SOT527-1 [NXP]
Package outline; 包装外形
| 型号： | SOT527-1 |
| 厂家： | 
NXP |
| 描述： | Package outline |
| 文件： | 总1页 (文件大小：16K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PDF: 2003 Apr 07
Philips Semiconductors
Package outline
HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads;
body width 4.4 mm; exposed die pad
SOT527-1
D
E
A
X
c
y
H
v
M
A
exposed die pad side
E
D
h
Z
11
20
(A )
3
A
2
A
E
h
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
D
E
E
e
H
L
L
p
v
w
y
Z
θ
1
2
3
p
h
h
E
max.
8o
0o
0.15 0.95
0.05 0.80
0.30 0.20 6.6
0.19 0.09 6.4
4.3
4.1
4.5
4.3
3.1
2.9
6.6
6.2
0.75
0.50
0.5
0.2
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-02-18
03-04-07
SOT527-1
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