |
文件: | 总30页 (文件大小:175K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
SA3600
Low voltage dual-band RF front-end
Product specification
1999 Nov 02
Supersedes data of 1999 March 18
Philips
Semiconductors
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
DESCRIPTION
APPLICATIONS
The SA3600 is an integrated dual-band RF front-end that operates at
both cellular (AMPS and TDMA) and PCS (TDMA) frequencies, and
• 800 to 1000 MHz analog and digital receivers
• 1800 to 2000 MHz digital receivers
• Portable radios
is designed in a 20 GHz f BiCMOS process—QUBiC2.
T
The low-band (LB) receiver is a combined low-noise amplifier (LNA)
and mixer. The LNA has a 1.7 dB noise figure (NF) at 881 MHz with
17 dB of gain and an IIP3 of –7 dBm. The wide-dynamic range mixer
has a 9.5 dB NF at 881 MHz with 9.5 dB of gain and an IIP3 of
+6 dBm.
• Mobile communications equipment
PIN CONFIGURATION
The high-band (HB) receiver is a combined low-noise amplifier (LNA)
and mixer, with the low-band and high-band mixers sharing the same
mixer output. The LNA has a 2.2 dB NF at 1960 MHz with 16 dB of
gain and an IIP3 of –5 dBm. The wide-dynamic range mixer has a 8.5
dB NF at 1960 MHz with 8.5 dB of gain and an IIP3 of +5.5 dBm.
LB_LNA_OUT
HB_LNA_OUT
GND
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
GND
HB_LNA_IN
LB_LNA_IN
V
V
CC
CC
HB_MXR+_IN
HB_MXR–_IN
PD1
LB_MXR_IN
GND
FEATURES
• Low current consumption: LB I = 14.5 mA; HB I = 20.5 mA
CC
CC
MXR+_OUT
MXR–_OUT
GND
• Outstanding low- and high-band noise figure
GND
• LNAs with gain control (30 dB gain step)
• LO input and output buffers
HB_VCO_OUT
PD2 10
GND 11
15 LB_VCO_IN
14 PD3
• Selectable frequency doubler
LB_VCO_OUT
HB_VCO_IN
SR01596
12
13
• On chip logic for network selection and power down
• Very small outline package
ORDERING INFORMATION
PACKAGE
DESCRIPTION
TYPE NUMBER
NAME
VERSION
SA3600
TSSOP24
Plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355–1
PIN DESCRIPTIONS
PIN
PIN
NO.
NO.
13
14
15
16
17
18
19
20
21
22
23
24
PIN NAME
HB_LNA_OUT
GND
DESCRIPTION
PIN NAME
HB_VCO_IN
PD3
DESCRIPTION
Highband VCO input
1
Highband LNA output
Ground
2
Power down control 3
Lowband VCO input
Ground
3
HB_LNA_IN
Vcc
Highband LNA input
Power supply
LB_VCO_IN
GND
4
5
HB_MXR+_IN
HB_MXR–_IN
PD1
Highband mixer positive input
Highband mixer negative input
Power down control 1
Ground
MXR–_OUT
MXR+_OUT
GND
Mixer negative output
Mixer positive output
Ground
6
7
8
GND
LB_MXR_IN
Lowband mixer input
Power supply
9
HB_VCO_OUT
PD2
Highband VCO buffered output
Power down control 2
Ground
V
CC
10
11
12
LB_LNA_IN
GND
Lowband LNA input
Ground
GND
LB_VCO_OUT
Lowband VCO buffered output
LB_LNA_OUT
Lowband LNA output
2
1999 Nov 02
853–2183 22617
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
BLOCK DIAGRAM
LB_LNA_OUT
1
24
23
22
21
20
19
18
17
16
15
14
13
HB_LNA_OUT
2
3
GND
GND
HB_LNA_IN
LB_LNA_IN
4
V
V
CC
CC
SA3600
5
HB_MXR+_IN
HB_MXR–_IN
PD1
LB_MXR_IN
GND
6
7
MXR+_OUT
MXR–_OUT
8
GND
9
HB_VCO_OUT
PD2
GND
10
11
LB_VCO_IN
GND
PD3
x2
LB_VCO_OUT 12
HB_VCO_IN
SR01594
Figure 1.
Block Diagram
MODE SELECT LOGIC
Cel
LNA
Cel
MXR
PCS
LNA
PCS
MXR
x2
DBL
LB LO
O/P
HB LO
O/P
PD1
PD2
PD3
OPERATING MODE
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Sleep mode
off
off
off
on
off
off
off
off
off
off
on
on
off
off
off
off
off
off
off
off
off
on
off
on
off
off
off
off
on
on
on
on
off
off
off
off
on
on
off
off
off
on
on
on
on
on
off
off
off
off
off
off
off
off
on
on
Tx mode, LO lowband buffer
Rx mode cellular, low gain
Rx mode cellular, high gain
Rx mode PCS, low gain, x2
Rx mode PCS, high gain, x2
Rx mode PCS, low gain, no x2
Rx mode PCS, high gain, no x2
3
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
OPERATION
The SA3600 is a highly integrated dual-band radio frequency (RF)
front-end integrated circuit (IC) targeted for TDMA applications. This
IC is split into separate low-band (LB) and high-band (HB) receivers.
The LB receiver contains a low noise amplifier (LNA) and mixer that
are designed to operate in the cellular frequency range
(869–894MHz). The HB receiver contains an LNA and mixer that
are designed to operate in the PCS frequency range
(1930–1990 MHz). The SA3600 also contains a frequency doubler
that can drive the HB mixer local oscillator (LO) port, allowing a
single-band voltage controlled oscillator (VCO) to be used to drive
both mixers. Modes for bypassing the doubler are also provided, in
the case where a dual-band VCO is used.
