SA56203STW_技术文档

SA56203S

One-chip motor driver

Rev. 01 — 31 January 2005

Preliminary data sheet

1. General description

The SA56203S is a one-chip motor driver IC that is capable of driving all motors of CD or

DVD systems e.g. spindle, sled and loading motors and actuators on the optical pick-up

unit. The driver intended for the 3-phase, brushless, Hall-commutated spindle motor uses

True-Silent PWM. This proprietary technology ensures that all 3-phase motor currents are

sinusoidal resulting in an optimally silent driver. Internal regeneration of the back EMF of

the spindle motor enables the driver to operate in current-steering mode without using

external power-dissipating sense resistors. The driver for the 2-phase sled stepper motor

operates in current-steering PWM mode. In addition the IC contains four full-bridge linear

channels that can be used to drive a loading motor and 3D actuators (focus, tracking and

tilt).

The SA56203S is available in an exposed die pad HTSSOP56 package.

2. Features

■ True-Silent PWM spindle motor driver

■ Low heat generation due to power-efﬁcient direct full-bridge switching of spindle motor

driver

■ Controlled spindle motor current during acceleration and brake

■ Reverse torque brake function (full bridge)

■ Adjustable spindle motor current limiter

■ Internal regeneration for EMF of spindle motor

■ Current-steering PWM controlled stepper motor driver for sled

■ Four class-AB linear channels for loading motor and 3D actuators (focus, tracking and

tilt)

■ Tracking actuator driver with back EMF ampliﬁer

■ Loading motor driver with transresistance ampliﬁer for loading current

■ Low on-resistance D-MOSFET output power stages

■ Built-in thermal shutdown and thermal warning

■ Interfaces to 3 V and 5 V logic

■ Package with low thermal resistance to heatsink (reﬂowable die pad)

■ Lead free package.

SA56203S

Philips Semiconductors

One-chip motor driver

3. Applications

■ DVD+RW, DVD-RW and DVD-RAM

■ Combi

■ CD-RW

■ Other compact disc media.

4. Ordering information

Table 1:

Ordering information

Type number

Package

Name

Description

Version

SA56203STW

HTSSOP56 plastic thermal enhanced thin shrink small outline package; 56 leads;

body width 6.1 mm; exposed die pad

SOT793-1

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

2 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

5. Block diagram

1

2

3

4

5

6

56

HU+

HU−

HV+

HV−

HW+

HW−

REVERSE

DETECTION

OSCILLATOR

COSC

THERMAL

SHUTDOWN

HALL

AMP

FG

55

VINLD

54

VINTRK

53

VINFCS

52

VINTLT

51

V

7

DD(LD)

50

HBIAS

RREF

HALL BIAS

V

DD(TRK)

49

48

47

47 kΩ

LDO+

LEVEL

SHIFT

8

VINREF

LDO−

9

CURRENT

REFERENCE

REMF

RLIM

10

TRKO+

TRKO−

47 kΩ

LEVEL

SHIFT

46

45

44

43

11

VINREF

V

SS1(SPN)

V

SS(ACT)

DD(ACT)

12

13

14

15

16

17

U

47 kΩ

FCSO+

FCSO−

TLTO+

TLTO−

V

LEVEL

SHIFT

DD1(SPN)

42

41

SPINDLE

LOGIC

VINREF

V

SS2(SPN)

47 kΩ

LEVEL

SHIFT

W

40

39

38

VINREF

V

DD2(SPN)

V

DD(SLD)

18

RSLD1

FG

SA56203S

19

20

37

V

SLDO1+

SSA

VINSPN

VINREF

ADC

36

35

34

SLDO1−

RSLD2

21

22

VINREF

SLED

LOGIC

500 kΩ

SLDO2+

V

DDA

33

32

SLDO2−

23

24

25

CP1

CP2

CP3

V

SS(SLD)

CHARGE

PUMP

31

30

VLDTRK

VINSLD2

47 kΩ

26

27

28

CTL1

CTL2

TEMP

MUTE/

STANDBY

FUNCTIONS

VINREF

47 kΩ

29

VINSLD1

VINREF

001aac121

Fig 1. Block diagram

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

3 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

6. Pinning information

6.1 Pinning

1

56

COSC

HU+

HU−

2

55 VINLD

3

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

HV+

VINTRK

VINFCS

VINTLT

4

HV−

5

HW+

HW−

HBIAS

RREF

REMF

RLIM

6

V

DD(LD)

7

DD(TRK)

8

LDO+

9

LDO−

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

TRKO+

TRKO−

V

SS1(SPN)

U

V

SS(ACT)

DD(ACT)

DD1(SPN)

V

FCSO+

FCSO−

TLTO+

TLTO−

SA56203STW

V

SS2(SPN)

W

V

DD2(SPN)

FG

V

DD(SLD)

V

SSA

RSLD1

VINSPN

VINREF

SLDO1+

SLDO1−

RSLD2

V

DDA

CP1

CP2

SLDO2+

SLDO2−

V

CP3

SS(SLD)

VLDTRK

CTL1

CTL2

TEMP

30 VINSLD2

29

VINSLD1

001aac122

Fig 2. Pin conﬁguration

6.2 Pin description

Table 2:

Symbol

HU+

Pin description

1

Description

Hall input U positive

Hall input U negative

Hall input V positive

Hall input V negative

Hall input W positive

Hall input W negative

Hall element bias

HU−

2

HV+

3

HV−

4

HW+

5

HW−

6

HBIAS

RREF

7

8

external resistor for current reference

9397 750 14192

Preliminary data sheet

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4 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

