SAA9740H_技术文档

INTEGRATED CIRCUITS

DATA SHEET

SAA9740H

Advanced Auto Control Function

(A2CF)

1996 Oct 10

Product speciﬁcation

Supersedes data of 1996 Jan 30

File under Integrated Circuits, IC02

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

FEATURES

Auto Exposure features

• 5 windows accumulation

• One chip full digital Auto Focus (AF), Auto Exposure

(AE) and Auto White Balance (AWB)

• Calculation of white-clip by centre window

• Possible to use NTSC and PAL CCD with horizontal

resolution of 510, 670, 720 or 768 pixels

• Possible to control size and place of the centre windows

by the light condition with microprocessor.

• No manual adjustment

Auto White Balance features

• One microprocessor system commonly used with

CAMera Digital Signal Processor (CAMDSP)

SAA9750H

• Mono colour detection

• Accumulation of UV data in the corresponding UV

• 8-bit parallel microprocessor interface

• LQFP64 package (0.5 mm pitch)

• Single 3 V power supply.

quadrant

• Green and Magenta elimination gate

• Luminance gate for detecting white

• UV limiter

Auto Focus features

• White-clip detection/counter.

• Video AF system

• Two windows system (a small centre and large window)

GENERAL DESCRIPTION

• The window size and place are microprocessor

The Advanced Auto Control Function (A2CF) is to be used

for a colour CCD camera system. This IC can realize AWB,

AF and AE with a microprocessor. This device consists of

an input data selector, a parallel 8-bit microprocessor

interface, a data accumulator, a window generator, a

command decoder and AWB, AF, AE for each processing

block.

controlled

• Including 5^thorder IIR digital high-pass filter

• Line peak accumulation in the large window

• High-pass filter’s output accumulation in one field.

QUICK REFERENCE DATA

SYMBOL

V_DD

PARAMETER

digital supply voltage (pins 6, 18 and 47)

LOW level digital input voltage

HIGH level digital input voltage

LOW level digital output voltage

HIGH level digital output voltage

operating ambient temperature

MIN.

2.7

TYP.

3.0

MAX.

3.3

UNIT

V

V_IL

0

−

0.3V_DD

V_DD

0.5

V_IH

0.7V_DD

V_OL

V_OH

T_amb

−

V_DD− 0.5 −

−

−20

−

+70

°C

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

SAA9740H

LQFP64 plastic low proﬁle quad ﬂat package; 64 leads; body 10 × 10 × 1.4 mm

SOT314-2

1996 Oct 10

2

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

PINNING

SYMBOL

TYPE

DESCRIPTION

Y3

1

input

−

Y input from SAA9750H (CAMDSP) (LSB)

input pin for test

TSTIN1

TSTIN2

TSTIN3

TST1

V_DD1

2

3

input pin for test

4

input pin for test

5

input pin for test

6

digital supply voltage

V_SS1

7

−

ground

UV_SEL

UV0

8

input

−

UV select input from SAA9750H (CAMDSP)

UV input from SAA9750H (CAMDSP) (LSB)

UV input from SAA9750H (CAMDSP)

UV input from SAA9750H (CAMDSP) (MSB)

white-clip input from SAA9750H (CAMDSP)

digital supply voltage

9

UV1

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

UV2

UV3

UV4

UV5

UV6

UV7

WCLIP

V_DD2

V_SS2

−

ground

IO7

bidirectional

input

microprocessor interface (MSB)

microprocessor interface

IO6

IO5

microprocessor interface

IO4

microprocessor interface

IO3

microprocessor interface

IO2

microprocessor interface

IO1

microprocessor interface

IO0

microprocessor interface (LSB)

system reset

RSTB

RDB

input

read control from microprocessor

write control from microprocessor

address set from microprocessor

window interrupt

WRB

ASTB

WDINT

VD

input

output

input

V-drive signal input

HD

input

H-drive signal input

HSYNC

WDMNT

LWDB

TSTOUT6

TSTOUT7

CLK2OUT

input

HSYNC input

output

window monitor for test (open-drain)

large window for test (open-drain)

output pin for test

output

output pin for test

output

output pin of internal clock (open-drain)