High-Band Receive Section
The HB circuit contains a LNA followed by a Gilbert cell mixer with
differential inputs. The LNA output uses an internal pull-up inductor
to VCC , which eliminates the need for an external pull-up. The
mixer IF outputs are differential and are combined with the low-band
IF mixer outputs thereby eliminating the need for extra output pins.
Similar to the LB LNA, the HB LNA has two gain settings: high gain
(16 dB) and low gain (–15 dB).
Control Logic Section
Pins PD1, PD2, and PD3, control the logic functions of the SA3600.
The PD1 selects between LB and HB operations. In LB receive
mode, the LB LNA is in high gain mode (or on) when PD1,2,3 are
(0,1,1). In all other modes, the LB LNA is off. The LB mixer is on
when PD1,2,3 are (0,1,X). In all other modes, the LB mixer is off.
During transmit mode when PD1,2,3 are (0,0,1), the LB LO buffer is
on, enabling use of the LO signal for the transmitter.
The SA3600 has eight modes of operation that control the LNAs,
mixers, LO buffers and doubler. The select pins (PD1,2,3) are used
to change modes of operation. The internal select logic powers the
device down (0,0,0), turns on the LB LO buffer for use in transmit
mode (0,0,1), enables cellular receive mode for high and low gain
(0,1,X), enables PCS receive mode for high and low gain both
without doubler (1,1,X) and with doubler (1,0,X).
In HB receive mode, the HB LNA is in high gain mode (or on) when
PD1,2,3 are (1,X,1). In all other modes, the HB LNA is off. The HB
mixer is on when PD1,2,3 are (1,X,X), and is off in all other modes.
The on-chip frequency doubler (X2) is on in (1,0,X) modes. When
the frequency doubler is on, the input signal from the LB LO buffer is
doubled in frequency, which can then be used to drive the HB mixer
LO port. The frequency doubler can also be bypassed in modes
(1,1,X), in which case the HB mixer is driven directly by an external
2 GHz LO signal.
Low-Band Receive Section
The LB circuit contains a LNA followed by a wide dynamic range
active mixer. In a typical application circuit, the LNA output uses an
external pull-up inductor to VCC and is AC coupled. The mixer IF
outputs are differential and are combined with the high-band IF
mixer outputs thereby eliminating the need for extra output pins.
External inductors and capacitors can be used to convert the
differential mixer outputs to single-ended. Furthermore, the LNA
provides two gain settings: high gain (17dB) and low gain (–15 dB).
The desired gain state can be selected by setting the logic pins
(PD1,PD2,PD3) appropriately.
Local Oscillator (LO) Section
The LB LO buffers are on for all modes except sleep mode, when
PD1,2,3 are (0,0,0), and for HB receive mode without doubler,
PD1,2,3 are (1,1,X). The HB LO buffers are on only when PD1,2,3
are (1,1,X). The PD1,2,3 pins are used to power-up/down all LO
input buffers, which minimizes the pulling effect on the external VCO
when entering receive or transmit mode.
4
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
1
ABSOLUTE MAXIMUM RATINGS
LIMITS
SYMBOL
PARAMETER
UNITS
MIN.
–0.3
–0.3
MAX.
V
CC
Supply voltage
Voltage applied to any other pin
Power dissipation, T = +25 °C (still air)
+4.5
V
V
P
V
CC
+0.3
V
mW
°C
IN
555
D
amb
T
J MAX
Maximum junction temperature
Power input/output
150
+20
+10
+150
+85
P
MAX
MAX
dBm
mA
°C
I
DC current into any I/O pin
Storage temperature range
Operating temperature
–10
–65
–40
T
T
STG
°C
O
NOTES:
1. IC is protected against ESD voltages up to 500 V (human body model).
DC ELECTRICAL CHARACTERISTICS
Unless otherwise specified, all Input/Output ports are single-ended.
DC PARAMETERS
V
CC
= +3.0 V, T
= +25°C unless otherwise specified
amb
TEST CONDITIONS
TESTER LIMITS
SYMBOL
PARAMETER
UNIT
PD1
PD2
0
PD3
MIN
TYP
0.1
MAX
Sleep mode
0
0
0
0
1
1
1
1
0
1
0
1
0
1
0
1
1
µA
mA
mA
mA
mA
mA
mA
mA
V
Tx mode, LO lowband buffer
Rx mode cellular, low gain
Rx mode cellular, high gain
Rx mode PCS, low gain, x2
Rx mode PCS, high gain, x2
Rx mode PCS, low gain, no x2
Rx mode PCS, high gain, no x2
Input HIGH voltage
0
4.3
5.5
12
1
10.1
14
1
16.5
21
I
CC
0
17.5
23.5
14.5
20.5
0
28
1
17.5
24.5
1
V
IH
0.5xV
V
+0.3
CC
CC
V
Input LOW voltage
–0.3
–5
0.2xV
+5
V
IL
CC
I
Input bias current
Logic 1 or logic 0
µA
BIAS
5
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
AC ELECTRICAL CHARACTERISTICS
V
CC
= +3.0 V, f = 881 MHz, f = 963 MHz, T = +25°C, unless otherwise specified
RF
LO
amb
LIMITS
TYP
SYMBOL
PARAMETER
TEST CONDITIONS
UNIT
MAX.
MIN.
