SA615DK/01,112_技术文档

SA615

High performance low power mixer FM IF system

Rev. 4 — 14 November 2014

Product data sheet

1. General description

The SA615 is a high performance monolithic low-power FM IF system incorporating a

mixer/oscillator, two limiting intermediate frequency amplifiers, quadrature detector,

muting, logarithmic Received Signal Strength Indicator (RSSI), and voltage regulator. The

SA615 combines the functions of NXP Semiconductors SA602A and SA604A, but

features a higher mixer input intercept point, higher IF bandwidth (25 MHz) and

temperature compensated RSSI and limiters permitting higher performance application.

The SA615 is available in 20-lead SO (surface-mounted miniature package) and 20-lead

SSOP (shrink small outline package).

The SA605 and SA615 are functionally the same device types. The difference between

the two devices lies in the guaranteed specifications. The SA615 has a higher I_CC, lower

input third-order intercept point, lower conversion mixer gain, lower limiter gain, lower AM

rejection, lower SINAD, higher THD, and higher RSSI error than the SA615. Both the

SA605 and SA615 devices meet the EIA specifications for AMPS and TACS cellular radio

applications.

2. Features and benefits

 Low power consumption: 5.7 mA typical at 6 V

 Mixer input to >500 MHz

 Mixer conversion power gain of 13 dB at 45 MHz

 Mixer noise figure of 4.6 dB at 45 MHz

 XTAL oscillator effective to 150 MHz (L/C oscillator to 1 GHz local oscillator can be

injected)

 102 dB of IF amplifier/limiter gain

 25 MHz limiter small signal bandwidth

 Temperature-compensated logarithmic Received Signal Strength Indicator (RSSI) with

a dynamic range in excess of 90 dB

 Two audio outputs — muted and unmuted

 Low external component count; suitable for crystal/ceramic/LC filters

 Excellent sensitivity: 0.22 V into 50  matching network for 12 dB SINAD

(Signal-to-Noise-and-Distortion ratio) for 1 kHz tone with RF at 45 MHz and IF at

455 kHz

 SA615 meets cellular radio specifications

 ESD hardened

SA615

NXP Semiconductors

High performance low power mixer FM IF system

3. Applications

 Cellular radio FM IF

 High performance communications receivers

 Single conversion VHF/UHF receivers

 SCA receivers

 RF level meter

 Spectrum analyzer

 Instrumentation

 FSK and ASK data receivers

 Log amps

 Wideband low current amplification

4. Ordering information

Table 1.

Ordering information

Type number

Topside

marking

Package

Name

Description

Version

SA615D/01

SA615D

SO20

plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

SA615DK/01

SA615DK

SSOP20

plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

4.1 Ordering options

Table 2.

