SA57022-33D-T [NXP]
IC VREG 3.3 V FIXED POSITIVE LDO REGULATOR, 0.5 V DROPOUT, PDSO7, 4.40MM WIDTH, PLASTIC, SOP-7, Fixed Positive Single Output LDO Regulator;
| 型号： | SA57022-33D-T |
| 厂家： | 
NXP |
| 描述： | IC VREG 3.3 V FIXED POSITIVE LDO REGULATOR, 0.5 V DROPOUT, PDSO7, 4.40MM WIDTH, PLASTIC, SOP-7, Fixed Positive Single Output LDO Regulator |
| 文件： | 总8页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
SA57022-XX
500 mA LDO with ON/OFF control and
Vref bypass
Product data
2003 Oct 13
Supersedes data of 2001 Oct 03
Philips
Semiconductors
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
GENERAL DESCRIPTION
The SA57022-XX has an extremely precise fixed output with a
typical accuracy of ±2%. It is designed to provide very low dropout
and ultra low noise with an optional Bypass pin, and fast transient
response. Supply current is reduced to zero (typical).
The SA57022-XX incorporates both over-temperature and
over-current protection. The SA57022-XX is stable with an output
capacitor of only 1.0 µF and has a maximum output current of
500 mA. It is available in the 7-pin small outline package (SOP002).
FEATURES
APPLICATIONS
• Very low dropout voltage: 300 mV typ. (I = 500 mA)
• Battery-operated systems
out
• High precision output voltage: ±2%
• Output current capacity: 500 mA
• Portable computers
• Cameras, VCRs and camcorders
• PCMCIA cards, modems, pagers
• Cellular/GSM/PHS phones
• Linear post-regulator for SMPS
• Instrumentation
• Low noise: 75 µV
typ. @ 20 Hz to 80 KHz, for C = 470 pF.
n
rms
• Extremely good line regulation: 10 mV typical
• Extremely good load regulation: 20 mV typical
• Low temperature drift co-efficient to V : ±100 ppm/°C
out
• Internal current limit and thermal shut-down circuits
• Input voltage range: –0.3 V to 12 V
• Wide preset output voltage range: 1.8 V to 5 V
• Wide operating temperature range: –40 °C to +85 °C
SIMPLIFIED SYSTEM DIAGRAM
V
IN
7
1
V
OUT
CURRENT
LIMIT
REFERENCE
R
DRIVER
BIAS
5
ON/OFF
THERMAL
SHUTDOWN
R
3
GND
4
BYPASS
SL01527
Figure 1. Simplified system diagram.
2
2003 Oct 13
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TEMPERATURE
RANGE
DESCRIPTION
VERSION
SA57022-XXD
small outline 7-pin surface mount (see dimensional drawing)
SOP002
–40 to +85 °C
NOTE:
Part number marking
The device has six voltage output options, indicated by the XX on
the order code.
Each package is marked with a four letter code. The first three
letters designate the product. The fourth letter, represented by ‘x’, is
a date tracking code.
XX
18
25
28
30
33
50
VOLTAGE (Typical)
Part number
SA57022-18
SA57022-25
SA57022-28
SA57022-30
SA57022-33
SA57022-50
Marking
A L M x
A L N x
A L P x
A L R x
A L S x
A L T x
1.8 V
2.5 V
2.8 V
3.0 V
3.3 V
5.0 V
PIN CONFIGURATION
PIN DESCRIPTION
PIN
1
SYMBOL
DESCRIPTION
V
OUT
Regulated output voltage.
No connection.
Ground.
V
1
2
3
4
7
6
5
V
IN
OUT
NC
2
NC
GND
3
SA57022-XX
GND
GND
4
BYPASS
Reference bypass input. Connecting a
470 pF capacitor further reduces output
noise.
BYPASS
ON/OFF
5
6
ON/OFF
GND
Output voltage On/Off control pin.
SL01525
Substrate ground pin. This pin must be
connected to ground.
Figure 2. Pin configuration.