–3 σ
+3 σ
Cascaded Gain Section
G
G
LB LNA + Mixer, High Gain
LB LNA + Mixer, Low Gain
Filter loss = 3 dB
Filter loss = 3 dB
20.5
23.5
–8.5
26.5
–5.5
dB
dB
SYS
BYP
–11.5
Low-band LNA Section
f
RF input frequency range
Small signal gain ENABLED
Noise figure ENABLED
869
894
MHz
dB
RF
G
16.1
1.5
17
1.7
–7
17.9
1.9
ENA
NF
dB
ENA
IIP3
Input 3rd order Intercept Point
Input 1 dB Compression Point
Small signal gain BYPASSED
Noise figure BYPASSED
–8.1
–5.9
dBm
dBm
dB
ENA
P1dB
–20
–15
15
ENA
G
BYP
NF
dB
BYP
IIP3
Input 3rd order Intercept Point
15
dBm
dB
BYP
IN
2
Z
Input return loss
50 Ω system
50 Ω system
10
2
Z
OUT
Output return loss
10
dB
1
T
SW
ENABLE/DISABLE speed
20
µs
Low-band Mixer Section
f
RF input frequency range
IF output frequency range
LO input range
869
70
894
200
MHz
MHz
MHz
dB
RF
f
IF
f
LO
939
1100
G
Small signal gain
P
P
P
P
= –5 dBm
= –5 dBm
= –5 dBm
= –5 dBm
9
9.5
9.5
6
10
10.4
6.9
MXR
LO
LO
LO
LO
NF
SSB Noise figure
8.6
5.1
dB
MXR
IIP3
Input 3rd order Intercept Point
Input 1 dB Compression Point
LO input power range
dBm
dBm
dBm
dB
MXR
P1dB
–14
–5
10
10
MXR
P
–7
–3
LO
2
Z
Input return loss
50 Ω system
50 Ω system
IN
2
Z
OUT
Output return loss
dB
Two-tone spurious rejection:
P
LO
= –5 dBm
f
f
=890.0 MHz @–36 dBm
=848.9 MHz @–20 dBm
RF
Tx
2(f –f ), f –f =f /2
–110
–110
RF Tx RF Tx IF
2-Tone
dBm
f
RF
=876.3 MHz @–36 dBm
=848.9 MHz @–20 dBm
3(f –f ), f –f =f /3
RF Tx RF Tx IF
f
Tx
RF–LO
LO–RF
RF to LO isolation
25
40
dB
dB
µs
LO to RF isolation
1
T
SW
ENABLE/DISABLE speed
20
Low-band LO Buffer Section
P
LO Input frequency range
LO Input power
939
–7
1100
–3
MHz
dBm
dBm
dB
LO
P
50 Ω matched LB_VCO_IN
50 Ω matched LB_VCO_OUT
50 Ω system
–5
–7.5
10
IN
P
OUT
LO Output power
–8
–7
2
Z
Input return loss
IN
2
Z
OUT
Output return loss
50 Ω system
10
dB
Harmonic content
P
LO
= –5 dBm
–20
dBc
µs
1
T
SW
ENABLE/DISABLE speed
20
6
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
AC ELECTRICAL CHARACTERISTICS
V
CC
= +3.0 V, f = 1960 MHz, f = 2042 MHz, T = +25°C, unless otherwise specified
RF
LO
amb
LIMITS
TYP
SYMBOL
PARAMETER
TEST CONDITIONS
UNIT
MIN.
–3 σ
+3 σ
MAX.
Cascaded Gain Section
G
G
HB LNA + Mixer, High Gain
HB LNA + Mixer, Low Gain
Filter loss = 3 dB
Filter loss = 3 dB
18.5
21.5
–9.5
24.5
–6.5
dB
dB
SYS
BYP
–12.5
High-band LNA Section
f
RF input frequency range
Small signal gain ENABLED
Noise figure ENABLED
1930
1990
MHz
dB
RF
G
15
1.9
16
2.2
–5
17
2.5
ENA
NF
dB
ENA
IIP3
Input 3rd order Intercept Point
Input 1 dB Compression Point
Small signal gain BYPASSED
Noise figure BYPASSED
–6.5
–3.5
dBm
dBm
dB
ENA
P1dB
–14
–15
15
ENA
G
BYP
NF
dB
BYP
IIP3
Input 3rd order Intercept Point
15
dBm
dB
BYP
2
Z
IN
Input return loss
50 Ω system, ENA and BYP
50 Ω system, ENA and BYP
10
Z
OUT
Output return loss
10
dB
1
T
SW
ENABLE/DISABLE speed
20
µs
High-band Mixer Section
f
RF input frequency range
IF output frequency range
LO input range
1930
70
1990
200
MHz
MHz
MHz
dB
RF
f
IF
f
LO
2000
2190
G
Small signal gain
P
LO
P
LO
P
LO
P
LO
P
LO
P
LO
= –5 dBm
= –5 dBm
= –5 dBm
= –5 dBm
= –5 dBm
= –5 dBm
7.8
7.6
8.1
4
8.5
8.5
9
9.2
9.4
9.9
7
MXR
SSB Noise figure, doubler off
SSB Noise figure, doubler on
dB
NF
MXR
dB
Input 3rd order Intercept Point, doubler off
Input 3rd order Intercept Point, doubler on
Input 1 dB Compression Point
5.5
3
dBm
dBm
dBm
IIP3
MXR
1.9
4.1
P1dB
–14
MXR
Half-IF spurious rejection
2(f –f ), f –f =f /2, doubler off
RF LO RF LO IF
–90
–85
f
f
=1972.0 MHz @–36 dBm
RF
f
IF/2 rej.
