SSL2109AT/1,118 [NXP]
Compact non-dimmable LED controller IC SOIC 8-Pin;
| 型号： | SSL2109AT/1,118 |
| 厂家： | 
NXP |
| 描述： | Compact non-dimmable LED controller IC SOIC 8-Pin 光电二极管 |
| 文件： | 总20页 (文件大小：325K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SSL2109AT
Compact non-dimmable LED driver IC
Rev. 5 — 3 October 2013
Product data sheet
1. General description
The SSL2109AT is a high-voltage Integrated Circuit (IC) for driving LED lamps in general
lighting applications.
The main benefits of this IC include:
• Small Printed-Circuit Board (PCB) footprint and compact solution
• High efficiency (up to 95 %) for non-dimmable high power factor solutions
• High power factor >0.9 (application dependent)
• Ease of integration and many protection features
• Low electronic Bill Of Material (BOM)
• Highly flexible IC for use in buck, buck/boost and flyback modes
• Single inductor used for non-isolated configurations because of internal
demagnetization detection and dV/dt supply
The IC is supplementary to the SSL21081/SSL21083 series but without an internal switch.
The IC has been designed to start up directly from the HV supply by an internal
high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling
from the drain, or any other auxiliary supply. This functionality provides full flexibility in the
application design. An internal clamp limits the supply voltage.
The IC provides accurate output current control to within 5 % LED current accuracy. The
IC can be operated using Pulse-Width Modulation (PWM) current regulation and has
many protection features including easy LED temperature feedback.
2. Features and benefits
LED driver IC for driving strings of LEDs or high-voltage LED modules from a rectified
mains supply
Part of a high-efficiency switch mode flyback or buck product family.
Driver-only which can drive an external MOSFET
Driver that has power-efficient boundary conduction mode of operation with:
No reverse recovery losses in freewheel diode
Zero Current Switching (ZCS) for switch turn-on
Zero voltage or valley switching for switch turn-off
Minimal required inductance value and size
Suitable for high power factor (>0.9) applications
Applicable in buck, buck/boost and flyback topologies
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
Direct PWM current regulation possible
Fast transient response through cycle-by-cycle current control:
Negligible AC mains ripple in LED current and minimal total capacitance in low
ripple configurations
No over or undershoots in the LED current
Simple high input power factor solution (>0.9)
Internal protection features:
UnderVoltage LockOut (UVLO)
Leading-Edge Blanking (LEB)
OverCurrent Protection (OCP)
Internal OverTemperature Protection (OTP)
Brownout protection
Output Short Protection (OSP)
Low component count LED driver solution (see Figure 3):
Easy external temperature protection with a single NTC
Option for soft-start function
Compatible with wall switches with built-in indication light during standby
IC lifetime easily matches or surpasses LED lamp lifetime
3. Applications
The SSL2109AT is intended for compact LED lamps with accurate fixed current output for
single mains input voltages. Mains input voltages include 100 V, 120 V and 230 V (AC).
The output signal can be modulated using a PWM signal. External components determine
the power range.
4. Quick reference data
Table 1.
Quick reference data
Symbol
VCC
Parameter
Conditions
Min
8
Typ
Max
16
Unit
V
[1]
supply voltage
operating range
normal operation
-
ICC(INT)
VHV
internal supply current
voltage on pin HV
voltage on pin DRAIN
-
1.3
-
mA
V
0.4
0.4
-
-
+600
+600
VDRAIN
V
fconv
conversion frequency
-
100
-
kHz
V
Vo(DRIVER)max maximum output voltage VCC > VCC(startup)
on pin DRIVER
9
10.5
12
[1] An internal clamp sets the supply voltage. The current into the VCC pin must not exceed the maximum IDD
value (see Table 4)
SSL2109AT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
2 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
5. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
SSL2109AT
SO8
plastic small package outline body; 8 leads; body width SOT96-1
3.9 mm
6. Block diagram
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Fig 1. SSL2109AT block diagram
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
3 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
7. Pinning information
7.1 Pinning
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Fig 2. SSL2109AT pin configuration
7.2 Pin description
Table 3.
