SL3S1204FTB0X_技术文档

SL3S1204

UCODE 7

Rev. 3.9 — 21 March 2017

241339

Product data sheet

COMPANY PUBLIC

1. General description

NXP’s UCODE 7 IC is the leading-edge EPC Gen2 RFID chip that offers best-in-class

performance and features for use in the most demanding RFID tagging applications.

Particularly well suited for inventory management application, like e.g Retail and Fashion,

with its leading edge RF performance for any given form factor, UCODE 7 enables long

read distance and fast inventory of dense RFID tag population. With its broadband design,

it offers the possibility to manufacture true global RFID label with best-in-class

performance over worldwide regulations.

The device also provides a pre-serialized 96-bit EPC and a Parallel encoding feature. For

applications where the same 58-bit Stock Keeping Unit (SKU) needs to be encoded on

multiple tags, at the same time, a combination of both features improves and simplifies the

tag initialization process.

On top UCODE 7 offers a Tag Power Indicator for RFID tag initialization optimization and

a Product Status Flag for Electronic Article Surveillance (EAS) application.

2. Features and benefits

2.1 Key features

 Read sensitivity 21 dBm

 Write sensitivity 16 dBm

 Parallel encoding mode: 100 items in 60ms

 Encoding speed: 16 bits per millisecond

 Innovative functionalities

 Tag Power Indicator

 Pre-serialization for 96-bit EPC

 Integrated Product Status Flag (PSF)

 Compatible with single-slit antenna

 Up to 128-bit EPC

 96-bit Unique Tag Identifier (TID) factory locked,

including 48-bit unique serial number

 EPC Gen2 v2.0 ready

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UCODE 7

2.1.1 Memory

 Up to 128-bit of EPC memory

 Supports pre-serialization for 96-bit EPC

 96-bit Tag IDentifier (TID) factory locked

 48-bit unique serial number factory-encoded into TID

 No User Memory

 32-bit kill password to permanently disable the tag

 32-bit access password

 Wide operating temperature range: 40 C up to +85 C

 Minimum 100.000 write cycle endurance

2.2 Key benefits

2.2.1 End user benefit

 Long READ and WRITE ranges due to leading edge chip sensitivity

 Very fast bulk encoding

 Product identification through unalterable extended TID range, including a 48-bit serial

number

 Reliable operation in dense reader and noisy environments through high interference

rejection

2.2.2 Antenna design benefits

 High sensitivity enables smaller and cost efficient antenna designs for the same retail

Tags

TAG n

All UCODE 7 tags receive the Command

aaa-006844

Fig 9. Illustration of Parallel encoding for 16-bit Write command

Use cases and benefits

Parallel encoding feature of UCODE 7 can enable ultra fast bulk encoding.

Taking in addition advantage of the pre-serialization scheme of UCODE 7, the same SKU

can be encoded in multiple tags as the EPC will be delivered pre-serialized already.

In the case of only one tag answering (like in printer encoding), this feature could be used

to save some overhead in commands to do direct EPC encoding after the handle reply.

Since this is a UCODE 7 specific feature the use of this features requires support on the

reader side.

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UCODE 7

10.6.5 Tag Power Indicator

Description

Upon a SELECT command on the “Tag Power Indicator”, located in the config word 204h,

an internal power check on the chip is performed to see if the power level is sufficient to

perform a WRITE command. The decision level is defined as nominal WRITE sensitivity

minus 1dB. In the case there is enough power, the SELECT command is matching and

non-matching if not enough power. The tag can then be singulated by the standard

inventory procedure.

Use cases and benefits

This feature gives the possibility to select only the tag(s) that receive enough power to be

written during e.g. printer encoding in a dense environment of tags even though the

reader may read more than one tag (see Figure 10 for illustration). The power level still

needs to be adjusted to transmit enough writing power to one tag only to do one tag

singulation.

Power level for READ/WRITE

too low/too low

OK/too low

Only this tag will select itself

OK/OK

OK/too low

too low/too low

aaa-005662

Fig 10. Selection of tags with Tag Power Indicator feature

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UCODE 7

10.6.6 Product Status Flag (PSF)

Description

The PSF is a general purpose bit located in the Configuration word at address 20Fh with a

value that can be freely changed.

