SA56004EDP,118_技术文档

SA56004X

SMBus-compatible, 8-pin, remote/local digital temperature

sensor with overtemperature alarms

Rev. 7 — 25 February 2013

Product data sheet

1. General description

The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital

temperature sensor with overtemperature alarms. The remote channel of the SA56004X

monitors a diode junction, such as a substrate PNP of a microprocessor or a diode

connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP). With factory trimming,

remote sensor accuracy of 1 C is achieved.

Undertemperature and overtemperature alert thresholds can be programmed to cause the

ALERT output to indicate when the on-chip or remote temperature is out of range. This

output may be used as a system interrupt or SMBus alert. The T_CRIT output is activated

when the on-chip or remote temperature measurement rises above the programmed

T_CRIT threshold register value. This output may be used to activate a cooling fan, send

a warning or trigger a system shutdown. To enhance system reliability further, the

SA56004X employs an SMBus time-out protocol. The SA56004X has a unique device

architecture.

The SA56004X is available in the SO8, TSSOP8 and HVSON8 packages. SA56004X has

8 factory-programmed device address options. The SA56004X is pin-compatible with the

LM86, MAX6657/8, and ADM1032.

2. Features and benefits

 Accurately senses temperature of remote microprocessor thermal diodes or diode

connected transistors within 1 C

 On-chip local temperature sensing within 2 C

 Temperature range of 40 C to +125 C

 11-bit, 0.125 C resolution

 8 different device addresses are available for server applications. The SA56004ED

with marking code 56004E, and SA56004EDP with marking code 6004E are address

compatible with the National LM86, the MAX6657/8 and the ADM1032.

 Offset registers available for adjusting the remote temperature accuracy

 Programmable under/overtemperature alarms: ALERT and T_CRIT

 SMBus 2.0 compatible interface, supports TIMEOUT

 Operating voltage range: 3.0 V to 3.6 V

 I²C-bus Standard-mode and Fast-mode compatible

 SO8, TSSOP8 and HVSON8 packages

 Programmable conversion rate (0.0625 Hz to 26 Hz)

 Undervoltage lockout prevents erroneous temperature readings

 Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

3. Applications

 System thermal management in laptops, desktops, servers and workstations

 Computers and office electronic equipment

 Electronic test equipment and instrumentation

 HVAC

 Industrial controllers and embedded systems

4. Ordering information

Table 1.

Ordering information

Type number^[1]Topside

marking

Package

Name

SO8

Description

Version

SA56004AD

SA56004BD

SA56004CD

SA56004DD

SA56004ED

SA56004FD

SA56004GD

SA56004HD

SA56004ADP

SA56004BDP

SA56004CDP

SA56004DDP

SA56004EDP

SA56004FDP

SA56004GDP

SA56004HDP

SA56004ATK

SA56004ETK

56004AD

56004BD

56004CD

56004DD

56004ED

56004FD

56004GD

56004HD

6004A

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

TSSOP8

plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

6004B

6004C

6004D

6004E

6004F

6004G

6004H

6004A

HVSON8

plastic thermal enhanced very thin small outline package; no leads; SOT782-1

8 terminals; body 3  3  0.85 mm

6004E

[1] There are 8 device slave address options, as described in Table 4.

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

2 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

4.1 Ordering options

Table 2.

Ordering options

Type number Orderable

part number

Package Packing method

Minimum

order quantity

Temperature

SA56004AD

SA56004BD

SA56004CD

SA56004DD

SA56004ED

SA56004FD

SA56004AD,112

SA56004AD,118

SA56004BD,112

SA56004BD,118

SA56004CD,112

SA56004CD,118

SA56004DD,112

SA56004DD,118

SA56004ED,112

SA56004ED,118

SA56004FD,112

SA56004FD,118

SA56004GD,118

SA56004HD,112

SA56004HD,118

SO8

Tube, bulk pack

2000

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

2500

6000

T_amb= 40 C to +125 C

Reel pack, SMD, 13-inch

Tube, bulk pack

Reel pack, SMD, 13-inch

Tube, bulk pack

Reel pack, SMD, 13-inch

Tube, bulk pack

Reel pack, SMD, 13-inch

Tube, bulk pack

Reel pack, SMD, 13-inch

Tube, bulk pack

Reel pack, SMD, 13-inch

Tube, bulk pack

SA56004GD

SA56004HD

Reel pack, SMD, 13-inch

SA56004ADP SA56004ADP,118 TSSOP8

SA56004BDP SA56004BDP,118 TSSOP8

SA56004CDP SA56004CDP,118 TSSOP8

SA56004DDP SA56004DDP,118 TSSOP8

SA56004EDP SA56004EDP,118 TSSOP8

SA56004FDP SA56004FDP,118 TSSOP8

SA56004GDP SA56004GDP,118 TSSOP8

SA56004HDP SA56004HDP,118 TSSOP8

SA56004ATK

SA56004ETK

SA56004ATK,118 HVSON8 Reel pack, SMD, 13-inch

SA56004ETK,118 HVSON8 Reel pack, SMD, 13-inch

SA56004X

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Product data sheet

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

5. Block diagram

SA56004X

ONE-SHOT

V

DD

REGISTER

LOCAL

TEMP

SENSOR

REMOTE OFFSET

REGISTER

CONFIGURATION

REGISTER

COMMAND

REGISTER

CONTROL

LOGIC

CONVERSION

REGISTER

LOCAL HIGH TEMP

THRESHOLD

LOCAL TEMP HIGH

LIMIT REGISTER

LOCAL TEMP

DATA REGISTER

LOCAL LOW TEMP

THRESHOLD

LOCAL TEMP LOW

THRESHOLD

11-BIT

Σ-Δ

D+

LOCAL

REMOTE

MUX

A-to-D

D−

REMOTE TEMP

DATA REGISTER

REMOTE HIGH

TEMP THRESHOLD

REMOTE TEMP

HIGH LIMIT REG.

CONVERTER

T_CRIT

HYSTERESIS

REMOTE LOW

TEMP THRESHOLD

REMOTE TEMP

LOW LIMIT REG.

ALERT

INTERRUPT

STATUS REGISTER

GND

OTP DEVICE

ADDRESS REGISTER

T_CRIT

INTERRUPT

SMBus INTERFACE

002aad202

SDATA

SCLK

Fig 1. Block diagram

SA56004X

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Product data sheet

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

6. Pinning information

6.1 Pinning

1

2

3

4

8

7

6

5

V

SCLK

SDATA

ALERT

GND

DD

1

2

3

4

8

7

6

5

V

SCLK

SDATA

ALERT

GND

DD

D+

D−

D+

D−

SA56004XD

SA56004XDP

T_CRIT

002aad199

002aad198

Fig 2. Pin configuration for SO8

Fig 3. Pin configuration for TSSOP8

terminal 1

index area

1

2

3

4

8

7

6

5

V

SCLK

SDATA

ALERT

GND

DD

D+

D−

SA56004XTK

T_CRIT

002aad200

Transparent top view

Fig 4. Pin configuration for HVSON8

6.2 Pin description

Table 3.

Symbol

Pin description

Pin Description

V_DD

1

Positive supply voltage. DC voltage from 3.0 V to 5.5 V.

Diode current source (anode).

D+

2

3

4

D

Diode sink current (cathode).

T_CRIT

T_CRIT alarm is open-drain, active LOW output which requires an external

pull-up resistor. It functions as a system interrupt or power shutdown.

GND

5

6

Power supply ground.

ALERT

ALERT alarm is an open-drain, active LOW output which requires an

external pull-up resistor. It functions as an interrupt indicating that the

temperature of the on-chip or remote diode is above or below programmed

overtemperature or undertemperature thresholds.

SDATA

SCLK

7

8

SMBus/I²C-bus bidirectional data line. This is an open-drain output which

requires an external pull-up resistor.

SMBus/I²C-bus clock input which requires an external pull-up resistor.

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

7. Functional description

Refer to Figure 1 “Block diagram”.

