SAA3049AT [NXP]
Infrared remote control decoder; 红外遥控器解码器
| 型号： | SAA3049AT |
| 厂家： | 
NXP |
| 描述： | Infrared remote control decoder |
| 文件： | 总16页 (文件大小：93K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
SAA3049A
Infrared remote control decoder
1996 Sep 13
Product specification
Supersedes data of 1996 Apr 15
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
FEATURES
GENERAL DESCRIPTION
• Decodes 64 remote control commands with a maximum
of 32 subaddresses
The main function of the SAA3049A is to check and
convert the received coded data (RECS80/RC5) into
latched binary outputs. The device address can be
hard-wired for a particular address, allowing several
devices in one location. Alternatively, received data with
any address can be accepted; the received data and
address are then outputs.
• Accepts RECS80 codes with pulse position modulation
(SAA3004, SAA3007, SAA3008) or RC5 codes with
bi-phase transmission (SAA3006, SAA3010)
• Suitable for low voltage and low SAA3049A supply
current applications
• Adding circuitry for binary decoding allows a maximum
of 2048 commands to be used, for example 1-of-16
decoder (HEF4515).
ORDERING INFORMATION
PACKAGE
DESCRIPTION
DIP20 plastic dual in-line package; 20 leads (300 mil)
SO20 plastic small outline package; 20 leads; body width 7.5 mm
TYPE
NUMBER
NAME
VERSION
SAA3049AP
SAA3049AT
SOT146-1
SOT163-1
1996 Sep 13
2
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
SYSTEM DIAGRAM
command acknowledge
V
V
CC
+5 V
Batt
bits
CA
A
B
C
D
E
F
REMOTE
CONTROL
TRANSMITTER
REMOTE
CONTROL
DECODER
data
SAA3004
SAA3007
SAA3008
IN
IR
CQW89A
CQY89A
IR
BPW50
or
PREAMPLIFIER
toggle
T0
SAA3006
SAA3010
SAA3049A
A0 (S0)
A1 (S1)
A2 (S2)
A3 (S3)
A4
address
MGE374
4 MHz
Remote control transmitters (see individual data sheet for full specification):
SAA3004: VBatt = 4 to 11 V (max.); 7 × 64 = 448 commands (RECS80 code).
SAA3007: VBatt = 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code).
SAA3008: VBatt = 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code).
SAA3006: VBatt = 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code).
SAA3010: VBatt = 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code).
Fig.1 System diagram.
1996 Sep 13
3
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
PINNING
SYMBOL PIN
DESCRIPTION
A
1
2
3
4
5
6
7
8
9
data output
data output
data output
data output
data output
data output
B
C
handbook, halfpage
A
1
2
3
4
5
6
7
8
9
20
V
CC
D
B
19 CRI
E
C
18 T0
F
A0 (S0)
A1 (S1)
IN
data/address output/input
data/address output/input
digital input
D
E
17 A2 (S2)
16 A3 (S3)
15 A4
SAA3049A
F
GND
MODE
XTAL1
XTAL2
RESET
A4
10 ground
A0 (S0)
A1 (S1)
IN
14 RESET
13 XTAL2
12 XTAL1
11 MODE
11 RC5/RECS80 mode selection
12 crystal oscillator
13 crystal oscillator
14 reset input
GND 10
15 address output/input
16 address output/input
17 address output/input
18 T0 bit
MGD347
A3 (S3)
A2 (S2)
T0
CRI
19 command received indicator
20 supply voltage
Fig.2 Pin configuration.
VCC
1996 Sep 13
4
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
PARAMETER
CONDITIONS
MIN.
−0.5
MAX.
+7
UNIT
supply voltage
input voltage
V
V
VI
any pin
−0.5
−
VCC + 0.5
−10
II
DC input current
any pin
any pin
mA
mA
mW
mW
mA
mA
°C
IO
DC output current
−
10
Ptot
Po
total power dissipation
power dissipation per output
positive supply current
negative supply current
operating ambient temperature
storage temperature
−
125
−
30
IDD
ISS
Tamb
Tstg
−50
−100
−40
−65
+50
+50
+85
+150
°C
HANDLING
Inputs and outputs are protected against electrostatic charge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
1996 Sep 13
5
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
CHARACTERISTICS
VCC = 2.5 to 5.5 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC
ICC
supply voltage
supply current
2.5
−
5.5
0.7
V
VDD = 3 V,
−
0.3
mA
f
xtal = 4 MHz
Input signals (pin 9)
VIH
VIL
HIGH level input voltage
LOW level input voltage
0.7VCC
0
−
−
VCC
V
V
0.3VCC
Mode selection (pin 11)
VIH
VIL
HIGH level input voltage
LOW level input voltage
0.7VCC
0
−
−
VCC
V
V
0.3VCC
Command received indicator and mode control (pin 19); note 1
VIH
VIL
HIGH level input voltage
LOW level input voltage
0.7VCC
0
−
−
VCC
V
V
0.3VCC
Crystal oscillator
fosc
oscillator frequency
note 2
−
4
−
−
MHz
mA
Outputs
OPEN-DRAIN WITHOUT INTERNAL PULL-UP RESISTOR; note 3
IOL(sink)
LOW level output sink current
VCC = 5 V;