Use cases and benefits

The PSF bit can be used as an EAS (Electronic Article Surveillance) flag, quality checked

flag or similar.

In order to detect the tag with the PSF activated, a EPC SELECT command selecting the

PSF flag of the Configuration word can be used. In the following inventory round only PSF

enabled chips will reply their EPC number.

10.6.7 Single-slit antenna solution

Description

In UCODE 7 the test pads TP1 and TP2 are electrically disconnected meaning they are

not electrically active and can be safely short-circuited to the RF pads RF1 and RF2 (see

Figure 11).

Standard assembly

Single-slit assembly

Supporting pads

aaa-005857

Fig 11. Standard antenna design versus single-slit antenna

Uses cases and benefits

Using single-slit antenna enables easier assembly and antenna design. Inlay

manufacturer will only have to take care about one slit of the antenna instead of two in

case all pads need to be disconnected from each other.

Additionally single-slit antenna assembly and the related increased input capacitance (see

Table 13) can be used advantageously over the standard antenna design as additional

room for optimization to different antenna design.

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UCODE 7

11. Limiting values

Table 12. Limiting values^[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Voltages are referenced to RFN

Symbol

Parameter

Conditions

Min

Max

Unit

Bare die limitations

T_stg

storage temperature

55

40

-

+125

+85

± 2

C

kV

T_amb

V_ESD

ambient temperature

[3]

electrostatic discharge

voltage

Human body model

Pad limitations

P_iinput power

maximum power

-

100

mW

dissipation, RFP pad

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any conditions other

than those described in the Operating Conditions and Electrical Characteristics section of this specification

is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maxima.

[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.

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UCODE 7

12. Characteristics

12.1 UCODE 7 bare die characteristics

Table 13. UCODE 7 RF interface characteristics (RF1, RF2)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

f_i

input frequency

840

-

960

MHz

[1][3][8]

[2]

P_i(min)

t 16bit

minimum input power

Encoding speed

READ sensitivity

WRITE sensitivity

16-bit

-

21

-16

1

-

dBm

ms

pF



[5]

32-bit (block write)

parallel

1.8

0.63

[3][4]

[6]

C_i

Z

Chip input capacitance

Chip impedance

866 MHz

14.5-j293 -

12.5-j277 -

12.5-j267 -

18-j245

915 MHz



953 MHz



Z

Typical assembled impedance ^[9]

Typical assembled impedance ^[9]in 915MHz

case of single-slit antenna assembly

915MHz



[6][7]

13.5-j195 -



[3][4]

C_i

Z

Chip input capacitance, Large Pads parallel

-

0.68

-

pF



Chip impedance, Large Pads

866 MHz

915 MHz

953 MHz

12.6-j267 -

11.8-j254

11.5-j244

-



Tag Power Indicator mode

P_i(min)minimum input power level to be

able to select the tag

[2]

-

-15

-

dBm

[1] Power to process a QUERY command

[2] Tag sensitivity on a 2dBi gain antenna

[3] Measured with a 50  source impedance directly on the chip

[4] At minimum operating power

[5] When the memory content is “0000...”.

[6] The antenna shall be matched to this impedance

[7] Depending on the specific assembly process, sensitivity losses of few tenths of dB might occur

[8] Results in approximately -21,5dBm tag sensitivity with a 2dBi gain antenna

[9] Assuming a 80fF additional input capacitance, 250fF in case of single slit antenna

Table 14. UCODE 7 memory characteristics

Symbol

Parameter

Conditions

Min

Typ

Max Unit

EEPROM characteristics

t_ret

retention time

T_amb55 C

20

-

year

N_endu(W)

write endurance

100k

cycle

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UCODE 7

12.2 UCODE 7 SOT886 characteristics

Table 15. UCODE 7 RF interface characteristics (RF1, RF1)

Symbol Parameter

P_i(min)minimum input power

Conditions

Min

Typ

Max Unit

[1][2]

[3]

READ

sensitivity

-

21

-

dBm

Z

impedance

915 MHz

-

12.8 -j248

-



[1] Power to process a Query command.