7.1 Serial bus interface

The SA56004X should be connected to a compatible two-wire serial interface System

Management Bus (SMBus) as a slave device using the two device terminals SCLK and

SDATA. The ALERT pin can optionally be used with the SMBus protocol to implement the

ARA response. The controller provides a clock signal to the device SCLK pin and

write/read data to/from the device through the device SDATA pin. External pull-up

resistors, about 10 k each, are needed for these device pins due to open-drain circuitry.

Data of 8-bit digital byte or word are used for communication between the controller and

the device using SMBus 2.0 protocols which are described more in Section 7.10 “SMBus

interface”. The operation of the device to the bus is described with details in the following

sections.

7.2 Slave address

The SA56004X has a 7-bit slave address register which is factory programmed in OTP

memory. Eight unique devices are available with different slave addresses as defined in

Table 4. Up to eight devices can reside on the same SMBus without conflict, if their

addresses are unique.

Table 4.

Slave addresses

Type number

SA56004AD

SA56004ADP

SA56004ATK

SA56004BD

SA56004BDP

SA56004CD

SA56004CDP

SA56004DD

SA56004DDP

SA56004ED^[2]

SA56004EDP^[2]

SA56004ETK^[2]

SA56004FD

Device slave address^[1]

1001 000

1001 001

1001 010

1001 011

1001 100

1001 101

1001 110

1001 111

SA56004FDP

SA56004GD

SA56004GDP

SA56004HD

SA56004HDP

[1] The device slave address is factory programmed in OTP device address register.

[2] The SA56004ED/EDP/ETK has the bus address of the National LM86, MAX6657/8 and the ADM1032.

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Product data sheet

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

7.3 Register overview

The SA56004X contains three types of SMBus addressable registers: read-only (R),

write-only (W), and read-write (R/W). Attempting to write to any R-only register or read

data from any W-only register produces an invalid result. Some of the R/W registers have

separate addresses for reading and writing operations.

The registers of the SA56004X serve four purposes:

• Control and configuration of the SA56004X

• Status reporting

• Temperature measurement storage

• ID and manufacturer test registers

Table 5 describes the names, addresses, Power-On Reset (POR), and functions of each

register. The data of the temperature-related registers is in two’s complement format in

which the MSB is the sign bit. The 8-bit data of other registers is in 8-bit straight format.

SA56004X

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Product data sheet

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 5.

Register assignments

Command byte

Register

name

POR state

Function

Bits

Access

Read

Write

address

LTHB

RTHB

SR

00h

01h

02h

03h

04h

05h

06h

07h

08h

n/a

0000 0000

1000

local temperature high byte

remote temperature high byte

status register

8

R

n/a

8

R

n/a

8

R

CON

09h

0Ah

0Bh

0Ch

0Dh

0Eh

0Fh

n/a

configuration register

8

R/W

W

CR

conversion rate

4

LHS

0100 0110

0000 0000

0100 0110

0000 0000

-

local high setpoint

8

LLS

local low setpoint

8

RHSHB

RLSHB

One Shot

RTLB

RTOHB

RTOLB

RHSLB

RLSLB

RCS

remote high setpoint high byte

remote low setpoint high byte

writing register initiates a one-shot conversion

remote temperature low byte

remote temperature offset high byte

remote temperature offset low byte

remote high setpoint low byte

remote low setpoint low byte

remote T_CRIT setpoint

local T_CRIT setpoint

8

0

10h

11h

12h

13h

14h

19h

20h

21h

22h

BFh

FEh

FFh

0000 00

0000 0000

000

6 (MSBs)

8

R

11h

12h

13h

14h

19h

20h

21h

n/a

R/W

3 (MSBs) R/W

000

0101 0101

0 1010

8

R/W

R

LCS

8

TH

T_CRIT hysteresis

5

ATLB

AM

0000 0000

0

local temperature low byte

Alert mode

3 (MSBs)

BFh

n/a

1

8

R/W

R

RMID

RDR

1010 0001

0000 0000

read manufacturer’s ID

n/a

read stepping or die revision

R

7.4 Power-on reset

When power is applied to the SA56004X, the device enters its Power-On Reset (POR)

state and its registers are reset to their default values. The configuration, status, and

temperature-reading registers remain in these states until after the first conversion. As

shown in Table 5 this results in:

1. Command register set to 00h.

2. Local Temperature register (LTHB and LTLB) set to 0 C.

3. Remote Diode Temperature register (RTHB and RTLB) set to 0 C until the end of the

first conversion.

4. Status register (SR) set to 00h.

5. Configuration register (CON) set to 00h; interrupt latches are cleared, the ALERT and

T_CRIT output drivers are off and the ALERT and T_CRIT pins are pulled HIGH by

the external pull-up resistors.

6. Local T_CRIT temperature setpoints (LCS) and Remote T_CRIT temperature

setpoints (RCS) at 85 C.

7. Local HIGH setpoint (LHS) and remote HIGH temperature setpoint (RHSHB) at 70 C.

SA56004X

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Product data sheet

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB) at 0 C.

9. Conversion Rate register (CR) is set to 8h; the default value of about 16

conversions/s.

7.5 Starting conversion

Upon POR, the RUN/STOP bit 6 of the configuration register is zero (default condition),

then, the device enters into its free-running operation mode in which the device A/D

converter is enabled and the measurement function is activated. In this mode, the device

cycles the measurements of the local and remote temperature automatically and

periodically. The conversion rate is defined by the programmable conversion rate stored in

the conversion rate register. It also performs comparison between readings and limits of

the temperature in order to set the flags and interruption accordingly at the end of every

conversion. Measured values are stored in the temp registers, results of the limit

comparisons are reflected by the status of the flag bits in the status register and the

interruption is reflected by the logical level of the ALERT and T_CRIT output. If the

power-on temperature limit is not suitable, the temp limit values could be written into the

limit registers during the busy-conversion duration of about 38 ms of the first conversion

after power-up. Otherwise, the status register must be read and the configuration bit 7

must be reset in order to recover the device from interruption caused by the undesired

temp limits.

7.6 Low power software standby mode

The device can be placed in a software standby mode by setting the RUN/STOP bit 6 in

the configuration register HIGH (logic 1). In standby, the free-running oscillator is stopped,

the supply current is less than 10 A if there is no SMBus activity, all data in the registers

is retained. However, the SMBus is still active and reading and writing registers can still be

performed. A one-shot command initiates a single conversion which has the same effect

as any conversion that occurs when the device is in its free-running mode. To restore the

device to free running mode, set the RUN/STOP bit 6 LOW (logic 0).

7.7 Temperature data format

The temperature data can only be read from the Local and Remote Temperature

registers; the setpoint registers (for example, T_CRIT, LOW, HIGH) are read/write.

Both local and remote temperature reading data is represented by an 11-bit,

two’s complement word with the Least Significant Bit (LSB) = 0.125 C. The temperature

setpoint data for the remote channel is also represented by an 11-bit, two’s complement

word with the LSB = 0.125 C. The temperature setpoint data for both the local channel

and the T_CRIT setpoints are represented by 8-bit, two’s complement words with the

LSB =1.0 C. For 11-bit temp data, the data format is a left justified, 16-bit word available

in two 8-bit registers (high byte and low byte). For 8-bit temp data, the data is available in

a single 8-bit register (high byte only).

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Product data sheet

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 6.

Temperature data format

Temperature

Digital output

Binary

Hexadecimal

7D00h

1900h

+125 C

+25 C

+1 C

0111 1101 0000 0000

0001 1001 0000 0000

0000 0001 0000 0000

0000 0000 0010 0000

0000 0000 0000 0000

1111 1111 1110 0000

1111 1111 0000 0000

1110 0111 0000 0000

1100 1001 0000 0000

0100h

+0.125 C

0 C

0020h

0000h

0.125 C

1 C

FFE0h

FF00h

25 C

55 C

E700h

C900h

7.8 SA56004X SMBus registers

7.8.1 Command register

The command register selects which register will be read or written to. Data for this

register should be transmitted during the Command Byte of the SMBus write

communication.