7
V
IN
Power supply input.
MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
V
V
Supply voltage
–0.3
+12
IN
Operating voltage
V
+ 0.5
V
+ 10
V
IN(OPR)
OUT
OUT(typ)
OUT(typ)
I
Output current
0
500
mA
°C
T
oper
Operating temperature
Storage temperature
Power dissipation (Note 1)
Power dissipation (Note 2)
–40
–40
–
+85
+150
400
T
stg
°C
P
P
mW
mW
D
–
950
D
NOTES:
1. Unattached.
2. Mounted on double-sided glass epoxy PCB, with copper ground plane 192 × 142 × 1.2 mm.
3
2003 Oct 13
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
ELECTRICAL CHARACTERISTICS
T
amb
= 25 °C; V
= 1.6 V, unless otherwise specified.
ON/OFF
SYMBOL
PARAMETER
CONDITIONS
MIN.
–
TYP.
1.9
0
MAX.
5
UNIT
mA
µA
V
I
I
No-load input current
Input current (off)
I
= 0 mA
CC
OUT
V
= 0 V
–
1
CC(OFF)
ON/OFF
I
= 250 mA
98%
1.764
2.450
2.744
2.940
3.234
4.900
–
–
102%
1.836
2.550
2.856
3.060
3.060
5.100
0.5
V
OUT
Output voltage (as % of V
)
OUT
nom
SA57022-18
SA57022-25
SA57022-28
SA57022-30
SA57022-33
SA57022-50
1.8
2.5
2.8
3.0
3.3
5.0
0.3
10
V
V
V
V
V
V
V
IO
Dropout voltage (Note 2)
Line regulation
V
= V
– 0.2 V; I = 250 mA
OUT
V
IN
OUT
∆V1
V
= V
+1.5 V to V = V +2.5 V;
OUT
–
20
mV
IN
OUT
IN
I
= 250 mA
OUT
∆V2
Load regulation
I
= 0 to 250 mA
–
–
20
120
–
mV
OUT
∆V
/∆T
V
OUT
Temperature coefficient
T = –30 to +85 °C
100
ppm/°C
OUT
j
(Note 1)
RR
Ripple rejection (Note 1)
f = 120 Hz; V
= 1 V; I
= 250 mA
OUT
50
–
64
75
20
–
–
–
dB
ripple
V
n
Output noise voltage (Note 1)
ON/OFF pin input current
f
= 20 to 80 kHz; C = 470 pF
µV
rms
BW
n
I
V
= V
IN
10
30
µA
ON/OFF
ON/OFF
V
V
ON/OFF HIGH threshold voltage
ON/OFF LOW threshold voltage
1.6
-0.3
V
+0.3
V
V
ON/OFF(H)
IN
–
0.4
ON/OFF(L)
NOTES:
1. The parameter is guaranteed by design.
2. This parameter is not guaranteed if V
is less than 2 V.
OUT
4
2003 Oct 13
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
APPLICATION INFORMATION
C
= 1 µF
IN
CERAMIC
VOLTAGE
INPUT
7
6
5
V
ON/OFF
SUB
IN
V
NC
2
GND BYPASS
OUT
1
3
4
TO LOAD
C
= 2.2 µF
C = 470 pF
n
OUT
CERAMIC
CERAMIC
SL01526
Figure 3. Typical application circuit.
Input capacitor
Thermal shutdown
An input capacitor of 1.0 µF (min) should be connected from V to
Integrated thermal protection circuitry shuts the regulator off when
die temperature exceeds 150 °C. The regulator remains off until the
die temperature drops to approximately 140 °C.
IN
GND if there is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is operated as the power
source. The capacitor should be less than 1 cm from the input pin.
Power dissipation
Aluminum electrolytic or tantalum capacitor types can be used.
(Because many aluminum electrolytic capacitors freeze at
approximately –30 °C, solid tantalums are recommended for
applications operating below –25 °C.) When operating from sources
other than batteries, supply-noise rejection and transient response
can be improved by increasing the value of the input and output
capacitors and employing passive filtering techniques.
