SSL2102 [NXP]
Mains LED driver IC for dimmable LED lighting; 市电LED驱动器IC,用于可调光LED照明型号: | SSL2102 |
厂家: | NXP |
描述: | Mains LED driver IC for dimmable LED lighting |
文件: | 总21页 (文件大小:109K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SSL2102
Mains LED driver IC for dimmable LED lighting
Rev. 01 — 29 June 2009
Product data sheet
1. General description
The SSL2102 is a Switched Mode Power Supply (SMPS) controller IC that operates in
combination with a phase cut dimmer directly from rectified mains. It is designed to drive
LED devices. The device includes a high-voltage power switch and a circuit to allow direct
start-up from the rectified mains voltage. Furthermore the device includes high-voltage
circuitry to supply the phase cut dimmer.
For dimmer applications, integrated dedicated circuitry optimizes the dimming curve.
2. Features
I Easy migration to existing lighting control infrastructure, TRIAC and transistor dimmers
I Supports majority of available dimming solutions
I Valley switching efficiency is optimized by dedicated built-in circuitry
I Built-in demagnetization detection
I The IC has Over Temperature Protection (OTP) built-in
I Short-Winding Protection (SWP) and Over Current Protection (OCP)
I The IC has internal VCC generation that allows start-up from rectified mains voltage
I Natural dimming curve by logarithmic correction
I Limited external components required due to high integration level
I Thermal enhanced SO20 wide body package.
3. Applications
The SSL2102 is suitable for high efficiency and high power factor SSL applications below
25 W, these include:
I SSL retro-fit lamps (e.g. GU10, E27) from 8 W to 15 W.
I LED modules, separate power supplies, e.g. LED spots, down-lights from 15 W to
25 W
I LED strings, e.g. retail display up to a maximum of 25 W
For power ratings below 15 W (for LED modules) and 8 W (for SSL retrofit) NXP offers the
SSL2101.
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
4. Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min Typ
Max
Unit
RDSon
drain-source on-state
power switch; ISOURCE = −0.50 A
resistance
Tj = 25 °C
4.5 6.5
7.5
Ω
ISOURCE = −0.20 A
Tj = 125 °C
-
9.5
10
Ω
VCC
supply voltage
8.5
10
-
-
40
V
fosc
oscillator frequency
current on pin DRAIN
100
-
200
2.2
kHz
mA
IDRAIN
VDRAIN > 60 V;
no auxiliary supply
VDRAIN > 60 V;
-
30
125
µA
with auxiliary supply
VDRAIN
δmin
voltage on pin DRAIN
minimum duty factor
maximum duty cycle
ambient temperature
40
-
600
V
-
0
75
-
-
-
%
%
δmax
-
Tamb
−40
+100 °C
5. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
SOT163-1
SSL2102T
SO20
plastic small outline package; 20 leads; body width 7.5 mm
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
2 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
6. Block diagram
ISENSE
SBLEED WBLEED
12
1
4
BLEEDER
5
20
V
SUPPLY
DRAIN
CC
VALLEY
13
AUX
LOGIC
2, 3, 6, 7, 14,
16, 17, 18, 19
100 mV
GND
RC
Stop
10
OSCILLATOR
Low freq
15
SOURCE
Blank
THERMAL
SHUTDOWN
PROTECTION
LOGIC
POWER - UP
RESET
0.5 V
8
9
BRIGHTNESS
RC2
FRC
1.5 V
Overcurrent
PWM
LIMIT
CIRCUIT
11
PWMLIMIT
Short-winding protection
014aaa810
Fig 1. Block diagram
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
3 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
7. Pinning information
7.1 Pinning
1
2
20
19
18
17
16
15
14
13
12
11
SBLEED
GND
DRAIN
GND
3
GND
GND
4
WBLEED
GND
5
V
CC
GND
SSL2102
6
GND
GND
SOURCE
GND
7
8
BRIGHTNESS
RC2
AUX
9
ISENSE
PWMLIMIT
10
RC
014aaa807
Fig 2. Pin configuration SO20
7.2 Pin description
Table 3.
