SA606D/01 [NXP]
IC SPECIALTY TELECOM CIRCUIT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20, Telecom IC:Other;
| 型号： | SA606D/01 |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY TELECOM CIRCUIT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20, Telecom IC:Other 电信 光电二极管 电信集成电路 |
| 文件： | 总33页 (文件大小：536K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SA606
Low-voltage high performance mixer FM IF system
Rev. 6 — 8 November 2013
Product data sheet
1. General description
The SA606 is a low-voltage high performance monolithic FM IF system incorporating a
mixer/oscillator, two limiting intermediate frequency amplifiers, quadrature detector,
logarithmic Received Signal Strength Indicator (RSSI), voltage regulator and audio and
RSSI op amps. The SA606 is available in SO20 and SSOP20 packages.
The SA606 was designed for portable communication applications and will function down
to 2.7 V. The RF section is similar to the famous SA605. The audio and RSSI outputs
have amplifiers with access to the feedback path. This enables the designer to adjust the
output levels or add filtering.
2. Features and benefits
Low power consumption: 3.5 mA typical at 3 V
Mixer input to >150 MHz
Mixer conversion power gain of 17 dB at 45 MHz
XTAL oscillator effective to 150 MHz (LC oscillator or external oscillator can be used at
higher frequencies)
102 dB of IF amp/limiter gain
2 MHz IF amp/limiter small signal bandwidth
Temperature compensated logarithmic RSSI with a 90 dB dynamic range
Low external component count; suitable for crystal/ceramic/LC filters
Excellent sensitivity: 0.31 V into 50 matching network for 12 dB SINAD
(Signal-to-Noise-and-Distortion ratio) for 1 kHz tone with RF at 45 MHz and IF at
455 kHz
SA606 meets cellular radio specifications
Audio output internal op amp
RSSI output internal op amp
Internal op amps with rail-to-rail outputs
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 Class II, Level B
3. Applications
Portable cellular radio FM IF
Cordless phones
Wireless systems
RF level meter
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
Spectrum analyzer
Instrumentation
FSK and ASK data receivers
Log amps
Portable high performance communication receiver
Single conversion VHF receivers
4. Ordering information
Table 1.
Ordering information
Tamb = 40 C to +85 C
Type number
Topside
mark
Package
Name
Description
Version
SA606D/01
SA606D
SO20
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
SOT266-1
SA606DK/01
SA606DK
SSOP20
plastic shrink small outline package; 20 leads;
body width 4.4 mm
SA606DK/02
SA606DK/03
SA606DK
SA606DK
SSOP20
SSOP20
plastic shrink small outline package; 20 leads;
body width 4.4 mm
SOT266-1
SOT266-1
plastic shrink small outline package; 20 leads;
body width 4.4 mm
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package
Packing method
Minimum
order
Temperature
quantity
SA606D/01
SA606D/01,112
SA606D/01,118
SA606DK/01,112
SA606DK/01,118
SA606DK/02,118
SA606DK/03,118
SO20
Standard marking
*IC’s tube - DSC bulk pack
1520
2000
1350
2500
2500
2500
Tamb = 40 C to +85 C
SO20
Reel 13” Q1/T1
*Standard mark SMD
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
SA606DK/01
SSOP20
SSOP20
SSOP20
SSOP20
Standard marking
*IC’s tube - DSC bulk pack
Reel 13” Q1/T1
*Standard mark SMD
Tamb = 40 C to +85 C
SA606DK/02
SA606DK/03
Reel 13” Q1/T1
*Standard mark SMD
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Reel 13” Q1/T1
*Standard mark SMD
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
2 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
5. Block diagram
20
19
18
17
16
15
14
13
12
11
IF amp
limiter
mixer
RSSI
OSC
quad
VREG
6
audio
E
3
B
4
1
2
5
7
8
9
10
002aag090
Fig 1. Block diagram of SA606