IF/3 rej.
dBm
dBm
=2013.1 MHz @–5 dBm
LO
Half-IF spurious rejection
2(f –f ), f –f =f /2, doubler on
RF LO RF LO IF
Third-IF spurious rejection
3(f –f ), f –f =f /3
RF LO RF LO IF
=1985.7 MHz @–36 dBm
RF
–114
f
=2013.1 MHz @–5 dBm
LO
Two-tone spurious rejection:
P
LO
= –5 dBm,
f
f
=1933.0 MHz @–36 dBm
=1850.8 MHz @–20 dBm
RF
Tx
f
–f , f –f =f
–70
–115
–125
RF Tx RF Tx IF
2-tone
f
RF
=1951.0 MHz @–36 dBm
=1909.9 MHz @–20 dBm
dBm
2(f –f ), f –f =f /2
RF Tx RF Tx IF
f
Tx
f
RF
=1937.3 MHz @–36 dBm
=1909.9 MHz @–20 dBm
3(f –f ), f –f =f /3
RF Tx RF Tx IF
f
Tx
P
LO input power range
–7
–5
10
10
40
30
–3
20
dBm
dB
dB
dB
dB
µs
LO
2
Z
Input return loss
50 Ω system
50 Ω system
IN
2
Z
OUT
Output return loss
RF–LO
LO–RF
RF to LO isolation
LO to RF isolation
1
T
SW
ENABLE/DISABLE speed
7
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
AC ELECTRICAL CHARACTERISTICS
V
CC
= +3.0 V, T = +25°C, unless otherwise specified
amb
LIMITS
TYP
SYMBOL
PARAMETER
TEST CONDITIONS
UNITS
MAX.
MIN.
–3 σ
+3 σ
High-band LO Buffer Section
P
LO Input frequency range
LO Input power
2000
–7
2190
–3
MHz
dBm
dBm
dB
LO
P
50 Ω matched HB_VCO_IN
50 Ω matched HB_VCO_OUT
50 Ω system
–5
–8
IN
P
OUT
LO Output power
–8.8
–7.2
2
Z
Input return loss
10
IN
2
Z
OUT
Output return loss
50 Ω system
10
dB
Harmonic content
P
LO
= –5 dBm
–20
dBc
µs
1
T
SW
ENABLE/DISABLE speed
20
x2 LO Doubler Section
f
LO Input frequency
LO Input power
1000
–7
1095
–3
MHz
dBm
dB
LO
P
Z
50 Ω matched LB_VCO_IN
50 Ω system
–5
10
10
IN
2
Input return loss
IN
2
Z
OUT
Output return loss
50 Ω system
dB
1
T
SW
ENABLE/DISABLE speed
20
µs
NOTES:
1. Dependent on external components.
2. External matching required.
8
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
PIN NO
PIN MNEMONIC
DC V
EQUIVALENT CIRCUIT
V
CC
1
HB LNA OUT
SR01786
V
BIAS
5K
3
HB LNA IN
0.8
SR01787
V
CC
4
5
6
V
V
CC
BIAS
HB MXR+ IN
HB MXR– IN
1.2
1.2
SR01788
7
PD1
PD2
PD3
10
14
Apply externally
SR01789
V
CC
V
CC
9
HB VCO OUT
Pull-up externally to V
CC
SR01790
9
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
PIN NO
PIN MNEMONIC
DC V
EQUIVALENT CIRCUIT
V
CC
12
LB VCO OUT
V
CC
– 0.2 V
SR01791
V
V
V
CC
BIAS
BIAS
13
HB VCO IN
1.9
SR01792
V
CC
15
LB VCO IN
1.0
SR01793
V
CC
2 pF
17
MXR– OUT
V
CC
Pull-up externally to V
CC
2 pF
18
MXR+ OUT
SR01794
10
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
PIN NO
PIN MNEMONIC
DC V
EQUIVALENT CIRCUIT
V
BIAS
V
CC
20
LB MXR IN
1.2
SR01795
V
BIAS
V
CC
5K
22
LB LNA IN
0.8
SR01796
V
CC
24
LB LNA OUT
Pull-up externally to V
CC
SR01797
11
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
PERFORMANCE CHARACTERISTICS
V
CC
= +3.0 V, T
= +25_C; unless otherwise specified.
amb
16.0
15.0
0.20
0.15
+85° C
+85° C
+25° C
14.0
+25° C
–40° C
0.10
0.05
13.0
12.0
11.0
–40° C
00.0
2.5
3.0
3.5
4.0
2.5
3.0
3.5
4.0
V
(V)
CC
V
(V)
CC
SR02204
SR02201
Figure 5.
I
versus V (mode 011 – LB receive, high gain)
Figure 2.
I versus V (mode 000 – sleep mode)
CC CC
CC
CC
19.0
18.5
5.0
4.8
18.0
4.6
4.4
17.5
17.0
+85° C,
+25° C
+85° C
+25° C
4.2
4.0
–40° C
–40° C
16.5
2.5
3.0
3.5
4.0
2.5
3.0
3.5
4.0
V
(V)
CC
V
(V)
CC
SR02205
SR02202
Figure 6.
I
versus V (mode 100 – HB receive, low gain,
Figure 3.
I versus V (mode 001 – transmit mode)
CC CC
CC
CC
doubler on)
26.5
25.0
11.0
10.5
10.0
+85° C
+25° C
23.5
–40° C,
+25° C
22.0
20.5
–40° C
+85° C
9.5
2.5
2.5
3.0
3.5
4.0
3.0
3.5
4.0
V
(V)
CC
V
(V)
CC
SR02203
SR02206
Figure 7.
