SAA1310 [NXP]
Control interface for VHS video recorders; 对于VHS录像机的控制界面
| 型号： | SAA1310 |
| 厂家： | 
NXP |
| 描述： | Control interface for VHS video recorders |
| 文件： | 总15页 (文件大小：110K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
SAA1310
Control interface for VHS video
recorders
April 1995
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Control interface for VHS video
recorders
SAA1310
FEATURES
GENERAL DESCRIPTION
• Full support of VISS and VASS mode (VHS
Index/Address Search System)
The SAA1310 provides an interface between the tape
control head in the VHS deck-electronics.
The circuit also includes an interface between sensors in
the deck mechanics and the microprocessor.
• Read, write and overwrite of Tape Control/head signal
(CTL)
• Power-ON and power-failure indicator
• 4 general purpose comparators for interface between
sensors and microprocessor
• 2 comparators have a 100 mA output driver
• PAL and NTSC compatible
ORDERING INFORMATION
PACKAGE
EXTENDED
TYPE NUMBER
PINS
PIN POSITION
MATERIAL
CODE
SOT102 (1)
SOT163A (2)
SAA1310
18
20
DIL
SO
plastic
plastic
SAA1310T
Note
1. SOT102-1; 1996 December 02.
2. SOT163-1; 1996 December 02.
April 1995
2
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
write/read
input
write
current
10
(11)
WRITE
AMPLIFIER
control head data
output
16
(18)
capstan reverse
input
18
(20)
control head
input/output
2
(2)
AMPLIFIER
FILTER
DETECTOR
SAA1310
(SAA1310T)
control head
feedback
1
(1)
reference voltage
output
3
(3)
V
P
V
ref
POWER-ON AND
POWER-FAILURE
DETECTOR
17
(19)
power on/failure
output
V
ref
power on/failure
capacitor
4
(4)
5
(6)
comparator 1
comparator 2
comparator 3
comparator 4
comparator 1
non - inverting input
15
(17)
comparator 1
output
6
(7)
comparator 2
non - inverting input
14
(15)
comparator 2
output
13
(14)
comparator 3
output
7
(8)
comparator 3
inverting input
11
(12)
comparator 4
output
8
(9)
comparator 4
inverting input
9 (10) 12 (13)
MEA082 - 1
V
GND
P
Pin numbers in parenthesis refer to the SAA1310T.
Fig.1 Block diagram.
3
April 1995
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
PIN CONFIGURATION
handbook, halfpage
dbook, halfpage
CTL FB
1
2
20 CAPREV
CTL FB
CTL I/O
1
2
3
4
5
6
7
8
9
18 CAPREV
PO/FAIL OUT
CTL DATA
CTL I/O
19
18
17
16
17 PO/FAIL OUT
V
3
ref
CTL DATA
V
16
ref
CPO/FAIL
n.c.
4
COUT1
n.c.
CPO/FAIL
CIN1
15
SAA1310 14
13
COUT1
COUT2
COUT3
5
SAA1310T
CIN1
6
15 COUT2
14 COUT3
13 GND
CIN2
CIN2
7
CIN3
12 GND
8
CIN3
CIN4
11 COUT4
CIN4
9
12 COUT4
11 WRITE/READ
V
P
10 WRITE/READ
V
P
10
MEA083
MEA084
a. SAA1310.
b. SAA1310T.
Fig.2 Pin configurations.