7.8.2 Local and remote temperature registers (LTHB, LTLB, RTHB, RTLB)

Table 7.

Byte

LTHB, LTLB, RTHB, RTLB - Local and remote temperature registers

High byte (read only; address 00h, 01h)

Low byte (read only; address 10h)

Bit

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

7.8.3 Configuration register (CON)

The configuration register is an 8-bit register with read address 03h and write address

09h. Table 8 shows how the bits in this register are used.

Table 8.

CON - Configuration register (read address 03h; write address 09h)

bit assignments

Bit

Description

POR state

7

ALERT mask.

0

The ALERT interrupt is enabled when this bit is LOW. The ALERT interrupt

is disabled (masked) when this bit is HIGH.

6

RUN/STOP.

0

Standby or run mode control. Running mode is enabled when this bit is

LOW. The SA56004X is in standby mode when this bit is HIGH.

5

4

Not defined; defaults to logic 0.

Remote T_CRIT mask.

0

The T_CRIT output will be activated by a remote temperature that exceeds

the remote T_CRIT setpoint when this bit is LOW. The T_CRIT output

will not be activated under this condition when this bit is HIGH.

3

Not defined; defaults to logic 0.

0

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 8.

CON - Configuration register (read address 03h; write address 09h)

bit assignments …continued

Bit

Description

POR state

2

Local T_CRIT mask.

0

The T_CRIT output will be activated by a local temperature that exceeds

the local T_CRIT setpoint when this bit is LOW. The T_CRIT output will not

be activated under this condition when this bit is HIGH.

1

0

Not defined; defaults to logic 0.

Fault queue.

0

A single remote temperature measurement outside the HIGH, LOW or

T_CRIT setpoints will trigger an outside limit condition resulting in setting

the status bits and associated output pins when this bit is LOW. Three

consecutive measurements outside of one of these setpoints are required

to trigger an outside of limit condition when this bit is HIGH.

7.8.4 Status register (SR)

The contents of the status register reflect condition status resulting from all activities:

comparison between temperature measurements and temperature limits, the status of

A/D conversion, and the hardware condition of external diode to the device. Bit

assignments are listed in Table 9. This register is read-only and its address is 02h. Upon

POR, all bits are set to zero.

Remark: Any one of the fault conditions, with the exceptions of Diode OPEN and

A/D BUSY, introduces an Alert interrupt (see Section 7.9.1.2). Also, whenever a one-shot

command is executed, the status byte should be read after the conversion is completed,

which is about 38 ms (1 conversion time period) after the one-shot command is sent.

Table 9.

SR - Status register (read-only address 02h) bit assignments

Description

Bit

7

Name

BUSY

When logic 1, A/D is busy converting. POR state = n/a.

6

LHIGH When logic 1, indicates local HIGH temperature alarm. POR state = 0.

LLOW When logic 1, indicates a local LOW temperature alarm. POR state = 0.

RHIGH When logic 1, indicates a remote diode HIGH temperature alarm. POR state = 0.

RLOW When logic 1, indicates a remote diode LOW temperature alarm. POR state = 0.

OPEN When logic 1, indicates a remote diode disconnect. POR state = 0.

RCRIT When logic 1, indicates a remote diode critical temperature alarm. POR state = 0.

LCRIT When logic 1, indicates a local critical temperature alarm. POR state = 0.

5

4

3

2

1

0

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

7.8.5 Conversion rate register (CR)

The conversion rate register is used to store programmable conversion data, which

defines the time interval between conversions in the standard free-running auto convert

mode. Table 10 shows all applicable data values and rates for the SA56004X. Only the

4 LSBs of the register are used and the other bits are reserved for future use. The register

is R/W using the read address 04h and write address 0Ah. The POR default conversion

data is 08h.

Table 10. Conversion rate control byte (CR)

Data value

00h

Conversion rate (Hz)

0.06

0.12

0.25

0.50

1.0

2

01h

02h

03h

04h

05h

06h

4

07h

8

08h

16

09h

32

0Ah to FFh

n/a

7.8.6 Temperature limit registers

Table 11. LHS, RHSHB, RHSLB - Local and remote HIGH setpoint registers

Byte

High byte (read only address 05h, 07h;

write address 0Bh, 0Dh)^[1]

Low byte (read/write address 13h)^[2]

Bit

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

[1] POR default LHS = RHSHV = 46h (70 C).

[2] POR default RHSLB = 00h.

Table 12. LLS, RLSHB, RLSLB - Local and remote LOW setpoint registers

Byte

High byte (read address 06h, 08h;

write address 0Ch, 0Eh)^[1]

Low byte (read/write address 14h)^[2]

Bit

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

[1] POR default LLS = RLSHV = 00h.

[2] POR default RLSLB = 00h (0 C).

Table 13. LCS, RCS - Local and remote T_CRIT registers

Byte

Bit

Single high byte (read/write address 20h, 19h)^[1]

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

[1] POR default LCS = RCS = 55h (85 C).

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 14. TH - T_CRIT hysteresis register

Byte

Bit

Single high byte (read/write address 21h)^[1]

D7

D6

D5

D4

D3

D2

D1

D0

Value

-

16

8

4

2

1

[1] POR default TH = 0Ah (10 C).

7.8.7 Programmable offset register (remote only)

Table 15. RTOHB, RTOLB - Remote temperature offset registers

Byte

Bit

High byte (read/write address 11h)^[1]

Low byte (read/write address 12h)^[2]

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

[1] POR default RTOHB = RTOLB = 00h.

[2] POR default RTOLB = 00h.

7.8.8 ALERT mode register (AM)

Table 16. AM - ALERT mode register

Read and write address BFh.

Bit

D7

D6

D5

D4

D3

D2

D1

D0

ALERT mode

Value

0

D[7:1] is not defined and defaults to logic 0.

D0: The ALERT output is in interrupt mode when this bit is LOW. The ALERT output is in

comparator mode when this bit is HIGH.

7.8.9 Other registers

The Manufacturers ID register has a default value A1h (1010 0001) and a read address

FEh.

The Die Revision Code register has a default value 00h (0000 0000) and read address

FFh. This register increments by 1 every time there is a revision to the die.

7.8.10 One-shot register

The one-shot register is used to initiate a single conversion and comparison cycle when

the device is in the standby mode; upon completion of the single conversion cycle, the

device returns to the standby mode. It is not a data register; it is the write operation that

causes the one-shot conversion. The data written to this register is not stored; an FFh

value will always be read from this register. To initiate a one-shot operation, send a

standard write command with the command byte of 0Fh (One-Shot Write Address).

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Digital temperature sensor with overtemperature alarms

7.9 Interruption logic and functional description

7.9.1 ALERT output

The ALERT output is used to signal Alert interruptions from the device to the SMBus or

other system interrupt handler and it is active LOW. Because this is an open-drain output,

a pull-up resistor (typically 10 k) to V_DDis required. Several slave devices can share a

common interrupt line on the same SMBus.

The ALERT function is very versatile and accommodates three separate operating

modes:

• Temperature comparator

• System interrupt based on temperature

• SMBus Alert Response Address (ARA) response.

The ARA and interrupt modes are different only in how the user interacts with the

SA56004X.

At the end of every temperature reading, digital comparators determine if the readings are

above the HIGH or T_CRIT setpoint or below the LOW setpoint register values. If so, the

corresponding bit in the Status register is set. If the ALERT mask bit 7 of the Configuration

register is not HIGH, then any bit set in the Status register other than the BUSY (D7) and

OPEN (D2) causes the ALERT output pin to be active LOW. An alert will be triggered after

any conversion cycle that finds the temperature is out of the limits defined by the setpoint

registers. In order to trigger an ALERT in all alert modes, the ALERT mask bit 7 of the

Configuration register must be cleared (not HIGH).

7.9.1.1 ALERT output in comparator mode

When operating the SA56004X in a system that utilizes an SMBus controller not having

an interrupt, the ALERT output may be operated as a temperature comparator. In this

mode, when the condition that triggered the ALERT to be asserted is no longer present,

the ALERT output is released as it goes HIGH. In order to use the ALERT output as a

temperature comparator, bit D0 (the ALERT configure bit) in the ALERT Mode (AM)

register must be set HIGH. This is not the POR default.