I
versus V (mode 101 – HB receive, high gain,
Figure 4.
I versus V (mode 010 – LB receive, low gain)
CC CC
CC
CC
doubler on)
12
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
–13.0
–14.0
16.0
15.5
–40° C
+25° C
+85° C
–15.0
–16.0
15.0
+85° C
14.5
–17.0
–18.0
–40° C
+25° C
14.0
865
870
875
880
885
890
895
900
2.5
3.0
3.5
4.0
V
(V)
CC
Frequency (MHz)
SR02207
SR02210
Figure 8.
I
versus V (mode 110 – HB receive, low gain,
Figure 11. LB LNA low gain versus frequency
CC
CC
doubler off)
3.0
2.5
24.0
22.0
+85° C
+25° C
+85° C
2.0
20.0
18.0
+25° C
–40° C
–40° C
1.5
1.0
16.0
865
870
875
880
885
890
895
900
2.5
3.0
3.5
4.0
Frequency (MHz)
V
(V)
CC
SR02208
SR02211
Figure 9.
I
versus V (mode 111 – HB receive, high gain,
Figure 12.
LB LNA noise figure versus frequency
(high gain mode)
CC
CC
doubler off)
–4.0
18.0
17.5
–6.0
–40° C
+25° C
+85° C
17.0
+25° C
–40° C
–8.0
16.5
16.0
+85° C
–10.0
865
870
875
880
885
890
895
900
865
870
875
880
885
890
895
900
Frequency (MHz)
Frequency (MHz)
SR02212
SR02209
Figure 10.
LB LNA gain versus frequency
Figure 13.
LB LNA IIP3 versus frequency
(high gain mode)
13
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
–12.0
–13.0
–18.0
–19.0
–40° C
+25° C
–14.0
–15.0
+25° C
+85° C
–20.0
–16.0
–40° C
+85° C
–17.0
–18.0
–21.0
–22.0
1920
1930
1940
1950
1960
1970
1980
1990 2000
SR02216
865
870
875
880
885
890
895
900
Frequency (MHz)
Frequency (MHz)
SR02213
Figure 14.
LB LNA 1 dB compression versus frequency
(high gain mode)
Figure 17.
HB LNA low gain versus frequency
–11.0
3.0
+85° C
+25° C
–12.0
–13.0
–14.0
+85° C
2.5
2.0
+25° C
–40° C
–15.0
–16.0
–40° C
1.5
1.0
–17.0
1920
1920
1930
1940
1950
1960
1970
1980
1990
2000
1930
1940
1950
1960
1970
1980
1990
SR02214
2000
Frequency (MHz)
Frequency (MHz)
SR02217
Figure 15.
HB LNA 1 dB compression versus frequency
(high gain mode)
Figure 18.
HB LNA noise figure versus frequency
(high gain mode)
17.0
16.5
0.0
–40° C
+85° C
–2.0
+85° C
+25° C
–4.0
16.0
15.5
15.0
+25° C
–40° C
–6.0
–8.0
–10.0
1920
1930
1940
1950
1960 1970
1980
1990
2000
1920
1930
1940
1950
1960
1970
1980
1990
2000
Frequency (MHz)
Frequency (MHz)
SR02215
SR02218
Figure 16.
HB LNA gain versus frequency
Figure 19.
HB LNA IIP3 versus frequency
(high gain mode)
14
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
11.0
–12.0
–13.0
–40° C
–40° C
10.0
+25° C
+85° C
+25° C
–14.0
–15.0
9.0
+85° C
8.0
7.0
–16.0
865
870
875
880
885
890
895
900
865
870
875
880
885
890
895
900
Frequency (MHz)
Frequency (MHz)
SR02219
SR02222
Figure 20.
LB mixer conversion gain versus frequency
Figure 23.
LB mixer 1 dB compression versus frequency
10.0
12.0
11.0
10.0
9.0
–40° C
+25° C
9.0
+85° C
+25° C
8.0
+85° C
–40° C
7.0
6.0
8.0
7.0
1920
1930
1940
1950
1960
1970
1980
1990 2000
SR02224
865
870
875
880
885
890
895
900
Frequency (MHz)
Frequency (MHz)
SR02220
Figure 21.
LB mixer noise figure versus frequency
Figure 24.
HB mixer conversion gain versus frequency,
doubler off
11.0
10.0
9.0
10.0
–40° C
+25° C
8.0
6.0
4.0
+85° C
+25° C
–40° C
8.0
7.0
+85° C
2.0
0.0
1920
1930
1940
1950
1960
1970
1980
1990
2000
865
870
875
880
885
890
895
900
Frequency (MHz)
Frequency (MHz)
SR02225
SR02221
Figure 22.
LB mixer input IP3 versus frequency
Figure 25.
HB mixer noise figure versus frequency,
doubler off
15
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
–82.0
–84.0
10.0
–40° C
8.0
+25° C
+25° C
+85° C
6.0
–86.0
+85° C
4.0
–40° C
–88.0
–90.0
2.0
0.0
1920
1930
1940
1950
1960
1970
1980
1990 2000
SR02228
1920
1930
1940
1950
1960
1970
1980
1990 2000
SR02226
Frequency (MHz)
Frequency (MHz)
Figure 26.
HB mixer input IP3 versus frequency,
doubler off
Figure 29.
