SC18IS600IBS [NXP]
SPI to I2C-bus interface; SPI与I2C总线接口型号: | SC18IS600IBS |
厂家: | NXP |
描述: | SPI to I2C-bus interface |
文件: | 总30页 (文件大小:165K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SC18IS600/601
SPI to I2C-bus interface
Rev. 05 — 28 July 2008
Product data sheet
1. General description
The SC18IS600/601 is designed to serve as an interface between the standard SPI of a
host (microcontroller, microprocessor, chip set, etc.) and the serial I2C-bus. This allows
the host to communicate directly with other I2C-bus devices. The SC18IS600/601 can
operate as an I2C-bus master-transmitter or master-receiver. The SC18IS600/601
controls all the I2C-bus specific sequences, protocol, arbitration and timing.
The key distinction between the SC18IS600 and the SC18IS601 lies in the clock source:
internal (SC18IS600) versus external (SC18IS601).
2. Features
I SPI slave interface
I SPI Mode 3
I Master I2C-bus controller
I General Purpose Input/Output (GPIO) pins: 4 (SC18IS600); 3 (SC18IS601)
I Two quasi-bidirectional I/O pins
I 5 V tolerant I/O pins
I High-speed SPI:
N Up to 3 Mbit/s (SC18IS601)
N Up to 1.2 Mbit/s (SC18IS600)
I High-speed I2C-bus: 400 kbit/s
I 96-byte transmit buffer
I 96-byte receive buffer
I 2.4 V to 3.6 V operation
I Power-down mode with WAKEUP pin
I Oscillator: internal (SC18IS600); external (SC18IS601)
I Active LOW interrupt output
I Available in very small TSSOP16 and HVQFN24 packages
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
SC18IS600IPW
SC18IS601IPW
SC18IS600IBS
TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; SOT616-3
body 4 × 4 × 0.85 mm
4. Block diagram
SC18IS600
CONTROL
LOGIC
RESET
MISO
MOSI
SCLK
CS
SDA
SCL
2
I C-BUS
BUFFER
SPI
CONTROLLER
GPIO0
GPIO1
GPIO2
GPIO3
IO5
INT
INTERRUPT
CONTROL
LOGIC
GENERAL
PURPOSE
I/Os
IO4/WAKEUP
OSCILLATOR
ON-CHIP
RC
OSCILLATOR
002aab712
Fig 1. Block diagram of SC18IS600
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
2 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
SC18IS601
CONTROL
LOGIC
RESET
MISO
MOSI
SCLK
CS
SDA
2
I C-BUS
BUFFER
SPI
CONTROLLER
SCL
GPIO0
GPIO1
GPIO2
INT
INTERRUPT
CONTROL
LOGIC
GENERAL
PURPOSE
I/Os
IO5
IO4/WAKEUP
external clock input
(CLKIN)
OSCILLATOR
002aab784
Fig 2. Block diagram of SC18IS601
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
3 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
5. Pinning information
5.1 Pinning
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GPIO0
CS
IO5
GPIO0
CS
IO5
WAKEUP/IO4
INT
WAKEUP/IO4
INT
RESET
RESET
V
GPIO3
V
CLKIN
SS
SS
SC18IS600IPW
SC18IS601IPW
MISO
MOSI
SDA
V
DD
MISO
MOSI
SDA
V
DD
SCLK
SCLK
GPIO2
GPIO1
GPIO2
GPIO1
SCL
SCL
002aab713
002aab714
Fig 3. SC18IS600 pin configuration for TSSOP16
Fig 4. SC18IS601 pin configuration for TSSOP16
terminal 1
index area
1
2
3
4
5
6
18
17
16
15
14
13
CS
WAKEUP/IO4
INT
RESET
V
GPIO3
SS
SC18IS600IBS
MISO
MOSI
SDA
V
DD
SCLK
GPIO2
002aad707
Transparent top view
Fig 5. SC18IS600 pin configuration for HVQFN24
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
4 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
Type Description
TSSOP16
HVQFN24
SC18IS600 SC18IS601 SC18IS600
GPIO0
CS
1
2
1
2
23
1
I/O
I
programmable I/O pin
Chip select. When CS is LOW, the SC18IS600/601 is
selected.
RESET
3
3
2
I
Master Reset. When active (LOW), RESET sets internal
registers to the default values, and resets the I2C-bus and
SPI hardware. See Table 3.
VSS
4
4
3[1]
4
I
ground supply voltage
SPI slave data output
SPI slave data input
I2C-bus serial data input/output
I2C-bus serial clock output
programmable I/O pin
programmable I/O pin
SPI clock input
MISO
MOSI
SDA
5
5
O
I
6
6
5
7
7
6
I/O
O
I/O
I/O
I
SCL
8
8
8
GPIO1
GPIO2
SCLK
VDD
9
9
11
13
14
15
16
-
10
11
12
13
-
10
11
12
-
I
2.4 V to 3.6 V supply voltage
programmable I/O pin
external clock input
GPIO3
CLKIN
INT
I/O
I
13
14
14
17
O
Interrupt. When active (LOW), INT informs the CPU that
the SC18IS600/601 has an interrupt to be serviced.
INT is reset (deactivated) either when the I2CStat register
is read or as a result of a master reset (RESET). This pin
is an open-drain pin.