Pin description
Symbol
SBLEED
GND
Pin
1
Description
drain of internal strong bleeder switch
ground
2
GND
3
ground
WBLEED
VCC
4
drain of internal weak bleeder switch
supply voltage
5
GND
6
ground
GND
7
ground
BRIGHTNESS
RC2
8
brightness input
9
setting for frequency reduction
frequency setting
RC
10
11
12
13
PWMLIMIT
ISENSE
AUX
PWM limit input
current sense input for WBLEED
Input for voltage from auxiliary winding for timing
(demagnetization)
GND
14
15
16
17
18
19
20
ground
SOURCE
GND
source of internal power switch
ground
ground
ground
ground
GND
GND
GND
DRAIN
drain of internal power switch; input for start-up current and valley
sensing
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
4 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
8. Functional description
The SSL2102 is a LED driver IC that operates directly from the rectified mains.
The SSL2102 uses on-time mode control and frequency control to control the LED
brightness. The BRIGHTNESS and PWMLIMIT input of the IC can be used to control the
LED light output in combination with an external dimmer. The PWMLIMIT input can also
be used for Thermal Lumen Management (TLM) and for precision LED current control.
8.1 Start-up and UnderVoltage LockOut (UVLO)
Initially, the IC is self-supplying from the rectified mains voltage. The IC starts switching as
soon as the voltage on pin VCC passes the VCC(startup) level. The supply can be taken over
by the auxiliary winding of the transformer as soon as VCC is high enough and the supply
from the line is stopped for high efficiency operation. Alternatively the IC can be supplied
via a bleeder resistor connected to a high voltage.
Remark: The maximum VCC voltage rating of the IC.
If for some reason the auxiliary supply is not sufficient, the high-voltage supply can also
supply the IC. As soon as the voltage on pin VCC drops below the VCC(UVLO) level, the IC
stops switching and will restart from the rectified mains voltage, if the internal current
delivered is sufficient.
8.2 Oscillator
An internal oscillator inside the IC provides the timing for the switching converter logics.
The frequency of the oscillator is set by the external resistors and the capacitor on pin RC
and pin RC2. The external capacitor is charged rapidly to the VRC(max) level and, starting
from a new primary stroke, it discharges to the VRC(min) level. Because the discharge is
exponential, the relative sensitivity of the duty factor to the regulation voltage at low duty
factor is almost equal to the sensitivity at high duty factors. This results in a more constant
gain over the duty factor range compared to Pulse Width Modulated (PWM) systems with
a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. The
frequency of the converter when VBRIGHTNESS is high can be estimated using Equation 1:
1
1
RC =
– t
(1)
------
3.5
---------
f osc
ch arge
R equals the parallel resistance of both oscillator resistors. C is the capacitor connected at
the RC pin (pin 8).
The BRIGHTNESS input controls the frequency reduction mode. Figure 3 shows that the
oscillator switches over from an RC curve with R1//R2 to R1 only. A low BRIGHTNESS
voltage will reduce the switching frequency.
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
5 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
5 V
STARplug
OSCILLATOR
RC
24 µA
R1
R2
220 kΩ
10 kΩ
BRIGHTNESS
Comparator
C1
330 pF
RC2
V
V
rc_threshold
014aaa574
Fig 3. Brightness control block
A typical RC waveform is given in Figure 4. The RC switch-over threshold is controlled by
the BRIGHTNESS pin.
To ensure that the capacitor can be charged within the charge time, the value of the
oscillator capacitor should be limited to 1 nF. Leakage current limits the value of the
resistor connected between the RC pin and the ground should be limited to a maximum of
220 kΩ.
Voltage
(mV)
RC voltage
rc_threshhold
75 mV
014aaa582
time
Fig 4. Brightness timing waveform.