HB mixer half-IF spur versus frequency
(input = –36 dBm, doubler on)
–13.0
10.0
–40° C
–13.5
–14.0
9.0
8.0
7.0
6.0
–40° C
+25° C
+85° C
+25° C
+85° C
–14.5
–15.0
1920
1930
1940
1950
1960
1970
1980
1990
2000
1920
1930
1940
1950
1960
1970
1980
1990
2000
Frequency (MHz)
Frequency (MHz)
SR02227
SR02229
Figure 27.
HB mixer 1 dB compression versus frequency,
doubler off
Figure 30.
HB mixer conversion gain versus frequency,
doubler on
–86.0
–88.0
12.0
+85° C
11.0
10.0
–40° C
+25° C
–90.0
–92.0
–94.0
+25° C
–40° C
9.0
8.0
+85° C
–96.0
1920
7.0
1920
1930
1940
1950
1960
1970
1980
1990
2000
1930
1940
1950
1960
1970
1980
1990
2000
Frequency (MHz)
Frequency (MHz)
SR02223
SR02230
Figure 28.
HB mixer half-IF spur versus frequency
(input = –36 dBm, doubler off)
Figure 31.
HB mixer noise figure versus frequency,
doubler on
16
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
6.0
5.0
–5.0
–6.0
+85° C
4.0
–40° C
+25° C
–7.0
–8.0
3.0
+25° C
+85° C
2.0
1.0
–9.0
–40° C
0.0
–10.0
1920
1930
1940
1950
1960
1970
1980
1990 2000
950
955
960
965
970
975
980
Frequency (MHz)
Frequency (MHz)
SR02233
SR02231
Figure 32.
HB mixer input IP3 versus frequency,
doubler on
Figure 34.
LB LO output power versus frequency (mode 010)
30.0
–6.0
–7.0
+25° C
28.0
–40° C
+25° C
+85° C
–8.0
–9.0
+85° C
–40° C
26.0
24.0
–10.0
–11.0
1920
1930
1940
1950
1960
1970
1980
1990
2000
2010
2020
2030
2040
2050
2060
2070
2080
Frequency (MHz)
Frequency (MHz)
SR02232
SR02234
Figure 33.
HB mixer input IP2 versus frequency,
doubler on
Figure 35.
HB LO output power versus frequency
(mode 110)
17
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
PMU
PMU
10 kΩ
10 nh
LB_LNA_OUT
220 pF
220 pF
1.8 pF
HB_LNA_OUT
1
24
23
22
21
20
19
18
17
16
15
14
13
12 nh
GND
PMU
GND
2
10 kΩ
10 kΩ
PMU
220 pF
5.6 nh
220 pF
RF
Source
HB_LNA_IN
LB_LNA_IN
3
4
RF Source
6.8 pF
3 dB Pad
V
CC
V
CC
PMU
0.01 µF
PMU
0.01 µF
100 pF
100 pF
18 nh
3 dB Pad
PMU
HB_MXR+_IN
HB_MXR–_IN
PD1
10 kΩ
LB_MXR_IN
GND
5
10 kΩ
220 pF
100 pF
PMU
10 nh
220 pF
6
1 kΩ
MXR+_OUT
MXR–_OUT
PMU
PMU
7
PMU
0.01 µF
100 pF
0.1 pF
8.2 pF
470 nh
10 pF
470 nh
GND
8
RF Meas.
8.2 pF
10 nh
100 pF
HB_VCO_OUT
PD2
GND
9
RF Meas.
10 kΩ
PMU
1 kΩ
LB_VCO_IN
PMU
10
11
12
RF Source
18 pF
0.1 µF
4.7 nh
1 k
GND
PD3
PMU
2.7 pF
10 kΩ
0.1 µF
PMU
LB_VCO_OUT
HB_VCO_IN
RF Meas.
RF Source
100 pF
PMU
4.7 nh
10 kΩ
SR02235
Figure 36.
SA3600 production test circuit schematic
18
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
J1
SMA
J6
SMA
C12
1.5pF
R11
000
R10
10
LBLOUT
HBLOUT
L18
TOKO 8.2nH
L19
UL
L16
8.2nH
R9
UL
R8
330
C34
10nF
J2
SMA
J7
SMA
C13
100pF
C2
100pF
R12
000
C37
LBLIN
LBMIN
10nF
HBLIN
C1
0.5pF
R2
10
R1
10
HBLNA_OUT
GND
LBLNA_OUT
1
2
24
23
22
21
20
19
18
17
16
15
14
13
C16
100nF
C16
100pF
J8
SMA
GND
C18
1nF
C3
100nF
C4
100pF
HBLNA_IN
LBLNA_IN
3
L15
22nH
L4
1.8nH
C5
100pF
C6
1.8pF
C33
1pF
V
CC
V
CC
4
SA3600
HBMIX_IN-P
HBMIX_IN-N
PD1
LBMIX_IN
J3
C28
6.8pF
C20
27pF
5
C9
100pF
SMA
L2
2.7nH
GND
L11
UL
L12
UL
6
HBMIN
L3
2.7nH
L5
1.8nH
MIXER_OUT-P
MIXER_OUT-N
82MHz IF
J9
C22
1nF
7
L8
120nH
L7
180nH
R4
10k
GND
SMA
8
C7
1.8pF
C6
100pF
HBVCO_OUT
PD2
GND
9
MIXOUT
LBVCO_IN
10
11
12
R3
10k
L6
180nH
C19
27pF
GND
PD3
PD1
x2
LBVCO_OUT
HBVCO_IN
R7
L9
C27
6.8pF
10
120nH
PD2
J11
SMA
C21
100pF
C24
22pF
L10
10nH
J4
C10
5.6pF
C32
8.2pF
0402
SMA
L13
2.7nH
HBLOOUT
Mode Select
Sleep mode
PD1 PD2 PD3
C31
8.2pF
0402
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
J5
C11
Tx mode, LO LB Buffer
SMA
1.2pF
Rx mode cell, LO Gain
Rx mode cell, HI Gain
J10
SMA
LBLOOUT
C23
100pF
Rx mode PCS, LO Gain X2
Rx mode PCS, HI Gain X2
Rx mode PCS, LO Gain No X2
Rx mode PCS, HI Gain No X2
C30
2.2pF
J12
CC
V
PD3
V
CC
GND
R6
10
C26
100nF
C25
100pF
C38
100pF
SR02236
Figure 37.