7.9.1.2 ALERT output in interrupt mode

In the interrupt mode, the ALERT output is used to provide an interrupt signal that remains

asserted until the interrupt service routine has elapsed. In the interrupt operating mode, a

read of the Status register will set the ALERT mask bit 7 of the Configuration register if

any of the temperature alarm bits of the Status register is set, with exception of BUSY (D7)

and OPEN (D2). This protocol prevents further ALERT output triggering until the master

device has reset the ALERT mask bit at the end of the interrupt service routine. The

Status register bits are cleared only upon a read of the Status register by the serial bus

master (see Figure 5). In order for the ALERT output to be used as an interrupt, the

ALERT Configure bit D0 of the ALERT Mode (AM) register must be set LOW (POR

default).

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SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

remote temperature high limit

remote diode temperature

ALERT pin

status register bit 4

(RHIGH)

A

B, C

D

E, F

002aad216

Fig 5. ALERT output in interrupt mode

The following events summarize the ALERT output interrupt mode of operation:

Event A: Master senses ALERT output being active-LOW.

Event B: Master reads the SA56004X Status register to determine what cause the

ALERT interrupt.

Event C: SA56004X clears the Status register, resets the ALERT output HIGH, and sets

the ALERT mask bit 7 in the Configuration register.

Event D: A new conversion result indicates that the temperature is still above the high

limit, however the ALERT pin is not activated due to the ALERT mask.

Event E: Master should correct the conditions that caused the ALERT output to be

triggered. For instance, the fan is started, setpoint levels are adjusted.

Event F: Master resets the ALERT mask bit 7 in the Configuration register.

7.9.1.3 ALERT output in SMBus ALERT mode

When several slave devices share a common interrupt line, an SMBus alert line is

implemented. The SA56004X is designed to accommodate the Alert interrupt detection

capability of the SMBus 2.0 Alert Response Address (ARA) protocol, defined in SMBus

specification 2.0. This procedure is designed to assist the master in resolving which slave

device generated the interrupt and in servicing the interrupt while minimizing the time to

restore the system to its proper operation. Basically, the SMBus provides Alert response

interrupt pointers in order to identify slave devices which have caused the Alert interrupt.

When the ARA command is received by all devices on the SMBus, the devices pulling the

SMBus alert line LOW send their device addresses to the master; await an

acknowledgement and then release the alert line. This requirement to disengage the

SMBus alert line prevents locking up the alert line. The SA56004X complies with this ARA

disengagement protocol by setting the ALERT mask bit 7 in the Configuration register at

address 09h after successfully sending out its address in response to an ARA command

and releasing the ALERT output. Once the mask bit is activated, the ALERT output is

disabled until enabled by software. In order to enable the ALERT the master must read

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Digital temperature sensor with overtemperature alarms

the Status register, at address 02h, during the interrupt service routine and then reset the

ALERT mask bit 7 in the Configuration register to logic 0 at the end of the interrupt service

routine (see Figure 6).

In order for the SA56004X to respond to the ARA command, the bit D0 in the ALERT

mode register must be set LOW.

ALERT mask bit 7 and the ALERT mode bit D0 are both LOW for the POR default.

remote temperature high limit

remote diode temperature

temperature

ALERT pin

status register bit 4

(RHIGH)

002aad215

A

B

C

D

Fig 6. ALERT pin in SMBus Alert mode

The following events summarize the ALERT output interrupt operation in the SMBus Alert

mode:

Event A: Master senses the ALERT line being LOW.

Event A to B: Master sends a read command using the common 7-bit Alert Response

Address (ARA) of 0001100.

Event A to B: Alerting device(s) return ACK signal and their addresses using the

I²C-bus Arbitration (the device with the lowest address value sends its address first. The

master can repeat the alert reading process and work up through all the interrupts).

Event B: Upon the successful completion of returning address, the SA56004X resets its

ALERT output (to OFF) and sets the ALERT mask bit 7 in its configuration register.

Event C: Master should read the device status register to identify and correct the

conditions that caused the Alert interruption. The status register is reset.

Event D: Master resets the ALERT mask bit 7 in the configuration register to enable the

device ALERT output interruption.

Remark: The bit assignment of the returned data from the ARA reading is listed in

Table 17. If none of the devices on the bus is alerted, then the returned data from ARA

reading is FFh (1111 1111).

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Digital temperature sensor with overtemperature alarms

Table 17. ALERT response bit assignment

ALERT response bit

Device address bit

Function

7 (MSB)

ADD6

ADD5

ADD4

ADD3

ADD2

ADD1

ADD0

1

address bit 6 (MSB) of alerted device

address bit 5 of alerted device

address bit 4 of alerted device

address bit 3 of alerted device

address bit 2 of alerted device

address bit 1 of alerted device

address bit 0 of alerted device

always logic 1

6

5

4

3

2

1

0

7.9.2 T_CRIT output

The T_CRIT output is LOW when any temperature reading is greater than the preset limit

in the corresponding critical temperature setpoint register. When one of the T_CRIT

setpoint temperatures is exceeded, the appropriate status register bit, 1 (RCRIT) or 0

(LCRIT), is set.

After every local and remote temperature conversion the status register flags and the

T_CRIT output are updated. Figure 7 is a timing diagram showing the relationship of

T_CRIT output, Status bit 1 (RCRIT) and the remote critical temperature setpoint (RCS),

and critical temperature hysteresis (TH) with remote temperature changes. Note that the

T_CRIT output is de-activated only after the remote temperature is below the remote

temperature setpoint, RCS minus the hysteresis, TH. In the interrupt mode only, the

Status register flags are reset after the Status register is read.

RCS

remote temperature

RCS − TH

Status register bit 1

(RCRIT)

T_CRIT output

A

B

C

002aad217

Fig 7. T_CRIT temperature response timing

Event A: T_CRIT goes LOW and Status bit 1 (RCRIT) is set HIGH when Remote

Temperature exceeds RCS, Remote T_CRIT Setpoint.

Event B: Remote Temperature goes below RCS  TH. T_CRIT is de-activated, but

Status register remains unchanged.

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Digital temperature sensor with overtemperature alarms

Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in

the interrupt mode).

7.9.3 Fault Queue

To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fault

Queue for both local and remote channel. The Fault Queue insures a temperature

measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint by not triggering

until three consecutive out-of-limit measurements have been made. The fault queue

defaults OFF upon POR and may be activated by setting bit 0 in the Configuration register

(address 09h) to logic 1.

remote temperature

RCS

RCS − TH

remote HIGH setpoint

remote LOW setpoint

ALERT output

T_CRIT output

events

A

B

C

D

E

F

G

H

I

002aad218

Remark: All events indicate the completion of a conversion.

Fig 8. Fault queue remote HIGH and LOW and T_CRIT, T_CRIT hysteresis setpoint

response (comparator mode)

Event A: The remote temperature has exceeded the Remote HIGH setpoint.

Event B: Three consecutive over limit measurements have been made exceeding the

Remote HIGH setpoint; the ALERT output is activated (goes LOW). By now, the remote

temp has exceeded the Remote T_CRIT setpoint (RCS).

Event C: Three consecutive over limit measurements have been made exceeding RCS;

the T_CRIT output is activated (goes LOW).

Event D: The remote temperature falls below the RCS  TH setpoint.

Event E: The ALERT output is de-activated (goes HIGH) after a below_high_limit

temperature measurement is completed.

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Digital temperature sensor with overtemperature alarms

Event F: Three consecutive measurements have been made with the remote

temperature below the RCS  TH threshold; the T_CRIT output is de-activated (goes

HIGH).

Event G: The remote temp falls below the Remote LOW setpoint.

Event H: Three consecutive measurements are made with the temp below the Remote

LOW setpoint; ALERT output is activated (goes LOW).

Event I: The ALERT output is de-activated (goes HIGH) after a above_low_limit

temperature measurement is completed.