Ordering options

Type number

Orderable

Package

Packing method

Minimum Temperature

part number

order

quantity

SA615D/01

SA615D/01,112

SA615D/01,118

SA615DK/01,112

SA615DK/01,118

SO20

Standard marking

* IC’s tube - DSC bulk pack

1520

2000

1350

2500

T_amb= 40 C to +85 C

_amb= 40 C to +85 C

SO20

Reel 13” Q1/T1

*Standard mark SMD

T

SA615DK/01

SSOP20

Standard marking

* IC’s tube - DSC bulk pack

T_amb= 40 C to +85 C

Reel 13” Q1/T1

*Standard mark SMD

SA615

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Product data sheet

Rev. 4 — 14 November 2014

2 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

5. Block diagram

20

19

18

17

16

15

14

13

12

11

IF amp

limiter

mixer

RSSI

quad

10

OSCILLATOR

mute

E

3

B

4

1

2

5

6

7

8

9

aaa-012909

Fig 1. Block diagram

SA615

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Product data sheet

Rev. 4 — 14 November 2014

3 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

6. Pinning information

6.1 Pinning

1

2

20

19

18

17

16

15

14

13

12

11

RF_IN

RF_BYPASS

OSC_OUT

MIXER_OUT

IF_AMP_DECOUPL

IF_AMP_IN

3

4

OSC_IN

IF_AMP_DECOUPL

IF_AMP_OUT

GND

5

MUTE_INPUT

SA615D/01

6

V

CC

7

RSSI_OUT

MUTE_AUD_OUTP

UNMUTE_AUD_OUTP

QUADRATURE_IN

LIMITER_IN

8

LIMITER_DECOUPL

LIMITER_OUT

9

10

aaa-013002

Fig 2. Pin configuration for SO20

1

2

20

MIXER_OUT

RF_IN

RF_BYPASS

OSC_OUT

19

18

17

16

15

14

13

12

11

IF_AMP_DECOUPL

IF_AMP_IN

3

4

OSC_IN

IF_AMP_DECOUPL

IF_AMP_OUT

GND

5

MUTE_INPUT

SA615DK/01

6

V

CC

7

RSSI_OUT

MUTE_AUD_OUTP

UNMUTE_AUD_OUTP

QUADRATURE_IN

LIMITER_IN

8

LIMITER_DECOUPL

LIMITER_OUT

9

10

aaa-013003

Fig 3. Pin configuration for SSOP20

SA615

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Product data sheet

Rev. 4 — 14 November 2014

4 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

6.2 Pin description

Table 3.

Symbol

RF_IN

Pin description

1

Description

RF input

RF_BYPASS

2

RF bypass pin

OSC_OUT

3

oscillator output

OSC_IN

4

oscillator input

MUTE_INPUT

V_CC

5

mute input

6

positive supply voltage

RSSI output

RSSI_OUT

7

MUTED_AUD_OUTP

UNMUTED_AUD_OUTP

QUADRATURE_IN

LIMITER_OUT

LIMITER_DECOUPL

LIMITER_IN

8

mute audio output

unmute audio output

quadrature detector input terminal

limiter amplifier output

limiter amplifier decoupling pin

limiter amplifier input

ground; negative supply

IF amplifier output

IF amplifier decoupling pin

IF amplifier input

9

10

11

12

13

14

15

16

17

18

19

20

GND

IF_AMP_OUT

IF_AMP_DECOUPL

IF_AMP_IN

IF_AMP_DECOUPL

MIXER_OUT

IF amplifier decoupling pin

mixer output

SA615

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Product data sheet

Rev. 4 — 14 November 2014

5 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

7. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_CC

Parameter

Conditions

Min

-

Max

9

Unit

V

supply voltage

T_stg

storage temperature

ambient temperature

65

40

+150

+85

C

T_amb

operating

8. Thermal characteristics

Table 5.

Symbol

Z_th(j-a)

Thermal characteristics

Parameter

Conditions

SA615D/01 (SO20)

SA615DK/01 (SSOP20)

Typ

Unit

K/W

transient thermal impedance

from junction to ambient

90

117

9. Static characteristics

Table 6.

Static characteristics

V_CC= +6 V; T_amb= 25 C; unless specified otherwise.

Symbol

V_CC

Parameter

Conditions

Min

4.5

-

Typ

Max

8.0

7.4

-

Unit

V

supply voltage

supply current

threshold voltage

-

I_CC

5.7

mA

V

V_th

mute switch-on

mute switch-off

1.7

-

1.0

V

SA615

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Product data sheet

Rev. 4 — 14 November 2014

6 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

10. Dynamic characteristics

Table 7.

Dynamic characteristics

T_amb= 25 C; V_CC= +6 V; unless specified otherwise. RF frequency = 45 MHz + 14.5 dBV RF input step-up.

IF frequency = 455 kHz; R17 = 5.1 k; RF level = 45 dBm; FM modulation = 1 kHz with 8 kHz peak deviation.

Audio output with C-message weighted filter and de-emphasis capacitor. Test circuit Figure 7. The parameters listed below

are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the

ultimate performance limits of the device. Use of an optimized RF layout improves many of the listed parameters.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Mixer/oscillator section (external LO = 300 mV)

f_i

input frequency

-

500

150

5.0

-

MHz

dB

f_osc

oscillator frequency

noise figure

-

NF

at 45 MHz

-

IP3_i

G_p(conv)

input third-order intercept point

conversion power gain

FL1 = 45.0 MHz; FL2 = 45.06 MHz

matched 14.5 dBV step-up

50  source

-

12

13

-

dBm

dB

8.0

-

1.7

4.7

-

dB

R_i(RF)

RF input resistance

RF input capacitance

mixer output resistance

single-ended input

3.0

-

k

C_i(RF)

3.5

4.0

-

pF

R_o(mix)

IF section

G_amp(IF)

G_lim

MIXER_OUT pin

1.25

1.50

k

IF amplifier gain

limiter gain

50  source

-

39.7

62.5

109

-

dB

P_i(IF)

IF input power

for 3 dB input limiting sensitivity;

dBm

R17 = 5.1 k; test at IF_AMP_IN pin

_AM

AM rejection

audio level

80 % AM 1 kHz

25

60

33

43

dB

RMS value; R10 = 100 k;

