SAA7167 [NXP]

YUV-to-RGB Digital-to-Analog Converter DAC; YUV到RGB的数字 - 模拟转换器DAC的
SAA7167
型号: SAA7167
厂家: NXP    NXP
描述:

YUV-to-RGB Digital-to-Analog Converter DAC
YUV到RGB的数字 - 模拟转换器DAC的

转换器
文件: 总20页 (文件大小:147K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
SAA7167  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
1995 Nov 03  
Preliminary specification  
Supersedes data of 1995 Jun 13  
File under Integrated Circuits, IC22  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
FEATURES  
On-chip mixing of digital video data and analog  
RGB signals  
Supports video input format of YUV 4 : 2 : 2, 4 : 1 : 1,  
2 : 1 : 1 andRGB 5 : 6 : 5  
Video input rate up to 50 MHz  
voltage output amplifier, capable of converting digital video  
data to analog RGB video, and then mixing video and  
external analog RGB inputs.  
Allows for both binary and two’s complement video  
input data  
Triple 8-bit DACs for video output  
Built-in voltage output amplifier  
The video data path contains a data re-formatter,  
YUV-to-RGB colour space matrix as well as triple DACs for  
video data processing. An analog mixer performs  
multiplexing between DAC outputs of the video path and  
external analog RGB inputs.  
Provide keying control with external key and internal  
8-bit, 2 × 8-bit and 3 × 8-bit pixel colour key  
Programmable via the I2C-bus  
5 V CMOS device; LQFP48 package.  
The final analog outputs are buffered with built-in voltage  
output amplifiers to provide the direct driving capability for  
a 150 load. Figure 1 shows the overall block diagram.  
GENERAL DESCRIPTION  
The operation of SAA7167 is controlled via the I2C-bus.  
The SAA7167 is a mixed-mode designed IC containing a  
video data path, keying control block, analog mixer, and a  
QUICK REFERENCE DATA  
SYMBOL  
VDDD  
PARAMETER  
MIN.  
4.75  
MAX.  
5.25  
UNIT  
digital supply voltage  
analog supply voltage  
V
V
VDDA  
Tamb  
4.75  
0
5.25  
70  
operating ambient temperature  
°C  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
SAA7167  
LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm  
SOT313-2  
1995 Nov 03  
2
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
BLOCK DIAGRAM  
C
ref(h)  
Bin Gin Rin  
29 31 33  
36  
MIXER  
MIXER  
MIXER  
Rout  
Gout  
Bout  
OPAMP  
OPAMP  
OPAMP  
32  
30  
28  
YUV7 to  
YUV0  
38 to  
45  
YUV  
TO  
RGB  
MATRIX  
8-BIT  
DAC  
(3×)  
RE-  
FORMATTER  
UV7 to  
UV0  
MUX  
46 to 48,  
1 to 5  
HREF  
9
22  
23  
24  
SDA  
SCL  
RES  
2
I C-BUS  
CLOCK  
GENERATOR  
KEYING CONTROL  
8
SAA7167  
CONTROL  
6
10  
PCLK  
21  
13 to 20  
MGB743  
VCLK  
EXTKEY  
P7 to P0  
Fig.1 Block diagram.  
1995 Nov 03  
3
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
PINNING  
SYMBOL PIN  
DESCRIPTION  
I/O  
UV4  
UV3  
UV2  
UV1  
UV0  
1
2
3
4
5
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
I
I
I
I
I
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
VCLK  
VDDD  
VSSD  
HREF  
PCLK  
AP  
6
video clock input  
I
7
digital supply voltage  
I/O  
8
digital ground  
I/O  
9
horizontal reference input signal  
pixel clock input  
I
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
I
test pins, normally connected to ground  
test pins, normally connected to ground  
pixel bus input 7 (for keying control)  
pixel bus input 6 (for keying control)  
pixel bus input 5 (for keying control)  
pixel bus input 4 (for keying control)  
pixel bus input 3 (for keying control)  
pixel bus input 2 (for keying control)  
pixel bus input 1 (for keying control)  
pixel bus input 0 (for keying control)  
external key signal input  
I
SP  
I
P7  
I
P6  
I
P5  
I
P4  
I
P3  
I
I
P2  
P1  
I
P0  
I
EXTKEY  
SDA  
SCL  
RES  
n.c.  