[2] Measured with a 50  source impedance.

[3] At minimum operating power.

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UCODE 7

13. Package outline

XSON6: plastic, extremely thin small outline package; no leads;

6 terminals; body 1.0 x 1.45 x 0.5 mm

SOT886-1

X

A

1

D

B

A

E

detail X

terminal 1

index area

terminal 1

e

C

y

1

index area

v

w

C A

C

B

y

b

C

1

L

2

1

6

3

L

1

e

L

4

0

2 mm

scale

Dimensions (mm are the original dimensions)

Unit

A

1

b

D

E

e

L

v

w

y

1

2

max 0.50 0.05 0.25 1.50 1.05

0.35 0.40 0.10

0.20 1.45 1.00 0.6 1.0 0.30 0.35 0.05 0.10 0.05 0.05 0.05

0.00 0.17 1.40 0.95 0.27 0.32 0.02

mm nom

min

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

sot886-1_po

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

13-07-03

13-07-10

SOT886-1

Fig 12. Package outline SOT886

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UCODE 7

14. Packing information

14.1 Wafer

See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-S&C document number: 1093**”

See Ref. 23 “Data sheet - Delivery type description – General specification for 12” wafer

on UV-tape with electronic fail die marking, BU-S&C document number: 1862**”

14.2 SOT886

See: www.nxp.com/packages/SOT886.html

15. Abbreviations

Table 16. Abbreviations

Acronym

CRC

Description

Cyclic Redundancy Check

CW

Continuous Wave

DSB-ASK

DC

Double Side Band-Amplitude Shift Keying

Direct Current

EAS

Electronic Article Surveillance

Electrically Erasable Programmable Read Only Memory

EEPROM

EPC

Electronic Product Code (containing Header, Domain Manager, Object Class

and Serial Number)

FM0

G2

Bi phase space modulation

Generation 2

IC

Integrated Circuit

PIE

PSF

RF

Pulse Interval Encoding

Product Status Flag

Radio Frequency

UHF

SECS

TID

Ultra High Frequency

Semi Equipment Communication Standard

Tag IDentifier

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UCODE 7

16. References

[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF

RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0

(December 17, 2005)

[2] EPCglobal: EPC Tag Data Standards

[3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft)

[4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference

(draft)

[5] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment operating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 1 – Technical characteristics and test methods

[6] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment operating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive

[7] [CEPT1]: CEPT REC 70-03 Annex 1

[8] [ETSI1]: ETSI EN 330 220-1, 2

[9] RTCal is the Interrogator-to-Tag calibration symbol length defined in the EPCglobal

specification

[10] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility

And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment

operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:

Technical characteristics and test methods.

[11] [FCC1]: FCC 47 Part 15 Section 247

[12] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International

Standards

[13] ISO/IEC 3309: Information technology – Telecommunications and information

exchange between systems – High-level data link control (HDLC) procedures –

Frame structure

[14] ISO/IEC 15961: Information technology, Automatic identification and data capture –

Radio frequency identification (RFID) for item management – Data protocol:

application interface

[15] ISO/IEC 15962: Information technology, Automatic identification and data capture

techniques – Radio frequency identification (RFID) for item management – Data

protocol: data encoding rules and logical memory functions

[16] ISO/IEC 15963: Information technology — Radio frequency identification for item

management — Unique identification for RF tags

[17] ISO/IEC 18000-1: Information technology — Radio frequency identification for item

management — Part 1: Reference architecture and definition of parameters to be

standardized

[18] ISO/IEC 18000-6: Information technology automatic identification and data capture

techniques — Radio frequency identification for item management air interface —

Part 6: Parameters for air interface communications at 860–960 MHz

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UCODE 7

[19] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary

– Part 3: radio-frequency identification (RFID)

[20] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:

Radio-frequency devices, U.S. Federal Communications Commission.