Pin description
Symbol
HV
Pin
1
Description
high-voltage supply pin
supply voltage
VCC
2
NTC
3
temperature protection input
low-side external switch
driver output
SOURCE
DRIVER
DVDT
GND
4
5
6
AC supply pin
7
ground
DRAIN
8
high-side external switch
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
4 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
8. Functional description
8.1 Introduction
The SSL2109AT is a driver for small form factor retrofit SSL lamps and separate LED
drivers.
8.2 Converter operation
The converter in the SSL2109AT is a Boundary Conduction Mode (BCM), peak current
controlled system. Figure 3 shows the basic application diagram. Figure 4 shows the
waveforms.
This converter type operates at the boundary between continuous and discontinuous
mode. Energy is stored in inductor L each period that the switch is on. The inductor
current IL is zero when the MOSFET is switched on. The amplitude of the current build-up
in L is proportional to the voltage drop over the inductor and the time that the MOSFET
switch is on. When the MOSFET is switched off, the energy in the inductor is released
towards the output. The current then falls at a rate proportional to the value of VOUT. The
LED current ILED depends on the peak current through the inductor (SSL2109AT
controlled) and on the HV bus voltage while it is optimized for a high power factor. A new
cycle is started once the inductor current IL is zero. This quasi-resonant operation results
in higher efficiency.
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Fig 3. SSL2109AT basic low ripple buck application diagram
8.3 Driver pin
The SSL2109AT is equipped with an internal driver that can control an external switch.
The voltage on the driver output pin is increased towards VO(DRIVER)max to open the switch
during the first cycle (t0 to t1). The voltage on the driver output pin is pulled down towards
a low level from the start of the secondary stroke until the next cycle starts (t0 to t00).
During transition from low to high and back, there is a controlled switching slope
steepness. This controlled condition limits the high-frequency radiation from the circuit to
the surrounding area.
At the lowest VCC voltage (VCC(stop)), the voltage of the driver is VO(DRIVER)min
.
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
5 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
8.4 Valley detection
A new cycle is started when the primary switch is switched on (see Figure 4). In the
following sections, “on” represents the conductive state and off the non-conductive state.
Following time t1, when the peak current is detected on the SOURCE pin, the switch is
turned off and the secondary stroke starts at t2. When the secondary stroke is completed
with the coil current at t3 equaling zero, the drain voltage starts to oscillate at
approximately VIN VOUT level. The peak-to-peak amplitude equals 2 VOUT
.
A special feature, called valley detection is an integrated part of the SSL2109AT circuitry.
Dedicated built-in circuitry connected to the DRAIN pin, senses when the voltage on the
drain of the switch has reached its lowest value. The next cycle is then started at t00. As a
result the capacitive switching losses are reduced.
If both the frequency of the oscillations and the voltage swing are within the range
specified (fring and ∆Vvrec(min)) for detection, a valley is detected and accepted. If a valid
valley is not detected, the secondary stroke is continued until the maximum off-time
(toff(high)) is reached. Then the next cycle is started.
A series resistance can be included at the drain sensing pin for flyback mode to remove
the high-frequency ringing caused by the transformer leakage inductance.
V
GATE
V
OUT
V
DRAIN
V
IN
valley
0
magnetization
demagnetization
I
L
0
2
1
3
4
t
t
0
t
t
t
3
00
1
2
T
aaa-001744
Fig 4. Buck waveforms and valley detection
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
6 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
8.5 Protective features
The IC has the following protections:
• UnderVoltage LockOut (UVLO)
• Leading-Edge Blanking (LEB)
• OverCurrent Protection (OCP)
• Internal OverTemperature Protection (OTP)
• Brownout protection
• Output Short Protection (OSP)
• LED overtemperature control and protection
The OSP is a latched protection. This protection causes the IC to halt until a reset (a result
of power cycling) is executed. When VCC drops to below VCC(rst), the IC resets the latch
protection mode. The internal OTP and LED over temperature protections are safe-restart
protections. If VCC drops to below VCC(stop), the IC halts. Switching starts only when a no
fault condition exists.