I
I2C-bus data line  
I2C-bus clock line  
set to LOW to reset the I2C-bus  
I/O  
I
I
not connected  
VSSA2  
VDDA2  
Bout  
Bin  
analog ground 2  
I/O  
I/O  
O
I
analog supply voltage 2  
analog Blue signal output  
analog Blue signal input  
Gout  
Gin  
analog Green signal output  
analog Green signal input  
analog Red signal output  
analog Red signal input  
O
I
Rout  
Rin  
O
I
VSSA1  
VDDA1  
Cref(h)  
analog ground 1  
I/O  
I/O  
I/O  
analog supply voltage 1  
capacitor for reference high voltage output (2.25 V)  
1995 Nov 03  
4
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
SYMBOL PIN  
DESCRIPTION  
I/O  
n.c.  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
not connected  
YUV7  
YUV6  
YUV5  
YUV4  
YUV3  
YUV2  
YUV1  
YUV0  
UV7  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
digital video Y or UV (of YUV format 2 : 1 : 1) input data, or digital G and B input data  
I
I
I
I
I
I
I
I
I
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
UV6  
UV5  
47  
48  
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
I
I
digital video UV (of YUV format 4 : 1 : 1 and 4 : 2 : 2) input data, or digital G and R  
input data  
index  
corner  
C
V
1
2
36  
35  
34  
33  
UV4  
UV3  
ref(h)  
DDA1  
SSA1  
V
UV2  
3
4
UV1  
Rin  
UV0  
5
32 Rout  
31 Gin  
6
VCLK  
SAA7167  
V
7
Gout  
30  
DDD  
V
29 Bin  
8
SSD  
HREF  
PCLK  
AP  
9
Bout  
28  
27  
26  
V
V
10  
11  
12  
DDA2  
SSA2  
SP  
25 n.c.  
MGB744  
Fig.2 Pin configuration.  
5
1995 Nov 03  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
FUNCTIONAL DESCRIPTION  
Table 2 Pixel byte sequence of 4 : 1 : 1  
The SAA7167 contains a video data path, 3 analog mixers  
and voltage output amplifiers for the RGB channels  
respectively, a keying control block as well as an I2C-bus  
control block.  
INPUT  
YUV0  
YUV1  
YUV2  
YUV3  
YUV4  
YUV5  
YUV6  
YUV7  
UV0  
PIXEL BYTE SEQUENCE OF 4 : 1 : 1  
Y0 Y0 Y0 Y0 Y0 Y0 Y0 Y0  
Y1 Y1 Y1 Y1 Y1 Y1 Y1 Y1  
Y2 Y2 Y2 Y2 Y2 Y2 Y2 Y2  
Y3 Y3 Y3 Y3 Y3 Y3 Y3 Y3  
Y4 Y4 Y4 Y4 Y4 Y4 Y4 Y4  
Y5 Y5 Y5 Y5 Y5 Y5 Y5 Y5  
Y6 Y6 Y6 Y6 Y6 Y6 Y6 Y6  
Y7 Y7 Y7 Y7 Y7 Y7 Y7 Y7  
Video data path  
The video data path includes a video data re-formatter, a  
YUV-to-RGB colour space conversion matrix, and triple  
8-bit DACs.  
RE-FORMATTER  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
The re-formatter de-multiplexes the different video formats  
YUV 4 : 1 : 1, 4 : 2 : 2 or 2 : 1 : 1 to internal YUV 4 : 4 : 4,  
which can then be processed by the RGB matrix. The pixel  
byte sequences of those video input formats are shown in  
Tables 1 to 4.  