7.9.4 Temperature measurement

To measure the remote temperature or the temperature of an externally attached diode,

the device automatically forces two successive currents of about 160 A and 10 A at D+

pin. It measures the voltage (V_BE) between D+ and D, detects the difference between the

two V_BEvoltages or the V_BEand then converts the V_BEinto a temperature data using

the basic PTAT voltage formula as shown in Equation 1. The device typically takes about

38 ms to perform a measurement during each conversion period or cycle, which is

selectable by programming the conversion rate register.

kT

q

l2

l1









-----

----

V_BE= n 

 ln

(1)

Where:

n = diode ideality factor

k = Boltzmann’s constant

T = absolute temperature (K) = 273 C + T (C)

q = electron charge

ln = natural logarithm

l2, l1 = two source currents

Because the device does not directly convert the sensed V_BEas in the old method of

temperature measurement systems, the V_BEcalibration is not required. Furthermore, the

device remote temperature error is adjusted at the manufacturer to meet the

specifications with the use of the reference diode-connected transistors such as the

2N3904/2N3906. The diode type to be used in customer applications must have the

characteristics as close to the 2N3904/2N3906 as possible in order to obtain optimal

results. Finally, to prevent the effects of system noise on the measured V_BEsignals, an

external capacitor of about 2200 pF connected between the D+ and D pins as well as the

grounded-shield cable for the diode connection wires are recommended.

7.9.5 Diode fault detection

The SA56004X is designed with circuitry to detect the fault conditions of the remote diode.

When the D+ pin is shorted to V_DDor floating, the Remote Temperature High Byte (RTHB)

register is loaded with +127 C, the Remote Temperature Low Byte (RTLB) register is

loaded with 0 C, and the OPEN bit (bit 2 of the Status register) is set. Under the above

conditions of D+ shorted to V_DDor floating, if the Remote T_CRIT setpoint is set less than

+127 C, and T_CRIT Mask are disabled, then, the T_CRIT output pins will be pulled

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Digital temperature sensor with overtemperature alarms

LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a

value less than +127 C and the Alert Mask is disabled, then the ALERT output will be

pulled LOW. Note that the OPEN bit itself will not trigger an ALERT.

When the D+ pin is shorted to ground or to D, the Remote Temperature High Byte

(RTHB) register is loaded with 128 C (1000 0000) and the OPEN (bit 2 in the Status

register) will not be set. Since operating the SA56004X is beyond its normal limits, this

temperature reading represents this shorted fault condition. If the value in the Remote

Low Setpoint High Byte (RLSHB) register is more than 128 C and the Alert Mask is

disabled, the ALERT output will be pulled LOW.

7.10 SMBus interface

The device can communicate over a standard two-wire serial interface System

Management Bus (SMBus) or compatible I²C-bus using SCLK and SDATA. The device

employs four standard SMBus protocols: Write Byte, Read Byte, Receive Byte, and

Send Byte. Data formats of four protocols are shown in Figure 9. The following key points

of protocol are important:

• The SMBus master initiates data transfer by establishing a START condition (S) and

terminates data transfer by generating a STOP condition (P).

• Data is sent over the serial bus in sequences of 9 clock pulses according to each 8-bit

data byte followed by 1-bit status of device acknowledgement (A).

• The 7-bit slave address is equivalent to factory-programmed address of the device.

• The command byte is equivalent to the address of the selected device register.

• The Receive Byte format is used for quicker transfer data from a device reading

register that was previously selected.

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Digital temperature sensor with overtemperature alarms

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

(cont.)

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

device register command

SDATA

S

W

A

9

A

START

device address

1

2

3

4

5

6

7

SCLK

SDATA

D7 D6 D5 D4 D3 D2 D1 D0

data to be written to register

A

P

STOP

002aad219

a. Write Byte format (to write a data byte to the device register)

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

(cont.)

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

device register command

SDATA

S

W

A

9

A

P

START

device address

STOP

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

9

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

data from device register

SDATA

S

R

A

NA

P

RESTART

device address

STOP

002aad220

b. Read Byte format (to read a data byte from the device register)

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

(cont.)

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

data from device register

SDATA

S

R

A

NA

P

RESTART

device address

STOP

002aad221

c. Receive Byte format (to read a data byte from already pointed register)

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

device register command

SDATA

S

W

A

P

START

device address

STOP

002aad222

d. Send Byte format

Fig 9. SMBus interface protocols

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Digital temperature sensor with overtemperature alarms

7.10.1 Serial interface reset

If the SMBus master attempts to reset the SA56004X while the SA56004X is controlling

the data line and transmitting on the data line, the SA56004X must be returned to a known

state in the communication protocol. This may be accomplished in two ways:

1. When the SDATA is LOW, the SA56004X SMBus state machine resets to the SMBus

idle state if SCLK is held LOW for more than 35 ms (maximum TIMEOUT period).

According to SMBus specification 2.0, all devices are required to time out when the

SCLK line is held LOW for 25 ms to 35 ms. Therefore, to insure a time-out of all

devices on the bus, the SCLK line must be held LOW for at least 35 ms.

2. When the SDATA is HIGH, the master initiates an SMBus START. The SA56004X

responds properly to a SMBus START condition only during the data retrieving cycle.

After the START, the SA56004X expects an SMBus Address byte.

8. Application design-in information

8.1 Factors affecting accuracy

8.1.1 Remote sensing diode

The SA56004X is designed to work with substrate transistors built into processors’ CPUs

or with discrete transistors. Substrate transistors are generally PNP types with the

collector connected to the substrate. Discrete types can be either a PNP or an NPN

transistor connected as a diode (base shorted to collector). If an NPN transistor is used,

the collector and base are connected to D+ and the emitter to D. If a PNP transistor is

used, the collector and base are connected to D and the emitter to D+. Substrate

transistors are found in a number of CPUs. To reduce the error due to variations in these

substrate and discrete transistors, a number of factors should be considered:

• The ideality factor, n_f, of the transistor. The ideality factor is a measure of the deviation

of the thermal diode from the ideal behavior. The SA56004X is trimmed for an n_fvalue

of 1.008. Equation 2 can be used to calculate the error introduced at a temperature

T C when using a transistor whose n_fdoes not equal 1.008. Consult the processor

data sheet for n_fvalues.

This value can be written to the offset register and is automatically added to or

subtracted from the temperature measurement.

n_natural– 1.008

------------------------------------------

T =

 273.15 Kelvin + T

(2)

1.008

• Some CPU manufacturers specify the high and low current levels of the substrate

transistors. The I_sourcehigh current level of the SA56004X is 100 A and the low-level

current is 10 A.

If a discrete transistor is being used with the SA56004X, the best accuracy is obtained by

choosing devices according to the following criteria:

• Base-emitter voltage greater than 0.25 V at 6 mA, at the highest operating

temperature.

• Base-emitter voltage less than 0.95 V at 100 mA, at the lowest operating temperature.

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Digital temperature sensor with overtemperature alarms

• Base resistance less than 100 .

• Small variation in h_FE(say 50 to 150) that indicates tight control of V_BEcharacteristics.

Transistors such as 2N3904, 2N3906, or equivalents in SOT23 packages are suitable

devices to use. See Table 18 for representative devices.

Table 18. Representative diodes for temperature sensing

Manufacturer

ROHM

Model number

UMT3904

Diodes Inc.

MMBT3904-7

MMBT3904

Philips

ST Micro

MMBT3904

ON Semiconductor

Chenmko

MMBT3904LT1

MMBT3904

Infineon Technologies

Fairchild Semiconductor

National Semiconductor

SMBT3904E6327

MMBT3904FSCT

MMBT3904N623

8.1.2 Thermal inertia and self-heating

Accuracy depends on the temperature of the remote-sensing diode and/or the internal

temperature sensor being at the same temperature as that being measured, and a

number of factors can affect this. Ideally, the sensor should be in good thermal contact

with the part of the system being measured, for example, the processor. If it is not, the

thermal inertia caused by the mass of the sensor causes a lag in the response of the

sensor to a temperature change. In the case of the remote sensor, this should not be a

problem, since it is either a substrate transistor in the processor or a small package

device, such as the SOT23, placed close to it.