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
3 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
6. Pinning information
6.1 Pinning
1
2
20
19
18
17
16
15
14
13
12
11
RF_IN
RF_IN_DECOUPL
OSC_OUT
MIXER_OUT
IF_AMP_DECOUPL
IF_AMP_IN
3
4
OSC_IN
IF_AMP_DECOUPL
IF_AMP_OUT
GND
5
RSSI_OUT
SA606D/01
6
V
CC
7
AUDIO_FEEDBACK
AUDIO_OUT
LIMITER_IN
8
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_OUT
9
RSSI_FEEDBACK
QUADRATURE_IN
10
002aag091
Fig 2. Pin configuration for SO20
1
2
20
MIXER_OUT
RF_IN
RF_IN_DECOUPL
OSC_OUT
19
18
17
16
15
14
13
12
11
IF_AMP_DECOUPL
IF_AMP_IN
3
4
OSC_IN
IF_AMP_DECOUPL
IF_AMP_OUT
GND
SA606DK/01
SA606DK/02
SA606DK/03
5
RSSI_OUT
6
V
CC
7
AUDIO_FEEDBACK
AUDIO_OUT
LIMITER_IN
8
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_OUT
9
RSSI_FEEDBACK
QUADRATURE_IN
10
002aag092
Fig 3. Pin configuration for SSOP20
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
4 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
6.2 Pin description
Table 3.
Pin description
Pin
Symbol
Description
RF_IN
1
RF input
RF_IN_DECOUPL
OSC_OUT
2
RF input decoupling pin
oscillator output
3
OSC_IN
4
oscillator input
RSSI_OUT
5
RSSI output
VCC
6
positive supply voltage
audio amplifier negative feedback terminal
audio amplifier output
RSSI amplifier negative feedback terminal
quadrature detector input terminal
limiter amplifier output
limiter amplifier decoupling pin
limiter amplifier decoupling pin
limiter amplifier input
ground; negative supply
IF amplifier output
AUDIO_FEEDBACK
AUDIO_OUT
RSSI_FEEDBACK
QUADRATURE_IN
LIMITER_OUT
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_IN
7
8
9
10
11
12
13
14
15
16
17
18
19
20
GND
IF_AMP_OUT
IF_AMP_DECOUPL
IF_AMP_IN
IF amplifier decoupling pin
IF amplifier input
IF_AMP_DECOUPL
MIXER_OUT
IF amplifier decoupling pin
mixer output
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
5 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
7. Functional description
The SA606 is an IF signal processing system suitable for second IF systems with input
frequency as high as 150 MHz. The bandwidth of the IF amplifier and limiter is at least
2 MHz with 90 dB of gain. The gain/bandwidth distribution is optimized for 455 kHz,
1.5 k source applications. The overall system is well-suited to battery operation as well
as high performance and high quality products of all types.
The input stage is a Gilbert cell mixer with oscillator. Typical mixer characteristics include
a noise figure of 6.2 dB, conversion gain of 17 dB, and input third-order intercept of
9 dBm. The oscillator will operate in excess of 200 MHz in L/C tank configurations.
Hartley or Colpitts circuits can be used up to 100 MHz for crystal configurations. Butler
oscillators are recommended for crystal configurations up to 150 MHz.
The output impedance of the mixer is a 1.5 k resistor permitting direct connection to a
455 kHz ceramic filter. The input resistance of the limiting IF amplifiers is also 1.5 k. With
most 455 kHz ceramic filters and many crystal filters, no impedance matching network is
necessary. The IF amplifier has 43 dB of gain and 5.5 MHz bandwidth. The IF limiter has
60 dB of gain and 4.5 MHz bandwidth.
To achieve optimum linearity of the log signal strength indicator, there must be a 12 dBV
insertion loss between the first and second IF stages. If the IF filter or interstage network
does not cause 12 dBV insertion loss, a fixed or variable resistor or an L pad for
simultaneous loss and impedance matching can be added between the first IF output
(IF_AMP_OUT) and the interstage network. The overall gain will then be 90 dB with
2 MHz bandwidth.
The signal from the second limiting amplifier goes to a Gilbert cell quadrature detector.