UV1  
UV2  
UV3  
UV4  
V6 V4 V2 V0 V6 V4 V2 V0  
V7 V5 V3 V1 V7 V5 V3 V1  
U6 U4 U2 U0 U6 U4 U2 U0  
U7 U5 U3 U1 U7 U5 U3 U1  
UV5  
Table 1 Pixel byte sequence of 4 : 2 : 2  
UV6  
PIXEL BYTE SEQUENCE OF  
UV7  
INPUT  
4 : 2 : 2  
Y data  
UV data  
0
1
2
3
4
5
6
7
YUV0 (LSB)  
YUV1  
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
U0  
U1  
U2  
U3  
U4  
U5  
U6  
U7  
0
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
V0  
V1  
V2  
V3  
V4  
V5  
V6  
V7  
1
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
U0  
U1  
U2  
U3  
U4  
U5  
U6  
U7  
2
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
V0  
V1  
V2  
V3  
V4  
V5  
V6  
V7  
3
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
U0  
U1  
U2  
U3  
U4  
U5  
U6  
U7  
4
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
V0  
V1  
V2  
V3  
V4  
V5  
V6  
V7  
5
0
4
YUV2  
Table 3 Pixel byte sequence of 2 : 1 : 1  
YUV3  
INPUT  
YUV0  
YUV1  
YUV2  
YUV3  
YUV4  
YUV5  
YUV6  
YUV7  
Y data  
UV data  
PIXEL BYTE SEQUENCE OF 2 : 1 : 1  
YUV4  
U0 Y0 V0 Y0 U0 Y0 V0 Y0  
U1 Y1 V1 Y1 U1 Y1 V1 Y1  
U2 Y2 V2 Y2 U2 Y2 V2 Y2  
U3 Y3 V3 Y3 U3 Y3 V3 Y3  
U4 Y4 V4 Y4 U4 Y4 V4 Y4  
U5 Y5 V5 Y5 U5 Y5 V5 Y5  
U6 Y6 V6 Y6 U6 Y6 V6 Y6  
U7 Y7 V7 Y7 U7 Y7 V7 Y7  
YUV5  
YUV6  
YUV7 (MSB)  
UV0 (LSB)  
UV1  
UV2  
UV3  
UV4  
X
0
0
X
0
2
X
4
4
X
4
6
UV5  
X
X
X
X
UV6  
UV7 (MSB)  
Y data  
UV data  
0
2
4
1995 Nov 03  
6
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
Table 4 Pixel byte sequence of 5 : 6 : 5  
Analog mixers and keying control  
The analog mixers are controlled to switch between the  
outputs from the video DACs and analog RGB inputs by a  
keying signal. The analog RGB inputs need to interface  
with analog mixers in the way of DC-coupling, also these  
RGB inputs are limited to RGB signals without a sync level  
pedestal. The keying control can be enabled by setting I2C  
bit KEN = 1. Two kinds of keying are possible to generate:  
one is external key (from EXTKEY pin when  
KMOD2 to KMOD0 are logic 0), and the other is the  
internal pixel colour key (when KMOD2 to KMOD0 are not  
logic 0) generated by comparing the input pixel data with  
the internal I2C-bus register value KD7 to KD0. Controlled  
by KMOD2 to KMOD0 bits, there are 4 ways to compare  
the pixel data (see Table 5).  
PIXEL BYTE SEQUENCE OF RGB  
INPUT  
5 : 6 : 5  
UV7  
G0  
R4  
R3  
R2  
R1  
R0  
G5  
G4  
G3  
G2  
G1  
B4  
B3  
B2  
B1  
B0  
0
G0  
R4  
R3  
R2  
R1  
R0  
G5  
G4  
G3  
G2  
G1  
B4  
B3  
B2  
B1  
B0  
1
G0  
R4  
R3  
R2  
R1  
R0  
G5  
G4  
G3  
G2  
G1  
B4  
B3  
B2  
B1  
B0  
2
G0  
R4  
R3  
R2  
R1  
R0  
G5  
G4  
G3  
G2  
G1  
B4  
B3  
B2  
B1  
B0  
3
UV6  
UV5  
UV4  
UV3  
UV2  
UV1  
UV0  
YUV7  
YUV6  
YUV5  
YUV4  
YUV3  
YUV2  
YUV1  
YUV0  
RGB data  
Table 5 KMOD2 to KMOD0  
KMOD2  
to  
PIXEL TYPE  
REMARK  
KMOD0  
100  
101  
8-bit pixel  
pseudo colour mode  
2 × 8-bit pixel  
high colour mode 1 with  
pixels given at both rising  
and falling edges of PCLK  
110  
111  
2 × 8-bit pixel  
3 × 8-bit pixel  
high colour mode 2 with  
pixels given only at rising  
edges of PCLK  
For RGB 5 : 6 : 5 video inputs, the video data are just  
directly bypassed to triple DACs.  