8.3 Duty factor control
The duty factor is controlled by an internally regulated voltage and the oscillator signal on
pin RC. The internal regulation voltage is set by the voltage on the PWMLIMIT pin.
A low PWMLIMIT voltage will results in a low on-time for the internal power switch. The
minimum duty factor of the switched mode power supply can be set to 0 %. The maximum
duty factor is set to 75 %.
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
6 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
8.4 Bleeder for dimming applications
The SSL2102 IC contains some circuitry intended for mains dimmer compatibility. This
circuit contains two current sinks that are called bleeders. A strong bleeder is used for
zero-cross reset of the dimmer and TRIAC latching. A weak bleeder is added to maintain
the hold current through the dimmer.
The strong bleeder switch is switched on when the maximum voltage on the WBLEED pin
and the SBLEED pin is below the Vth(SBLEED) level (52 V typically). The weak bleeder
switch is switched on as soon as the voltage on pin ISENSE exceeds the Vth(high)(ISENSE)
level (−100 mV typically). The weak bleeder switch is switched off when the ISENSE
voltage drops below the Vth(low)(ISENSE) level (−250 mV typically). The weak bleeder switch
is also switched off when the strong bleeder switch is switched on. See Figure 5.
WBLEED
SBLEED
D2
D3
Integrated
I1
20 µA
B1
LOW V DETECT
M2
M1
Q
S R
OR
−0.1 V
−0.25 V
ISENSE
GND
014aaa571
Fig 5. Bleeder circuit
8.5 Valley switching
A new cycle is started when the primary switch is switched on (see Figure 6). After a time
determined by the oscillator voltage, RC and the internal regulation level, the switch is
turned off and the secondary stroke starts. The internal regulation level is determined by
the voltage on pin PWMLIMIT.
After the secondary stroke, the drain voltage shows an oscillation with a frequency of
approximately:
1
(2)
----------------------------------------------
2 × π × (Lp × Cp)
where:
Lp = primary self inductance
Cp = parasitic capacitance on drain node
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
7 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
As soon as the oscillator voltage is high again and the secondary stroke has ended, the
circuit waits for a low drain voltage before starting a new primary stroke.
Figure 6 shows the drain voltage together with the valley signal, the signal indicating the
secondary stroke and the RC voltage.
The primary stroke starts some time before the actual valley at low ringing frequencies,
and some time after the actual valley at high ringing frequencies.
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
A
B
regulation level
RC
oscillator
014aaa572
A: Start of new cycle with valley switching.
B: Start of new cycle in a classical PWM system.
Fig 6. Signals for valley switching, flyback configuration
Figure 7 shows a typical curve for a reflected output voltage N at an output voltage of
80 V. This voltage is the output voltage transferred to the primary side of the transformer
with the factor N (determined by the turns ratio of the transformer). It shows that the
system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus
reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is
started at 33 ° before the valley. The switch-on losses are still reduced significantly.
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
8 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
014aaa573
40
phase
(°)
20
0
−20
−40
0
200
400
600
800
f (kHz)
(1) At N × Vo = 80 V)
Fig 7. Typical phase of drain ringing at switch-on (at
8.6 Demagnetization
The system operates in discontinuous conduction mode if the AUX pin is connected. As
long as the secondary stroke has not ended, the oscillator will not start a new primary
stroke. During the first tsup(xfmr_ring) seconds, demagnetization recognition is suppressed.
This suppression may be necessary in applications where the transformer has a large
leakage inductance and at low output voltages.
8.7 Overcurrent protection
The cycle-by-cycle peak drain current limit circuit uses the external source resistor
RSENSE1 to measure the current. The circuit is activated after the leading edge blanking
time tleb. The protection circuit limits the source voltage over the RSENSE resistor to
Vth(ocp)SOURCE and thus limits the primary peak current.
8.8 Short-winding protection
The short-winding protection circuit is also activated after the leading edge blanking time.
