SOT685-1 [NXP]
Package outline; 包装外形
| 型号： | SOT685-1 |
| 厂家： | 
NXP |
| 描述： | Package outline |
| 文件： | 总1页 (文件大小：14K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PDF: 2002 Nov 27
Philips Semiconductors
Package outline
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 6 x 5 x 0.85 mm
SOT685-1
0
2.5
5 mm
X
scale
B
A
D
A
A
1
c
E
detail X
terminal 1
index area
C
e
terminal 1
index area
1
y
y
b
v
e
M
M
C
C
A
B
C
1
1
4
w
L
E
h
exposed tie bar (4×)
e
h
8
5
D
h
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
A
UNIT
A
b
c
E
e
e
e
h
y
D
D
E
L
v
w
y
1
1
h
1
h
max.
0.05
0.00
0.5
0.3
5.15 3.95 6.15 3.65
4.85 3.65 5.85 3.35
0.75
0.50
mm
0.05
0.1
1
0.2
1.27
3.81 0.35
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-08-12
02-11-27
SOT685-1
- - -
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