The input video data can be selected to either two’s  
complement (I2C-bus DRP-bit = 0) or binary offset  
(DRP-bit = 1). The video input format is selected by  
I2C-bus bits FMTC1 and FMTC0.  
true colour mode  
Since only one control register KD7 to KD0 provides the  
data value for pixel data comparison, when at 2 × 8-bit or  
3 × 8-bit pixel input modes, it is presumed that all input  
bytes (lower, middle, or higher) of each pixel must be same  
as KD7 to KD0 in order to make graphics colour key  
active.  
The rising edge of HREF input defines the start of active  
video data. When HREF is inactive, the video output will be  
blanked.  
YUV-TO-RGB MATRIX  
The polarity of EXTKEY can be selected with KINV. With  
KINV = 0, EXTKEY = HIGH switches analog mixers to  
select DAC outputs. Before the internal keying signal  
switches the analog multiplexers, it can be further delayed  
up to 7 PCLK cycles with the control bits  
The matrix converts YUV data, in accordance with  
CCIR-601, to RGB data with approximately 1.5 LSB  
deviation to the theoretical values for 8-bit resolution.  
TRIPLE 8-BIT DACS  
KDLY2 to KDLY0.  
Three identical DACs for R, G and B video outputs are  
designed with voltage-drive architecture to provide  
high-speed operation of up to 50 MHz conversion data  
rate. A Cref(h) pin is provided to allow for one external  
de-coupling capacitor to be connected between the  
internal reference voltage source and ground.  
1995 Nov 03  
7
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
With the digital input YUV video data in accordance with  
CCIR-601, the RGB output of 8-bit DAC actually ranges  
from the 16th step (black) to the 235th step (white).  
Therefore, after the voltage divider with external serial  
resistor and monitor load resistor, the output voltage range  
to monitor is approximately 0.7 V (peak-to-peak).  
Voltage output amplifiers  
Before the analog input enters the analog mixers, it passes  
through voltage output amplifiers. Level shifters are used  
internally to provide an offset of 0.2 V and an amplifier gain  
of 2 for analog inputs to match with the output levels from  
DACs. After buffering with voltage output amplifiers, the  
final RGB outputs can drive a 150 load directly (25 Ω  
internal resistor, 50 external serial resistor, and 75 Ω  
load resistor at monitor side (see Fig.9).  
I2C-bus control  
Only one control byte is needed for the SAA7167.  
The I2C-bus format is shown in Table 6.  
The output voltage level of DAC ranges from the lowest  
level 0.2 V (zero code) to the highest level 1.82 V (all one  
code).  
Table 6 I2C-bus format  
S
slave address  
A
subaddress  
A
data  
A
P
Notes  
1. S = START condition.  
2. Slave address = 1011 111X; this slave address is identical to the one for the SAA9065; X = R/W control bit:  
a) X = 0; order to write.  
b) X = 1; order to read (not used for SAA7167).  