WAKEUP/IO4 15
15
18
20
I/O
Wake up the SC18IS600/601 from the Power-down mode.
Pulled LOW by the host to wake-up from low power state.
This pin can also be used as a quasi-bidirectional I/O
when not in a power-down state.
IO5
n.c.
16
-
16
-
I/O
-
quasi-bidirectional I/O pin
not connected
7, 9, 10, 12,
19, 21, 22,
24
[1] HVQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply
ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be
soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias
need to be incorporated in the PCB in the thermal pad region.
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
5 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
6. Functional description
The SC18IS600/601 acts as a bridge between a SPI interface and an I2C-bus. It allows a
SPI master device to communicate with I2C-bus slave devices. The SPI interface supports
Mode 3 of the SPI specification and can operate up to 3 Mbit/s (SC18IS601).
6.1 Internal registers
The SC18IS600/601 provides internal registers for monitoring and control. These
registers are shown in Table 3. Register functions are more fully described in the following
paragraphs.
Table 3.
Internal registers summary
Register Register Bit 7
address
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R/W Default
value
0x00
0x01
0x02
0x03
0x04
0x05
IOConfig IO3.1[1] IO3.0[1] IO2.1
IO2.0
IO1.1
IO1.0
IO0.1
GPIO1
CR1
IO0.0
GPIO0
CR0
TE
R/W 0x00
R/W 0x3F
R/W 0x19
R/W 0xFE
IOState
0
0
GPIO5 GPIO4 GPIO3[2] GPIO2
I2CClock CR7
CR6
TO5
1
CR5
TO4
1
CR4
TO3
1
CR3
TO2
CR2
TO1
I2CTO
I2CStat
I2CAdr
TO6
1
TO0
I2CSTAT3 I2CSTAT2 I2CSTAT1 I2CSTAT0 R
0xF0
ADR7
ADR6
ADR5 ADR4 ADR3
ADR2 ADR1 R/W 0x00
X
[1] For SC18IS601, these bits are ‘Don’t care’.
[2] For SC18IS601 GPIO3 is not used.
6.2 Register descriptions
6.2.1 Programmable IO port configuration register (IOConfig)
Pins GPIO0 to GPIO3 may be configured by software to one of four types. These are:
quasi-bidirectional, push-pull, open-drain, and input-only. Two configuration bits per pin,
located in the IOConfig register, select the IO type for each pin. Each pin has
Schmitt-triggered input that also has a glitch suppression circuit. IO4 and IO5 are
quasi-bidirectional pins and are not user-configurable. For SC18IS601, GPIO3 is
non-existent.
Table 4 shows the configurations for the programmable I/O pins. IOx.1 and IOx.0
correspond to GPIOx.
Table 4.
Pin configurations
IOx.1
IOx.0
Pin configuration
0
0
1
1
0
1
0
1
quasi-bidirectional output configuration
input-only configuration
push-pull output configuration
open-drain output configuration
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
6 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
6.2.1.1 Quasi-bidirectional output configuration
Quasi-bidirectional outputs can be used both as an input and output without the need to
reconfigure the pin. This is possible because when the pin outputs a logic HIGH, it is
weakly driven, allowing an external device to pull the pin LOW. When the pin is driven
LOW, it is driven strongly and able to sink a large current. There are three pull-up
transistors in the quasi-bidirectional output that serve different purposes.
One of these pull-ups, called the ‘very weak’ pull-up, is turned on whenever the pin latch
for the pin contains a logic 1. This very weak pull-up sources a very small current that will
pull the pin HIGH if it is left floating.
A second pull-up, called the ‘weak’ pull-up, is turned on when the pin latch for the pin
contains a logic 1 and the pin itself is also at a logic 1 level. This pull-up provides the
primary source current for a quasi-bidirectional pin that is outputting a 1. If this pin is
pulled LOW by an external device, the weak pull-up turns off, and only the very weak
pull-up remains on. In order to pull the pin LOW under these conditions, the external
device has to sink enough current to overpower the weak pull-up and pull the pin below its
input threshold voltage.
The third pull-up is referred to as the ‘strong’ pull-up. This pull-up is used to speed up
LOW-to-HIGH transitions on a quasi-bidirectional pin when the pin latch changes from a
logic 0 to a logic 1. When this occurs, the strong pull-up turns on for two system clock
cycles quickly pulling the pin HIGH.
The quasi-bidirectional pin configuration is shown in Figure 6.
Although the SC18IS600/601 is a 3 V device, most of the pins are 5 V tolerant. If 5 V is
applied to a pin configured in quasi-bidirectional mode, there will be a current flowing from
the pin to VDD causing extra power consumption. Therefore, applying 5 V to pins
configured in quasi-bidirectional mode is discouraged.
A quasi-bidirectional pin has a Schmitt-triggered input that also has a glitch suppression
circuit.
V
DD
2 SYSTEM
CLOCK
CYCLES
P
P
P
very
weak
strong
weak
GPIOn,
IOn pin
pin latch data
V
SS
input data
glitch rejection
002aab882
Fig 6. Quasi-bidirectional output configuration
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
6.2.1.2 Open-drain output configuration
The open-drain output configuration turns off all pull-ups and only drives the pull-down
transistor of the pin when the pin latch contains a logic 0. To be used as a logic output, a
pin configured in this manner must have an external pull-up, typically a resistor tied to
VDD. The pull-down for this mode is the same as for the quasi-bidirectional mode.