150

260

mV

15 nF de-emphasis

unmuted audio level

R11 = 100 k; 150 pF de-emphasis

-

530

12

-

mV

dB

SINAD

THD

signal-to-noise-and-distortion ratio RF level 118 dB

-

total harmonic distortion

30

42

68

S/N

signal-to-noise ratio

RSSI output voltage

no modulation for noise

-

[1]

V_o(RSSI)

IF; R9 = 100 k

IF level = 118 dBm

0

160

2.5

4.8

80

800

mV

V

IF level = 68 dBm

1.7

3.3

IF level = 18 dBm

3.6

5.8

V

_RSSI(range)RSSI range

R9 = 100 k; IF_AMP_OUT pin

-

dB

k

_RSSI

Z_i(IF)

Z_o(IF)

Z_i(lim)

R_o

RSSI variation

-

2

IF input impedance

IF output impedance

limiter input impedance

output resistance

1.40

0.85

1.40

-

1.6

1.0

1.6

58

unmuted audio

muted audio

-

58

SA615

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Product data sheet

Rev. 4 — 14 November 2014

7 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

Table 7.

Dynamic characteristics …continued

T_amb= 25 C; V_CC= +6 V; unless specified otherwise. RF frequency = 45 MHz + 14.5 dBV RF input step-up.

IF frequency = 455 kHz; R17 = 5.1 k; RF level = 45 dBm; FM modulation = 1 kHz with 8 kHz peak deviation.

Audio output with C-message weighted filter and de-emphasis capacitor. Test circuit Figure 7. The parameters listed below

are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the

ultimate performance limits of the device. Use of an optimized RF layout improves many of the listed parameters.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

RF/IF section (internal LO)

unmuted audio level

RMS value; V_CC= 4.5 V;

RF level = 27 dBm

-

450

4.3

-

mV

V

V_o(RSSI)

RSSI output voltage

system; V_CC= 4.5 V;

RF level = 27 dBm

[1] The generator source impedance is 50 , but the SA615 input impedance at pin 18 (IF_AMP_IN) is 1500 . As a result, IF level refers

to the actual signal that enters the SA615 input (pin 8, MUTED_AUD_OUTP) which is about 21 dB less than the ‘available power’ at the

generator.

SA615

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Product data sheet

Rev. 4 — 14 November 2014

8 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

11. Application information

R17

C15

5.1 kΩ

FL1

20

FL2

C23

C21

17

C18 C17

13

19

18

16

15

14

12

11

700 Ω

IF amp

limiter

mixer

quad

detector

RSSI

mute

switch

OSCILLATOR

1

2

3

4

5

6

7

8

9

10

L3

C3

C1

C9

R9

R10

C12

R11

C13

C8

(1)

R5

C7

L2

C24

C10

C11

C26

C25

L1

C2

45 MHz

input

C5

C6

X1

C14

aaa-012965

The layout is very critical in the performance of the receiver. We highly recommend our demo

board layout.

All of the inductors, the quad tank, and their shield must be grounded. A 10 F to 15 F or higher

value tantalum capacitor on the supply line is essential. A low frequency ESR screening test on this

capacitor ensures consistent good sensitivity in production. A 0.1 F bypass capacitor on the

supply pin, and grounded near the 44.545 MHz oscillator improves sensitivity by 2 dB to 3 dB.

(1) R5 can be used to bias the oscillator transistor at a higher current for operation above 45 MHz.

Recommended value is 22 k, but should not be below 10 k.

Fig 4. SA615 45 MHz application circuit

SA615

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Product data sheet

Rev. 4 — 14 November 2014

9 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

Table 8.

SA615 application component list

Component Value

Description

NPO ceramic

Package

C0805K

Part number

C1

33 pF

445-127x-1-ND

445-7484-6-ND

490-1994-2-ND

311-1036-1-ND

490-1994-2-ND

399-3293-1-ND

490-1994-2-ND

311-1036-1-ND

478-3117-1-ND

311-1036-1-ND

399-1161-1-ND

399-1125-1-ND

311-1036-1-ND

490-1994-2-ND

C2

220 pF

C3

5 pF to 30 pF

100 nF  10 %

5 pF to 30 pF

1 nF

NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP

100 nF  10 % monolithic ceramic C0805K

NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP

C5

C6

C7

ceramic

C0805K

C1812

C8

10 pF

NPO ceramic

C9

100 nF  10 %

22 F

monolithic ceramic

tantalum

C10^[1]