[21] Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-S&C document number: 1093**¹

[22] Application note - AN11274 – FAQ on UCODE 7

[23] Data sheet - Delivery type description – General specification for 12” wafer on

UV-tape with electronic fail die marking, BU-S&C document number: 1862**

1. ** ... document version number

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17. Revision history

Table 17. Revision history

Document ID

SL3S1204 v. 3.9

Modifications:

Release date

20170321

Data sheet status

Change notice Supersedes

- SL3S1204 v. 3.8

Product data sheet

• Introduction of Large Pads

• Table 1 “Ordering information” :updated

• Section 8.2 “Wafer layout 8 inch with large pads”: added

• Section 9.1.2 “8 inch Wafer, Large pads”: added

• Table 13 “UCODE 7 RF interface characteristics (RF1, RF2)”: updated

SL3S1204 v. 3.8

Modifications:

20161011

Product data sheet

-

SL3S1204 v. 3.7

• Figure 7 “UCODE 7 TID memory structure”: updated

• Figure 12 “Package outline SOT886”: updated

• Editorial changes

SL3S1204 v. 3.7

Modifications:

20160718

• Update Automatic Pre-serialization functionality

• Figure 7 “UCODE 7 TID memory structure” - change of TID

20160524 Product data sheet

Product data sheet

-

SL3S1204 v. 3.6

SL3S1204 v. 3.5

SL3S1204 v. 3.6

Modifications:

-

• Introduction of 12 inch wafer delivery

• Section 8.3 “Wafer layout 12 inch”: added

• Section 9.1.3 “12 inch Wafer”: added

• Section 14.2 “SOT886”: added

• Table 15 “UCODE 7 RF interface characteristics (RF1, RF1)”: impedance value added

SL3S1204 v. 3.5

Modifications:

SL3S1204 v. 3.4

Modifications:

20150706

Product data sheet

-

SL3S1204 v. 3.4

• SOT886 package added

20141017

Product data sheet

-

SL3S1204 v. 3.3

• Table 9 “UCODE 7 overall memory map”: corrected

• Editorial changes

SL3S1204 v. 3.3

Modifications:

SL3S1204 v. 3.2

Modifications:

SL3S1204 v. 3.1

Modifications:

241330

20131217

Product data sheet

-

SL3S1204 v. 3.2

• Figure 7 “Automatic self pre-serialization scheme for 96-bit EPC”: corrected

20131120 Product data sheet SL3S1204 v. 3.1

• Security level changed from “COMPANY PROPRIETARY” to “COMPANY PUBLIC”

20130603 Product data sheet 241330

• Security level changed from “COMPANY CONFIDENTIAL” to “COMPANY PROPRIETARY”

-

20130522

Product data sheet

-

241312

Modifications

• Editorial changes

• Figure 4 “UCODE 7 8 inch wafer layout”: updated

• Table 9 “UCODE 7 overall memory map”: updated

• Table 10 “Configuration word UCODE 7”: updated

• Table 13 “UCODE 7 RF interface characteristics (RF1, RF2)”: updated

241312

20130422

Objective data sheet

241311

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UCODE 7

Table 17. Revision history …continued

Document ID

Release date

Data sheet status

Change notice Supersedes

Modifications

• Editorial changes

• Figure 7 “UCODE 7 TID memory structure”: updated

• Figure 7 “Automatic self pre-serialization scheme for 96-bit EPC”: updated

• Figure 10 “Selection of tags with Tag Power Indicator feature”: updated

• Figure 11 “Standard antenna design versus single-slit antenna”: updated

241311

20130325

Objective data sheet

241310

Modifications

241310

General Update

20130226

Objective data sheet

-

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18. Legal information

18.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

18.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

18.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

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UCODE 7

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

18.4 Trademarks

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

UCODE — is a trademark of NXP Semiconductors N.V.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

SL3S1204

All information provided in this document is subject to legal disclaimers.