1996 Oct 10

4

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

SYMBOL

TSTOUT1

TYPE

output

DESCRIPTION

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

output pin for test

ground

TSTOUT2

TSTOUT3

TSTOUT4

TSTOUT5

V_SS3

output

−

V_DD3

−

digital supply voltage

clock

CLK1

V_SS4

input

−

ground

CDS0

CDS1

CDS2

CDS3

CDS4

CDS5

CDS6

CDS7

SCAN_T

V_SS5

input

−

CDS input from ADC (LSB)

CDS input from ADC

CDS input from ADC (MSB)

test control for scan test

ground

AMSAL

Y7

input

for testing

Y input from SAA9750H (CAMDSP) (MSB)

Y input from SAA9750H (CAMDSP)

Y6

Y5

Y4

1996 Oct 10

5

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

handbook, full pagewidth

1

48

47

46

CLK1

Y3

V

2

3

4

5

6

7

8

9

TSTIN1

TSTIN2

TSTIN3

TST1

DD3

SS3

45 TSTOUT5

44

43

42

41

40

39

38

37

TSTOUT4

TSTOUT3

V

DD1

V

TSTOUT2

TSTOUT1

CLK2OUT

SS1

UV_SEL

UV0

SAA9740H

UV1 10

UV2 11

TSTOUT7

TSTOUT6

LWDB

12

13

14

UV3

UV4

UV5

36 WDMNT

35

34

HSYNC

HD

UV6 15

UV7

16

33 VD

MHA285

Fig.2 Pin configuration.

6

1996 Oct 10

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

This maximum focus value is accumulated in the AF

FUNCTIONAL DESCRIPTION

window (see Fig.3) by the 18-bit adder. The values in the

large window are stored in REG2 (see Table 7) and those

in the small window are stored in REG3 (see Table 7).

Which data is used is dependent on the software (see

Tables 6 and 7). Besides this accumulation, line peak

accumulation is also done. This data is the maximum value

in one field and is stored in REG0 (see Table 7).

The Advanced Auto Control Function (A2CF) will be used

for colour CCD camera systems.

The input signals are CDS (AF data) from 8-bit ADC,

Y (for AE, 5-bit) and UV (for AWB, 8-bit) data as the output

of SAA9750H (CAMDSP) and they are fed into the A2CF.

After being processed in the A2CF, corresponding data

are led into the microprocessor.

AE system

Together with the zoom encoder and focus sensor output

the microprocessor does the following control with the data

of A2CF:

handbook, halfpage

active video

• Control focus motor

• Control iris, AGC (via DAC) and high speed shutter

1

• Send the control data to SAA9750H (CAMDSP) via

serial bus.

2

3

5

4

CLK1 is depending on the CCD type. To cope with the

different CCD clocks, some reference data have to be set

by the microprocessor.

MHA288

AF system

Fig.4 AE window.

handbook, halfpage

active video

5-bit Y signals Y7 to Y3 which come from SAA9750H are

fed into A2CF for AE processing. This signal is internally

extended to 6 bits by adding a ‘0’ as new MSB. Next they

go through an LPF and they are down sampled in the

same way as AF processing. In order to prevent overflow

of the 18-bit adder block, 2 modes exist (see Table 4).

The first is H decimation is on or off. If H decimation is on,

then the data for AE processing is available in every other

line. The second mode is that the data for AE processing

is shifted to ¹⁄₂or not. If the data is shifted to ¹⁄₂, it is done

before down sampling and before the data going to the

18-bit adder becomes ¹⁄₂. Both these modes are controlled

by the microprocessor. In AE mode there are 5 windows

as shown in Fig.4. These windows are controlled by the

microprocessor. The accumulation data in window 1 to

window 5 is respectively stored in REG1 to REG5 (see

Table 7). The white-clip count data in the centre window is

stored to the lower 5 bits of REG0 (see Table 7).

large window

centre

window

MHA287

Fig.3 AF window.

Digital CDS signals CDS7 to CDS0 which come after

AGC, gamma processing and ADC are fed into A2CF.

This 8-bit data is shifted to the most suitable 6-bit data for

AF processing by microprocessor. For example, when the

MSB of them is ‘1’ then the 6-bit data is shifted by the

microprocessor to CDS7 to CDS2

(not CDS6 to CDS1 or CDS5 to CDS0; see Table 4). After

AF shifting the signals go through an LPF and they are

down sampled. The down sampling is done by CLK2

(CLK1/2). In order to detect the high frequency component

for AF processing, one HPF is added. This output is the

focus value. Next peak hold block is for acquiring

maximum focus value of every line in one field.