One port of the Gilbert cell is internally driven by the IF. The other output of the IF is
AC-coupled to a tuned quadrature network. This signal, which now has a 90 phase
relationship to the internal signal, drives the other port of the multiplier cell.
The demodulated output of the quadrature drives an internal op amp. This op amp can be
configured as a unity gain buffer, or for simultaneous gain, filtering, and second-order
temperature compensation if needed. It can drive an AC load as low as 5 k with a
rail-to-rail output.
A log signal strength indicator completes the circuitry. The output range is greater than
90 dB and is temperature compensated. This log signal strength indicator exceeds the
criteria for AMPS or TACS cellular telephone. This signal drives an internal op amp. The
op amp is capable of rail-to-rail output. It can be used for gain, filtering, or second-order
temperature compensation of the RSSI, if needed.
Remark: dBV = 20log VO/VI.
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
6 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
-
Max
7
Unit
V
VCC
Tstg
supply voltage
storage temperature
ambient temperature
65
40
+150
+85
C
C
Tamb
operating
9. Thermal characteristics
Table 5.
Symbol
Zth(j-a)
Thermal characteristics
Parameter
Conditions
Max
90
Unit
K/W
K/W
transient thermal impedance SA606D/01 (SO20)
from junction to ambient
SA606DK/01, SA606DK/02,
117
SA606DK/03 (SSOP20)
10. Static characteristics
Table 6.
Static characteristics
VCC = 3 V; Tamb = 25 C; unless specified otherwise.
Symbol
VCC
Parameter
Conditions
Min
2.7
-
Typ
Max
7.0
Unit
V
supply voltage
supply current
-
ICC
3.5
4.2
mA
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
7 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
11. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = 25 C; VCC = 3 V; unless specified otherwise. RF frequency = 45 MHz + 14.5 dBV RF input step-up.
IF frequency = 455 kHz; R17 = 2.4 k and R18 = 3.3 k. RF level = 45 dBm; FM modulation = 1 kHz with 8 kHz peak
deviation. Audio output with de-emphasis filter and C-message weighted filter. Test circuit Figure 19. The parameters listed
below are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent
the ultimate performance limits of the device. Use of an optimized RF layout will improve many of the listed parameters.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Mixer/oscillator section (external LO = 220 mV RMS value)
fi
input frequency
-
-
-
-
150
150
6.2
9
-
-
-
-
MHz
MHz
dB
fosc
NF
IP3i
oscillator frequency
noise figure
at 45 MHz
input third-order intercept point
50 source;
dB
f1 = 45.0 MHz; f2 = 45.06 MHz;
input RF level = 52 dBm
Gp(conv)
conversion power gain
matched 14.5 dBV step-up
50 source
13.5
17
2.5
8
19.5
dB
dB
k
pF
k
-
-
Ri(RF)
RF input resistance
RF input capacitance
mixer output resistance
single-ended input
-
-
Ci(RF)
-
3.0
1.5
4.0
-
Ro(mix)
IF section
Gamp(IF)
Glim
MIXER_OUT pin
1.25
IF amplifier gain
limiter gain
50 source
50 source
-
-
-
44
-
-
-
dB
58
dB
Pi(IF)
IF input power
for 3 dB input limiting sensitivity;
R17 = 2.4 k; R18 = 3.3 k
109
dBm
(Figure 19); test at IF_AMP_IN pin
AM
AM rejection
80 % AM 1 kHz
-
45
-
dB
mV
dB
dB
dB
Vo(aud)
SINAD
THD
audio output voltage
gain of two (2 k AC load)
70
120
17
160
signal-to-noise-and-distortion ratio IF level 110 dBm
-
-
-
-
total harmonic distortion
35
50
62
S/N
signal-to-noise ratio
RSSI output voltage
no modulation for noise
RF; R9 = 2 k
-
Vo(RSSI)
RF level = 118 dBm
-
0.3
1.1
0.8
1.8
V
V
SA606D/01, SA606DK/01;
0.7
RF level = 68 dBm;
SA606DK/02;
RF level = 68 dBm
0.95
1.06
-
-
1.05
1.15
V
V
SA606DK/03;
RF level = 68 dBm
RF level = 23 dBm
1.2
-
1.8
90
2.5
V
RSSI(range) RSSI range
-
-
-
-
-
dB
dB
k
k
k
RSSI
Zi(IF)
RSSI variation
-
1.5
1.5
0.3
1.5
IF input impedance
IF output impedance
limiter input impedance
IF_AMP_IN pin
IF_AMP_OUT pin
LIMITER_IN pin
1.3
-
Zo(IF)
Zi(lim)
1.3
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
8 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
Table 7.