If the source voltage exceeds the short-winding protection threshold voltage
Vth(swp)SOURCE, the IC stops switching. Only a power-on reset will restart normal operation.
The short-winding protection also protects in case of a secondary diode short circuit.
8.9 Overtemperature protection
Accurate temperature protection is provided in the device. When the junction temperature
exceeds the thermal shut-down temperature, the IC stops switching. During thermal
protection, the IC current is lowered to the start-up current. The IC continues normal
operation as soon as the overtemperature situation has disappeared.
1. RSENSE is the resistor between the SOURCE pin and GND
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
9 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground; positive currents flow into the device; pins VCC and RC cannot be current
driven. Pins ISENSE and AUX cannot be voltage driven.
Symbol
Voltages
VCC
Parameter
Conditions
Min
Max
Unit
supply voltage
continuous
−0.4
−0.4
−0.4
−0.4
−0.4
−0.4
−0.4
+40
+3
V
V
V
V
V
V
V
VRC
voltage on pin RC
voltage on pin RC2
VRC2
+3
VBRIGHTNESS voltage on pin BRIGHTNESS
+5
VPWMLIMIT
VSOURCE
VDRAIN
voltage on pin PWMLIMIT
voltage on pin SOURCE
voltage on pin DRAIN
+5
+5
DMOS power
transistor;
+600
T
amb = 25 °C
VSBLEED
voltage on pin SBLEED
voltage on pin WBLEED
off-state;
Tj = 125 °C
−0.4
−0.4
+600
+16
V
V
on-state;
VVCC > 8.5 V;
Tj < 125 °C
VWBLEED
off-state;
Tj < 125 °C
−0.4
−0.4
+600
+12
V
V
on-state;
VVCC > 8.5 V;
Tj < 125 °C
Currents
IISENSE
IAUX
current on pin ISENSE
current on pin AUX
−20
−10
−2
+5
+5
+2
+2
mA
mA
A
ISOURCE
IDRAIN
General
Ptot
current on pin SOURCE
current on pin DRAIN
−2
A
total power dissipation
storage temperature
ambient temperature
junction temperature
Tamb = 70 °C
-
1.6
W
Tstg
−55
−40
−40
+150
+100
+150
°C
°C
°C
Tamb
Tj
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
10 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground; positive currents flow into the device; pins VCC and RC cannot be current
driven. Pins ISENSE and AUX cannot be voltage driven.
Symbol
Parameter
Conditions
Min
Max
Unit
[1]
VESD
electrostatic discharge voltage
human body
model;
Pins 20, 1, 4
All other pins
−1000 +1000
−2000 +2000
V
V
V
V
[2]
[3]
machine model
−200
−500
+200
+500
charged device
model
[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[2] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω series
resistor.
[3] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 Ω resistor.
10. Thermal characteristics
The heat sink for SSL2102 applications is provided by the Printed-Circuit Board (PCB)
copper. The SSL2102 uses thermal leads (pins 2, 3, 6, 7,16, 17, 18 and 19) for heat
transfer from the die to PCB.
Enhanced thermal lead connection may drastically reduce thermal resistance.
The following equation shows the relationship between the maximum allowable power
dissipation P and the thermal resistance from junction to ambient.
Rth( j – a) = (T j(max) – Tamb) ⁄ P
Where:
Rth(j-a) = thermal resistance from junction to ambient
Tj(max) = maximum junction temperature
Tamb = ambient temperature
P = power dissipation
The thermal resistance as a function of the PCB area (Board: 0.8 mm thickness, 2 layers,
Bottom Cu coverage 90 %, Cu thickness 70 µm
(390 W/mK), Core material conductivity: 0.5 W/mK, 10 vias dia 0.3 mm) is shown in
Figure 8
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
11 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
014aaa812
100
Rth(j-a)
(°C/W)
80
60
40
20
(1)
(2)
(3)
0
2000
4000
6000
8000
10000
2
PCB area (mm )
(1) Top Cu coverage 20 %
(2) Top Cu coverage 50 %
(3) Top Cu coverage 100 %
Fig 8. SSL2102 core material conductivity
Table 5:
Symbol Parameter
Rth(j-a) thermal resistance from junction to ambient
Thermal characteristics
Conditions
Typ
Unit
[1]
62
KW
[1] Measured on a JEDEC test board (standard EIA/JESD 51-3) in free air with natural convection.