The upper 3 bits of REG0 is the overflow information in the

18-bit adder (see Table 7).

1996 Oct 10

7

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

mode (see Table 4) is for detecting whether the picture is

mono colour or not. If the AWB (B − Y) or AWB (R − Y) or

AWB (∆) (see Table 4) mode is active and white-clip or

AWB limited (as mentioned above), then the counts of

them are stored in the lower 5 bits of REG0 (see Table 7).

In the AWB Y mode the lower 4 bits of REG0 are contrast

peak data in one field and the 4th bit is the overflow

information of the AF (see Table 7).

AWB system

8-bit UV signals UV[7] to UV[0] which come from the

SAA9750H (CAMDSP) are fed into the A2CF for AWB

processing. First the 8-bit data is limited to 6-bits because

the necessary data for AWB processing is around the

white colour signal. Then these signals go through an LPF

and they are down sampled. They are separated to U and

V signals by using UV_SEL coming from SAA9750H

(CAMDSP). As shown in Table 1, in the large window

these signals are compared with the threshold that is set

by the microprocessor. If the conditions shown in Fig.8 are

valid, the data is available for AWB processing. If the

conditions aren’t valid, the data is ignored. The available

data in the first to the 4th quadrant are stored in

Microprocessor interface

8-bit data bus and 3 control ports are prepared (WRB,

RDB and ASTB) for microprocessor interface in A2CF for

quick data access instead of serial bus. A2CF has 11 read

commands and 13 write commands.

respectively REG1 to REG4 (see Table 7). The AWB (∆)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER

V_DD

MIN.

−0.5

MAX.

+5.0

UNIT

supply voltage

V

P_tot

V_I

total power dissipation

input voltage

−

83

mW

V

−0.5

−65

−20

−2000

100

V_DD+ 0.5

+150

+70

V_O

output voltage

V

T_stg

T_amb

V_es

storage temperature

°C

V

operating ambient temperature

electrostatic handling; note 1

latch-up protection

+2000

−

LTCH

mA

Note

1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

1996 Oct 10

8

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

DC CHARACTERISTICS

T

_amb= −20 to +70 °C; V_DD= 2.7 to 3.3 V; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS

I_DDsupply current note 1

MIN.

TYP.

12

MAX.

25

UNIT

mA

−

Input pins (TSTIN1 to TSTIN3, TST1, UV_SEL, UV0 to UV7, Y3 to Y7, WCLIP, RSTB, RDB, WRB, ASTB, VD, HD,

HSYNC, CLK1, CDS0 to CDS7, SCAN_T and AMSAL)

V_IH

V_IL

I_IH

HIGH level input voltage

LOW level input voltage

HIGH level input current

LOW level input current

0.7V_DD

−

V

−

0.3V_DD

V

V_IH= V_DD

V_IL= V_SS

1

µA

I_IL

−1

Output pins (WDINT and TSTOUT1 to TSTOUT7; push pull output)

V_OH

HIGH level output voltage

I_OH= −20 µA

_OH= −4 mA

I_OL= +20 µA

_OL= +4 mA

Output pins (WDMNT, LWDB and CLK2OUT; open-drain)

V

−

_DD− 0.1 −

−

V

I

_DD− 0.5 −

−

V_OL

LOW level output voltage

−

0.1

0.5

I

V_OL

LOW level output voltage

I_OL= +20 µA

I_OL= +4 mA

V_O= V_DD

−

0.1

0.5

5

V

I_OZ

3-state leakage current

µA

Bidirectional pins (IO0 to IO7)

V_OHHIGH level output voltage

I_OH= −20 µA

V

−

_DD− 0.1 −

−

V

I

_OH= −8 mA

I_OL= +20 µA

_OL= +8 mA

_DD− 0.5 −

−

V

V_OL

LOW level output voltage

−

0.1

0.5

−

V

I

V

V_IH

V_IL

I_IH

HIGH level input voltage

LOW level input voltage

HIGH level input current

LOW level input current

3-state leakage current

0.7V_DD

−

V

−

0.3V_DD

1

V

V_IH= V_DD

µA

I_IL

V_IL= V_SS

−1

I_OZ

V_O= V_DDor V_SS

±5

Note

1. 510H PAL; V_DD= 3 V; all modes active.