Dynamic characteristics …continued
Tamb = 25 C; VCC = 3 V; unless specified otherwise. RF frequency = 45 MHz + 14.5 dBV RF input step-up.
IF frequency = 455 kHz; R17 = 2.4 k and R18 = 3.3 k. RF level = 45 dBm; FM modulation = 1 kHz with 8 kHz peak
deviation. Audio output with de-emphasis filter and C-message weighted filter. Test circuit Figure 19. The parameters listed
below are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent
the ultimate performance limits of the device. Use of an optimized RF layout will improve many of the listed parameters.
Symbol
Zo(lim)
Parameter
Conditions
Min
Typ
0.3
Max
Unit
k
limiter output impedance
RMS output voltage
LIMITER_OUT pin
LIMITER_OUT pin
-
-
-
-
Vo(RMS)
130
mV
RF/IF section (internal LO)
Vo(aud)RMS RMS audio output voltage
VCC = 3 V; RF level = 27 dBm
-
-
120
2.2
-
-
mV
V
Vo(RSSI)
RSSI output voltage
system; VCC = 3 V;
RF level = 27 dBm
SINAD
signal-to-noise-and-distortion ratio system; RF level = 117 dBm
-
12
-
dB
12. Performance curves
002aaf410
6
V
= 7.0 V
5.0 V
CC
I
CC
(mA)
5
4
3
2
3.0 V
2.7 V
65
−55
−35
−15
5
25
45
85
105
T
125
(°C)
amb
Fig 4. Supply current versus ambient temperature
002aaf411
−8.0
IP3
i
(dBm)
−9.0
V
= 2.7 V
3.0 V
7.0 V
CC
−10.0
−11.0
−12.0
−13.0
−14.0
−40
−20
0
20
40
60
80
90
T
amb
(°C)
Fig 5. Third order intercept point versus ambient temperature and supply voltage
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
9 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
002aaf412
8.0
7.5
7.0
6.5
6.0
5.5
5.0
NF
(dB)
V
= 2.7 V
3.0 V
7.0 V
CC
−40
−20
0
20
40
60
80
90
T
(°C)
amb
Fig 6. Mixer noise figure versus ambient temperature and supply voltage
002aaf413
18.0
V
= 2.7 V
3.0 V
7.0 V
CC
G
p(conv)
(dB)
17.5
17.0
16.5
16.0
−40
−20
0
20
40
60
80
90
T
(°C)
amb
Fig 7. Conversion gain versus ambient temperature and supply voltage
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
10 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
002aaf414
20
IF output power
(dBm)
0
−20
−40
−60
(1)
(2)
−80
−66
−46
−26
−6
14
34
(3)
RF input level (dBm)
RF = 45 MHz; IF = 455 kHz.
(1) Fund product.
(2) Third order product.
(3) 50 input.
Fig 8. Mixer third order intercept and compression
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
11 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
002aaf415
5
audio
relative level
(dB)
−5
−15
−25
−35
−45
−55
−65
AM rejection
THD+N
noise
−125
−105
−85
−65
−45
−25
RF level (dBm)
VCC = 3 V; RF = 45 MHz; deviation = 8 kHz; Vo(aud)RMS = 104.9 mV.