The open-drain pin configuration is shown in Figure 7.
An open-drain pin has a Schmitt-triggered input that also has a glitch suppression circuit.
GPIO pin
pin latch data
V
SS
input data
glitch rejection
002aab883
Fig 7. Open-drain output configuration
6.2.1.3 Input-only configuration
The input-only pin configuration is shown in Figure 8. It is a Schmitt-triggered input that
also has a glitch suppression circuit.
input data
GPIO pin
002aab884
glitch rejection
Fig 8. Input-only configuration
6.2.1.4 Push-pull output configuration
The push-pull output configuration has the same pull-down structure as both the
open-drain and the quasi-bidirectional output modes, but provides a continuous strong
pull-up when the pin latch contains a logic 1. The push-pull mode may be used when
more source current is needed from a pin output.
The push-pull pin configuration is shown in Figure 9.
A push-pull pin has a Schmitt-triggered input that also has a glitch suppression circuit.
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
8 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
V
DD
P
N
strong
GPIO pin
pin latch data
V
SS
input data
glitch rejection
002aab885
Fig 9. Push-pull output configuration
6.2.2 I/O pins state register (IOState)
When read, this register returns the actual state of all programmable and
quasi-bidirectional I/O pins. When written, each register bit will be transferred to the
corresponding I/O pin programmed as output.
Table 5.
IOState - I/O pins state register (address 0x01) bit description
Bit
7:6
5
Symbol
Description
-
reserved
IO5
Set the logic level on the output pins.
Write to this register:
4
IO4
logic 0 = set output pin to zero
logic 1 = set output pin to one
A read from this register returns states of all pins.
3
GPIO3 (SC18IS600 only)
2
GPIO2
GPIO1
GPIO0
1
0
6.2.3 I2C-bus address register (I2CAdr)
The contents of the register represents the device’s own I2C-bus address. The most
significant bit corresponds to the first bit received from the I2C-bus after a START
condition. The least significant bit is not used, but should be programmed with a ‘0’.
I2CAdr is not needed for device operation, but should be configured so that its address
does not conflict with an I2C-bus device address used by the bus master.
6.2.4 I2C-bus clock rates register (I2CClk)
This register determines the I2C-bus clock frequency. Various clock rates are shown in
Table 6 for the SC18IS600. The frequency can be determined using Equation 1:
7.3728 × 106
4 × I2CClk
I2C-bus clock frequency =
(Hz)
(1)
------------------------------
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
The I2C-bus clock frequency for the SC18IS601 can be determined using Equation 2:
CLKIN
4 × I2CClk
I2C-bus clock frequency =
(Hz)
(2)
----------------------------
Table 6.
I2C-bus clock frequency example at 7.3728 MHz
I2CClk (decimal)
I2C-bus clock frequency
5 (minimum)
369 kHz
7
263 kHz
9
204 kHz
19
97 kHz
255 (maximum)
7.2 kHz
6.2.5 I2C-bus time-out register (I2CTO)
The time-out register is used to determine the maximum time that the I2C-bus master is
allowed to complete a transfer before setting an I2C-bus time-out interrupt.
Table 7.
I2CTO - I2C-bus time-out register (address 0x04) bit description
Bit
7:1
0
Symbol
TO[7:1]
TE
Description
Time-out value
Enable/disable time-out function
logic 0 = disable
logic 1 = enable
The least significant bit of I2CTO (TE bit) is used as a time-out enable/disable. A logic 1
will enable the time-out function.
On the SC18IS600 the time-out oscillator operates at 57.6 kHz. For the SC18IS601 the
time-out oscillator frequency can be determined using Equation 3:
CLKIN
128
Time-out oscillator frequency =
(Hz)
(3)
------------------
This oscillator is fed into a 16-bit down counter. The down counter’s lower nine bits are
loaded with ‘1’, while the upper seven bits are loaded with the contents of I2CTO.
57.6 kHz
OSCILLATOR
16-BIT DOWN COUNTER
[I2CTO][111111111]
time-out
002aab715
Fig 10. Time-out value
The time-out value is an approximate value.
In the case of arbitration loss, the SC18IS600/601 will transmit a START condition when
the bus becomes free unless the time-out condition is reached. If the time-out condition is
reached, an interrupt will be generated on the INT pin. The ‘I2C-bus time-out’ status can
be read in I2CStat.
SC18IS600_601_5
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Product data sheet
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
6.2.6 I2C-bus status register (I2CStat)
This register reports the results of I2C-bus transmit and receive transaction between
SC18IS600/601 and an I2C-bus slave device.
Table 8.
I2C-bus status
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 I2C-bus status description
Register
value
0xF0
1
1
1
1
1
1
0
0
0
0
0
0
0
1
Transmission successful. The SC18IS600/601
has successfully completed an I2C-bus read or
write transaction. An interrupt is generated on
INT. This is also the default status after reset. No
interrupt is generated after reset.
I2C-bus device address not acknowledged. No
I2C-bus slave device has acknowledged the slave
address that has been sent out in an I2C-bus read
or write transaction. An interrupt is generated on
INT.
0xF1
1
1
0xF2
0xF3
0xF8
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
0
0
0
1
1
0
0
1
0
I2C-bus device address not acknowledged. An
I2C-bus slave has not acknowledged the byte that
has just been transmitted by the SC18IS600/601.