PINNING (pins in parenthesis refer to SAA1310T)
SYMBOL
PIN
DESCRIPTION
CTL FB
CTL I/O
Vref
1
(1)
control head feedback
control head input/output
reference voltage output
2
(2)
3
(3)
CPO/FAIL
CIN1
4
(4)
power on/failure capacitor
comparator 1 input
comparator 2 input
comparator 3 input
comparator 4 input
supply voltage
5
(6)
CIN2
6
(7)
CIN3
7
(8)
CIN4
8
(9)
VP
9
(10)
(11)
(12)
(13)
(14)
(15)
(17)
(18)
(19)
(20)
WRITE/READ
COUT4
10
11
12
13
14
15
16
17
18
write/read input
comparator 4 output
ground
GND
COUT3
comparator 3 output
comparator 2 output
comparator 1 input
control head data output
power on/failure output
capstan reverse input
COUT2
COUT1
CTL DATA
PO/FAIL OUT
CAPREV
April 1995
4
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
LIMITING VALUES (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
supply voltage range
CONDITIONS
MIN. MAX. UNIT
VP
0
6.0
VP
V
VI/VO
VO
voltage on all pins
except pins 11 (12) and 13 (14)
0
V
output voltage on pins 11 (12) and 13 (14)
storage temperature range
ambient temperature range
0
18
V
Tstg
Tamb
−65
0
+150
+70
°C
°C
THERMAL RESISTANCE
SYMBOL
PARAMETER
TYP.
MAX.
UNIT
Rth
Rth
thermal resistance (SAA1310)
thermal resistance (SAA1310T)
75
90
−
−
K/W
K/W
April 1995
5
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
CHARACTERISTICS (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)
VP = 5 V; Tamb = 25 °C; all voltage referenced to pin 12 (13); according to the test set-up (see Fig.4); unless otherwise
specified
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
Pd
power dissipation
note 1
−
85
−
mW
Supply pin 9 (10)
VP
IP
supply voltage
supply current
4.5
10
13
5.0
15
18
5.5
20
24
V
read mode
mA
mA
write mode; duty factor = 50%
CTL I/O pin 2 (2)
READ MODE PIN 10 (11) < 0.5 V
VI
input voltage (peak-to-
peak value)
f = 500 Hz
0.35
−
−
mV
mV
kHz
µA
f = 30 kHz; non-linear operation −
−
200
−
B
Ib
bandwidth low-pass filter
input bias current
−
3
read mode
−
0.1
−
WRITE MODE PIN 10 (11) > 3.5 V
VO
output voltage LOW
ICTL I/O = 3 mA;
−
−
−
0.4
V
V
pin CTL DATA = HIGH
ICTL I/O = − 3 mA;
VO
output voltage HIGH
4.6
−
pin CTL DATA = LOW
WRITE/READ pin 10 (11)
VI
input voltage
read mode
−
−
−
0.5
3.3
V
write mode; analog
read mode
1.6
−
V
II
input current
− 1.5 −
µA
µA
write mode
−
0.1
−
Vref pin 3 (3); note 2
VO
Itot
RO
output voltage
total current
2.4
−4
−
2.5
−
2.6
+ 4
0.6
V
including write current
mA
Ω
output resistance
0.4
CAPREV pin 18 (20)
VIH
VIL
IIH
input voltage HIGH
2.0
−
−
−
−
−
−
V
input voltage LOW
input current HIGH
input current LOW
0.8
10
−
V
VCAPREV = 5 V
VCAPREV = 0 V
−
µA
µA
IIH
−10
April 1995
6
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
CTL DATA pin 16 (18)
WRITE MODE
VIH
VIL
IIH
input voltage HIGH
2.0
−
−
−
−
−
−
V
input voltage LOW
input current HIGH
input current LOW
0.8
10
−
V
VCTL DATA = 5 V
−
µA
µA
IIL
VCTL DATA = 0 V
−10
READ MODE
VOL
VOH
output voltage LOW
output voltage HIGH
IOL = 0.5 mA
−
−
−
0.4
V
V
IOH = − 50 µA
2.4
−
CPO/FAIL and PO/FAIL OUT pin 4 (4) and 17 (19); see Fig.3
VO
operating voltage range at decreasing VP
1.5
−
5.5
0.4
−
V
VOL
VOH
td
output voltage LOW
output voltage HIGH
delay time
IOL = 1 mA
−
−
V
IOH = 1 mA
VP − 0.9
−
V
CCAPREV = 68 nF
−
50
−
−
ms
V
VTL1
VTL2
IO
threshold level 1
4.5
−
4.8
−
threshold level 2
3.5
−3
300
20
2.1
V
source current pin 4
sink current pin 4
minimum output voltage
maximum output voltage
−
−
µA
µA
mV
V
IO
−
−
VO(min.)