C11

C12

C13

C14

C15

C17

C18

C21

C23

C24

C25

C26

CN1

CN2

100 nF  10 %

15 nF  10 %

150 pF  2 %

100 nF  10 %

10.0 pF

monolithic ceramic

ceramic

C0805K

N1500 ceramic

monolithic ceramic

NPO ceramic

100 nF  10 %

monolithic ceramic

5 pF to 30 pF trim NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP

470 pF

39 pF

monolithic ceramic

8-pin header

C0805K

MA08-1

399-8083-10ND

BU-SMA-H

J502-ND-142-

0701-881/886

520-142-0701-881

FL1, FL2^[2]

ceramic filter;

surface mount

CFUKF455KB4X-R0

Murata CFUKF455KB4X or equivalent

L1

330 nH

Coilcraft 1008CS-331

WE-KI_1008_B 1008CS-331

L2

1.2 H

fixed inductor Coilcraft 1008CS-122XKLC WE-KI_1008_B 1008CS-122

L3

220 H

fixed inductor

WE-GF_L

R0603

1812LS-224XJB

311-100KCRCT-ND

311-5.10KCRDKR-ND

568-2087-5-nd

R9

100 k  1 %

5.1 k  5 %

1/4 W metal film

R10^[3]

R11^[3]

R17

U1

1/4 W metal film

C0805K

TSSOP20

UM-1

1/4 W metal film

1/4 W carbon composition

SA605DK

X1

44.545 MHz

resonant 3rd-overtone crystal

49HC/11453

[1] This value can be reduced when a battery is the power source.

[2] The ceramic filters can be 30 kHz SFG455A3s made by Murata, which have 30 kHz IF bandwidth (they come in blue), or 16 kHz

CFU455Ds, also made by Murata (they come in black). All of our specifications and testing are done with the more wideband filter.

[3] Optional.

SA615

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Product data sheet

Rev. 4 — 14 November 2014

10 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

(1)

RF GENERATOR

45 MHz

SA615 DEMOBOARD

V

(+6 V)

CC

(2)

RSSI

AUDIO

DATA

DC VOLTMETER

(3)

C-MESSAGE

HP339A DISTORTION

SCOPE

(4)

ANALYZER

aaa-013153

(1) The C-message filter has a peak gain of 100 dB for accurate measurements. Without the gain, the

measurements may be affected by the noise of the scope and HP339 analyzer.

(2) Set your RF generator at 45.000 MHz, use a 1 kHz modulation frequency and a 6 kHz deviation if

you use 16 kHz filters, or 8 kHz if you use 30 kHz filters.

(3) The smallest RSSI voltage (that is, when no RF input is present and the input is terminated) is a

measure of the quality of the layout and design. If the lowest RSSI voltage is 250 mV or higher, it

means that the receiver is in regenerative mode. In that case, the receiver sensitivity is worse than

expected.

(4) The measured typical sensitivity for 12 dB SINAD should be 0.22 V or 120 dBm at the RF input.

Fig 5. SA615 application circuit test setup

20

6

5

4

3

2

1

0

RF = 45 MHz

RSSI

(V)

IF = 455 kHz

V

= 6 V

CC

AUDIO REF = 174 mV (RMS value)

0

THD + NOISE

AM (80 % MOD)

NOISE

(dB)

−20

THD + NOISE

AM (80 % MOD)

−40

−60

RSSI (V)

−110

−80

NOISE

−100

−130

−90

−70

−50

−30

−10

10 20

RF input level (dBm)

aaa-012967

Audio out:

C message weighted

0 dB reference = recovered audio for 8 kHz peak deviation (dB)

Fig 6. Performance of the SA615 application board at 25 C

SA615

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Product data sheet

Rev. 4 — 14 November 2014

11 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

11.1 Circuit description

The SA615 is an IF signal processing system suitable for second IF or single conversion

systems with input frequency as high as 1 GHz. The bandwidth of the IF amplifier is about

40 MHz, with 39.7 dB of gain from a 50  source. The bandwidth of the limiter is about

28 MHz with about 62.5 dB of gain from a 50  source. However, the gain/bandwidth

distribution is optimized for 455 kHz, 1.5 k source applications. The overall system is

well-suited to battery operation as well as high-performance and high-quality products of

all types.