3. A = acknowledge; generated by the slave.  
4. Subaddress = subaddress byte.  
5. Data = data byte.  
6. P = STOP condition.  
Table 7 Control data byte  
SUBADDRESS  
D7  
KMOD2  
0
D6  
KMOD1  
0
D5  
KMOD0  
0
D4  
DRP  
0
D3  
KEN  
0
D2  
KINV  
KDLY2  
KD2  
D1  
D0  
00  
01  
02  
FMTC1  
KDLY1  
KD1  
FMTC0  
KDLY0  
KD0  
KD7  
KD6  
KD5  
KD4  
KD3  
1995 Nov 03  
8
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
Table 8 Bit functions in data byte; notes 1 and 2  
BIT  
DESCRIPTION  
FMTC1 and FMTC0  
video format control:  
00; YUV 4 : 2 : 2  
01; YUV 4 : 1 : 1  
10; YUV 2:1:1/CCIR 656  
11; RGB 5 : 6 : 5  
key polarity:  
KINV  
KEN  
KINV = 0: EXTKEY = HIGH for analog mixer to select DAC outputs  
KINV = 1: EXTKEY = HIGH for analog mixer to select analog RGB inputs  
key enable:  
0 = disable  
1 = enable  
DRP  
UV input data code: 0 = two’s complement; 1 = binary offset  
keying mode:  
KMOD2 to KMOD0  
000; external key  
100; 8-bit pixel colour key  
101; 2 × 8-bit pixel colour key (with two-edge clock latching for pixel input)  
110; 2 × 8-bit pixel colour key (with one-edge clock latching for pixel input)  
111; 3 × 8-bit pixel colour key (with one-edge clock latching for pixel input)  
all other combinations are reserved  
KDLY2 to KDLY0  
KD7 to KD0  
added keying delay cycles (from 0 to 7 PCLK)  
the data value compared for 8, 16 or 24-bit pixel colour key  
Notes  
1. All I2C-bus control bits are initialized to logic 0 after RES is activated.  
2. PCLK should be active in any event to allow for correct operation of I2C-bus programming.  
DC CHARACTERISTICS  
Tamb = 0 to 70 °C.  
SYMBOL  
VDDD  
PARAMETER  
digital supply voltage  
MIN.  
4.75  
TYP.  
5.0  
MAX.  
5.25  
UNIT  
V
V
VDDA  
IDDtot  
VIH  
analog supply voltage  
4.75  
5.0  
100  
5.25  
total supply current (fclk = 50 MHz)  
HIGH level input voltage (pin SDA)  
LOW level input voltage (pin SDA)  
HIGH level digital input voltage  
mA  
V
3
VDDD + 0.5  
VIL  
0.5  
2
+1.5  
V
VIH  
V
VIL  
LOW level digital input voltage  
0.8  
V
Vin  
full-scale analog RGB inputs  
0.7  
1.4  
V
Vout  
DNL  
INL  
full scale analog RGB outputs (for 150 load)  
differential non-linearity error of video output  
integral non-linearity error of video output  
V
1
LSB  
LSB  
1
1995 Nov 03  
9
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
AC CHARACTERISTICS  
Tamb = 0 to 70 °C.  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
50  
UNIT  
MHz  
fclk  
video clock rate  
δ
duty factor of VCLK  
50  
%
PCLK  
pixel clock rate (8-bit pixel colour key); see Fig.4  
50  
40  
MHz  
MHz  
pixel clock rate (2 × 8-bit pixel colour key; mode 1);  
see Fig.5  
pixel clock rate (2 × 8-bit pixel colour key; mode 2);  
80  
MHz  
see Fig.6  
pixel clock rate (3 × 8-bit pixel colour key); see Fig.7  
duty factor of PCLK  
40  
3
75  
60  
MHz  
%
50  
tsu1  
th1  
tsu2  
th2  
tsu3  
th3  
digital input set-up time to VCLK rising edge  
digital input hold time to VCLK rising edge  
digital input set-up time to PCLK rising edge  
digital input hold time to PCLK rising edge  
digital input set-up time to PCLK falling edge  
digital input hold time to PCLK falling edge  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
3
3
3
3
3
tsw  
switching time between video DAC/analog inputs;  
note 1  
15  
Tgroup  
overall group delay from digital video inputs to analog  
outputs (see Fig.8):  
YUV video input mode  
20TVCLK + tPD  
ns  
ns  
ns  
ns  
ns  
ns  
RGB video input mode  
12TVCLK + tPD  
tr  
DAC analog output rise time (see Fig.8); note 2  
DAC analog output fall time (see Fig.8); note 2  
DAC analog output settling time (see Fig.8); note 3  
5
tf  
5
ts  
15  
tPD  
DAC analog output propagation delay (see Fig.8);  
note 4  
15  
Analog outputs from analog inputs  
Gv  
B
voltage gain  
bandwidth (3 dB)  
slew rate  
2.0  
75  
90  
MHz  
SR  
V/µs  
Notes  
1. Switching time measured from the 50% point of the EXTKEY transition edge to the 50% point of the selected analog  
output transition.  