11. Characteristics
Table 6.
Characteristics
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are
positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless
otherwise specified. Typical frequency 100 kHz.
Symbol
Supply
ICC
Parameter
Conditions
Min
Typ
Max
Unit
supply current
normal operation;
-
1.7
2
mA
V
V
DRAIN = 60 V;
CC = 20 V
ICC(ch)
charge supply
current
VDRAIN > 60 V;
CC = 0 V
-6
−4.5
-
mA
V
VCC
supply voltage
8.5
-
40
V
V
VCC(startup)
start-up supply
voltage
9.75 10.25 10.75
VCC(UVLO)
undervoltage
lockout supply
voltage
7.9 8.2 8.5
V
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
12 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
Table 6.
Characteristics …continued
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are
positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless
otherwise specified. Typical frequency 100 kHz.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDRAIN
current on pin
DRAIN
VDRAIN > 60 V;
no auxiliary supply
-
-
2.2
mA
VDRAIN > 60 V;
with auxiliary supply
-
30
-
125
600
µA
VDRAIN
voltage on pin
DRAIN
40
V
Pulse width modulator
δmin
minimum duty
factor
-
-
0
-
-
%
%
δmax
maximum duty
cycle
f = 100 kHz
75
SOPS
Vdet(demag)
demagnetization
detection voltage
50
100
1.5
150
2.0
mV
tsup(xfmr_ring)
transformer
ringing
at start of secondary
stroke
1.0
µs
suppression time
RC oscillator
VRC(min)
minimum voltage
on pin RC
60
2.4
-
75
2.5
1
90
2.6
-
mV
V
VRC(max)
tch(RC)
maximum voltage
on pin RC
charge time on pin
RC
µs
VBRIGHTNESS
voltage on pin
BRIGHTNESS
2.5 V RC2 trip level
180 mV RC2 trip level
75 mV RC2 trip level
-
0.5
-
V
-
1.25
2.3
-
V
-
-
V
fosc
oscillator
10
100
200
kHz
frequency
IBRIGHTNESS
current on pin
BRIGHTNESS
VBRIGHTNESS = 0 V
−20
−24
−28
µA
Bleeder
Vth(SBLEED)
threshold voltage
on pin SBLEED
46
-
52
56
-
V
Vth(low)ISENSE
Vth(high)ISENSE
RDSon(SBLEED)
low threshold
voltage on pin
ISENSE
−250
mV
high threshold
voltage on pin
ISENSE
-
−100
-
mV
drain-source
on-state
resistance on pin
SBLEED
I
SBLEED = 25 mA
Tj = 25 °C
140
220
170
270
200
320
Ω
Ω
Tj = 125 °C
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
13 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
Table 6.