8.5.1 UnderVoltage LockOut (UVLO)
When the voltage on the VCC pin drops lower than VCC(stop), the IC stops switching. An
attempt is made to restart by supplying VCC from the HV pin voltage.
8.5.2 Leading-Edge Blanking (LEB)
To prevent false detection of the short-winding or overcurrent, a blanking time following
switch-on is implemented. When the MOSFET switch switches on, there can be a short
current spike due to capacitive discharge of voltage over the drain and source and the
charging of the gate to source capacitance. During the LEB time (tleb), the spike is
disregarded.
8.5.3 OverCurrent Protection (OCP)
The SSL2109AT contains a highly accurate peak current detector. It triggers when the
voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The current through
the switch is sensed using a resistor connected to the SOURCE pin. The sense circuit is
activated following LEB time tleb. As the LED current is half the peak current (by design), it
automatically provides protection for maximum LED current during operation. There is a
propagation delay (td(ocp-swoff)) between the overcurrent detection and the actual switching
off of the switch. Due to the delay, the actual peak current is slightly higher than the OCP
level set using the resistor in series to the SOURCE pin.
8.5.4 OverTemperature Protection (OTP)
When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the
converter stops operating. The OTP safe-restart protection and the IC restart with
switching resuming when the IC temperature drops lower than Tth(rel)otp
.
8.5.5 Brownout protection
Brownout protection is designed to limit the lamp power when the input voltage drops
close to the output voltage level. The input power has to remain constant. The input
current would otherwise increase to a level that is too high for the input circuitry. For the
SSL2109AT, there is a maximum limit on the on-time of switch ton(high)
.
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
7 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
The rate of current rise in the coil during the on-phase is proportional to the difference
between input voltage and output voltage. Therefore, the peak current cannot be reached
before ton(high). As a result the average output current to the LEDs is reduced.
8.5.6 Output Short-circuit Protection (OSP)
During the secondary stroke (switch-off time), if a valley is not detected within the off-time
limit (toff(high)), then typically the output voltage is less than the minimum limit allowed in
the application. This condition can occur either during start-up or due to a short-circuit. A
timer tdet(sc) is started when toff(high) is detected. Timer tdet(sc) is reset when a valid valley
detection occurs in one of the subsequent cycles or when VCC drops to below VCC(stop)
.
The timer can also be reset if the maximum limit on the on-time of the switch (ton(high)) is
reached, which is usually the case at start-up (brownout protection). If no valley is
detected and (ton(high)) is not reached before tdet(sc), then it is concluded that a real
short-circuit exists. The IC enters latched protection. If VCC drops to below VCC(rst), the IC
resets the latched protection mode (see Figure 5).
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Fig 5. OSP logic diagram
8.6 VCC supply
The SSL2109AT can be supplied using three methods:
• Under normal operation, the voltage swing on the DVDT pin is rectified within the IC
providing current towards the VCC pin
• At start-up, there is an internal current source connected to the HV pin. The current
source provides internal power until either the dV/dt supply or an external current on
the VCC pin provides the supply
• Using an auxiliary winding, the voltage is rectified and connected to the VCC pin via a
series resistor.
The IC starts up before the voltage at the VCC pin exceeds VCC(startup). The IC locks out
(stops switching) when the voltage at the VCC pin is < VCC(stop). The hysteresis between
the start and stop levels allows the IC to be supplied by a buffer capacitor until the dV/dt
supply is settled. The SSL2109AT has an internal VCC clamp, which is an internal active
Zener (or shunt regulator). This internal active Zener limits the voltage on the supply VCC
pin to the maximum value of VCC. If the maximum current of the dV/dt supply minus the
current consumption of the IC (determined by the load on the gate drivers) is lower than
the IDD maximum value, no external Zener diode is required in the supply circuit.