Fig 9. Relative level of audio, AM rejection, THD+N and noise versus RF level
(Tamb = 40 C)
002aaf416
5
audio
relative level
(dB)
−5
−15
−25
−35
−45
−55
−65
AM rejection
THD+N
noise
−125
−105
−85
−65
−45
−25
RF level (dBm)
VCC = 3 V; RF = 45 MHz; deviation = 8 kHz; Vo(aud)RMS = 117.6 mV.
Fig 10. Relative level of audio, AM rejection, THD+N and noise versus RF level
(Tamb = +25 C)
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
12 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
002aaf417
5
audio
relative level
(dB)
−5
−15
−25
−35
−45
−55
−65
AM rejection
THD+N
noise
−125
−105
−85
−65
−45
−25
RF level (dBm)
VCC = 3 V; RF = 45 MHz; deviation = 8 kHz; Vo(aud)RMS = 127 mV.
Fig 11. Relative level of audio, AM rejection, THD+N and noise versus RF level
(Tamb = +85 C)
002aaf418
5
audio
relative level
(dB)
−5
−15
−25
−35
−45
−55
distortion
AM rejection
noise
−65
−55
−35
−15
5
20
45
65
85
105
T
125
(°C)
amb
VCC = 3 V; RF = 45 MHz; RF level = 45 dBm; deviation = 8 kHz; Vo(aud)RMS = +117.6 mV.
Fig 12. Relative audio level, distortion, AM rejection and noise versus
ambient temperature
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
13 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
002aaf419
2.4
V
o(RSSI)
(V)
T
= +85 °C
room
−40 °C
amb
2.0
1.6
1.2
0.8
0.4
0
−95
−75
−55
−35
−15
5
IF level (dBm)
455 kHz IF at 3 V.
Fig 13. RSSI output voltage versus IF level (SA606D/01; SA606DK/01)
002aaf420
2.1
T
= +85 °C
+27 °C
−40 °C
amb
V
o(RSSI)
(V)
1.8
1.5
1.2
0.9
0.6
0.3
−125
−105
−85
−65
−45
−25
RF level (dBm)
VCC = 3 V
Fig 14. RSSI output voltage versus RF level (SA606D/01; SA606DK/01)
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
14 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
002aaf421
300
V
V
CC
= 7.0 V
5.0 V
o(aud)RMS
(mV)
200
100
0
3.0 V
2.7 V
65
−55
−35
−15
5
25
45
85
105
T
125
(°C)
amb
Fig 15. RMS audio output voltage versus ambient temperature
13. Application information
C26
R18
3.3 kΩ
C15
R17
2.4 kΩ
FL1
20
FL2
C23
C21
C18 C17
13
19
18
17
16
15
14
12
11
IF amp
limiter
mixer
RSSI
OSC
quad
VREG
audio
1
2
3
4
5
6
7
8
9
10
C1
C2
C9
R11
C8
10 kΩ
L1
C12
R10
8.2 kΩ
C10
C7
L2
R19
11 kΩ
45 MHz
input
C5
IFT1
C27
C6
C19
390 pF
X1
C14
RSSI_OUT
V
AUDIO_OUT
CC
002aag098
The layout is very critical in the performance of the receiver. We highly recommend our demo
board layout.
All of the inductors, the quad tank, and their shield must be grounded. A 10 F to 15 F or higher
value tantalum capacitor on the supply line is essential. A low frequency ESR screening test on this
capacitor will ensure consistent good sensitivity in production. A 0.1 F bypass capacitor on the
supply pin, and grounded near the 44.545 MHz oscillator improves sensitivity by 2 dB to 3 dB.
Fig 16. SA606 45 MHz application circuit (SA606DK demo board)
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
15 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
Table 8.