2. DAC output rise/fall time measured between the 10% and 90% points of full scale transition.  
3. DAC settling time measured from the 50% point of full-scale transition to the output remaining within ±1 LSB.  
4. DAC analog output propagation delay measured from the 50% point of the rising edge of VCLK to the 50% point of  
full-scale transition.  
1995 Nov 03  
10  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
VCLK  
t
su1  
HREF  
t
h1  
YUV  
t
su1  
UV  
MGB745  
Fig.3 Video data input timing.  
h
PCLK  
t
su2  
t
h2  
P7 to P0  
pixel 1  
pixel 2  
pixel 3  
pixel 4  
pixel 5  
pixel 6  
pixel 7  
MGB746  
Fig.4 Pixel data timing; 8-bit pixel colour key.  
11  
1995 Nov 03  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
PCLK  
t
t
su2  
su3  
t
t
h2  
h3  
P7 to P0  
pixel 1  
pixel 2  
pixel 3  
MGB747  
Fig.5 Pixel data input timing; 2 × 8-bit pixel colour key; mode 1.  
h
PCLK  
t
su2  
t
h2  
P7 to P0  
pixel 1  
pixel 2  
pixel 3  
MGB748  
Fig.6 Pixel data input timing; 2 × 8-bit pixel colour key; mode 2.  
1995 Nov 03  
12  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
h
PCLK  
t
su2  
t
h2  
P7 to P0  
MGB749  
pixel 1  
pixel 2  
Fig.7 Pixel data input timing; 3 × 8-bit pixel colour key.  
h
VCLK  
T
group  
YUV and UV  
(full-scale transition)  
t
s
t
PD  
Rout, Bout and Gout  
MGB750  
t ; t  
r
f
Fig.8 DAC output timing.  
13  
1995 Nov 03  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
APPLICATION INFORMATION  
digital YUV video data inputs  
8
38 to 45  
C
ref(h)  
36  
YUV7 to YUV0  
UV7 to UV0  
8
0.1 µF  
46 to 48,  
1 to 5  
to PC monitor  
47 Ω  
analog inputs from VGA  
Rin  
Gin  
Bin  
32  
30  
28  
33  
Rout  
75 Ω  
75 Ω  
75 Ω  
75 Ω  
SAA7167  
47 Ω  
Gout  
31  
29  
75 Ω  
75 Ω  
47 Ω  
Bout  
cable  
monitor side  
MGB751  
Fig.9 Typical application diagram for analog circuits.  
1995 Nov 03  
14  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
PACKAGE OUTLINE  
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm  
SOT313-2  
c
y
X
36  
25  
A
E
37  
24  
Z
E
Q
e
H
E
A
2
A
(A )  
3
A
1
w M  
p
θ
pin 1 index  
b
L
p
L
13  
48  
detail X  
1
12  
Z
v M  
D
A
e
w M  
b
p
D
B
H
v M  
B
D
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.  
7o  
0o  
0.20 1.45  
0.05 1.35  
0.27 0.18 7.1  
0.17 0.12 6.9  
7.1  
6.9  
9.15 9.15  
8.85 8.85  
0.75 0.69  
0.45 0.59  
0.95 0.95  
0.55 0.55  
1.60  
mm  
0.25  
0.5  
1.0  
0.2 0.12 0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
93-06-15  
94-12-19  
SOT313-2  
1995 Nov 03  
15  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
If wave soldering cannot be avoided, the following  
conditions must be observed:  
SOLDERING  
Introduction  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave)  
soldering technique should be used.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
The footprint must be at an angle of 45° to the board  
direction and must incorporate solder thieves  
downstream and at the side corners.  