Table 2:

Symbol

REMF

RLIM

Pin description …continued

9

Description

external resistor for EMF regeneration

external resistor for current limit

spindle driver ground 1

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

V_SS1(SPN)

U

V_DD1(SPN)

V

V_SS2(SPN)

W

V_DD2(SPN)

FG

spindle driver output U

spindle driver supply voltage 1

spindle driver output V

spindle driver ground 2

spindle driver output W

spindle driver supply voltage 2

frequency generator output

analog ground

V_SSA

VINSPN

VINREF

V_DDA

spindle driver input voltage for spindle motor current

reference input voltage for all motor drivers

analog supply voltage

CP1

charge pump capacitor connection 1

charge pump capacitor connection 2

charge pump capacitor connection 3

driver logic control input 1

CP2

CP3

CTL1

CTL2

driver logic control input 2

TEMP

thermal warning

VINSLD1

VINSLD2

VLDTRK

V_SS(SLD)

SLDO2−

SLDO2+

RSLD2

SLDO1−

SLDO1+

RSLD1

V_DD(SLD)

TLTO−

TLTO+

FCSO−

FCSO+

V_DD(ACT)

V_SS(ACT)

TRKO−

TRKO+

LDO−

sled driver 1 input for sled motor current

sled driver 2 input for sled motor current

voltage output loader/track

sled driver ground

sled driver output 2 negative

sled driver output 2 positive

sled driver 2 current sense

sled driver output 1 negative

sled driver output 1 positive

sled driver 1 current sense

sled driver sense supply voltage

tilting driver output negative

tilting driver output positive

focus driver output negative

focus driver output positive

focus/tilt drivers supply voltage

actuator drivers ground

tracking driver output negative

tracking driver output positive

loading driver output negative

loading driver output positive

LDO+

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

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SA56203S

Philips Semiconductors

One-chip motor driver

Table 2:

Symbol

V_DD(TRK)

V_DD(LD)

VINTLT

VINFCS

VINTRK

VINLD

Pin description …continued

50

51

52

53

54

55

56

Description

tracking driver supply voltage

loading driver supply voltage

tilting driver input for tilt actuator driver

focus driver input for focus actuator voltage

tracking driver input for tracking actuator voltage

loading driver input for loading motor voltage

external capacitor for internal oscillator

COSC

7. Functional description

7.1 Spindle motor control

The control input voltage on pin VINSPN is converted into a digital value by the ADC

where the voltage on pin VINREF is the midpoint reference. The transconductance gain

from input voltage V_VINSPNto output motor current I_MOTis:

I_MOT

-----------------------------------------------------

(V_VINSPN– V_VINREF

I_LIM

g_m(SPN)

=

---------------------

)

V_VINREF

where I_LIMcan be programmed by means of external resistor R_LIM. The motor current is

described by Figure 3.

I

LIM

I

MOT

forward

torque

0

V

2V

VINREF

reverse

torque

brake

−I

LIM

V

VINSPN

001aaa431

Fig 3. Spindle motor current as a function of control input voltage VINSPN

For VINSPN voltages larger than V_VINREFthe motor will accelerate with forward torque

control. For VINSPN voltages smaller than V_VINREFthe motor will brake with reverse

torque control.

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

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SA56203S

Philips Semiconductors

One-chip motor driver

7.2 Spindle brake

Because the U, V and W half-bridges of the spindle motor driver use a direct PWM

full-bridge switching scheme, the motor current can also be controlled and limited during

brake. It should be noted that because of this active brake mechanism energy of the motor

can be recuperated back to the supply. Especially at large speeds, this can result in

currents delivered back to the supply.

If the supply and / or other circuits than the motor driver do not use this recuperated

current, then the supply voltage can rise to unacceptable values. In this event it is

recommended to lower the spindle current during brake by means of the VINSPN setting.

The SA56203S has a clamp incorporated on the spindle driver supply voltage for

protecting the IC against this overvoltage.

Upon detection of reverse rotation all U, V and W driver outputs are connected to

V_DD(SPN). This short brake prevents the motor from spinning backwards.

7.3 Internal regeneration of back EMF spindle motor

The spindle motor driver uses the information from the Hall sensors to internally

regenerate the back EMF of the motor (see Figure 4).

ANALOG DOMAIN

DIGITAL DOMAIN

VINSPN

U

V

W

V

= R × I

V

= V + V

MOT RI EMF

torque

control

signal

RI

m

A

PWM

D

spindle

motor

V

= ω × k

EMF

R

LIM

Hall U

Hall V

Hall W

maximum

motor

current

ω

SPEED

R

EMF

motor

k-factor

001aaa438

Fig 4. Regeneration of back EMF voltage spindle motor

Rotational speed ω is derived from the Hall event frequency. Multiplying ω with the k-factor

of the motor gives the back EMF voltage V_EMF. This V_EMFis added to the current-limited

scaled spindle input voltage V_VINSPN. This sum V_MOTsteers the PWM outputs U, V and W.

The result is that the input voltage V_VINSPNrepresents the current through the motor. This

explains how the SA56203S spindle motor driver exhibits a current control transfer

function without using external sense resistors.

The simpliﬁed motor schematic in Figure 5 shows the series resistance and back EMF

voltage of the motor.