1996 Oct 10

9

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

AC CHARACTERISTICS

Microprocessor interface

T_amb= −20 to +70 °C; V_DD= 2.7 to 3.3 V; V_IL= 0 V; V_IH= V_DD; V_ref= 0.5V_DD; input t_rand t_f= 30 ns; see Fig.5; unless

otherwise speciﬁed.

SYMBOL

PARAMETER

CONDITIONS

MIN.

0.4

TYP.

MAX.

UNIT

µs

t_suAD

t_hAD

t_AR

address setup time

address hold time

ASTB to RDB time

RDB width

−

0.4

0.5

1.0

−

µs

t_{W R}

t_RRD

t_hRRD

t_AW

RDB to read data

R_L= 1 kΩ

0.8

0.1

−

RDB to read data hold time R_L= 1 kΩ

ASTB to WRB time

WRB width

−

0.5

1.0

0.4

t_{W W}

t_suW

t_hW

−

WRB setup time

−

WRB hold time

−

V

handbook, full pagewidth

IO7 to IO0

IH

90%

10%

address

10%

read data

write data

V

IL

t

suAD

t

RRD

hRRD

t

hAD

IH

90%

50%

10%

ASTB

V

IL

t

f

r

t

W R

AR

IH

RDB

50%

V

IL

t

hW

suW

t

AW

W W

IH

WRB

50%

V

IL

MHA292

Fig.5 Microprocessor interface timing.

10

1996 Oct 10

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

Data input/output timing (CLK1)

T_amb= −20 to +70 °C; V_DD= 2.7 to 3.3 V; V_IL= 0 V; V_IH= V_DD; V_ref= 0.5V_DD; t_rand t_f= 6 ns; output load

capacitance = 20 pF; unless otherwise speciﬁed.

SYMBOL

t_suDI

PARAMETER

data input setup time

data input hold time

data output delay time

data output hold time

width of CLK1

CONDITIONS

MIN.

TYP.

MAX.

UNIT

ns

note 1

5

8

−

t_hDI

ns

%

t_dDO

notes 2 and 3

60

−

t_hDO

t_{W CLK1}

50

Notes

1. Data inputs: UV0 to UV7, Y3 to Y7, AD0 to AD7, UV_SEL, HSYNC, HD, VD and WCLIP.

2. Data outputs: WDINT, CLK2OUT, WDMNT and LWDB (open-drain outputs with 1 kΩ output load resistor).

3. T_amb= 25 °C; V_DD= 3.0 V.

t

r

handbook, full pagewidth

CLK1

f

W CLK1

V

IH

90%

V

ref

10%

V

IL

t

suDI

hDI

IH

90%

data inputs

10%

V

IL

t

dDO

IH

90%

(1)

data outputs

10%

V

IL

MHA291

(1) 50% for open-drain outputs.

Fig.6 Data input/output timing (CLK1).

1996 Oct 10

11

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

MICROPROCESSOR COMMANDS

Table 1 Write commands; note 1

DATA

COMMAND

FUNCTION

IO7

IO6

IO5

IO4

X1[4]

IO3

IO2

X1[2]

IO1

X1[1]

IO0

81H⁽²⁾

82H⁽²⁾

83H⁽²⁾

84H⁽²⁾

85H⁽²⁾

86H⁽²⁾

87H⁽²⁾

88H⁽²⁾

8BH

X

X1[5]

X2[5]

X3[5]

X4[5]

Y1[5]

Y2[5]

Y3[5]

Y4[5]

X1[3]

X2[3]

X3[3]

X4[3]

Y1[3]

Y2[3]

Y3[3]

Y4[3]

X

X1[0]

X2[0]

X3[0]

X4[0]

Y1[0]

Y2[0]

Y3[0]

Y4[0]

IIRC0

THA[0]

THC[0]

MODE0

PVD

X1 address

X2 address

X3 address

X4 address

Y1 address

Y2 address

Y3 address

Y4 address

IIRC

X2[4]

X3[4]

X4[4]

Y1[4]

Y2[4]

Y3[4]

Y4[4]

X2[2]

X3[2]

X4[2]