The on-chip sensor, however, is often remote from the processor and is only monitoring

the general ambient temperature around the package. The thermal time constant of the

SSOP16 package in still air is about 140 seconds, and if the ambient air temperature

quickly changed by 100 C, it would take about 12 minutes (five time constants) for the

junction temperature of the SA56004X to settle within 1 C of this. In practice, the

SA56004X package is in electrical and therefore thermal contact with a printed-circuit

board and can also be in a forced airflow. How accurately the temperature of the board

and/or the forced airflow reflect the temperature to be measured also affects the accuracy.

Self-heating due to the power dissipated in the SA56004X or the remote sensor causes

the chip temperature of the device or remote sensor to rise above ambient. However, the

current forced through the remote sensor is so small that self-heating is negligible. In the

case of the SA56004X, the worst-case condition occurs when the device is converting at

16 conversions per second while sinking the maximum current of 1 mA at the ALERT

output. In this case, the total power dissipation in the device is about 11 mW. The thermal

resistance, R_th(j-a), of the SSOP16 package is about 121 C/W.

In practice, the package has electrical and therefore thermal connection to the printed

circuit board, so the temperature rise due to self-heating is negligible.

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Digital temperature sensor with overtemperature alarms

8.1.3 Layout considerations

Digital boards can be electrically noisy environments, and the SA56004X is measuring

very small voltages from the remote sensor, so care must be taken to minimize noise

induced at the sensor inputs. The following precautions should be taken.

1. Place the SA56004X as close as possible to the remote sensing diode. Provided that

the worst noise sources, that is, clock generators, data/address buses, and CRTs, are

avoided, this distance can be 4 inches to 8 inches.

2. Route the D+ and D tracks close together, in parallel, with grounded guard tracks on

each side. Provide a ground plane under the tracks if possible.

3. Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track

minimum width and spacing is recommended (see Figure 10).

4. Try to minimize the number of copper/solder joints, which can cause thermocouple

effects. Where copper/solder joints are used, make sure that they are in both the D+

and D path and at the same temperature.

Thermocouple effects should not be a major problem since 1 C corresponds to about

200 V and thermocouple voltages are about 3 V/C of temperature difference.

Unless there are two thermocouples with a large temperature differential between

them, thermocouple voltages should be much less than 200 V.

5. Place a 0.1 F bypass capacitor close to the V_DDpin. In very noisy environments,

place a 1000 pF input filter capacitor across D+ and D close to the SA56004X.

6. If the distance to the remote sensor is more than 8 inches, the use of twisted-pair

cable is recommended. This works up to about 6 feet to 12 feet.

7. For really long distances (up to 100 feet), use shielded twisted pair, such as

Belden #8451 microphone cable. Connect the twisted pair to D+ and D and the

shield to GND close to the SA56004X. Leave the remote end of the shield

unconnected to avoid ground loops.

Because the measurement technique uses switched current sources, excessive cable

and/or filter capacitance can affect the measurement. When using long cables, the filter

capacitor can be reduced or removed.

Cable resistance can also introduce errors. 1  resistance introduces about 1 C error.

GND

D+

10 mil

D−

GND

002aag953

Fig 10. Typical arrangement of signal tracks

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Digital temperature sensor with overtemperature alarms

8.2 Power sequencing considerations

8.2.1 Power supply slew rate

When powering-up the SA56004X, ensure that the slew rate of V_DDis less than 18 mV/s.

A slew rate larger than this may cause power-on reset issues and yield unpredictable

results.

8.2.2 Application circuit

Figure 11 shows a typical application circuit for the SA56004X, using a discrete sensor

transistor connected via a shielded, twisted-pair cable. The pull-ups on SCLK, SDATA,

and ALERT are required only if they are not already provided elsewhere in the system.

The SCLK and SDATA pins of the SA56004X can be interfaced directly to the SMBus of

an I/O controller, such as the Intel 820 chip set.

V

DD

R

10 kΩ

1

8

V

DD

V

SCLK

CLOCK

DD

100 nF

(1)

SMBus

CONTROLLER

SA56004X

shielded twisted pair

2

3

7

6

D+

SDATA

DATA

2.2 nF

D−

ALERT

INT

remote sensor

V

DD

2N3904 (NPN), 2N3906 (PNP),

or similar standalone, ASIC or

microprocessor thermal diode

R

10 kΩ

4

5

T_CRIT

GND

+5 V

FAN CONTROL

CIRCUIT

002aad201

(1) Typical value, placed close to temperature sensor.

Fig 11. Typical application circuit

8.3 Timing and firmware consideration

It is important not to violate the conversion timing on this part.

Regardless of timing, the device ‘could’ report an erroneous reading, but NXP, nor

reporting customers have not encountered two subsequent erroneous readings in its

product reviews or evaluations. Masking of single or two sequential erroneous readings is

recommended by comparing several reads should there be a large prompt change in the

temperature reading before taking protective action.

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

25 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

9. Limiting values

Table 19. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

All voltages are referenced to GND.

Symbol Parameter

Conditions

Min

0.3

1

Max

+6

Unit

V

V_DD

supply voltage

voltage at SDATA, SCLK, ALERT, T_CRIT

voltage at positive diode input

voltage at negative diode input

sink current

+6

V

V_D+

V_D

V_DD+ 0.3

+0.8

+50

V

I_sink

SDATA, SCLK, ALERT, T_CRIT

Human Body Model

mA

V

I_D+

D+ input current

1

+1

[1]

V_ESD

T_j(max)

T_stg

electrostatic discharge voltage

maximum junction temperature

storage temperature

-

2000

+150

+165

-

C

65

[1] The D+ and D pins are 1000 V HBM due to the higher sensitivity of the analog pins that introduces a limitation to the circuit protection

structure.

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

26 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

10. Characteristics

Table 20. Electrical characteristics

V_DD= 3.0 V to 3.6 V; T_amb= 40 C to +125 C; unless otherwise specified.

Symbol Parameter

Conditions

Min

2

Typ

Max

+2

Unit

C

T_ERRL

local temperature error

T_amb= +60 C to +100 C

T_amb= 40 C to +125 C

1

-

3

+3

C

T_ERRR

remote temperature error

T_amb= +25 C to +85 C;

T_RD= +60 C to +100 C

1

-

+1

C

T

_amb= 40 C to +85 C;

_RD= 40 C to +125 C

3

-

+3

C

T_RESR

remote temperature

resolution

-

11

-

bit

C

bit

C

ms

V

-

0.125

11

-

T_RESL

local temperature resolution

-

0.125

38

-

T_conv

V_DD

I_DD

conversion period

supply voltage

-

[1]

3.0

-

5.5

-

quiescent current

during conversion,

500

A

16 Hz conversion rate

shut-down current

SMBus inactive

-

10

160

10

-

A

V

I_RD

remote diode source current high setting: D+  D = +0.65 V

-

low setting

-

[3]

[4]

V_th(UVLO)undervoltage lockout

threshold voltage^[2]

V_DDinput disables A/D conversion

2.6

2.95

V_th(POR)

power-on reset threshold

voltage

V_DDinput falling edge

1.8

-

2.4

-

V

T_th(high)

high threshold temperature

local and remote ALERT high

default temperature settings;

default values set at power-up

+70

C

T_th(low)

low threshold temperature

local and remote ALERT low default

temperature settings;

default values set at power-up

-

0

-

C

T_th(crit)

critical threshold temperature local and remote T_CRIT default

temperature settings;

+85

default values set at power-up

T_hys

V_sat

hysteresis temperature

saturation voltage

T_CRIT; default value set at

power-up

-

+10

-

C

ALERT and T_CRIT output;

I_O= 6.0 mA

0.4

V

[1] The SA56004X is optimized for 3.3 V V_DDoperation.