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
8 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
8.7 DVDT pin supply
The DVDT pin is connected to an internal single-sided rectification stage. When a different
voltage with sufficient amplitude is supplied to the pin, the IC can be powered without any
other external power connection. This provides an effective method to prevent additional
high power losses, which are the result if a regulator were used for continuously powering
the IC. Unlike an auxiliary supply, additional inductor windings are not required.
8.8 VCC regulator
During supply dips, the input voltage can drop so much that it can no longer supply the
required IC current through the DVDT pin. Under these conditions, if the VCC voltage
drops lower than VCC(swon)reg level, another regulator with a current capability of up to
IHVhigh(oper) is started. The job of the regulator is to fill in the required supply current, which
the dV/dt supply does not deliver, thus preventing that the IC enters UVLO. When the
VCC voltage is higher than the VCC(swon)reg level, the regulator is turned off.
8.9 NTC functionality and PWM regulation
The NTC pin can be used as a control method for LED thermal protection. Alternatively,
the pin can be used as an input to disable/enable light output using a digital signal (PWM
regulation). The pin has an internal current source that generates the current of Ioffset(NTC)
An NTC resistor to monitor the LED temperature can be connected directly to the NTC
pin. Depending on the resistance value and the corresponding voltage on the NTC pin,
the converter reacts as shown in Figure 6.
.
During start-up, before VCC reaches VCC(startup) the voltage on the NTC pin must be less
than the minimum value of Vact(tmr)NTC. This is valid when the voltage on the NTC pin is
derived from the VCC using a resistive divider and a PTC in series with the resistor
between pins VCC and NTC.
If an NTC resistor is connected between the NTC pin and ground, the voltage on the NTC
pin is 0 V when VCC reaches VCC(startup)
.
Peak current
I
V
= 500 mV
= 250 mV
pk
th(ocp)SOURCE
th(ocp)SOURCE
V
I
pk
/ 2
1
2
3
4
5
V
NTC
001aan700
Fig 6. NTC control curve
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
9 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
When the voltage on the NTC pin exceeds Vth(high)NTC (see Figure 6 (4)), the converter
delivers nominal output current. When the voltage is lower than this level, the peak current
is gradually reduced until Vth(low)NTC is reached (see Figure 6 (3)). The peak current is
now half the peak current of nominal operation. When Vact(tmr)NTC is passed
(see Figure 6 (2)), a timer starts to run to distinguish between the following situations:
• If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC (see Figure 6 (1)),
LED overtemperature is detected. The IC stops switching and attempts to restart from
the HV pin voltage. The converter restarts from an NTC protection shutdown when the
voltage on the NTC pin exceeds Vth(high)NTC (see Figure 6 (4)). It is assumed that the
reduction in peak current does not result in a lower NTC temperature and LED OTP is
activated.
• If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC (see Figure 6 (1)), it
is assumed that the pin is pulled down externally. The restart function is not triggered.
Instead, the output current is reduced to zero. PWM regulation and consequently LED
output current regulation can be implemented this way. The output current rises again
when the voltage exceeds Vth(low)NTC
.
8.9.1 Soft-start function
The NTC pin can be used to make a soft start function. During switch-on, the level on the
NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time
constant can be defined. The time constant causes the level on the NTC pin to increase
slowly. When passing level Vth(low)NTC (see Figure 6 (3)), the converter starts with half of
the maximum current. The output current slowly increases to maximum when Vth(high)NTC
(see Figure 6 (4)) is reached.