Y1[2]

Y2[2]

Y3[2]

Y4[2]

IIRC2

X2[1]

X3[1]

X4[1]

Y1[1]

Y2[1]

Y3[1]

Y4[1]

TEST2 TEST1 TEST0

IIRC1

THA[1]

THC[1]

MODE1

PHD

8CH

THB[3] THB[2] THB[1] THB[0]

THA[3] THA[2]

THC[3] THC[2]

TH1

8DH

X

TH2

8EH

SFTY

X

SFT1

SIZE

SFT0

HON

X

MODE2

PHS

MODE

8FH

MWD1 MWD0

SET

Notes

1. X = don’t care.

2. For auto exposure processing different windows in the active video field are taken with different weighting factors.

The coordinates of the five windows are set according to Fig.7. The resolution is 1 bit ≡ 16 pixel in x-direction and

1 bit ≡ 8 lines in y-direction.

handbook, halfpage

0/0

active video

X3/Y3

WIN1

X1/Y1

WIN2

WIN3

WIN5

WIN4

X2/Y2

X4/Y4

MHA289

Fig.7 Window size control for AE processing

(see WRITE command 81H to 88H).

1996 Oct 10

12

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

Address 8BH

Table 2 IIRC (IO[2] to IO[0])

IIRC2

IIRC1

IIRC0

FUNCTION

1 MHz HPF select for auto focus processing

700 kHz HPF select for auto focus processing

220 kHz HPF select for auto focus processing

bypass HPF for auto focus processing

0

1

0

1

0

1

0

1

0

110 kHz select for auto focus processing

Table 3 IIRC 9IO[6] to 9IO[4]; note 1

TEST2

TEST1

TEST0

FUNCTION

X

only for test purposes

Note

1. X = don’t care.

Address 8CH and 8DH

Address 8CH and 8DH are used to define the active range that is taken for auto white balance processing.

The calculation of active area can be seen in Fig.8.

handbook, full pagewidth

R−Y (V)

THB

THA

−THA

B−Y (U)

−THB

Conditions:

(1) U + V < THA.

(2)

V < THB.

MHA290

(3) Y > THC.

Threshold values can be set with 4-bit resolution.

Fig.8 Set threshold values for Auto White Balance (AWB) mode.

13

1996 Oct 10

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

Address 8EH

By applying address 8EH and setting the MODE bits it is possible to read the values that are stored in the registers

corresponding to the selected mode. The selection which register will be read is then defined by READ address

70H to 7BH (see Tables 6 and 7).

Table 4 MODE and shift deﬁnition (see WRITE command 8EH); note 1

IO7

IO6

IO5

IO4

IO3

IO2

IO1

IO0

MODE

FUNCTION

SFTY SFT1 SFT0

−

HON MODE MODE MODE

X

0

X

0

X

0

1

0

1

0

1

0

1

0

1

0

1

AE

AF

set mode: read AE values

set mode: read AF values

AWB (B − Y) set mode: read AWB (B − Y) values

AWB (R − Y) set mode: read AWB (R − Y) values

AWB ∆

AWB Y

H dec

set mode: read AWB ∆ values

set mode: read AWB Y values

decimation for 1H off

1

H dec

decimation for 1H on

X

AF shift

select CDS5 to CDS0 for AF

processing

X

0

1

X

1

X

0

1

0

AF shift

AE shift

select CDS6 to CDS1 for AF

processing

select CDS7 to CDS2 for AF

processing

take AE[5] to AE[0] for internal AE

processing (see Chapter

“Functional description”)

1

X

0

AE shift

take AE[5] to AE[1] for internal AE

processing (see Chapter

“Functional description”)

Note

1. X = don’t care.

1996 Oct 10

14

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

Address 8FH

To apply several types of CCDs it is possible to set polarity VD, HD and HSYNC by PVD, PHD and PHS.

The modes set by MWD and SIZE bit are only used for system evaluation. During normal application mode they can have

any value.