The amount of power the regulator dissipates is primarily a function
of input and output voltage, and output current. The following
equation is used to calculate worst case actual power dissipation:
Eqn. (1)
ǒ
Ǔ
PD [ VIN(max) * VOUT(min) ILOAD(max)
Where:
P
V
V
= worst case actual power dissipation
D
Output capacitor
= maximum voltage on V
IN(max)
OUT(min)
LOAD(max)
IN
Phase compensation is used to ensure stable operation even if load
current varies. For this reason, an output capacitor with good
frequency characteristics is needed. Set it as close to the circuit as
possible, with wires as short as possible. A 1.0 µF capacitor from
= minimum regulator output voltage
= maximum output (load) current
I
The maximum allowable power dissipation, as shown in Equation (2),
is a function of the maximum ambient temperature (T ), the
maximum allowable die temperature (125 °C), and the thermal
V
OUT
to ground is recommended. The output capacitor should have
amb(max)
an ESR (effective series resistance) of 5.0 Ω or less, and a resonant
frequency above 1.0 MHz.
resistance from junction-to-air (R
).
th(j–a)
Tj(max) * Tamb(max)
Optional BYPASS capacitor
PD(max)
+
Eqn. (2)
A 470 pF capacitor connected from the BYPASS input to ground
reduces noise present on the internal reference, which in turn
significantly reduces output noise. This capacitor must have low
leakage, because the pin is high impedance. If output noise is not a
concern, this pin may be left unconnected. Larger capacitor values
may be used, but results in a longer time period to rated output
voltage when power is initially applied.
Rth(j*a)
The SUB (heat sink) pin must be connected to ground with a wide
trace.
PCB layout hints
The component placement around the LDO should be done carefully
to achieve good dynamic line and load response. The input and
noise capacitor should be kept close to the LDO. The rise in junction
temperature depends on how efficiently the heat is carried away
from the junction to ambient. The junction to lead thermal
impedance is a characteristic of the package and fixed. The thermal
impedance between lead to ambient can be reduced by increasing
the copper area on PCB. Increase the input, output and ground
trace area to reduce the junction-to-ambient impedance.
ON/OFF
The regulator is fully enabled when a logic HIGH is applied to this
input. The regulator enters shutdown when a logic LOW is appplied
to this input. During shutdown, regulator output voltage falls to
zero,and supply current is reduced to 1.0 µA max, and V
zero. For use as an always-on regulator, connect ON/OFF pin to the
supply voltage, as shown in Figure 3.
falls to
OUT
Optional BYPASS diode
If the voltage on the output pin rises above the input voltage, as
might happen in some applications, the overcurrrent will flow via
internal parasitic diodes from output to input. To prevent this,
connect a bypass diode between the output and input pins.
5
2003 Oct 13
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
PACKING METHOD
The SA57003 is packed in reels, as shown in Figure 4.
GUARD
BAND
TAPE
TAPE DETAIL
REEL
ASSEMBLY
COVER TAPE
CARRIER TAPE
BARCODE
LABEL
BOX
SL01305
Figure 4. Tape and reel packing method
6
2003 Oct 13
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
Plastic small outline package; 7 leads; body width 4.4 mm
SOP002
7
2003 Oct 13
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
REVISION HISTORY
Rev
Date
Description
_2
20031013
Product data (9397 750 12112). ECN 853-2293 30328 of 09 September 2003.
Modifications:
• Change package name from SOP-7B to SOP002 in Ordering information and Package outline sections.
_1
20011003
Product data (9397 750 08967). ECN 853-2293 27197 of 03 October 2001.
Data sheet status
Product
status
Definitions
[1]
Level
Data sheet status
[2] [3]
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limitingvaluesdefinition— Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,
copyright, or mask work right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2003
Contact information
All rights reserved. Printed in U.S.A.
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 10-03
9397 750 12112
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:
Philips
Semiconductors
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