An interrupt is generated on INT.
I2C-bus busy. The SC18IS600/601 is busy
performing an I2C-bus transaction, no new
transaction should be initiated by the host. No
interrupt is generated.
I2C-bus time-out (see Section 6.2.5 “I2C-bus
time-out register (I2CTO)”). The SC18IS600/601
has started an I2C-bus transaction that has taken
longer than the time programmed in I2CTO
register. This could happen after a period of
unsuccessful arbitration or when an I2C-bus slave
is (continuously) pulling the SCL clock LOW. An
interrupt is generated on INT.)
0xF9
1
1
1
1
1
0
0
1
I2C-bus invalid data count. The number of bytes
specified in a read or write command to the
SC18IS600/601. An interrupt is generated on INT.
SC18IS600_601_5
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Product data sheet
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
6.3 External clock input (SC18IS601)
In this device, the processor clock is derived from an external source driving the CLKIN
pin. The clock rate may be from 0 Hz up to 18 MHz.
6.4 I2C-bus serial interface
I2C-bus uses two wires (SDA and SCL) to transfer information between devices connected
to the bus, and it has the following features:
• Bidirectional data transfer between masters and slaves
• Multi-master bus (no central master)
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer
• The I2C-bus may be used for test and diagnostic purposes.
A typical I2C-bus configuration is shown in Figure 11. The SC18IS600/601 device
provides a byte-oriented I2C-bus interface that supports data transfers up to 400 kHz.
(Refer to UM10204, “I2C-bus specification and user manual”.)
V
DD
R
PU
R
PU
SDA
SCL
2
I C-bus
2
2
I C-BUS
DEVICE
I C-BUS
SC18IS600/601
DEVICE
002aab716
Fig 11. I2C-bus configuration
6.5 Serial Peripheral Interface (SPI)
The host communicates with the SC18IS600/601 via the SPI interface. The
SC18IS600/601 operates in Slave mode up to 3 Mbit/s.
The SPI interface has four pins: SCLK, MOSI, MISO, and CS.
• SCLK, MOSI and MISO are typically tied together between two or more SPI devices.
Data flows from the master to the SC18IS600/601 on the MOSI (Master Out Slave In)
pin and flows from SC18IS600/601 to the master on the MISO (Master In Slave Out)
pin. The SCLK signal is an input to the SC18IS600/601.
• CS is the slave select pin. In a typical configuration, an SPI master selects one SPI
device as the current slave. An SPI slave device uses its CS pin to determine whether
it is selected. The CS pin may be tied LOW if it is the only device on the bus.
Typical connections are shown in Figure 12.
SC18IS600_601_5
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Product data sheet
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
master
slave
SC18IS600/601
MISO
MOSI
SPICLK
PORT
SCLK
CS
slave
OTHER SPI
DEVICE
SCLK
CS
PORT
002aab717
Fig 12. SPI single master multiple slaves configuration
6.6 SPI message format
6.6.1 Write N bytes to I2C-bus slave device
SPI host sends
0x00
NUMBER
SLAVE ADDRESS
+ W
DATA
BYTE 1
DATA
BYTE N
COMMAND OF BYTES
CS
SCLK
MOSI
command 0x00
number of bytes D[7:0] slave address A[7:1]
0
data byte 1
data byte N
002aab718
Fig 13. Write N bytes to I2C-bus slave device
The SPI host issues the write command by sending a 0x00 command followed by the total
number of bytes (maximum 96 bytes excluding the address) to send and an I2C-bus slave
device address followed by I2C-bus data bytes, beginning with the first byte (data byte 1)
and ending with the last byte (data byte N). Once the SPI host issues this command, the
SC18IS600/601 will access the I2C-bus slave device and start sending the I2C-bus data
bytes.
When the I2C-bus write transaction has successfully finished, and interrupt is generated
on the INT pin, and the ‘transaction completed’ status can be read in I2CStat.
Note that the third byte sent by the host is the device I2C-bus slave address. The
SC18IS600/601 will ignore the least significant bit so a write will always be performed
even if the least significant bit is a ‘1’.
SC18IS600_601_5
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Product data sheet
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SC18IS600/601
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SPI to I2C-bus interface
6.6.2 Read N bytes from I2C-bus slave device
SPI host sends
0x01
NUMBER
SLAVE ADDRESS
+ R
COMMAND OF BYTES
CS
SCLK
MOSI
command 0x01
number of bytes D[7:0] slave address A[7:1]
1
002aab719
Fig 14. Read N bytes from I2C-bus slave device
Once the host issues this command, the SC18IS600/601 will start an I2C-bus read
transaction on the I2C-bus to the specified slave address. Once the data is received, the
SC18IS600/601 will place this data in the receiver buffer, and will generate an interrupt on
the INT pin. The ‘transaction completed’ status can be read in the I2CStat. Note that the
data is not returned until a Read Buffer command is performed (see Section 6.6.4 “Read
buffer”).
Note that the third byte sent by the host is the device slave address. The SC18IS600/601
will ignore the least significant bit so a read will always be performed even if the least
significant bit is a ‘0’. The maximum number of bytes to be read is 96.