[2] Definition of UnderVoltage LockOut (UVLO) threshold voltage: The value of V_DDbelow which the internal A/D converter is disabled. This

is designed to be a minimum of 200 mV above the power-on reset. While it is disabled, the temperature that is in the ‘read temperature

registers’ remains at the value that it was before the A/D was disabled. This is done to eliminate the possibility of reading unexpected

false temperatures due to the A/D converter not working correctly due to low voltage. In case of power-up (rising V_DD), the reading that

is stored in the ‘read temperature registers’ will be the default value of 0 C. V_DDwill rise to the value of the V_th(UVLO), at which point the

A/D functions correctly and the normal temperature is read.

[3] V_DD(rising edge) voltage below which the A/D converter is disabled.

[4] V_DD(falling edge) voltage below which the logic is reset.

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

27 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 21. SMBus interface characteristics

V_DD= 3.0 V to 3.6 V; T_amb= 40 C to +125 C; unless otherwise specified.

These specifications are guaranteed by design and not tested in production.

Symbol

V_IH

Parameter

Conditions

Min

2.2

-

Typ

Max

Unit

V

HIGH-level input voltage

LOW-level input voltage

LOW-level output current

SCLK, SDATA; V_DD= 2.7 V to 5.5 V

ALERT, T_CRIT; V_OL= 0.4 V

SDATA; V_OL= 0.6 V

-

5

-

V_IL

0.8

V

I_OL

1.0

6.0

-

mA

A

pF

-

I_OH

I_IL

HIGH-level output current

LOW-level input current

HIGH-level input current

input capacitance

1.0

-

1.0

-

I_IH

1.0

-

C_i

SCLK, SDATA

-

SMBus digital switching characteristics^[1]

f_SCLK

SCLK operating frequency

SCLK LOW time

-

400

kHz

ns

t_LOW

10 % to 10 %

90 % to 90 %

600

0

5000

-

t_HIGH

SCLK HIGH time

SMBus free time^[2]

hold time of START condition^[3]10 % of SDATA to 90 % of SCLK

hold time of data^[4]

set-up time of data in^[5]

5000

t_BUF

-

t_HD;STA

t_HD;DAT

t_SU;DAT

t_SU;STA

-

300

250

-

set-up time of repeat START

condition^[6]

90 % to 90 %

t_SU;STO

set-up time of STOP condition^[7]90 % of SCLK to 90 % of SDATA

250

-

ns

s

ns

ms

t_r

rise time

SCLK and SDATA

C_L= 400 pF; I_O= 3 mA

-

1

t_f

fall time

-

300

250

35

t_of

output fall time

SMBus time-out time^[8]

-

t_to(SMBus)

25

[1] The switching characteristics of the SA56004X fully meet or exceed all parameters specified in SMBus version 2.0. The following

parameters specify the timing between the SCLK and SDATA signals in the SA56004X. They adhere to, but are not necessarily

specified as the SMBus specifications.

[2] Delay from SDATA STOP to SDATA START.

[3] Delay from SDATA START to first SCLK HIGH-to-LOW transition.

[4] Delay from SCLK HIGH-to-LOW transition to SDATA edges.

[5] Delay from SDATA edges to SCLK LOW-to-HIGH transition.

[6] Delay from SCLK LOW-to-HIGH transition to restart SDATA.

[7] Delay from SCLK HIGH-to-LOW transition to SDATA STOP condition.

[8] LOW period for reset of SMBus.

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

28 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

t

f

r

t

HD;STA

t

LOW

SCLK

t

HIGH

t

SU;STO

HD;DAT

SU;STA

SU;DAT

t

HD;STA

SDATA

t

BUF

P

S

P

002aad237

Fig 12. Timing measurements

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

29 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

11. Performance curves

002aad228

002aad229

24

800

V

= 5.5 V

3.6 V

3.3 V

3.0 V

V

DD

= 5.5 V

3.6 V

3.3 V

3.0 V

I

DD

I

DD

shutdown

quiescent

(μA)

16

8

600

400

200

0

−50

−25

0

25

50

75

100

amb

125

(°C)

−50

−25

0

25

50

75

100

amb

125

(°C)

T

Fig 13. Typical I_DDshutdown versus temperature and

V_DD

Fig 14. Typical I_DDquiescent current versus

temperature and V_DD(conversion rate = 16 Hz)

002aad230

002aad231

400

500

quiescent

(μA)

(1)

V

= 5.5 V

3.6 V

3.3 V

3.0 V

I

DD

I

DD

quiescent

(μA)

400

300

200

100

(2)

300

200

(3)

(4)

(8)

(9)

(5)

(6)

(7)

100

−50

−25

0

25

50

75

100

amb

125

(°C)

−25

0

25

50

75

100

T (°C)

amb

125

T

Conversion rate:

(1) 16 Hz

(2) 8.0 Hz

(3) 4.0 Hz

(4) 2.0 Hz

(5) 1.0 Hz

(6) 0.5 Hz

(7) 0.25 Hz

(8) 0.12 Hz

(9) 0.06 Hz

Fig 15. Typical I_DDquiescent current versus

temperature and V_DD

Fig 16. Typical I_DDquiescent current versus

temperature and conversion rate (V_DD= 3.3 V)

(conversion rate = 0.06 Hz)

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

30 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

002aad232

002aad234

14

10

V

= 5.5 V

3.6 V

3.3 V

3.0 V

V

= 5.5 V

3.6 V

3.3 V

3.0 V

DD

I

OL

(mA)

10

8

6

4

6

2

−50

−25

0

25

50

75

100 125

(°C)

−50

−25

0

25

50

75

100 125

(°C)

T

amb

Fig 17. Typical T_CRIT I_OLversus temperature and

V_DD(V_OL= 0.4 V)

Fig 18. Typical ALERT I_OLversus temperature and V_DD

(V_OL= 0.4 V)

002aad233

002aad235

2.80

2.6

V

(V)

V

th(UVLO)

th(POR)

(V)

2.2

2.78

2.76

2.74

2.72

2.70

1.8

1.4

1.0

V

= 5.5 V

3.6 V

3.3 V

3.0 V

DD

−50

−25

0

25

50

75

100

amb

125

(°C)

−50

−25

0

25

50

75

100

amb

125

(°C)

T

Fig 19. Typical undervoltage lockout threshold

voltage versus temperature and V_DD

Fig 20. Typical power-on reset threshold voltage

versus temperature

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

31 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

12. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 21. Package outline SOT96-1 (SO8)

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

32 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm

SOT505-1

D

E

A

X

c

y

H

v

M

A

E

Z

5

8

A

(A )

2

A

3

A

1

pin 1 index

θ

L

p

L

1

4

detail X

e

w M

b

p

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

A

b

c

D

E

e

H

E

L

p

UNIT

v

w

y

Z

θ

1

2

3

p

max.

0.15

0.05

0.95

0.80

0.45

0.25

0.28

0.15

3.1

2.9

3.1

2.9

5.1

4.7

0.7

0.4

0.70

0.35

6°

0°

mm

1.1

0.65

0.25

0.94

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-04-09

03-02-18

SOT505-1

Fig 22. Package outline SOT505-1 (TSSOP8)

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

33 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

SOT782-1

X

D

B

A

E

A

1

c

detail X

terminal 1

index area

e

1

C

terminal 1

index area

v

C A

C

B

e

b

y

1

y

w

C

1

4

L

K

E

h

8

5

D

h

0

1

2 mm

L

scale

Dimensions

(1)

Unit

A

b

c

D

h

E

e

1

K

v

w

y

1

h

max 1.00 0.05 0.35

mm nom 0.85 0.03 0.30 0.2 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 0.1 0.05 0.05 0.1

min 0.80 0.00 0.25 2.90 2.35 2.90 1.55 0.25 0.35

3.10 2.45 3.10 1.65

0.35 0.45

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

sot782-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

JEITA

- - -

09-08-25

09-08-28

SOT782-1

MO-229

Fig 23. Package outline SOT782-1 (HVSON8)

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

34 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

13. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

13.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

13.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

13.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

SA56004X

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Product data sheet

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35 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

13.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 24) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 22 and 23

Table 22. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

235

 350

220

< 2.5

 2.5

220

Table 23. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 24.