Table 5 Settings (see WRITE command 8FH); note 1

IO7

IO6

IO5

IO4

IO3

IO2

IO1

IO0

MODE

FUNCTION

VD ‘H’ active

−

SIZE

MWD1 MWD0

−

PHS

PHD

PVD

X

0

X

0

X

0

X

0

X

0

1

PVD

VD ‘L’ active

X

PHD

HD ‘H’ active

1

PHD

HD ‘L’ active

X

PHSYNC

MWD AE

MWD AF

MWD AWB

MWD ALL

MWD SMALL

MWD LARGE

HSYNC ‘H’ active

HSYNC ‘L’ active

monitor AE window

monitor AF window

monitor AWB window

monitor all windows

monitor small window

monitor large window

1

X

0

1

0

1

X

1

Note

1. X = don’t care.

READ commands

The values of the internal registers can be read as follows:

1. Set mode AF, AE or AWB by WRITE command 8EH according to Table 4.

2. Select register by READ command 70H to 7BH according to Table 6.

Table 6 Read command

DATA

COMMAND

FUNCTION

IO7

IO6

IO5

IO4

IO3

IO2

IO1

O[9]

IO0

70H

71H

72H

73H

74H

75H

76H

77H

78H

79H

7BH

O[15]

O[7]

O[14]

O[6]

O[13]

O[5]

O[12]

O[4]

O[11]

O[3]

O[10]

O[2]

O[8]

O[0]

O[8]

O[0]

O[8]

O[0]

O[8]

O[0]

O[8]

O[0]

REG1

REG2

REG3

REG4

REG5

REG0

O[1]

O[9]

O[1]

O[9]

O[1]

O[9]

O[1]

O[9]

O[1]

O[15]

O[7]

O[14]

O[6]

O[13]

O[5]

O[12]

O[4]

O[11]

O[3]

O[10]

O[2]

O[15]

O[7]

O[14]

O[6]

O[13]

O[5]

O[12]

O[4]

O[11]

O[3]

O[10]

O[2]

O[15]

O[7]

O[14]

O[6]

O[13]

O[5]

O[12]

O[4]

O[11]

O[3]

O[10]

O[2]

O[15]

O[7]

O[14]

O[6]

O[13]

O[5]

O[12]

O[4]

O[11]

O[3]

O[10]

O[2]

O[7]

O[6]

O[5]

O[4]

O[3]

O[2]

1996 Oct 10

15

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

Register assignment

For the different modes (AF, AE and AWB) the contents of the registers are assigned according to Table 7.

Table 7 Register assignment

MODE

REGISTER

DATA

FUNCTION

AF

REG0 (8-bit)

O[7] to O[5] n.a.

O[4]

overﬂow information of AF block

O[3] to O[0] contrast peak within one ﬁeld

REG1 (18-bit) O[15] to O[0] n.a.

REG2 (18-bit) O[15] to O[0] accumulated data in the large window

REG3 (18-bit) O[15] to O[0] accumulated data in the centre window

REG4 (18-bit) O[15] to O[0] accumulated data of the large window minus the data of the centre

window

REG5 (18-bit) O[15] to O[0] n.a.

AE

REG0 (8-bit)

O[7] to O[5] 18-bit adder overﬂow information

O[4] to O[0] white-clip counter output

REG1 (18-bit) O[15] to O[0] accumulated data in WIN1; REG1[18] to REG1[3]

REG2 (18-bit) O[15] to O[0] accumulated data in WIN2; REG2[18] to REG2[3]

REG3 (18-bit) O[15] to O[0] accumulated data in WIN3; REG3[18] to REG3[3]

REG4 (18-bit) O[15] to O[0] accumulated data in WIN4; REG4[18] to REG4[3]

REG5 (18-bit) O[15] to O[0] accumulated data in WIN5; REG5[18] to REG5[3]

AWB (B − Y) REG0 (8-bit)

O[7] to O[5] n.a.

O[4] to O[0] white-clip or AWB limiter count

REG1 (18-bit) O[15] to O[0] accumulated B − Y data of 1st quadrant; REG1[18] to REG1[3]

REG2 (18-bit) O[15] to O[0] accumulated B − Y data of 2nd quadrant; REG2[18] to REG2[3]

REG3 (18-bit) O[15] to O[0] accumulated B − Y data of 3rd quadrant; REG3[18] to REG3[3]

REG4 (18-bit) O[15] to O[0] accumulated B − Y data of 4th quadrant; REG4[18] to REG4[3]

REG5 (18-bit) O[15] to O[0] n.a.

AWB (R − Y) REG0 (8-bit)

O[7] to O[5] n.a.