The input stage is a Gilbert cell mixer with oscillator. Typical mixer characteristics include

a noise figure of 5 dB, conversion gain of 13 dB, and input third-order intercept of

10 dBm. The oscillator operates in excess of 1 GHz in L/C tank configurations. Hartley or

Colpitts circuits can be used up to 100 MHz for crystal configurations. Butler oscillators

are recommended for crystal configurations up to 150 MHz.

The output of the mixer is internally loaded with a 1.5 k resistor, permitting direct

connection to a 455 kHz ceramic filter. The input resistance of the limiting IF amplifiers is

also 1.5 k. With most 455 kHz ceramic filters and many crystal filters, no impedance

matching network is necessary. To achieve optimum linearity of the log signal strength

indicator, there must be a 12 dBV insertion loss between the first and second IF stages. If

the IF filter or inter-stage network does not cause 12 dBV insertion loss, a fixed or variable

resistor can be added between the first IF output (pin 16, IF_AMP_OUT) and the

inter-stage network.

The signal from the second limiting amplifier goes to a Gilbert cell quadrature detector.

One port of the Gilbert cell is internally driven by the IF. The other output of the IF is

AC-coupled to a tuned quadrature network. This signal, which now has a 90 phase

relationship to the internal signal, drives the other port of the multiplier cell.

Overall, the IF section has a gain of 90 dB. For operation at intermediate frequencies

greater than 455 kHz, special care must be given to layout, termination, and inter-stage

loss to avoid instability.

The demodulated output of the quadrature detector is available at two pins, one

continuous and one with a mute switch. Signal attenuation with the mute activated is

greater than 60 dB. The mute input is very high-impedance and is compatible with CMOS

or TTL levels.

A log signal strength completes the circuitry. The output range is greater than 90 dB and is

temperature compensated. This log signal strength indicator exceeds the criteria for

AMPS or TACS cellular telephone.

Remark: dBV = 20log V_O/ V_I.

SA615

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Product data sheet

Rev. 4 — 14 November 2014

12 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

12. Test information

−25 dB,

−10.6 dB,

−29 dB,

929 Ω/50 Ω pad

−10.6 dB,

50 Ω/50 Ω pad

−36 dB,

156 kΩ/50 Ω pad

1500 Ω/50 Ω pad 50 Ω/50 Ω pad

50.5 Ω

3880 Ω

96.5 Ω

51.5 Ω

96.5 Ω

51.7 Ω

1.3 kΩ

71.5 Ω

32.6 Ω

71.5 Ω

32.8 Ω

C24

FL1

R17

C15

C16

C22 C20

SW8 SW7

C19

5.1 kΩ

SW9

SW6

SW5

FL2

C18 C17

C23

19

C21

20

18

17

16

15

14

13

12

11

700 Ω

IF amp

limiter

mixer

quad

detector

RSSI

mute

switch

OSCILLATOR

1

2

3

4

5

6

7

8

9

10

C9

R9

R10

C12

R11

C3

C1

SW1

SW3

C8

SW4

C10

C11

C13

L1

C7

L2

C2

IFT1

C5

C26

‘C’ WEIGHTED

AUDIO

X1

MEASUREMENT

CIRCUIT

SW2

C6

R1

R3

C14

C3

C4

R2

ext.

LOC osc

44.545 MHz

R7

30.5 Ω

45.06

MHz

45 MHz

R6

R8

178 Ω 39.2 Ω

mini-circuit

ZSC2-1B

aaa-012966

Fig 7. SA615 45 MHz test circuit (relays as shown)

SA615

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Product data sheet

Rev. 4 — 14 November 2014

13 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

Table 9.

Automatic test circuit component list

Description

Component

C1

33 pF NPO ceramic

C2

180 pF NPO ceramic

C3, C6

5 pF to 30 pF variable capacitor; Murata TZC3P300A 110R00

C5, C9, C11, C14, C17, 100 nF  10 % monolithic ceramic

C18, C21, C23

C7

1 nF ceramic

C8, C15

C10^[1]

C12

C13

C26

FL1

10 pF NPO ceramic

6.8 F tantalum (minimum)

15 nF  10 % ceramic

150 pF  2 % N1500 ceramic

390 pF  10 % monolithic ceramic

ceramic filter Murata SFG455A3 or equivalent

FL2

IFT1

L1

330 H variable shielded inductor, Toko 836AN-0129Z

330 nH Coilcraft 1008CS-331

L2

1.2 H Coilcraft 1008CS-122

X1

44.545 MHz 3rd Overtone series resonant crystal in the HC-49U case

100 k  1 % 1/4 W metal film

R9

R10, R11

R17

100 k  1 % 1/4 W metal film (optional)

5.1 k  5 % 1/4 W carbon composition

[1] This value can be reduced when a battery is the power source.