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

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SA56203S

Philips Semiconductors

One-chip motor driver

V

M1

V

RM

V

EMF

2

EMF

2

V

RM

001aaa450

V

M2

Fig 5. Simpliﬁed spindle motor schematic

Figure 6 shows the motor voltages V_M1and V_M2during accelerating and braking. The

back EMF voltage is part of these motor voltages.

V

M1

V

DD(SPN)

V

EMF

2

V

RM

V

M2

V

DD(SPN)

2

k

ω

0

ω

max

ω

0

V

EMF

2

V

RM

M1

V

0

M2

accelerating

braking

001aaa432

Fig 6. Motor voltages when accelerating and braking with constant motor current

7.4 Sine generation using True-Silent signals

For the phase relation between the Hall inputs and the spindle outputs in forward rotation,

see Figure 7. These are the signal shapes in sine mode using our True-Silent PWM

technology. The particular shape of the 120° symmetrical U, V and W steering voltages

are because of improved drive strength and improved power efﬁciency. The drive strength

is improved because with this signal shape a 15 % larger sine can be ﬁt within the supply

rails compared to direct-written sine signals. Also the power efﬁciency is improved

because this signal shape has 33 % less switching losses compared to a direct-written

sine.

The result is that the motor currents (and motor torques) are pure sine waves generated in

such a way that the motor is driven optimally silent, optimally power efﬁcient and with

maximum driving strength.

9397 750 14192

Preliminary data sheet

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SA56203S

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One-chip motor driver

HALL U

HALL W

HALL V

U(V)

U

U(I)

V(V)

V

V(I)

W(V)

W

W(I)

001aaa433

Fig 7. Phase relation between Hall input signals and spindle motor driver output

voltages U(V), V(V), W(V) and motor currents U(I), V(I), W(I) in forward rotation

mode

7.5 Programming R_LIM

If the supply is connected between the terminals of a non-running spindle motor, then

usually a current will ﬂow that is too large. The motor current can be limited to a value I_LIM

I_LIMcan be programmed by means of R_LIM. In order to calculate the required R_LIMﬁrst a

typical maximum motor current I_MAXneeds to be determined:

.

V_DD(SPN)

I_MAX

=

-------------------------------------------------------------------

R_motor+ R_switches+ R_wiring

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Preliminary data sheet

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SA56203S

Philips Semiconductors

One-chip motor driver

I_LIMcan be chosen to be a fraction of this maximum current I_MAX. By making the ratio

between R_LIMand R_REFthis same fraction, I_LIMis programmed as expressed in the

R_LIM

following formula: I_LIM

=

× I

------------

MAX

R_REF

Figure 8 shows the limit current as a function of R_LIMwith R_REF= 47 kΩ.

001aaa434

100

I

LIM

(% of I

)

MAX

80

60

40

20

0

10

20

30

40

R

50

(kΩ)

LIM

Fig 8. Limit current I_LIMas a function of external resistor R_LIM

During accelerating and braking the motor current will not exceed I_LIM. I_LIMalso sets the

I_LIM

transconductance gain, g_m

=

of the spindle driver.

---------------------

V_VINREF

7.6 Programming R_EMF

The back EMF voltage is internally regenerated. The ratio between R_EMFand R_REFis

used to scale the internal EMF regeneration. The value of external resistor R_EMFdepends

on the type of motor (k-factor and number of pole pairs N_PP) and the motor supply voltage

V_DD(SPN). The following formula should be used to determine the R_EMFresistor:

k × 2.6 × 10³× R_REF

R_EMF

=

with k in units Nm/A.

--------------------------------------------------

N_PP× V_DD(SPN)

7.7 Frequency generator

The raw zero-crossings of the Hall sensors are ﬁrst ﬁltered and debounced before being

passed to the Frequency generator (FG). The FG toggles its output at every ﬁltered Hall

zero-crossing. For three Hall sensors this means that the motor frequency is linked to the

FG

3 × N_PP

FG frequency by: f _motor

=

-------------------

where N_PPindicates the number of pole pairs of the motor. The FG has an open-drain

output for easy interfacing to 3 V and 5 V logic.

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

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SA56203S

Philips Semiconductors

One-chip motor driver

7.8 Sled motor driver

Two current steering channels are available to drive a stepper motor. Per channel an

external sense resistor R_senseis used that is connected to V_DD(SLD). A peak-current control

loop is implemented that modulates the duty cycle of the PWM signal (see Figure 9).

R

sense

V

RSLD

DD(SLD)

47 kΩ

A

I

−

47 kΩ

VINSLD

SLDO+

+

Σ

R

S

LOGIC

DRIVE

M

DRIVER

Q

SLDO−

V

VINREF

CLOCK

input amplifier

I

O

001aab483

V

SS(SLD)

Fig 9. Peak-current control architecture of sled motor driver

f _osc

The clock generator has a nominal frequency of

= 70 kHz. See Figure 10, transfer

---------

256

function from input voltage V_VINSLDto output current at a typical R_senseof 0.5 Ω.

Input-to-output transconductance gain can be scaled down by connecting external resistor

R_extin series with the input VINSLD.

I

(A)

OUT

1 A

(V)

dead zone

+1 A/V

30 mV

V

− V

VINREF

VINSLD

−30 mV

+1 A/V

−1 A

001aaa436

Fig 10. Transfer function of sled motor driver

Both limiting current and transconductance gain are related to R_sensein the following way:

I_o

1

Transconductance gain: g_m

=

-------

-----------------------

2 × R_sense

V_in

9397 750 14192

Preliminary data sheet

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SA56203S

Philips Semiconductors

One-chip motor driver

1

Limiting current: I_LIM

=

-----------------------

2 × R_sense

7.9 Loading motor driver

One of the linear channels is available to drive a DC loading motor. Pin V_DD(LD)is used to

set the supply voltage for the loading motor driver. The following voltage-steering bridge

topology is implemented in the SA56203S.