O[4] to O[0] white-clip or AWB limiter count

REG1 (18-bit) O[15] to O[0] accumulated R − Y data of 1st quadrant; REG1[18] to REG1[3]

REG2 (18-bit) O[15] to O[0] accumulated R − Y data of 2nd quadrant; REG2[18] to REG2[3]

REG3 (18-bit) O[15] to O[0] accumulated R − Y data of 3rd quadrant; REG3[18] to REG3[3]

REG4 (18-bit) O[15] to O[0] accumulated R − Y data of 4th quadrant; REG4[18] to REG4[3]

REG5 (18-bit) O[15] to O[0] n.a.

AWB (∆)

REG0 (8-bit)

O[7] to O[5] n.a.

O[4] to O[0] white-clip or AWB limiter count

REG1 (18-bit) O[15] to O[0] accumulated ∆(R − Y) data of WIN1 to WIN5; REG1[18] to REG1[3]

REG2 (18-bit) O[15] to O[0] accumulated ∆(B − Y) data of WIN1 to WIN5; REG2[18] to REG2[3]

REG3 (18-bit) O[15] to O[0] accumulated ∆(R − Y) data of WIN3; REG3[18] to REG3[3]

REG4 (18-bit) O[15] to O[0] accumulated ∆(B − Y) data of WIN3; REG4[18] to REG4[3]

REG5 (18-bit) O[15] to O[0] n.a.

1996 Oct 10

16

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

MODE

REGISTER

DATA

FUNCTION

AWB (Y)

REG0 (8-bit)

O[7] to O[5] n.a.

O[4]

overﬂow information of auto focus block

O[3] to O[0] contrast peak within one ﬁeld

REG1 (18-bit) O[15] to O[0] accumulated R − Y data of 1st quadrant; REG1[18] to REG1[3]

REG2 (18-bit) O[15] to O[0] accumulated R − Y data of 2nd quadrant; REG2[18] to REG2[3]

REG3 (18-bit) O[15] to O[0] accumulated R − Y data of 3rd quadrant; REG3[18] to REG3[3]

REG4 (18-bit) O[15] to O[0] accumulated R − Y data of 4th quadrant; REG4[18] to REG4[3]

REG5 (18-bit) O[15] to O[0] n.a.

1996 Oct 10

17

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

PACKAGE OUTLINE

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm

SOT314-2

y

X

A

48

33

Z

49

32

E

e

H

A

E

2

E

A

(A )

3

A

1

w M

p

θ

b

L

p

pin 1 index

L

64

17

detail X

1

16

Z

v M

D

A

e

w M

b

p

D

B

H

v M

B

D

0

2.5

scale

5 mm

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

D

H

L

v

w

y

Z

E

θ

1

2

3

p

E

p

D

max.

7^o

0^o

0.20 1.45

0.05 1.35

0.27 0.18 10.1 10.1

0.17 0.12 9.9 9.9

12.15 12.15

11.85 11.85

0.75

0.45

1.45 1.45

1.05 1.05

1.60

mm

0.25

0.5

1.0

0.2 0.12 0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-12-19

97-08-01

SOT314-2

1996 Oct 10

19

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

If wave soldering cannot be avoided, the following

conditions must be observed:

SOLDERING

Introduction

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves

downstream and at the side corners.

Even with these conditions, do not consider wave

soldering LQFP packages LQFP48 (SOT313-2),

LQFP64 (SOT314-2) or LQFP80 (SOT315-1).

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Reﬂow soldering

Reflow soldering techniques are suitable for all LQFP

packages.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

Wave soldering

Wave soldering is not recommended for LQFP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

1996 Oct 10

20

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

1996 Oct 10

21

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

NOTES

1996 Oct 10

22

Philips Semiconductors

Product speciﬁcation

Advanced Auto Control Function (A2CF)

SAA9740H

NOTES

1996 Oct 10

23

Philips Semiconductors – a worldwide company

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Internet: http://www.semiconductors.philips.com

Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA52

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

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under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

537021/1200/02/pp24

Date of release: 1996 Oct 10

Document order number: 9397 750 01158


型号：	SAA9740H
厂家：	NXP
描述：	Advanced Auto Control Function A2CF 先进的自动控制功能A2CF
文件：	总24页 (文件大小：103K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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