VO(max.)
−
−
−
−
High output current type comparators
CIN3 and CIN4 pins 7 (8) and 8 (9)
Vhys
VIL
VIH
IIL
input hysteresis
−
−
10
−
−
mV
V
input voltage LOW
input voltage HIGH
input current LOW
input current HIGH
V
−
−
ref − 10 mV
V
ref + 10 mV
−
V
CIN3 = CIN4 = 0 V
CIN3 = CIN4 = VP
−1
−
µA
µA
IIH
−
−
+ 1
COUT3 and COUT4 pins 13 (14) and 11 (12)
VOL
output voltage LOW
IOL = 100 mA
OL = 2 mA
−
−
−
−
−
−
1.0
0.4
1
V
I
V
±IOL
leakage current
output voltage HIGH;
µA
COUT3 = COUT4 = 17 V
ttr
Tj
transient time
note 3
−
−
0.5
−
−
µs
°C
thermal protection
130
April 1995
7
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
Low output current type comparators
CIN1 AND CIN2 pins 5 (6) and 6 (7)
Vhys
VIL
VIH
II
input hysteresis
input voltage LOW
input voltage HIGH
input current
−
−
V
10
−
−
V
−
−
mV
V
ref − 10 mV
ref + 10 mV
−
V
CIN1 = CIN2 = 0 V
CIN1 = CIN2 = VP
COUT1 AND COUT2 pins 15 (17) and 14 (15)
−1
−
µ A
µ A
−
−
+1
VOL
VOH
ttr
output voltage HIGH
output voltage LOW
transient time
IOH = −100 µA
IOL = 2 mA
note 4
4.5
−
−
−
1
−
V
−
V
−
0.5
µ s
Notes to the characteristics
1. Without the sink current of the comparators; in write mode.
2. Minimum value of capacitor connected to this pin is 4.7 µF.
3. Vi = 100 mV p-p. Inputs connected to Vref via a 10 kΩ resistor; outputs connected to VP via a 250 Ω resistor.
4. Vi = 100 mV p-p. Inputs connected to Vref via a 10 kΩ resistor; outputs connected to VP via a 2.5 kΩ resistor.
April 1995
8
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
V
P
t
d
100
V
V
TL1
TL2
1.5 V
t
V
17 (19)
t
t
t
d
d
d
t
d
100
MEA085
t
Fig.3 Power-ON and power-failure detector.
April 1995
9
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
APPLICATION INFORAMTION
EMA08-61
nbok,fulpagewidth
April 1995
10
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
1
(1)
18
(20)
CAPREV
47 µF
2
(2)
17
(19)
PO/FAIL OUT
CTL head
4.7 nF
3
(3)
16
(18)
CTL DATA
COUT1
47
µF
V
4
(4)
15
(17)
I
68
nF
5
(6)
14
(15)
COUT2
COUT3
V
I
SAA1310
(SAA1310T)
6
(7)
13
(14)
V
I
V
I
7
(8)
12
(13)
V
I
8
(9)
11
(12)
COUT4
47 kΩ
9
(10)
10
(11)
WRITE/READ
+5 V
47
µF
100
nF
MEA087
Pin numbers in parenthesis refer to the SAA1310T.
Fig.5 Application diagram.
11
April 1995
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
PACKAGE OUTLINES
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
18
10
M
H
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
0.85
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.15
0.13
0.32
0.31
0.37
0.33
inches
0.19
0.020
0.15
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-10-14
95-01-23
SOT102-1
April 1995
12
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
April 1995
13
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
April 1995
14
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
April 1995
15
相关型号：
SAA1501TD-T
IC POWER SUPPLY MANAGEMENT CKT, PDSO24, 7.70 MM, PLASTIC, SOT137-1, SOP-24, Power Management Circuit
NXP
©2020 ICPDF网 联系我们和版权申明