−1.6
−12
VOL = 0.4 V
Notes
1. With pin 19 = HIGH, then pins 7, 8, 15, 16 and 17 are address inputs.
With pin 19 = LOW, then pins 7, 8, 15, 16, and 17 are 4 or 5 address received outputs.
a) In Figs 5, 6 and 7 this HIGH/LOW switching is dependent on whether the transistor on pin 19 is fed via a series
resistor or not. In both applications pin 19, which toggles several times (see Fig.4) while a valid command is
acknowledged, can be used to activate (flash) an LED indicator.
2. A quartz crystal with a frequency of 4 MHz is recommended for the standard transmitter application.
3. Application as output requires connection of an external pull-up resistor.
1996 Sep 13
6
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
Reset
The circuit is shown in Figs 5, 6 and 7. The alternative reset circuit shown in Fig.3 protects against short term power
supply transients by generating a reset.
The reset pin should either be connected to external reset circuitry as proposed or connected to VSS. If connected to VSS
,
a reset pulse will be generated by the on-chip Power-on reset circuit at typically 1.3 V (±500 mV accuracy).
V
20
14
CC
1.8 kΩ
390 Ω
1 µF
SAA3049A
1N4148
zener diode
3.6 V
BC548
68 kΩ
1N4148
1 kΩ
MGE375
Fig.3 Proposed improved reset circuit.
Infrared signal input (pin 9)
APPLICATION INFORMATION
This pin is sensitive to a negative-going edge.
In Fig.5, the circuit shown is for use with transmitters
SAA3004, SAA3007 or SAA3008; pin 11 is HIGH for
RECS80 code.
Command received indicator (pin 19)
In Fig.6, the circuit shown is for use with transmitter types
SAA3006 or SAA3010; pin 11 is LOW for RC5 code.
In Fig.7, the decoder is set for the required subaddress by
holding the address pins HIGH or LOW. Pin 11 is HIGH for
use with transmitter types SAA3004, SAA3007 or
SAA3008 (RECS80 code). Pin 11 is LOW for use with
transmitter types SAA3006 or SAA3010 (RC5 code).
The remote control decoder is for up to 32 subaddresses
with 6 + 1-bit parallel outputs (RC5 code).
handbook, halfpage
signal at
pin 19
≈15 ms
≈120 ms
MGE376
Fig.4 Output diagram of command acknowledge.
1996 Sep 13
7
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
GM3E7
nbok,fulpagewidth
1996 Sep 13
8
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
GM3E78
nbok,fulpagewidth
1996 Sep 13
9
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
GM3E79
nbok,fulpagewidth
1996 Sep 13
10
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
PACKAGE OUTLINES
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
M
H
20
11
pin 1 index
E
1
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
(1)
(1)
Z
1
2
UNIT
mm
b
b
c
D
E
e
e
1
L
M
M
H
w
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
2.0
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.078
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-05-24
SOT146-1
SC603
1996 Sep 13
11
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.42
0.39
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-24
SOT163-1
075E04
MS-013AC
1996 Sep 13
12
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
Several techniques exist for reflowing; for example,
thermal conduction by heated belt.
Dwell times vary between 50 and 300 seconds depending
on heating method. Typical reflow temperatures range
from 215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Sep 13
13
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Sep 13
14
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
NOTES
1996 Sep 13
15
Philips Semiconductors – a worldwide company
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Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/25/02/pp16
Date of release: 1996 Sep 13
Document order number: 9397 750 01145
相关型号：
SAA3049AT-T
IC INFRARED, RECEIVER IC, PDSO20, 7.50 MM, PLASTIC, MS-013AC, SOT-163-1, SOP-20, Remote Control IC
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SAA3049TD
IC INFRARED, REMOTE CONTROL SUPPORT CIRCUIT, PDSO20, 7.50 MM, PLASTIC, MS-013AC, SOT-163-1, SOP-20, Remote Control IC
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