SA3600 Application circuit (f = 82 MHz)
IF
19
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 1. Low-band LNA S-parameters (high gain mode)
Freq (MHz)
800
|S11| (U)
0.42
0.42
0.41
0.41
0.41
0.41
0.40
0.40
0.40
0.39
0.39
0.39
0.38
0.38
0.38
0.37
0.37
0.37
0.36
0.36
0.36
0.36
0.36
0.36
0.35
0.35
<S11 (deg)
–89
–89
–90
–91
–91
–92
–92
–93
–93
–93
–93
–94
–94
–94
–95
–95
–95
–96
–96
–96
–97
–96
–97
–97
–97
–97
|S21| (U)
5.19
5.17
5.11
5.11
5.03
4.97
4.97
4.92
4.85
4.84
4.77
4.73
4.67
4.61
4.55
4.49
4.43
4.36
4.30
4.25
4.23
4.16
4.15
4.11
4.07
4.04
<S21 (deg)
89
|S12| (U)
0.006
0.006
0.005
0.004
0.008
0.007
0.006
0.008
0.007
0.006
0.005
0.005
0.009
0.007
0.003
0.006
0.005
0.008
0.006
0.009
0.005
0.007
0.008
0.008
0.007
0.009
<S12 (deg)
14
|S22| (U)
<S22 (deg)
–37
–37
–38
–38
–38
–39
–40
–40
–41
–42
–42
–42
–43
–43
–44
–44
–44
–45
–46
–47
–47
–47
–48
–48
–49
–49
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.98
0.97
0.98
0.98
0.98
0.98
0.98
0.98
0.97
0.98
0.98
0.98
0.98
0.97
0.97
0.98
810
89
19
820
88
45
830
87
11
840
86
14
850
85
–2
860
84
32
870
83
8
880
82
–9
890
81
–18
3
900
81
910
79
–12
3
920
79
930
78
13
940
77
–1
950
77
–33
–29
–46
8
960
76
970
75
980
75
990
74
–24
21
1000
1010
1020
1030
1040
1050
74
73
–8
73
–20
–22
–55
–35
73
71
71
20
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 2. Low-band LO input (pin 15) and output (pin 12) S-parameters
Freq(MHz)
670
|S11| (U)
0.37
0.37
0.35
0.33
0.32
0.31
0.30
0.28
0.27
0.26
0.25
0.24
0.23
0.22
0.21
0.20
0.20
0.21
0.21
0.20
0.21
0.22
0.23
0.24
0.25
0.26
0.27
0.29
0.30
0.31
0.32
0.34
0.35
0.37
0.38
0.39
0.41
0.42
0.43
0.44
<S11 (deg)
–168
–168
–169
–171
–171
–171
–172
–171
–171
–170
–170
–168
–168
–165
–162
–160
–157
–153
–149
–147
–145
–141
–140
–137
–136
–136
–134
–134
–135
–134
–134
–135
–136
–136
–137
–138
–139
–140
–141
–142
|S22| (U)
0.46
0.47
0.49
0.50
0.50
0.51
0.52
0.53
0.53
0.54
0.55
0.56
0.56
0.58
0.58
0.59
0.59
0.60
0.60
0.61
0.62
0.62
0.62
0.63
0.64
0.64
0.64
0.65
0.65
0.65
0.65
0.66
0.66
0.66
0.66
0.66
0.66
0.66
0.67
0.66
<S22 (deg)
75
73
71
69
67
66
64
63
61
60
58
56
55
54
52
51
49
48
46
45
44
42
41
40
38
37
35
35
33
32
31
30
29
28
26
26
25
24
23
22
680
690
700
710
720
730
740
750
760
770
780
790
800
810
820
830
840
850
860
870
880
890
900
910
920
930
940
950
960
970
980
990
1000
1010
1020
1030
1040
1050
1060
21
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 2. Low-band LO input (pin 15) and output (pin 12) S-parameters (continued)
Freq(MHz)
1070
1080
1090
1100
|S11| (U)
0.46
0.48
0.49
0.51
0.52
0.53
0.53
0.54
0.55
0.56
0.57
<S11 (deg)
–143
|S22| (U)
0.66
0.66
0.66
0.66
0.67
0.67
0.67
0.67
0.68
0.68
0.68
<S22 (deg)
21
21
20
20
19
18
18
18
17
16
16
–144
–145
–147
1110
–150
1120
–151
1130
–153
1140
–155
1150
–156
1160
–157
1170
–159
22
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 3. Mixer output S-parameters
Both pins (17, 18)
Freq(MHz)
70
|S11| (U)
1.00
1.00
0.99
0.99
0.99
0.99
0.99
0.99
0.99
0.99
0.99
0.99
0.99
0.99
<S11 (deg)
–8
80
–9
90
–10
–11
–12
–13
–14
–16
–16
–18
–19
–20
–21
–22
100
110
120
130
140
150
160
170
180
190
200
23
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 4. Low-band mixer input S-parameters
Freq(MHz)
800
|S11| (U)
0.84
0.85
0.85
0.85
0.84
0.85
0.85
0.84
0.85
0.85
0.84
0.85
0.84
0.85
0.85
0.85
0.85
0.84
0.85
0.84
0.84
0.85
0.84
0.85
0.84
0.85
<S11 (deg)
–14
–14
–14
–15
–15
–15
–15
–15
–15
–15
–16
–15
–16
–16
–17
–17
–17