188 kΩ

47 kΩ

LDO−

47 kΩ

VINLD

188 kΩ

R

23.5 kΩ

V

DD(LD)

R

47 kΩ

VINREF

LDO+

188 kΩ

001aab246

Fig 11. Voltage steering bridge topology of linear driver

7.10 Actuator motor drivers

Three linear channels are available to drive 3D actuators: focus, tracking and tilt. Pin

V_DD(ACT)is used to set the supply voltage for the focus and tilt actuators (maximum 5.5 V).

A separate pin V_DD(TRK)sets the supply voltage for the tracking actuator (maximum 14 V).

The voltage-steering bridge topology is the same as depicted in Figure 11.

7.11 Charge pump

The on-board charge pump generates a voltage of typically 18.2 V by using the V_DD(SPN)

supply voltage. This boosted voltage is used to turn on the upper n-type DMOS transistors

of the output stages of the spindle driver, sled driver, loading driver and actuator drivers.

Recommended values for the pump and hold capacitor are 10 nF and 22 nF respectively

(see default settings). The charge pump should not be loaded with other components or

circuitry other than these capacitors.

7.12 Thermal protection

If the junction temperature of the SA56203S exceeds 150 °C, then a thermal warning

signal is given at pin TEMP. Pin TEMP has an active-LOW open-drain output for easy

interfacing to the 3 V and 5 V logic. The temperature hysteresis for the thermal warning is

20 °C. If the junction temperature of the IC rises to 160 °C, then a thermal shutdown is

activated that sets all power outputs in 3-state. The temperature hysteresis for the thermal

9397 750 14192

Preliminary data sheet

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SA56203S

Philips Semiconductors

One-chip motor driver

shutdown is 30 °C. As soon as the thermal shutdown deactivates at 130 °C, all motor

drivers continue normal operation. At the same time the thermal warning signal is

deactivated.

7.13 Oscillator

The RC oscillator uses two external components (R_REFand C_OSC) to ﬁx its frequency at

18 MHz. R_REFis used to generate a reference current. This reference current is used to

charge and discharge C_OSC. The nominal oscillation frequency f_oscis 18 MHz with

R_REF= 47 kΩ (2 % tolerance) and C_OSC= 70 pF (5 % tolerance). These values are ﬁxed.

The oscillator can be overruled by applying an 18 MHz clock to pin COSC. The reference

current derived from R_REFis also used for R_LIMand R_EMF. R_REFshould always be

connected.

7.14 Muting Functions

Pins CTL1 and CTL2 are used to mute certain parts of the IC; see Table 3.

Table 3:

Muting functions^[1]

CTL1 CTL2 Loading Sled

Focus

tilt

Tracking Spindle Special

motor

off

motor

L

off

standby

H

on

FG and Hall bias on; pin

VLDTRK for loader motor

H

L

off

on

off

on

off

on

all actuators off; pin

VLDTRK for tracking

actuator

H

spindle, sled and all

actuators on

[1] Off equals 3-state.

8. Internal circuitry

Table 4:

Symbol

Internal circuitry

Pin Equivalent circuit

Hall ampliﬁers

HU+

1

HU−

2

1, 3, 5

2, 4, 6

HV+

3

19

HV−

4

001aab696

HW+

HW−

V_SSA

5

6

19

Hall bias

HBIAS

V_SSA

7

19

off when standby

(CTL1 and CTL2 = LOW)

19

001aab697

9397 750 14192

Preliminary data sheet

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SA56203S

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One-chip motor driver

Table 4:

Symbol

Internal circuitry …continued

Pin Equivalent circuit

Current reference

RREF

REMF

RLIM

V_SSA

8

22

9

10

1.65 V

19

22

V_DDA

8

9

10

19

001aab698

Spindle motor driver

V_SS1(SPN)11

13, 17

U

12

V_DD1(SPN)13

14

V_SS2(SPN)15

16

12

14

16

V

W

11, 15

001aab699

V_DD2(SPN)17

Frequency generator

FG

18

19

18

V_SSA

19

001aab700

Spindle input

V_SSA

19

VINSPN

VINREF

20

21

20

21

500 kΩ

19

001aab701

Charge pump

V_DD1(SPN)13

V_DD2(SPN)17

13, 17

V_SSA

CP1

CP2

CP3

19

23

24

25

24

25

23

170 kΩ

12 kΩ

19

001aab702

9397 750 14192

Preliminary data sheet

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SA56203S

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One-chip motor driver

Table 4:

Symbol

Control

V_SSA

Internal circuitry …continued

Pin Equivalent circuit

19

26

27

to mute table

26 27

CTL1

CTL2

19

001aab703

Temperature warning

V_SSA

19

28

19

TEMP

temperature

above 150 °C

001aab704

Sled inputs

V_SSA

19

21

47 kΩ

VINREF

47 kΩ

VINSLD1 29

VINSLD2 30

29, 30

19

21

001aab705

VLDTRK output

V_SSA

19

22

31

22

V_DDA

VLDTRK

150 Ω

31

19

001aab706

Sled motor driver

V_SS(SLD)