Characteristics …continued
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are
positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless
otherwise specified. Typical frequency 100 kHz.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RDSon(WBLEED) drain-source
on-state
I
WBLEED = 10 mA
Tj = 25 °C
250
400
310
500
350
600
Ω
Ω
resistance on pin
WBLEED
Tj = 125 °C
Duty factor regulator: pin PWMLIMIT
IPWMLIMIT
current on pin
PWMLIMIT
−25
-
−18
µA
V
VPWMLIMIT
voltage on pin
PWMLIMIT
maximum duty cycle =
3 V
-
-
3
-
-
minimum duty factor
threshold
0.45
V
Valley switching
[1]
(∆V/∆t)vrec
valley recognition minimum absolute
-
100
-
V/µs
voltage change
with time
value
fring
ringing frequency N × VO = 100 V
200
-
550
150
800
-
kHz
ns
td(vrec-swon)
valley recognition
to switch-on delay
time
Current and short circuit winding protection
Vth(ocp)SOURCE
overcurrent
protection
threshold voltage
on pin SOURCE
dV/dt = 0.1 V/µs
dV/dt = 0.1 V/µs
dV/dt = 0.5 V/µs
0.47 0.50
0.53
-
V
Vth(swp)SOURCE short-winding
protection
-
1.5
V
threshold voltage
on pin SOURCE
td(ocp-swoff)
delay time from
overcurrent
protection to
switch-off
-
160
350
185
450
ns
ns
tleb
leading edge
blanking time
250
FET output stage
IL(DRAIN)
leakage current on VDRAIN = 600 V
pin DRAIN
-
-
-
125
-
µA
VBR(DRAIN)
breakdown
voltage on pin
DRAIN
Tamb = 25 °C
600
V
RDSon
drain-source
on-state
resistance
power switch; ISOURCE = −0.50 A
Tj = 25 °C
4.50 6.5
7.5
-
Ω
Ω
ISOURCE = −0.20 A
Tj = 125 °C
-
9.5
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
14 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
Table 6.
Characteristics …continued
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are
positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless
otherwise specified. Typical frequency 100 kHz.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tf(DRAIN)
fall time on pin
DRAIN
input voltage: 300 V;
no external capacitor at
drain
-
75
-
ns
Temperature protection
Totp
overtemperature
protection trip
junction temperature
junction temperature
150
-
160
2
170
-
°C
°C
Totp(hys)
overtemperature
protection trip
hysteresis
[1] Voltage change in time for valley recognition.
100
f
max
80
60
f
osc
(kHz)
40
20
f
min
0
0
1
2
3
V
(V)
BRIGHTNESS
014aaa664
Fig 9. Typical frequency as a function of voltage on pin BRIGHTNESS
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
15 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
12
t
(µs)
on
8
4
0
0
1
2
3
V
(V)
PWMLIMIT
014aaa665
VBRIGHTNESS = 3 V
Fig 10. Turn-on time as a function of voltage on pin PWMLIMIT
120
t
on
(µs)
80
40
0
0
1
2
3
V
(V)
PWMLIMIT
014aaa666
VBRIGHTNESS = 1 V
Fig 11. Turn-on time as a function of voltage on pin PWMLIMIT
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
16 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
12. Application information
L1
LED +
RGND
N
LED −
SBleed
1
DRAIN
TC
20
19
18
17
16
15
14
13
12
11
TC
2
TC
3
TC
WBleed
4
TC
VCC
VCC
5
TC
GND
6
Source
TC
GND
7
Brightness
8
Aux
RC2
9
lsense
PWMLimit
RC
10
SSL2102/SO20-W
RGND
014aaa823
Fig 12. Application example SSL2102
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
17 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
13. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
2.65
0.1
0.25
0.01
1.27
0.05
1.4
0.25
0.01
0.25
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT163-1
075E04
MS-013
Fig 13. Package outline SOT163-1 (SO20)
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
18 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
14. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SSL2102_1
20090629
Product data sheet
-
-
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
19 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SSL2102_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 29 June 2009
20 of 21
SSL2102
NXP Semiconductors
SMPS IC for dimmable LED lighting
17. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Functional description . . . . . . . . . . . . . . . . . . . 5
Start-up and UnderVoltage LockOut (UVLO) . . 5
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 6
Bleeder for dimming applications . . . . . . . . . . . 7
Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 7
Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 9
Overcurrent protection . . . . . . . . . . . . . . . . . . . 9
Short-winding protection. . . . . . . . . . . . . . . . . . 9
Overtemperature protection . . . . . . . . . . . . . . . 9
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal characteristics. . . . . . . . . . . . . . . . . . 11
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 June 2009
Document identifier: SSL2102_1
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