SA615

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Product data sheet

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14 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

13. Package outline

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Fig 8. Package outline SOT163-1 (SO20)

SA615

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Product data sheet

Rev. 4 — 14 November 2014

15 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

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Fig 9. Package outline SOT266-1 (SSOP20)

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Product data sheet

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16 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

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Product data sheet

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SA615

NXP Semiconductors

High performance low power mixer FM IF system

14.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 10) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 10 and 11

Table 10. SnPb eutectic process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

235

 350

220

< 2.5

 2.5

220

Table 11. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 10.

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Product data sheet

Rev. 4 — 14 November 2014

18 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 10. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

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Product data sheet

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SA615

NXP Semiconductors

High performance low power mixer FM IF system

15. Soldering: PCB footprints

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Fig 12. PCB footprint for SOT163-1 (SO20); wave soldering

SA615

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Product data sheet

Rev. 4 — 14 November 2014

20 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

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Fig 13. PCB footprint for SOT266-1 (SSOP20); reflow soldering

SA615

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Product data sheet

Rev. 4 — 14 November 2014

21 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

16. Abbreviations

Table 12. Abbreviations

Acronym

AM

Description

Amplitude Modulation

AMPS

ASK

CMOS

ESD

ESR

FM

Advanced Mobile Phone System

Amplitude Shift Keying

Complementary Metal-Oxide Semiconductor

ElectroStatic Discharge

Equivalent Series Resistor

Frequency Modulation

FSK

IF

Frequency Shift Keying

Intermediate Frequency

L/C

inductor-capacitor filter

RF

Radio Frequency

RSSI

SCA

SINAD

TACS

THD

TTL

Received Signal Strength Indicator

Subsidiary Communications Authorization

Signal-to-Noise-And-Distortion ratio

Total Access Communication System

Total Harmonic Distortion

Transistor-Transistor Logic

Ultra High Frequency

UHF

VHF

Very High Frequency

SA615

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Product data sheet

Rev. 4 — 14 November 2014

22 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

17. Revision history

Table 13. Revision history

Document ID Release date

Data sheet status

Change notice

Supersedes

SA615 v.4

20141114

Product data sheet

-

SA615 v.3

Modifications:

• Table 8 “SA615 application component list” updated

• Figure 4 “SA615 45 MHz application circuit” updated

SA615 v.3

SA615 v.2

20140512

Product data sheet

Product specification

-

SA615 v.2

19971107

853-1402 18665

853-1402 08109

NE/SA615 v.1

-

NE/SA615 v.1 19921103

SA615

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Product data sheet

Rev. 4 — 14 November 2014

23 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

18. Legal information

18.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

18.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

18.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

SA615

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 14 November 2014

24 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

18.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

SA615

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 14 November 2014

25 of 26

SA615

NXP Semiconductors

High performance low power mixer FM IF system

20. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

2

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3

4

4.1

5

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Thermal characteristics . . . . . . . . . . . . . . . . . . 6

Static characteristics. . . . . . . . . . . . . . . . . . . . . 6

Dynamic characteristics . . . . . . . . . . . . . . . . . . 7

Application information. . . . . . . . . . . . . . . . . . . 9

Circuit description. . . . . . . . . . . . . . . . . . . . . . 12

Test information. . . . . . . . . . . . . . . . . . . . . . . . 13

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15

8

9

10

11

11.1

12

13

14

Soldering of SMD packages . . . . . . . . . . . . . . 17

Introduction to soldering . . . . . . . . . . . . . . . . . 17

Wave and reflow soldering . . . . . . . . . . . . . . . 17

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 17

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 18

14.1

14.2

14.3

14.4

15

16

17

Soldering: PCB footprints. . . . . . . . . . . . . . . . 20

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 22

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23

18

Legal information. . . . . . . . . . . . . . . . . . . . . . . 24

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25

18.1

18.2

18.3

18.4

19

20

Contact information. . . . . . . . . . . . . . . . . . . . . 25

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 November 2014

Document identifier: SA615


型号：	SA615DK/01,112
厂家：	NXP
描述：	SA615 - High performance low power mixer FM IF system SSOP2 20-Pin 光电二极管商用集成电路
文件：	总26页 (文件大小：539K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SA615DK/01,112 [NXP]

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