SLDO2−

SLDO2+

RSLD2

32

33

34

35

36

37

38

35

38

33

34

36

37

SLDO1−

SLDO1+

RSLD1

32

44

32

44

001aab707

001aab708

Linear motor drivers

TLTO−

40

41

42

43

44

45

TLTO+

FCSO−

FCSO+

V_DD(ACT)

V_SS(ACT)

40

41

42

43

45

001aab709

001aab710

9397 750 14192

Preliminary data sheet

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One-chip motor driver

Table 4:

Symbol

V_SS(ACT)

TRKO−

TRKO+

LDO−

Internal circuitry …continued

Pin Equivalent circuit

45

50

51

46

47

46

47

48

49

48

LDO+

49

V_DD(TRK)

V_DD(LD)

50

45

001aab711

001aab712

51

Linear inputs

V_SSA

19

21

52

53

54

55

47 kΩ

VINREF

VINTLT

VINFCS

VINTRK

VINLD

Oscillator

V_SSA

47 kΩ

52, 53, 54, 55

21

19

001aab713

19

22

56

22

V_DDA

COSC

56

19

001aab714

9. Limiting values

Table 5:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

V_DD1(SPN)

V_DD2(SPN)

,

spindle driver supply

voltage

−0.5

+16

V

V_DD(SLD)

V_DD(LD)

sled driver sense supply

−0.5

+16

V

loading driver supply

voltage

V_DD(TRK)

V_DD(ACT)

tracking driver supply

voltage

−0.5

+16

V

focus/tilt drivers supply

voltage

+6.5

V_DDA

T_stg

analog supply voltage

storage temperature

−0.5

−55

−40

+6.5

+150

+85

V

°C

T_amb

operating temperature

range

T_j

junction temperature

−40

+160

2.1

°C

I_O(SPN)

spindle output current, pins

12, 14 and 16

-

A

9397 750 14192

Preliminary data sheet

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SA56203S

Philips Semiconductors

One-chip motor driver

Table 5:

Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

I_O(SLD)

sled output current, pins

33, 34, 35, 36, 37 and 38

-

1.2

A

I_O(ACT)

loading/actuator drivers

output current, pins 40, 41,

42, 43, 46, 47, 48 and 49

-

2.0

A

I_Hall

Hall current on pins 1, 2, 3,

4, 5 and 6

−1

−20

−1

+1

mA

I_HBIAS

I_RPROG

I_O(n)

Hall bias current on pin

HBIAS

+100

+1

current on external resistor

pins 8, 9 and 10

current on pins 18, 28 and

31

+10

+1

I_DIG

driver logic control current

on pins 26 and 27

I_CPUMP

I_STEER

charge pump current on

pins 23, 24 and 25

+20

+1

steering current on pins 20,

21, 29, 30, 52, 53, 54 and

55

I_COSC

V_esd

current on pin COSC

−20

+20

mA

electrostatic discharge

voltage

pins 23, 40 to 44 and 51 human body model

machine model

-

1000

100

V

all other pins

human body model

machine model

2000

200

10. Recommended operating conditions

Table 6:

Symbol

Recommended operating conditions

Parameter

Conditions

Min

Typ

Max

Unit

V_DD1(SPN)

V_DD2(SPN)

,

spindle driver supply V_DD1(SPN)

=

4.5

12

5.0

12

5

14

V

voltage

V_DD2(SPN)

V_DDA

analog supply

voltage

5.5

14

5.5

14

V_DD(SLD)

V_DD(ACT)

V_DD(TRK)

V_DD(LD)

sled driver sense

supply

focus/tilt drivers

supply voltage

tracking driver

supply voltage

12

loading driver supply

voltage

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

17 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

11. Thermal characteristics

Table 7:

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Typ

Unit

thermal resistance from

junction to ambient

in free air; multilayer

printed-circuit board

33

K/W

001aaa428

4

P

(W)

3

2

1

0

50

100

150

T

(°C)

amb

Fig 12. Maximum power dissipation as a function of ambient temperature

12. Characteristics

Table 8:

Characteristics

V_DDA= 5 V; V_DD1(SPN)= V_DD2(SPN)= 12 V; V_DD(SLD)= 12 V; V_DD(TRK)= 12 V; V_DD(ACT)= 5 V; V_DD(LD)= 12 V; T_amb= 25 °C; all

characteristics are speciﬁed for the default settings (see Table 9); all voltages are referenced to V_SS; positive currents ﬂow

into the device; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supplies: pins V_DD1(SPN), V_DD2(SPN), V_DDA, V_DD(ACT), V_DD(SLD), V_DD(LD), V_DD(TRK)

I_DD(SPN)

spindle driver supply

current

I_DD1(SPN)+ I_DD2(SPN)

2

3

5

mA

I_DDA

analog supply current

14

-

16

1

18

1.5

26

mA

I_DD(SLD)

I_DD(ACT)

sled driver supply current

focus/tilt drivers supply

current

-

19

I_DD(TRK)

I_DD(LD)

tracking driver supply

current

2

4

6

mA

loading driver supply

current

CTL2 = H

I_stb(tot)

total standby current

CTL1 = CTL2 = L

-

6

9

-

mA

V

V_DDA(POR)

power-on reset voltage on

V_DDA

3.5

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

18 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

Table 8:

Characteristics …continued

V_DDA= 5 V; V_DD1(SPN)= V_DD2(SPN)= 12 V; V_DD(SLD)= 12 V; V_DD(TRK)= 12 V; V_DD(ACT)= 5 V; V_DD(LD)= 12 V; T_amb= 25 °C; all

characteristics are speciﬁed for the default settings (see Table 9); all voltages are referenced to V_SS; positive currents ﬂow

into the device; unless otherwise speciﬁed.