SA606DK demo board component list
Component
Description
C1
C2
51 pF NPO ceramic
220 pF NPO ceramic
C5, C9, C14, C17,
100 nF 10 % monolithic ceramic
C18, C21, C23, C26
C6
5 pF to 30 pF trim cap
C7
1 nF ceramic
C8, C15
C10
C12
C19
C27
FL1, FL2[1]
IFT1
L1
10.0 pF NPO ceramic
10 F tantalum (minimum)
2.2 F 10 % tantalum
390 pF 10 % monolithic ceramic
2.2 F tantalum
ceramic filter Murata CFUKF455KB4X-R0
330 H Toko 836AN-0129Z
0.33 H Toko SCB-1320Z
L2
1.2 H
X1
44.545 MHz crystal ICM4712701
not used in application board
8.2 k 5 % 1/4W carbon composition
10 k 5 % 1/4W carbon composition
2.4 k 5 % 1/4W carbon composition
3.3 k 5 % 1/4W carbon composition
11 k 5 % 1/4W carbon composition
R5[2]
R10
R11
R17
R18
R19
[1] This a 30 kHz bandwidth 455 kHz ceramic filter. All the characterization and testing are done with this
wideband filter. A more narrowband 15 kHz bandwidth 455 kHz ceramic filter that may be used as an
alternative selection is Murata CFUKG455KE4A-R0.
[2] R5 can be used to bias the oscillator transistor at a higher current for operation above 45 MHz.
Recommended value is 10 k.
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
16 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
RF IN
45 MHz
IF = 455 kHz
SA6x6DK
SA58640DK
L1
FIL1
C6
C1 C2
C21
C23
TOKO
C5
455 kHz
L2
U1
C7
44.545 MHz
X1
C8
R17
R18
C26
R11
455 kHz
FIL2
C15
C17 C18
C14
R10
R19
C19
RSSI
VCC
C27
C10
C9
AUDIO
GND
C12
FT1
820 Ω
4.7 nF
AUDIO_DC
001aal912
Fig 17. SA6x6DK/SA58640DK top view with components
SA606
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Product data sheet
Rev. 6 — 8 November 2013
17 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
001aal892
Fig 18. SA6x6DK/SA58640DK bottom view (viewed from top)
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
18 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
14. Test information
−25 dB,
−10.6 dB,
−29 dB,
−10.6 dB,
−36 dB,
1500 Ω/50 Ω pad 50 Ω/50 Ω pad 929 Ω/50 Ω pad
50 Ω/50 Ω pad 156 kΩ/50 Ω pad
50.5 Ω
3880 Ω
96.5 Ω
51.5 Ω
96.5 Ω
51.7 Ω
C26
71.5 Ω
32.6 Ω
71.5 Ω
32.8 Ω
2430 Ω
1.3 kΩ
R18
3.3 kΩ
C15
C24
C20
C16
C22
C19
R17
2.4 kΩ
SW9
SW7
SW6
SW5
SW8
C23
C21
C18 C17
FL1
20
FL2
16
19
18
17
15
14
13
12 11
IF amp
limiter
mixer
RSSI
OSC
quad
VREG
audio
1
2
3
4
5
6
7
8
9
10
R13
C9
R11
SW3
SW4
SW1
SW11
R9
C1
C2
R14
C8
SW10
C12
C10
R10
C27
L1
C7
R19
16 kΩ
R12
IFT1
C5
C4
L2
X1
DEEMPHASIS
FILTER
SW2
C3
R1
R3
C14
C6
R2
ext.
LOC osc
44.545 MHz
45.06
MHz
C-WEIGHTED
AUDIO
MEASUREMENT
CIRCUIT
R7
30.5 Ω
45 MHz
R6
R8
V
CC
178 Ω 39.2 Ω
mini-circuit
ZSC2-1B
RSSI_OUT
AUDIO_OUT
002aaf407
Fig 19. SA606 45 MHz test circuit (relays as shown)
SA606
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Product data sheet
Rev. 6 — 8 November 2013
19 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
Table 9.