–17
–17
–18
–18
–18
–18
–19
–19
–19
810
820
830
840
850
860
870
880
890
900
910
920
930
940
950
960
970
980
990
1000
1010
1020
1030
1040
1050
24
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 5. High-band LNA S-parameters
Freq (MHz)
1800
1810
1820
1830
1840
1850
1860
1870
1880
1890
1900
1910
1920
1930
1940
1950
1960
1970
1980
1990
2000
2010
2020
2030
2040
2050
|S11| (U)
0.38
0.37
0.37
0.37
0.36
0.36
0.35
0.35
0.34
0.33
0.33
0.33
0.32
0.32
0.32
0.32
0.32
0.32
0.31
0.32
0.31
0.31
0.31
0.31
0.31
0.31
<S11 (deg)
156
156
155
154
155
154
155
154
152
154
153
154
153
154
153
153
154
155
154
156
155
156
157
158
158
159
|S21| (U)
6.73
6.77
6.82
6.79
6.84
6.80
6.81
6.85
6.84
6.84
6.83
6.83
6.87
6.84
6.86
6.84
6.78
6.80
6.75
6.72
6.68
6.68
6.65
6.63
6.59
6.58
<S21 (deg)
172
170
168
167
165
164
162
161
159
158
157
155
154
152
151
149
148
146
145
143
142
141
139
138
137
135
|S12| (U)
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.04
0.04
0.05
0.05
0.04
0.04
0.05
0.05
<S12 (deg)
105
113
109
107
106
102
108
101
102
107
102
101
102
99
|S22| (U)
<S22 (deg)
–106
–100
–95
0.13
0.11
0.10
0.10
0.09
0.09
0.10
0.10
0.12
0.13
0.14
0.15
0.17
0.18
0.19
0.21
0.22
0.24
0.26
0.27
0.28
0.30
0.31
0.32
0.33
0.34
–88
–74
–67
–51
–47
–41
–36
–32
–30
–28
–28
101
103
101
100
100
99
–26
–26
–26
–26
–26
–27
100
103
104
96
–27
–30
–31
–30
105
104
–32
–34
25
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 6. High-band LO input (pin 13) and output (pin 9) S-parameters
Freq(MHz)
1700
1710
1720
1730
1740
1750
1760
1770
1780
1790
1800
1810
1820
1830
1840
1850
1860
1870
1880
1890
1900
1910
1920
1930
1940
1950
1960
1970
1980
1990
2000
2010
2020
2030
2040
2050
2060
2070
2080
2090
|S11| (U)
0.82
0.82
0.82
0.82
0.82
0.83
0.82
0.82
0.82
0.83
0.82
0.82
0.83
0.82
0.82
0.82
0.82
0.82
0.82
0.82
0.82
0.81
0.82
0.81
0.81
0.81
0.81
0.80
0.80
0.80
0.80
0.80
0.80
0.80
0.79
0.79
0.79
0.79
0.78
0.77
<S11 (deg)
–36
–36
–37
–36
–37
–37
–37
–38
–38
–39
–39
–39
–40
–40
–41
–41
–42
–42
–42
–43
–43
–44
–44
–45
–46
–46
–47
–47
–48
–48
–48
–49
–50
–51
–51
–52
–52
–52
–53
–54
|S22| (U)
0.31
0.30
0.29
0.29
0.29
0.27
0.26
0.25
0.24
0.24
0.23
0.21
0.20
0.20
0.18
0.16
0.16
0.14
0.12
0.11
0.11
0.08
0.07
0.06
0.04
0.03
0.02
0.03
0.04
0.05
0.07
0.08
0.10
0.12
0.13
0.15
0.16
0.18
0.20
0.21
<S22 (deg)
86
85
83
81
81
79
76
76
74
72
71
69
68
66
67
63
61
60
56
52
53
47
42
34
29
–1
–21
–57
–85
–103
–112
–112
–119
–120
–125
–127
–130
–133
–135
–136
26
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Table 6. High-band LO input (pin 13) and output (pin 9) S-parameters (continued)
Freq(MHz)
2100
2110
|S11| (U)
0.78
0.77
0.77
0.77
0.76
0.77
0.76
0.76
0.76
0.76
0.76
<S11 (deg)
–54
|S22| (U)
0.23
0.24
0.26
0.27
0.29
0.29
0.31
0.33
0.34
0.35
0.36
<S22 (deg)
–138
–55
–139
2120
2130
2140
2150
2160
2170
2180
2190
2200
–56
–142
–57
–144
–57
–144
–58
–145
–58
–147
–59
–148
–60
–150
–60
–150
–61
–152
27
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
28
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
NOTES
29
1999 Nov 02
Philips Semiconductors
Product specification
Low voltage dual-band RF front-end
SA3600
Data sheet status
[1]
Data sheet
status
Product
status
Definition
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 1999
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 11-99
Document order number:
9397-750-06558
Philips
Semiconductors
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