6.6.3 I2C-bus read after write
SPI host sends
NUMBER OF NUMBER OF
SLAVE
ADDRESS
+ W
DATA
WRITE
BYTE 0
DATA
WRITE
BYTE N
SLAVE
ADDRESS
+ R
0x02
COMMAND
WRITE
BYTES
READ
BYTES
002aab720
Fig 15. I2C-bus read after write
Once the host issues this command, the SC18IS600/601 will start a write transaction on
the I2C-bus to the specified slave address. Once the data is written, the SC18IS600/601
will read data from the specified slave, place the data in the Receiver Buffer and generate
an interrupt on the INT pin. The ‘transaction completed’ status can be read in I2CStat.
Note that the data is not returned until a ‘Read Buffer’ command is performed.
6.6.4 Read buffer
SPI host sends
0x06
COMMAND
DATA
BYTE 1
DATA
BYTE N
002aab868
Fig 16. Read buffer
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Product data sheet
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
When the host issues a Read Buffer command, the SC18IS600/601 will return the data in
the Read Buffer on the MISO pin. Note that the Read Buffer will be overwritten if an
additional ‘Read N bytes’ or a ‘Read after write’ command is executed before the Read
Buffer command.
6.6.5 I2C-bus write after write
SPI host sends
0x03
COMMAND
NUMBER OF NUMBER OF
BYTES 1 BYTES 2
SLAVE 1
ADDRESS + W
DATA
BYTE 1
DATA
BYTE N
SLAVE 2
ADDRESS + W
DATA
BYTE 1
DATA
BYTE N
002aab721
Fig 17. Write after write
When the host issues this command, the SC18IS600/601 will first write N data bytes to
the I2C-bus slave 1 device followed by a write of M data bytes to the I2C-bus slave 2
device.
6.6.6 SPI configuration
SPI host sends
0x18
SPI
COMMAND CONFIGURATION
CS
SCLK
MOSI
character 0x18
SPI configuration data
002aab722
Fig 18. SPI configuration
Table 9.
SPI configuration
SPI configuration
Data order
0x81
0x42
LSB first
MSB first (default)
The SPI configuration command can be used to change the order in which the bits of SPI
data byte are sent on the SPI bus. In the LSB first configuration (SPI configuration data is
0x81), bit 0 is the first bit sent of any SPI byte. In MSB first (SPI configuration data is
0x42), bit 7 is the first bit sent. Table 9 shows the two possible configurations that can be
programmed.
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Product data sheet
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
6.6.7 Write to SC18IS600/601 internal registers
SPI host sends
0x20
COMMAND
REGISTER
X
DATA
BYTE
CS
SCLK
MOSI
character 0x20
register X
data byte
002aab723
Fig 19. Write to SC18IS600/601 internal registers
A Write Register function is initiated by sending a 0x20 command followed by an internal
register address to be written (see Section 6.1). The register data byte follows the register
address. Only one register can be accessed in a single transaction. There is no
auto-incrementing of the register address.
6.6.8 Read from SC18IS600/601 internal register
SPI host sends
0x21
COMMAND
REGISTER
X
REGISTER
DATA
CS
SCLK
MOSI
MISO
character 0x21
register X
dummy byte
data byte
002aab724
Fig 20. Read from SC18IS600/601 internal register
A Read Register function is initiated by sending a 0x21 command followed by an internal
register address to be read (see Section 6.1) and a dummy byte. The data byte of the
read register is returned by the SC18IS600 on the MISO pin. Only one register can be
accessed in a single transaction. There is no auto-incrementing of the register address.
Note that write and read from internal registers are processed immediately as soon as the
SC18IS600/601 determines the intended register.
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Product data sheet
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
6.6.9 Power-down mode
SPI host sends
0x30
COMMAND
0x5A
0xA5
CS
SCLK
MOSI
character 0x30
character 0x5A
character 0xA5
002aab725
Fig 21. Power-down mode
The SC18IS600/601 can be placed in a low-power mode where the internal oscillator is
stopped and it will no longer respond to SPI messages. Enter the Power-down mode by
sending the power-down command (0x30) followed by the two defined bytes, which are
0x5A followed by 0xA5. If the exact message is not received, the device will not enter the
power-down state.
Before entering the power-down state, WAKEUP/IO4 should be placed in a HIGH state.
To exit the power-down state, the WAKEUP/IO4 should be brought LOW. After leaving the
power-down state, the WAKEUP/IO4 can once again be used as a general-purpose IO
pin.
7. Limiting values
Table 10. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1][2]
Symbol
Tamb(bias)
Tstg
Parameter
Conditions
Min
Max
+125
+150
+5.5
8
Unit
°C
bias ambient temperature
operating
−55
storage temperature
−65
°C
Vn
voltage on any other pin
referenced to VSS
−0.5
V
IOH(I/O)
IOL(I/O)
II/O(tot)(max)
Ptot/pack
HIGH-level output current per input/output pin
LOW-level output current per input/output pin
maximum total I/O current
-
-
-
-
mA
mA
mA
W
20
120
1.5
[3]
total power dissipation per package
[1] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
[2] Parameters are valid over the operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[3] Based on package heat transfer, not device power consumption.