Automatic test circuit component list
Component
Description
C1
C2
100 pF NPO ceramic
390 pF NPO ceramic
C5, C9, C14, C17, C18,
C21, C23, C25, C26, C27
100 nF 10 % monolithic ceramic
C6
22 pF NPO ceramic
C7
1 nF ceramic
C8, C15
C10
10 pF NPO ceramic
10 F[1] tantalum (minimum)
2.2 F
C12
C27
2.2 F 10 % monolithic ceramic
ceramic filter Murata CFUKF455KB4X-R0
455 kHz (Ce = 180 pF) Toko RMC-2A6597H
147 nH to 160 nH Coilcraft UNI-10/142-04J08S
0.8 H nominal; Toko 292CNS-T1038Z
2 k 1 % 1/4 W metal film
10 k 1 %
FL1, FL2[2]
IFT1
L1
L2
R9
R10
R11, R14
R12
10 k 1 %
2 k 1 %
R13
20 k 1 %
R17
2.4 k 5 % 1/4 W carbon composition
3.3 k
R18
R19
16 k
X1
44.545 MHz crystal ICM4712701
[1] This value can be reduced when a battery is the power source.
[2] This a 30 kHz bandwidth 455 kHz ceramic filter. All the characterization and testing are done with this
wideband filter. A more narrowband 15 kHz bandwidth 455 kHz ceramic filter that may be used as an
alternative selection is Murata CFUKG455KE4A-R0.
SA606
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Product data sheet
Rev. 6 — 8 November 2013
20 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
(1)
RF GENERATOR
45 MHz
(2)
SA616 DEMOBOARD
RSSI AUDIO
V
(+3 V)
CC
DE-EMPHASIS
FILTER
DC VOLTMETER
(3)
C-MESSAGE
HP339A DISTORTION
SCOPE
(4)
ANALYZER
002aag099
(1) Set RF generator at 45.000 MHz; use a 1 kHz modulation frequency and a 6 kHz deviation if using
16 kHz filters, or 8 kHz if using 30 kHz filters.
(2) The smallest RSSI voltage (i.e., when no RF input is present and the input is terminated) is a
measure of the quality of the layout and design. If the lowest RSSI voltage is 500 mV or higher, it
means the receiver is in regenerative mode. In that case, the receiver sensitivity will be worse than
expected.
(3) The C-message and de-emphasis filter combination has a peak gain of 10 dB for accurate
measurements. Without the gain, the measurements may be affected by the noise of the scope
and HP339 analyzer. The de-emphasis filter has a fixed 6 dB/octave slope between 300 Hz and
3 kHz.
(4) The measured typical sensitivity for 12 dB SINAD should be 0.35 V or 116 dBm at the RF input.
(Also see Figure 10.)
Fig 20. SA606 application circuit test setup
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
21 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
15. Package outline
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Fig 21. Package outline SOT163-1 (SO20)
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
22 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
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Fig 22. Package outline SOT266-1 (SSOP20)
SA606
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Product data sheet
Rev. 6 — 8 November 2013
23 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
24 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 23) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Table 10. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
235
350
220
< 2.5
2.5
220
220
Table 11. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 23.