Even with these conditions, do not consider wave  
soldering LQFP packages LQFP48 (SOT313-2),  
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all LQFP  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
Wave soldering  
Wave soldering is not recommended for LQFP packages.  
This is because of the likelihood of solder bridging due to  
closely-spaced leads and the possibility of incomplete  
solder penetration in multi-lead devices.  
1995 Nov 03  
16  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
1995 Nov 03  
17  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
NOTES  
1995 Nov 03  
18  
Philips Semiconductors  
Preliminary specification  
YUV-to-RGB Digital-to-Analog  
Converter (DAC)  
SAA7167  
NOTES  
1995 Nov 03  
19  
Philips Semiconductors – a worldwide company  
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)  
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367  
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106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474  
Tel. (02)805 4455, Fax. (02)805 4466  
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,  
Tel. (01)60 101-1236, Fax. (01)60 101-1211  
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Portugal: PHILIPS PORTUGUESA, S.A.,  
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,  
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Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. (65)350 2000, Fax. (65)251 6500  
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Tel. (31)40-2783749, Fax. (31)40-2788399  
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,  
CEP: 04552-903-SÃO PAULO-SP, Brazil.  
P.O. Box 7383 (01064-970),  
195-215 Main Road Martindale, 2092 JOHANNESBURG,  
P.O. Box 7430, Johannesburg 2000,  
Tel. (011)470-5911, Fax. (011)470-5494  
Tel. (011)821-2333, Fax. (011)829-1849  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:  
Tel. (800) 234-7381, Fax. (708) 296-8556  
Chile: Av. Santa Maria 0760, SANTIAGO,  
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Tel. (03)301 6312, Fax. (03)301 42 43  
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,  
Tel. (0)8-632 2000, Fax. (0)8-632 2745  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. (02)773 816, Fax. (02)777 6730  
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77621 BOGOTA, Tel. (571)249 7624/(571)217 4609,  
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Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
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Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,  
Denmark: Prags Boulevard 80, PB 1919, DK-2300  
COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. (358)0-615 800, Fax. (358)0-61580 920  
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252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991  
United Kingdom: Philips Semiconductors LTD.,  
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,  
Tel. (0181)730-5000, Fax. (0181)754-8421  
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Greece: No. 15, 25th March Street, GR 17778 TAVROS,  
Tel. (01)4894 339/4894 911, Fax. (01)4814 240  
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Dr. Annie Besant Rd. Worli, Bombay 400 018  
Tel. (022)4938 541, Fax. (022)4938 722  
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P.O. Box 4252, JAKARTA 12950,  
Tel. (02)70-4044, Fax. (02)92 0601  
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Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. (01)7640 000, Fax. (01)7640 200  
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Piazza IV Novembre 3, 20124 MILANO,  
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557  
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,  
Tel. (03)3740 5130, Fax. (03)3740 5077  
Korea: Philips House, 260-199 Itaewon-dong,  
Internet: http://www.semiconductors.philips.com/ps/  
For all other countries apply to: Philips Semiconductors,  
International Marketing and Sales, Building BE-p,  
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,  
Telex 35000 phtcnl, Fax. +31-40-2724825  
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,  
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,  
Tel. 9-5(800)234-7381, Fax. (708)296-8556  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. (040)2783749, Fax. (040)2788399  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
SCD45  
© Philips Electronics N.V. 1995  
All rights are reserved. Reproduction in whole or in part is prohibited without the  
prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation  
or contract, is believed to be accurate and reliable and may be changed without  
notice. No liability will be accepted by the publisher for any consequence of its  
use. Publication thereof does not convey nor imply any license under patent- or  
other industrial or intellectual property rights.  
Tel. (09)849-4160, Fax. (09)849-7811  
Norway: Box 1, Manglerud 0612, OSLO,  
Printed in The Netherlands  
Tel. (022)74 8000, Fax. (022)74 8341  
Pakistan: Philips Electrical Industries of Pakistan Ltd.,  
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,  
KARACHI 75600, Tel. (021)587 4641-49,  
Fax. (021)577035/5874546  
483061/1100/01/pp20  
Date of release: 1995 Nov 03  
9397 750 00416  
Document order number:  

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