SC18IS600_601_5
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Product data sheet
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SC18IS600/601
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SPI to I2C-bus interface
8. Static characteristics
Table 11. Static characteristics
VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
13
16
4.8
6
Unit
mA
mA
mA
mA
µA
µA
V
IDD(oper)
operating supply current
VDD = 3.6 V; f = 12 MHz
VDD = 3.6 V; f = 18 MHz
VDD = 3.6 V; f = 12 MHz
VDD = 3.6 V; f = 18 MHz
VDD = 3.6 V; industrial
VDD = 3.6 V; extended
Schmitt trigger input
Schmitt trigger input
-
-
-
-
-
-
7
11
3.6
4
IDD(idle)
Idle mode supply current
IDD(tpd)
total Power-down mode supply
current
< 0.1
-
5
50
-
Vth(HL)
Vth(LH)
Vhys
HIGH-LOW threshold voltage
LOW-HIGH threshold voltage
hysteresis voltage
0.22VDD 0.4VDD
-
0.6VDD
0.2VDD
0.6
0.7VDD
-
V
-
V
VOL
LOW-level output voltage
all pins; IOL = 20 mA
all pins; IOL = 10 mA
all pins; IOL = 3.2 mA
-
1.0
0.5
0.3
-
V
-
0.3
V
-
0.2
V
VOH
HIGH-level output voltage
all pins; IOH = −8 mA;
VDD − 1
-
V
push-pull mode
all pins; IOH = −3.2 mA;
push-pull mode
V
DD − 0.7 VDD − 0.4 -
DD − 0.3 VDD − 0.2 -
V
V
all pins; IOH = −20 µA;
V
quasi-bidirectional mode
[2]
[3]
Cig
IIL
input capacitance at gate
LOW-level input current
input leakage current
-
-
-
-
-
15
pF
µA
µA
µA
logical 0; VI = 0.4 V
-
−80
[4]
ILI
all ports; VI = VIL or VIH
-
±10
[5][6]
ITHL
HIGH-LOW transition current
all ports; logical 1-to-0;
VI = 2.0 V at VDD = 3.6 V
−30
−450
RRESET_N(int) internal pull-up resistance on pin
RESET
10
-
30
kΩ
[1] Typical ratings are not guaranteed. The values listed are at room temperature, 3 V.
[2] Pin capacitance is characterized but not tested.
[3] Measured with pins in quasi-bidirectional mode.
[4] Measured with pins in high-impedance mode.
[5] Pins in quasi-bidirectional mode with weak pull-up (applies to all pins with pull-ups).
[6] Pins source a transition current when used in quasi-bidirectional mode and externally driven from logic 1 to logic 0. This current is
highest when VI is approximately 2 V.
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Product data sheet
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SC18IS600/601
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SPI to I2C-bus interface
9. Dynamic characteristics
Table 12. Dynamic characteristics
VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.[1]
Symbol Parameter
Conditions
Variable clock
fosc = 12 MHz Unit
Min Max
7.189 7.557 MHz
Min
Max
fosc(RC)
internal RC oscillator
frequency
SC18IS600;
nominal f = 7.3728 MHz; trimmed to
±1 % at Tamb = 25 °C
7.189
7.557
External clock input (SC18IS601); see Figure 23
fosc
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
VDD = 2.4 V to 3.6 V
0
83
22
22
-
12
-
-
-
-
MHz
ns
TCLCL
tCHCX
tCLCX
tCLCH
tCHCL
-
T
CLCL − tCLCX
22
22
-
-
ns
T
CLCL − tCHCX
-
ns
8
8
8
8
ns
clock fall time
-
-
ns
Glitch filter
[2]
[2]
tgr
glitch rejection time
RESET pin
-
-
50
15
-
-
-
50
15
-
ns
ns
ns
ns
any pin except RESET
tsa
signal acceptance time RESET pin
125
50
125
50
any pin except RESET
-
-
SPI slave interface
fosc
fSPI
SPI operating frequency 2.0 MHz
0
⁄
6
0
500
4
2.0
MHz
ns
6
TSPICYC SPI cycle time
tSPILEAD SPI enable lead time
2.0 MHz
2.0 MHz
⁄
-
-
-
-
-
-
-
-
fosc
4
4
-
µs
tSPILAG
tSCLKH
tSCLKL
tSPIDSU
tSPIDH
tSPIA
SPI enable lag time
SCLK HIGH time
SCLK LOW time
SPI data set-up time
SPI data hold time
SPI access time
SPI disable time
-
4
µs
3
⁄
-
-
190
190
100
100
0
ns
fosc
3
⁄
ns
fosc
100
100
0
-
ns
-
ns
120
240
240
167
-
120 ns
240 ns
240 ns
167 ns
tSPIDIS
tSPIDV
2.0 MHz
2.0 MHz
3.0 MHz
0
-
SPI enable to output
data valid time
0
-
0
-
tSPIOH
tSPIR
SPI output data hold
time
0
0
-
ns
SPI rise time
SPI outputs (SCLK, MOSI, MISO)
-
-
100
-
-
100 ns
2000 ns
SPI inputs (SCLK, MOSI, MISO,
CS)
2000
tSPIF
SPI fall time
SPI outputs (SCLK, MOSI, MISO)
-
-
100
-
-
100 ns
2000 ns
SPI inputs (SCLK, MOSI, MISO,
CS)
2000
[1] Parameters are valid over operating temperature range unless otherwise specified. Parts are tested to 2 MHz, but are guaranteed to
operate down to 0 Hz.
[2] SCL and SDA do not have glitch suppression circuits.