Symbol

Charge pump: pin CP3

V_Ooutput voltage

Parameter

Conditions

Min

Typ

Max

Unit

-

18.7

-

V

Spindle motor driver: pins HU+, HV+, HW+ HU−, HV−, HW−, HBIAS, RREF, REMF, RLIM, U, V, W FG, VINSPN, VINREF

and COSC

[1]

V_IO

input offset voltage Hall

ampliﬁer

V_HU−= V_HV−= V_HW−= 1.65 V

−3.5

-

+3.5

mV

V

V_i

input voltage range Hall

ampliﬁer

0

V_DDA

V_HBIAS

f_osc

voltage on pin HBIAS

I_HBIAS= 32 mA

-

0.6

18

-

V

oscillator frequency on pin

COSC

MHz

f_PWM

PWM frequency on pins

U, V and W

-

70

-

kHz

Ω

R_ds(on)

V_VINREF

V_VINSPN

I_U, I_V, I_W

D-MOSFET on-resistance I = 100 mA

(high or low)

-

0.35

1.65

-

input voltage range on

reference pin VINREF

1.2

0

2.5

V_DDA

-

V

input voltage range on

torque control pin VINSPN

V

[2]

[3]

spindle motor current limit see Figure 3;

-

2.0

A

R

_switches+ R_motor+ R_wiring= 2.5 Ω;

V_VINSPN= 0 V and 3.3 V

g_m(SPN)

transconductance gain

spindle

see Figure 3;

R

-

1.24

-

A/V

_switches+ R_motor+ R_wiring= 2.5 Ω;

V_VINSPN= 0 V and 3.3 V

Sled motor driver: pins RSLD1, SLDO1+, SLDO1−, RSLD2, SLDO2+, SLDO2−, VINSLD2 and VINSLD1

I_SLDO

motor current limit

R_sense= 0.5 Ω; V_VINSLD= 0 V

-

1.0

-

A

and 3.3 V

f_PWM

PWM frequency on pins

SLDO1+, SLDO1−,

-

70

-

kHz

SLDO2+ and SLDO2−

[4]

V_i(trip)

g_m

input dead zone trip level

transconductance gain

15

0.60

-

30

45

0.90

-

mV

A/V

Ω

[4] [5]

0.75

1.0

R_ds(on)

D-MOSFET on-resistance I = 100 mA; V_VINSLD= 0 V

(high or low) and 3.3 V

Loading motor driver: pins VINLD, LDO+ and LDO−

I_LDO

current limit (high or low) CTL1 = L; R_L= 4 Ω; V_VINLD= 0 V

0.85

1.0

1.5

A

and 3.3 V

V_OO

G_V

output offset voltage

voltage gain

CTL1 = L; no load

−100

17.2

-

0

+100

18.8

1.0

mV

dB

Ω

[6]

18.0

0.7

R_ds(on)

D-MOSFET on-resistance CTL1 = L; I = 100 mA; V_VINLD= 0 V

(high or low) and 3.3 V

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

19 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

Table 8:

Characteristics …continued

V_DDA= 5 V; V_DD1(SPN)= V_DD2(SPN)= 12 V; V_DD(SLD)= 12 V; V_DD(TRK)= 12 V; V_DD(ACT)= 5 V; V_DD(LD)= 12 V; T_amb= 25 °C; all

characteristics are speciﬁed for the default settings (see Table 9); all voltages are referenced to V_SS; positive currents ﬂow

into the device; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tracking actuator driver: pins VINTRK, TRKO+ and TRKO−

I_TRKO

V_OO

G_V

current limit

R_L= 4 Ω; V_VINTRK= 0 V and 3.3 V

1.0

1.5

0

2.0

A

output offset voltage

no load

−70

17.2

+70

18.8

mV

dB

[7]

voltage gain tracking

driver

18.0

R_ds(on)

D-MOSFET on-resistance I = 100 mA; V_VINTRK= 0 V or 3.3 V

(high or low)

-

0.7

1.0

2.0

Ω

Focus and tilt actuator drivers: pins VINFCS, VINTLT, FCSO+, FCSO−, TLTO+ and TLTO−

I_FCSO, I_TLTOcurrent limit

R_L= 4 Ω; V_VINFCS= 0 V or 3.3 V;

_VINTLT= 0 V or 3.3 V

1.0

1.5

A

V

V_OO

G_V

output offset voltage

no load

−55

0

+55

mV

dB

[7]

[8]

voltage gain focus/tilt

drivers

11.2

12

12.8

G_v(m)

gain mismatch between

focus and tilt drivers

0

-

5

%

R_ds(on)

MOSFET on-resistance

(high or low)

I = 100 mA; V_VINFCS= 0 V or 3.3 V;

0.6

0.9

Ω

V_VINTLT= 0 V or 3.3 V

Voltage output loader/tracking actuator: pin VLDTRK

G_R

transresistance gain of

current loading motor

CTL1 = L; I_LDO= 250 mA; R_L= 4 Ω

1.3

1.5

1.7

V/A

mV

dB

mV

V

V_OO

G_V

output offset

transresistance ampliﬁer

CTL1 = L; no load

−100

29.2

−250

-

0

+100

30.8

+250

-

[9]

voltage gain of back EMF CTL2 = L

voltage tracking actuator

30.0

0

V_OO

V_O(CM)