SA606
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Product data sheet
Rev. 6 — 8 November 2013
25 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 23. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
26 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
17. Soldering: PCB footprints
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Fig 24. PCB footprint for SOT163-1 (SO20); reflow soldering
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Fig 25. PCB footprint for SOT163-1 (SO20); wave soldering
SA606
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
27 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
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',0(16,216ꢀLQꢀPP
3ꢇ 3ꢁ $\
%\
&
'ꢇ
'ꢁ
*[
*\
+[
+\
ꢅꢂꢃꢄꢅ ꢅꢂꢊꢄꢅ ꢊꢂꢁꢅꢅ ꢈꢂꢄꢅꢅ ꢇꢂꢆꢄꢅ ꢅꢂꢈꢅꢅ ꢅꢂꢃꢅꢅ ꢃꢂꢉꢅꢅ ꢄꢂꢆꢅꢅ ꢊꢂꢆꢅꢅ ꢊꢂꢈꢄꢅ
VRWꢄꢁꢁꢃꢀBIU
Fig 26. PCB footprint for SOT266-1 (SSOP20); reflow soldering
SA606
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Product data sheet
Rev. 6 — 8 November 2013
28 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
18. Abbreviations
Table 12. Abbreviations
Acronym
AM
Description
Amplitude Modulation
AMPS
ASK
CDM
ESD
ESR
FM
Advanced Mobile Phone System
Amplitude Shift Keying
Charged-Device Model
ElectroStatic Discharge
Equivalent Series Resistance
Frequency Modulation
Frequency Shift Keying
Human Body Model
FSK
HBM
IF
Intermediate Frequency
inductor/capacitor filter
Local Oscillator
LC
LO
PCB
RF
Printed-Circuit Board
Radio Frequency
RMS
RSSI
SINAD
TACS
VHF
Root Mean Squared
Received Signal Strength Indicator
Signal-to-Noise And Distortion ratio
Total Access Communication System
Very High Frequency
SA606
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Product data sheet
Rev. 6 — 8 November 2013
29 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
19. Revision history
Table 13. Revision history
Document ID Release date
Data sheet status
Change notice
Supersedes
SA606 v.6
20131108
Product data sheet
-
SA606 v.5
Modifications:
• Table 1 “Ordering information”:
–
added Type number SA606DK/02
–
added Type number SA606DK/03
• Added Section 4.1 “Ordering options”
• Figure 3 “Pin configuration for SSOP20”: added Type numbers SA606DK/02 and SA606DK/03
• Table 5 “Thermal characteristics”: appended type numbers SA606DK/02, SA606DK/03 to Conditions
• Table 7 “Dynamic characteristics”: Vo(RSSI) for Condition RF level = 68 dB:
–
–
–
Added “SA606D/01, SA606DK/01” to (existing) Condition
Added Condition “SA606DK/02; RF level = 68 dBm”
Added Condition “SA606DK/03; RF level = 68 dBm”
• Figure 13 “RSSI output voltage versus IF level (SA606D/01; SA606DK/01)”:
appended “(SA606D/01; SA606DK/01)” to figure title
• Figure 14 “RSSI output voltage versus RF level (SA606D/01; SA606DK/01)”:
appended “(SA606D/01; SA606DK/01)” to figure title
• Added Section 17 “Soldering: PCB footprints”
SA606 v.5
SA606 v.4
SA606 v.3
SA606 v.2
20120724
20110412
20110317
19971107
Product data sheet
Product data sheet
Product data sheet
Product specification
-
-
-
SA606 v.4
SA606 v.3
SA606 v.2
ECN 853-1576 18665 SA606 v.1
dated 1997 Nov 07
SA606 v.1
19931026
Product specification
-
-
SA606
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
30 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
20.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SA606
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
31 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SA606
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 8 November 2013
32 of 33
SA606
NXP Semiconductors
Low-voltage high performance mixer FM IF system
22. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
4
4.1
5
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Performance curves . . . . . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 15
Test information. . . . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22
8
9
10
11
12
13
14
15
16
Soldering of SMD packages . . . . . . . . . . . . . . 24
Introduction to soldering . . . . . . . . . . . . . . . . . 24
Wave and reflow soldering . . . . . . . . . . . . . . . 24
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 24
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 25
16.1
16.2
16.3
16.4
17
18
19
Soldering: PCB footprints. . . . . . . . . . . . . . . . 27
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 29
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 30
20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 32
20.1
20.2
20.3
20.4
21
22
Contact information. . . . . . . . . . . . . . . . . . . . . 32
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 November 2013
Document identifier: SA606
相关型号：
SA606DK/01
IC SPECIALTY TELECOM CIRCUIT, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20, Telecom IC:Other
NXP
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