SC18IS600_601_5
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Product data sheet
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SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
Table 13. Dynamic characteristics
VDD = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.[1]
Symbol Parameter
Conditions
Variable clock
fosc = 18 MHz Unit
Min
Max
Min
Max
fosc(RC)
internal RC oscillator
frequency
SC18IS600;
nominal f = 7.3728 MHz;
trimmed to ±1 % at
7.189
7.557
7.189
7.557 MHz
Tamb = 25 °C
External clock input (SC18IS601); see Figure 23
fosc
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
0
55
22
22
-
18
-
-
-
-
MHz
ns
TCLCL
tCHCX
tCLCX
tCLCH
tCHCL
Glitch filter
tgr
-
T
CLCL − tCLCX
22
22
-
-
ns
T
CLCL − tCHCX
-
ns
5
5
5
5
ns
clock fall time
-
-
ns
[2]
[2]
glitch rejection time
RESET pin
-
-
50
15
-
-
-
50
15
-
ns
ns
ns
ns
any pin except RESET
RESET pin
tsa
signal acceptance time
125
50
125
50
any pin except RESET
-
-
SPI slave interface
fosc
fSPI
SPI operating frequency
3.0 MHz
3.0 MHz
3.0 MHz
3.0 MHz
0
⁄
0
333
4
3
MHz
ns
µs
µs
ns
ns
ns
ns
ns
ns
ns
6
6
TSPICYC
tSPILEAD
tSPILAG
tSCLKH
tSCLKL
tSPIDSU
tSPIDH
tSPIA
SPI cycle time
⁄
-
-
fosc
SPI enable lead time
SPI enable lag time
SCLK HIGH time
SCLK LOW time
SPI data set-up time
SPI data hold time
SPI access time
SPI disable time
4
4
-
-
-
4
-
3
⁄
-
-
167
167
100
100
0
-
-
fosc
3
⁄
fosc
100
100
0
-
-
-
-
80
160
160
80
160
160
tSPIDIS
tSPIDV
3.0 MHz
3.0 MHz
0
-
SPI enable to output data
valid time
0
-
tSPIOH
tSPIR
SPI output data hold time
SPI rise time
0
-
-
0
-
-
ns
ns
SPI outputs (SCLK,
MOSI, MISO)
100
100
SPI inputs (SCLK, MOSI,
MISO, CS)
-
-
-
2000
100
-
-
-
2000 ns
100 ns
2000 ns
tSPIF
SPI fall time
SPI outputs (SCLK,
MOSI, MISO)
SPI inputs (SCLK, MOSI,
MISO, CS)
2000
[1] Parameters are valid over operating temperature range unless otherwise specified. Parts are tested to 2 MHz, but are guaranteed to
operate down to 0 Hz.
[2] SCL and SDA do not have glitch suppression circuits.
SC18IS600_601_5
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Product data sheet
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20 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
CS
t
SPIF
T
CLCL
t
SPILEAD
t
SPIR
t
SPILAG
t
t
SPIF
SPIR
t
t
SCLKH
SCLKL
SCLK
(input)
t
t
t
SPIOH
SPIOH
SPIOH
t
t
t
SPIDV
SPIDV
SPIDV
t
SPIDIS
t
SPIA
MISO
(output)
slave LSB/MSB out
slave MSB/LSB out
not defined
t
t
t
t
t
SPIDH
SPIDSU
SPIDH
SPIDSU
SPIDSU
MOSI
(input)
MSB/LSB in
LSB/MSB in
002aab797
Fig 22. SPI slave timing (Mode 3)
V
DD
− 0.5 V
0.2V
+ 0.9 V
DD
0.2V
− 0.1 V
DD
0.45 V
t
CHCX
t
t
t
CLCH
CHCL
CLCX
T
CLCL
002aab886
Fig 23. External clock timing
SC18IS600_601_5
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Product data sheet
Rev. 05 — 28 July 2008
21 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
Table 14. Additional SPI AC characteristics
Symbol Parameter
Conditions
Min
Typ
Max Unit
tSPICLKW SPICLK HIGH time
between two SPI bytes
8
-
-
µs
µs
µs
µs
tCSW
tSPILAG1
td
CS HIGH time
between two SPI transactions
refer to Figure 25
refer to Figure 26
refer to Figure 27
SPI enable lag time 1 in a SPI to I2C-bus transaction
delay time
from last SCLK pulse to SDA LOW in a SPI to I2C-bus
transaction
t
SPICLKW
SCLK
t
SPILAG1
t
SPILEAD
CS
t
CSW
t
d
SDA
002aab927
Fig 24. SPI to I2C-bus timing diagram
002aab929
002aab930
8
5
t
SPILAG1
t
CSW
(µs)
(µs)
4
6
4
2
0
3
2
1
0
1.843
3.687
7.373
12.00
18.00
1.843
3.687
7.373
12.00
18.00
CLKIN frequency (MHz)
CLKIN frequency (MHz)
Fig 25. tCSW as a function of CLKIN frequency
Fig 26. tSPILAG1 as a function of CLKIN frequency
002aab931
160
t
d
(µs)
120
80
40
0
1.843
3.687
7.373
12.00
18.00
CLKIN frequency (MHz)
Fig 27. td as a function of CLKIN frequency
SC18IS600_601_5
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Product data sheet
Rev. 05 — 28 July 2008
22 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
10. Package outline
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 28. Package outline SOT403-1 (TSSOP16)
SC18IS600_601_5
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Product data sheet
Rev. 05 — 28 July 2008
23 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
SOT616-3
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
e
1
C
1/2 e
y
y
C
1
e
v
M
M
C
C
A
B
b
7
12
w
L
13
6
e
e
E
h
2
1/2 e
1
18
terminal 1
index area
24
19
X
D
h
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
mm
A
b
c
E
e
e
e
2
y
D
D
E
L
v
w
y
1
1
h
1
h
max.