R_O

output offset back EMF

ampliﬁer

CTL2 = L; R_L= 4 Ω

common mode output

voltage

V_VINREF

output resistance

I = 0.1 mA

-

150

-

Ω

I_{O(source/sink)}source and sink current

drive capability

0.3

mA

Digital inputs and outputs

Inputs: pins CTL1 and CTL2

V_IH

V_IL

HIGH-level input voltage

LOW-level input voltage

2.0

-

V

0.8

Outputs: pins FG and TEMP

V_OL

LOW-level output voltage I = 2 mA

-

0.5

V

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

20 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

Table 8:

Characteristics …continued

V_DDA= 5 V; V_DD1(SPN)= V_DD2(SPN)= 12 V; V_DD(SLD)= 12 V; V_DD(TRK)= 12 V; V_DD(ACT)= 5 V; V_DD(LD)= 12 V; T_amb= 25 °C; all

characteristics are speciﬁed for the default settings (see Table 9); all voltages are referenced to V_SS; positive currents ﬂow

into the device; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Temperature protection: pin TEMP

T_TEMP

thermal warning

temperature

-

150

20

-

°C

T_hys(TEMP)

T_SD

thermal warning

hysteresis

thermal shutdown

temperature

160

30

T_hys(SD)

thermal shutdown

hysteresis

[1] The recommended minimum Hall ampliﬁer differential input voltage is 25 mV (p-p).

[2] The motor current limit of the spindle is tested by applying VINSPN = 0 V and 3.3 V, measuring the duty cycles on the U, V and W

spindle driver outputs and calculating the corresponding motor currents with the applied 12 V supply voltage and the 2.5 Ω motor,

switches and wiring resistance.

[3] The transconductance gain of the spindle is tested by applying VINSPN = 0 V and 3.3 V and calculating the corresponding motor

currents (see Table note 2) and determining the slope (see Figure 3).

[4] The sled motor is tested loaded with R_L= 4 Ω in series with L_L= 1 mH.

[5] The transconductance gain of the sled motor driver is tested as:

g_m= {(I_SLDO−at V_VINSLD= 1.85 V) − (I_SLDO−at V_VINSLD= 1.45 V)}/0.4 V.

[6] The voltage gain of the loading motor driver is tested as:

G_V= {(V_LDO+− V_LDO−at V_VINLD= 2.4 V) − (V_LDO+− V_LDO−at V_VINLD= 0.9 V)}/1.5 V.

[7] The voltage gain of the actuator driver is tested as:

G_V= {(V_ACTO+− V_ACTO−at V_VINACT= 2.4 V) − (V_ACTO+− V_ACTO−at V_VINACT= 0.9 V)}/1.5 V.

[8] The gain mismatch is related to the absolute gain; an absolute gain of 8 (18 dB) corresponds with a maximum mismatch of 0.4 (5 %)

and an absolute gain of 4 (12 dB) corresponds with a maximum mismatch of 0.2 (5 %).

[9] The voltage gain of the back EMF voltage tracking actuator is tested as:

G_V= {(V_VLDTRKat V_TRKO+= 1.03 V and V_TRKO−= 1.00 V) − (V_VLDTRKat V_TRKO+= 1.00 V and V_TRKO−= 1.03 V)}/0.06 V.

Table 9:

Default settings

Default setting

HU+, HV+

HW+

5 V

ground

HU−, HV−, HW−

HBIAS

1.650 V

open-circuit

RREF

47 kΩ to V_SS, ﬁxed value, should not be changed

REMF

12 kΩ to V_SS

20 kΩ to V_SS

ground

RLIM

V_SS1(SPN), V_SS2(SPN)

U, V, W

open-circuit

12 V supply

open-circuit

ground

V_DD1(SPN), V_DD2(SPN)

FG

V_SSA

VINSPN, VINREF

V_DDA

1.65 V

5 V supply

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

21 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

Table 9:

Default settings …continued

Default setting

10 nF between CP1 and CP2

22 nF to ground

5 V

CP1, CP2

CP3

CTL1, CTL2

TEMP

open-circuit

COSC

70 pF to ground, ﬁxed value, should not be changed

VINLD, VINTRK, VINFCS, VINTLT

V_DD(LD), V_DD(TRK)

LDO+, LDO−, TRKO+, TRKO−

V_SS(ACT)

1.65 V

12 V supply

open-circuit

ground

V_DD(ACT)

5 V supply

FCSO+, FCSO−, TLTO+, TLTO−

V_DD(SLD)

open-circuit

12 V supply

RSLD1

0.5 Ω sense resistor to V_DD(SLD)

open-circuit

SLDO1+, SLDO1−

RSLD2

0.5 Ω sense resistor to V_DD(SLD)

open-circuit

SLDO2+, SLDO2−

V_SS(SLD)

ground

VLDTRK

open-circuit

VINSLD2, VINSLD1

1.65 V

9397 750 14192

Preliminary data sheet

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22 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

13. Application information

5 V

150 Ω

70 pF

0 V

1

56

HALL U

REVERSE

DETECTION

OSCILLATOR

2

3

THERMAL

SHUTDOWN

HALL

AMP

HALL V

HALL W

4

5

6

FG

55

54

53

52

51

50

49

loading motor in

tracking in

focus in

tilt in

12 V

7

HALL BIAS

(1)

0 V

R

REF

47 kΩ

LEVEL

SHIFT

loading

M

8

motor

48

47

(2)

