SOT545-3 [NXP]
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad; 塑料的热enganced薄型四方扁平封装; 48线索;身体7 ×7× 1毫米;裸露的芯片焊盘
| 型号： | SOT545-3 |
| 厂家： | 
NXP |
| 描述： | plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad |
| 文件： | 总1页 (文件大小：20K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PDF: 2004 Feb 05
Philips Semiconductors
Package outline
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
SOT545-3
c
y
exposed die pad side
X
D
h
36
25
A
24
37
Z
E
e
H
E
E
E
(A )
3
h
A
2
A
A
1
w M
θ
b
p
L
p
L
pin 1 index
13
48
detail X
1
12
w M
Z
v
v
M
M
A
B
D
b
p
e
D
B
H
D
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
D
E
E
e
H
H
E
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
h
h
D
p
D
max.
0.15 1.05
0.05 0.95
0.27 0.20 7.1
0.17 0.09 6.9
3.6
3.4
7.1
6.9
3.6
3.4
9.1
8.9
9.1
8.9
0.75
0.45
0.9
0.6
0.9
0.6
7°
0°
mm
1.2
0.25
0.5
1
0.2 0.08 0.08
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
SOT545-3
MS-026
04-02-05
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