0.05 0.30
0.00 0.18
4.1
3.9
2.75
2.45
4.1
3.9
2.75
2.45
0.5
0.3
0.05
0.1
1
0.2
0.5
2.5
2.5
0.1 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
04-11-19
05-03-10
SOT616-3
- - -
MO-220
- - -
Fig 29. Package outline SOT616-3 (HVQFN24)
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
24 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
11. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
11.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
11.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
11.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
25 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
11.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15 and 16
Table 15. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 16. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 30.
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
26 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 30. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
12. Abbreviations
Table 17. Abbreviations
Acronym
ASCII
CPU
Description
American Standard Code for Information Interchange
Central Processing Unit
GPIO
General Purpose Input/Output
Input/Output
I/O
I2C-bus
LSB
Inter-Integrated Circuit bus
Least Significant Bit
MSB
Most Significant Bit
PCB
Printed-Circuit Board
SPI
Serial Peripheral Interface
Universal Asynchronous Receiver/Transmitter
UART
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
27 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
13. Revision history
Table 18. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SC18IS600_601_5
Modifications:
20080728
Product data sheet
-
SC18IS600_601_4
• Table 9 “SPI configuration”:
–
SPI configuration for LSB first data order changed from “0x42” to “0x81”
–
SPI configuration for MSB first data order changed from “0x81” to “0x42”
• Section 6.6.6 “SPI configuration”, first paragraph:
–
2nd sentence: changed from “0x42” to “0x81”
rd sentence: changed from “0x81” to “0x42”
–
3
SC18IS600_601_4
SC18IS600_601_3
SC18IS600_601_2
SC18IS600_601_1
20080320
20061213
20060811
20060224
Product data sheet
Product data sheet
Product data sheet
Product data sheet
-
-
-
-
SC18IS600_601_3
SC18IS600_601_2
SC18IS600_601_1
-
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
28 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
to result in personal injury, death or severe property or environmental
14.2 Definitions
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
I2C-bus — logo is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SC18IS600_601_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
29 of 30
SC18IS600/601
NXP Semiconductors
SPI to I2C-bus interface
16. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
14
Legal information . . . . . . . . . . . . . . . . . . . . . . 29
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 29
14.1
14.2
14.3
14.4
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
15
16
Contact information . . . . . . . . . . . . . . . . . . . . 29
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6
Functional description . . . . . . . . . . . . . . . . . . . 6
Internal registers. . . . . . . . . . . . . . . . . . . . . . . . 6
Register descriptions . . . . . . . . . . . . . . . . . . . . 6
Programmable IO port configuration register
6.1
6.2
6.2.1
(IOConfig) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Quasi-bidirectional output configuration . . . . . . 7
Open-drain output configuration . . . . . . . . . . . . 8
Input-only configuration . . . . . . . . . . . . . . . . . . 8
Push-pull output configuration . . . . . . . . . . . . . 8
I/O pins state register (IOState) . . . . . . . . . . . . 9
I2C-bus address register (I2CAdr) . . . . . . . . . . 9
I2C-bus clock rates register (I2CClk) . . . . . . . . 9
I2C-bus time-out register (I2CTO). . . . . . . . . . 10
I2C-bus status register (I2CStat). . . . . . . . . . . 11
External clock input (SC18IS601). . . . . . . . . . 12
I2C-bus serial interface . . . . . . . . . . . . . . . . . . 12
Serial Peripheral Interface (SPI) . . . . . . . . . . . 12
SPI message format . . . . . . . . . . . . . . . . . . . . 13
Write N bytes to I2C-bus slave device. . . . . . . 13
Read N bytes from I2C-bus slave device . . . . 14
I2C-bus read after write. . . . . . . . . . . . . . . . . . 14
Read buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
I2C-bus write after write . . . . . . . . . . . . . . . . . 15
SPI configuration . . . . . . . . . . . . . . . . . . . . . . 15
Write to SC18IS600/601 internal registers . . . 16
Read from SC18IS600/601 internal register. . 16
Power-down mode . . . . . . . . . . . . . . . . . . . . . 17
6.2.1.1
6.2.1.2
6.2.1.3
6.2.1.4
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.3
6.4
6.5
6.6
6.6.1
6.6.2
6.6.3
6.6.4
6.6.5
6.6.6
6.6.7
6.6.8
6.6.9
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
Static characteristics. . . . . . . . . . . . . . . . . . . . 18
Dynamic characteristics . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
8
9
10
11
Soldering of SMD packages . . . . . . . . . . . . . . 25
Introduction to soldering . . . . . . . . . . . . . . . . . 25
Wave and reflow soldering . . . . . . . . . . . . . . . 25
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26
11.1
11.2
11.3
11.4
12
13
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 28
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 July 2008
Document identifier: SC18IS600_601_5
相关型号:
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