VINREF

R

EMF

9

CURRENT

REFERENCE

10

R

LIM

47 kΩ

tracking

actuator

LEVEL

SHIFT

46

45

44

43

11

VINREF

0 V

5 V

12

13

14

15

16

17

spindle

motor

47 kΩ

12 V

0 V

LEVEL

SHIFT

focus

actuator

42

41

40

SPINDLE

LOGIC

VINREF

47 kΩ

tilt

actuator

LEVEL

SHIFT

VINREF

12 V

39

38

12 V

47 kΩ

18

3.3 V

FG

SA56203S

sled motor

M

19

20

37

0 V

spindle input

1.65 V

ADC

36

35

34

21

VINREF

SLED

LOGIC

500 kΩ

22

23

5 V

33

32

10 nF

22 nF

CHARGE

PUMP

0 V

24

25

31

30

VLDTRK

sled in2

47 kΩ

26

27

MUTE/

STANDBY

FUNCTIONS

VINREF

MUTE/

SELECT

47 kΩ

29

sled in1

47 kΩ

VINREF

28

3.3 V

001aac123

(1) For R_EMFvalues see Section 7.6.

(2) For R_LIMvalues see Section 7.5.

Fig 13. Application diagram

9397 750 14192

Preliminary data sheet

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23 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

14. Package outline

HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads;

body width 6.1 mm; exposed die pad

SOT793-1

D

E

A

X

c

y

exposed die pad

H

v M

A

E

D

h

Z

56

29

(A )

3

A

2

E

h

θ

A

pin 1 index

1

L

p

L

detail X

1

28

w M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

Z

UNIT

A

b

c

D

E

e

H

L

v

w

y

θ

p

1

2

3

h

E

max.

8^o

0^o

0.15 1.05

0.05 0.80

0.27 0.20 14.1

0.17 0.09 13.9

4.3

4.1

6.2

6.0

4.3

4.1

8.3

7.9

0.8

0.4

0.1

mm

1.2

0.25

0.5

1

0.2

0.08

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

03-03-04

SOT793-1

143E36T

MO-153

Fig 14. Package outline SOT793-1 (HTSSOP56)

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

24 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

15. Soldering

15.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

15.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °C to 270 °C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all BGA, HTSSON..T and SSOP..T packages

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm³so called

thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm³so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

15.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 14192

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25 of 30

SA56203S

Philips Semiconductors

One-chip motor driver

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

15.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

15.5 Package related soldering information

Table 10: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package ^[1]

Soldering method

Wave

Reﬂow^[2]

BGA, HTSSON..T^[3], LBGA, LFBGA, SQFP,

SSOP..T^[3], TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable^[4]

suitable

PLCC^[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended^{[5] [6]}

not recommended^[7]

not suitable

suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L^[8], PMFP^[9], WQCCN..L^[8]

suitable

not suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

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Rev. 01 — 31 January 2005

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[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

9397 750 14192

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Rev. 01 — 31 January 2005

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16. Revision history

Table 11: Revision history

Document ID

Release date Data sheet status

20050131 Preliminary data sheet

Change notice Doc. number

9397 750 14192

Supersedes

SA56203S_1

-

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Preliminary data sheet

Rev. 01 — 31 January 2005

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One-chip motor driver

17. Data sheet status

Level Data sheet status^[1]Product status^{[2] [3]}

Deﬁnition

I

Objective data

Development

This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

[1]

[2]

Please consult the most recently issued data sheet before initiating or completing a design.

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

18. Deﬁnitions

19. Disclaimers

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

9397 750 14192

Preliminary data sheet

Rev. 01 — 31 January 2005

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Philips Semiconductors

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21. Contents

1

2

3

4

5

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

Functional description . . . . . . . . . . . . . . . . . . . 6

Spindle motor control . . . . . . . . . . . . . . . . . . . . 6

Spindle brake . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Internal regeneration of back EMF spindle

7.1

7.2

7.3

motor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Sine generation using True-Silent signals. . . . . 8

Programming R_LIM. . . . . . . . . . . . . . . . . . . . . . 9

Programming R_EMF. . . . . . . . . . . . . . . . . . . . . 10

Frequency generator. . . . . . . . . . . . . . . . . . . . 10

Sled motor driver . . . . . . . . . . . . . . . . . . . . . . 11

Loading motor driver. . . . . . . . . . . . . . . . . . . . 12

Actuator motor drivers . . . . . . . . . . . . . . . . . . 12

Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 12

Thermal protection . . . . . . . . . . . . . . . . . . . . . 12

Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Muting Functions . . . . . . . . . . . . . . . . . . . . . . 13

7.4

7.5

7.6

7.7

7.8

7.9

7.10

7.11

7.12

7.13

7.14

8

Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 13

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16

Recommended operating conditions. . . . . . . 17

Thermal characteristics. . . . . . . . . . . . . . . . . . 18

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 18

Application information. . . . . . . . . . . . . . . . . . 23

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24

9

10

11

12

13

14

15

15.1

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 25

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 26

Package related soldering information . . . . . . 26

15.2

15.3

15.4

15.5

16

17

18

19

20

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 28

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 29

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Contact information . . . . . . . . . . . . . . . . . . . . 29

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 31 January 2005

Document number: 9397 750 14192

Published in The Netherlands


型号：	SA56203STW
厂家：	NXP
描述：	IC BRUSHLESS DC MOTOR CONTROLLER, 2.1 A, PDSO56, 6.1 MM, HTSSOP-56, Motion Control Electronics 电动机控制光电二极管
文件：	总30页 (文件大小：158K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SA56203STW [NXP]

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