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

36 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 24. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

14. Soldering: PCB footprints

5.50

0.60 (8×)

1.30

4.00 6.60 7.00

1.27 (6×)

solder lands

sot096-1_fr

placement accuracy ± 0.25

Dimensions in mm

occupied area

Fig 25. PCB footprint for SOT96-1 (SO8); reflow soldering

SA56004X

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Product data sheet

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37 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

1.20 (2×)

enlarged solder land

0.60 (6×)

0.3 (2×)

1.30

4.00 6.60 7.00

1.27 (6×)

5.50

board direction

solder lands

solder resist

placement accurracy ± ±0.25

sot096-1_fw

occupied area

Dimensions in mm

Fig 26. PCB footprint for SOT96-1 (SO8); wave soldering

3.600

2.950

0.725

0.125

5.750 3.600

3.200 5.500

1.150

0.600

0.450

0.650

sot505-1_fr

solder lands

occupied area

Dimensions in mm

Fig 27. PCB footprint for SOT505-1 (TSSOP8); reflow soldering

SA56004X

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Product data sheet

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38 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Footprint information for reflow soldering of HVSON8 package

SOT782-1

Gx

P

D

C

nSPx

SPx

SPy

SLy By

Ay

Hy

Gy

nSPy

SLx

solder land

solder paste deposit

solder land plus solder paste

occupied area

DIMENSIONS in mm

P

Ay

By

C

D

SLx

SLy

SPx

1.1

SPy

0.65

Gx

Gy

3.25

Hy

nSPx nSPy

0.65

3.25

2.2

0.525

0.3

2.45

1.65

3.25

3.5

1

12-02-09

12-02-28

Issue date

sot782-1_fr

Fig 28. PCB footprint for SOT782-1 (HVSON8); reflow soldering

SA56004X

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Product data sheet

Rev. 7 — 25 February 2013

39 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

15. Abbreviations

Table 24. Abbreviations

Acronym

A/D

Description

Analog-to-Digital

ARA

Alert Response Address

Application Specific Integrated Circuit

Cathode Ray Tube

ASIC

CRT

ESD

ElectroStatic Discharge

Human Body Model

HBM

HVAC

I²C-bus

LSB

Heating, Ventilating and Air Conditioning

Inter-Integrated Circuit bus

Least Significant Bit

MSB

Most Significant Bit

OTP

One-Time Programmable

Power-On Reset

POR

PTAT

SMBus

UVLO

Proportional To Absolute Temperature

System Management Bus

Under Voltage LockOut

16. Revision history

Table 25. Revision history

Document ID

SA56004X v.7

Modifications:

Release date

Data sheet status

Change notice

Supersedes

20130225

Product data sheet

-

SA56004X v.6

• Table 1 “Ordering information”: added “Topside marking” column and corrected Topside marking for

SO8 package (appended “D”)

• Table 2 “Ordering options” modified:

–

deleted column “Topside marking” (moved to Table 1)

–

added columns “Orderable part number”, “Package”, “Packing method”, “Minimum order

quantity”

• Section 7.2 “Slave address”: added (new) Table 4 “Slave addresses”

• Added (new) Section 8.3 “Timing and firmware consideration”

• Deleted (old) Section 13 “Packing information”

• Added (new) Section 14 “Soldering: PCB footprints”

SA56004X v.6

SA56004X v.5

SA56004X v.4

20120423

20080522

20060808

20041006

Product data sheet

-

SA56004X v.5

SA56004X v.4

SA56004X v.3

SA56004X v.2

SA56004X v.3

(9397 750 13841)

SA56004X v.2

(9397 750 12015)

20030903

20030819

Objective data

-

SA56004-X v.1

-

SA56004-X v.1

(9397 750 10993)

SA56004X

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 25 February 2013

40 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

17. Legal information

17.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

17.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

17.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

SA56004X

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 25 February 2013

41 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

I²C-bus — logo is a trademark of NXP B.V.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

SA56004X

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 25 February 2013

42 of 43

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

19. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

8.2.1

8.2.2

8.3

Power supply slew rate . . . . . . . . . . . . . . . . . 25

Application circuit. . . . . . . . . . . . . . . . . . . . . . 25

Timing and firmware consideration . . . . . . . . 25

2

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3

9

Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 26

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27

Performance curves . . . . . . . . . . . . . . . . . . . . 30

Package outline. . . . . . . . . . . . . . . . . . . . . . . . 32

4

4.1

5

10

11

12

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

13

Soldering of SMD packages. . . . . . . . . . . . . . 35

Introduction to soldering. . . . . . . . . . . . . . . . . 35

Wave and reflow soldering. . . . . . . . . . . . . . . 35

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 35

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 36

13.1

13.2

13.3

13.4

7

Functional description . . . . . . . . . . . . . . . . . . . 6

Serial bus interface. . . . . . . . . . . . . . . . . . . . . . 6

Slave address. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Register overview. . . . . . . . . . . . . . . . . . . . . . . 7

Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8

Starting conversion. . . . . . . . . . . . . . . . . . . . . . 9

Low power software standby mode . . . . . . . . . 9

Temperature data format . . . . . . . . . . . . . . . . . 9

SA56004X SMBus registers. . . . . . . . . . . . . . 10

Command register . . . . . . . . . . . . . . . . . . . . . 10

Local and remote temperature registers

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

7.8.1

7.8.2

14

15

16

Soldering: PCB footprints . . . . . . . . . . . . . . . 37

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40

Revision history . . . . . . . . . . . . . . . . . . . . . . . 40

17

Legal information . . . . . . . . . . . . . . . . . . . . . . 41

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 41

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42

17.1

17.2

17.3

17.4

(LTHB, LTLB, RTHB, RTLB) . . . . . . . . . . . . . . 10

Configuration register (CON) . . . . . . . . . . . . . 10

Status register (SR) . . . . . . . . . . . . . . . . . . . . 11

Conversion rate register (CR). . . . . . . . . . . . . 12

Temperature limit registers . . . . . . . . . . . . . . . 12

Programmable offset register (remote only) . . 13

ALERT mode register (AM) . . . . . . . . . . . . . . 13

Other registers . . . . . . . . . . . . . . . . . . . . . . . . 13

One-shot register . . . . . . . . . . . . . . . . . . . . . . 13

Interruption logic and functional description . . 14

ALERT output . . . . . . . . . . . . . . . . . . . . . . . . . 14

ALERT output in comparator mode . . . . . . . . 14

ALERT output in interrupt mode . . . . . . . . . . . 14

ALERT output in SMBus ALERT mode . . . . . 15

T_CRIT output . . . . . . . . . . . . . . . . . . . . . . . . 17

Fault Queue . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Temperature measurement . . . . . . . . . . . . . . 19

Diode fault detection. . . . . . . . . . . . . . . . . . . . 19

SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 20

Serial interface reset. . . . . . . . . . . . . . . . . . . . 22

18

19

Contact information . . . . . . . . . . . . . . . . . . . . 42

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

7.8.3

7.8.4

7.8.5

7.8.6

7.8.7

7.8.8

7.8.9

7.8.10

7.9

7.9.1

7.9.1.1

7.9.1.2

7.9.1.3

7.9.2

7.9.3

7.9.4

7.9.5

7.10

7.10.1

8

8.1

8.1.1

8.1.2

8.1.3

8.2

Application design-in information . . . . . . . . . 22

Factors affecting accuracy . . . . . . . . . . . . . . . 22

Remote sensing diode . . . . . . . . . . . . . . . . . . 22

Thermal inertia and self-heating. . . . . . . . . . . 23

Layout considerations. . . . . . . . . . . . . . . . . . . 24

Power sequencing considerations . . . . . . . . . 25

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 February 2013

Document identifier: SA56004X


型号：	SA56004EDP,118
厂家：	NXP
描述：	SA56004X - SMBus-compatible, 8-pin, remote/local digital temperature sensor with overtemperature alarms TSSOP 8-Pin 光电二极管
文件：	总43页 (文件大小：537K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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