Product data sheet

COMPANY PUBLIC

Rev. 3.9 — 21 March 2017

241339

33 of 34

SL3S1204

NXP Semiconductors

UCODE 7

20. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

Use cases and benefits . . . . . . . . . . . . . . . . . . 21

Tag Power Indicator . . . . . . . . . . . . . . . . . . . . 22

Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Use cases and benefits . . . . . . . . . . . . . . . . . . 22

Product Status Flag (PSF) . . . . . . . . . . . . . . 23

Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Use cases and benefits . . . . . . . . . . . . . . . . . . 23

Single-slit antenna solution . . . . . . . . . . . . . . 23

Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Uses cases and benefits . . . . . . . . . . . . . . . . . 23

10.6.5

10.6.6

10.6.7

2

2.1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2

Antenna design benefits . . . . . . . . . . . . . . . . . . 2

Label manufacturer benefit. . . . . . . . . . . . . . . . 2

Supported features. . . . . . . . . . . . . . . . . . . . . . 2

2.1.1

2.2

2.2.1

2.2.2

2.2.3

2.3

3

3.1

3.2

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Markets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

11

Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 24

12

12.1

12.2

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25

UCODE 7 bare die characteristics. . . . . . . . . 25

UCODE 7 SOT886 characteristics. . . . . . . . . 26

4

Ordering information. . . . . . . . . . . . . . . . . . . . . 3

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Pinning information. . . . . . . . . . . . . . . . . . . . . . 6

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

5

13

Package outline. . . . . . . . . . . . . . . . . . . . . . . . 27

6

14

14.1

14.2

Packing information . . . . . . . . . . . . . . . . . . . . 28

Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

SOT886 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

7

7.1

8

Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Wafer layout 8 inch. . . . . . . . . . . . . . . . . . . . . . 7

Wafer layout 8 inch with large pads . . . . . . . . . 8

Wafer layout 12 inch. . . . . . . . . . . . . . . . . . . . . 9

15

16

17

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 28

References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Revision history . . . . . . . . . . . . . . . . . . . . . . . 31

8.1

8.2

8.3

18

Legal information . . . . . . . . . . . . . . . . . . . . . . 33

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 34

9

9.1

9.1.1

9.1.2

9.1.3

9.1.4

9.1.5

Mechanical specification . . . . . . . . . . . . . . . . 10

Wafer specification . . . . . . . . . . . . . . . . . . . . . 10

8 inch Wafer, Standard bumps . . . . . . . . . . . . 10

8 inch Wafer, Large pads . . . . . . . . . . . . . . . . 11

12 inch Wafer . . . . . . . . . . . . . . . . . . . . . . . . . 12

Fail die identification . . . . . . . . . . . . . . . . . . . 13

Map file distribution. . . . . . . . . . . . . . . . . . . . . 13

18.1

18.2

18.3

18.4

19

20

Contact information . . . . . . . . . . . . . . . . . . . . 34

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

10

10.1

10.2

10.3

10.3.1

10.3.2

10.4

Functional description . . . . . . . . . . . . . . . . . . 14

Air interface standards . . . . . . . . . . . . . . . . . . 14

Power transfer . . . . . . . . . . . . . . . . . . . . . . . . 14

Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 14

Interrogator to tag Link . . . . . . . . . . . . . . . . . . 14

Tag to interrogator Link. . . . . . . . . . . . . . . . . . 14

Supported commands . . . . . . . . . . . . . . . . . . 15

UCODE 7 memory . . . . . . . . . . . . . . . . . . . . . 15

UCODE 7 overall memory map . . . . . . . . . . . 16

UCODE 7 TID memory details . . . . . . . . . . . . 17

Supported features. . . . . . . . . . . . . . . . . . . . . 18

UCODE 7 features control mechanism. . . . . . 18

Backscatter strength reduction. . . . . . . . . . . . 19

Pre-serialization of the 96-bit EPC . . . . . . . . . 19

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Use cases and benefits . . . . . . . . . . . . . . . . . .19

Parallel encoding . . . . . . . . . . . . . . . . . . . . . . 19

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

10.5

10.5.1

10.5.2

10.6

10.6.1

10.6.2

10.6.3

10.6.4

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 21 March 2017

241339


型号：	SL3S1204FTB0X
厂家：	NXP
描述：	SL3S1204 - UCODE 7 SON 6-Pin
文件：	总34页 (文件大小：862K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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