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
10 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
General
SR
Parameter
Conditions
Min
Max
Unit
slew rate
on pin DRAIN
SO8 package
5
+5
V/ns
W
Ptot
total power dissipation
ambient temperature
junction temperature
storage temperature
-
0.6
Tamb
40
40
55
+125
+150
+150
C
Tj
C
Tstg
C
Voltages
VCC
[1]
supply voltage
continuous
0.4
0.4
0.4
0.4
0.4
+20
V
V
V
V
V
VDRAIN
VHV
VSOURCE
VNTC
voltage on pin DRAIN
voltage on pin HV
voltage on pin SOURCE
voltage on pin NTC
+600
+600
+5.2
+5.2
current limited
current limited
current limited
Currents
IDD
[2]
[3]
supply current
at pin VCC
-
-
20
mA
A
IDVDT
current on pin DVDT
duration 20 s
maximum
1.3
VESD
electrostatic discharge
voltage
human body
model; pins
DRAIN and HV
1
+1
kV
kV
V
human body
model; all other
pins
2
+2
[4]
charged device
500
+500
[1] The current flowing into the VCC pin must not exceed the maximum IDD value
[2] An internal clamp sets the supply voltage.
[3] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[4] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 resistor.
10. Thermal characteristics
Table 5.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to in free air; PCB: 2 cm 3 cm; 2-layer; 35 m
Conditions
Typ
Unit
159
K/W
ambient
Cu per layer
in free air; PCB: JEDEC 2s2p
89
K/W
K/W
j-top
thermal characterization parameter top package temperature measured at the
from junction to top of package warmest point on top of the case
0.49
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
11 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
11. Characteristics
Table 6.
Characteristics
Values specified at Tamb = 25 C unless otherwise specified; all voltages are measured with respect to ground; currents are
positive when flowing into the IC.
Symbol
fconv
Parameter
Conditions
Min
Typ
Max Unit
conversion frequency
-
100
-
kHz
High-voltage
Ileak(DRAIN)
Ileak(HV)
leakage current on pin DRAIN
leakage current on pin HV
VDRAIN = 600 V
VHV = 600 V
-
-
-
-
10
30
A
A
Supply
[1]
VCC
supply voltage
operating range
8
-
16
13
10
4.5
5.5
9.75
10.5
-
V
V
V
V
V
V
V
V
V
VCC(startup)
VCC(stop)
VCC(hys)
start-up supply voltage
stop supply voltage
hysteresis of supply voltage
reset supply voltage
11
8
12
9
between VCC(startup) and VCC(stop)
2
-
VCC(rst)
4.5
8.75
9.5
0.3
0.3
5
VCC(swon)reg
VCC(swoff)reg
VCC(reg)hys
regulator switch-on supply voltage insufficient dV/dt supply
regulator switch-off supply voltage insufficient dV/dt supply
regulator supply voltage hysteresis VCC(swoff)reg VCC(swon)reg
9.25
10
-
VCC(regswon-stop) supply voltage difference between VCC(swon)reg VCC(stop)
-
-
regulator switch-on and stop
Consumption
Istb(HV)
standby current on pin HV
internal supply current
during start-up or in protection;
VHV = 100 V
300
-
350
1.3
400
-
A
ICC(INT)
normal operation
mA
Capability
Isup(high)HV
high supply current on pin HV
Standby: VHV = 40 V;
VCC < VCC(stop)
1
2
1.3
2.3
1.6
2.6
mA
mA
Regulator On: VHV = 40 V;
VCC < VCC(swon)reg after start-up
Current protection
Vth(ocp)SOURCE overcurrent protection threshold
voltage on pin SOURCE
V/t = 0.1 V/s
480
230
-
500
250
75
520
270
100
mV
mV
ns
V/t = 0.1 V/s; VNTC = 0.325 V
V/t = 0.1 V/s
td(ocp-swoff)
tleb
delay time from overcurrent
protection to switch-off
leading edge blanking time
overcurrent protection
260
300
340
ns
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
12 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
Table 6.
Characteristics …continued
Values specified at Tamb = 25 C unless otherwise specified; all voltages are measured with respect to ground; currents are
positive when flowing into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Valley detection
(V/t)vrec
valley recognition voltage change on pin DRAIN
with time
30
20
10
V/s
[2]
fring
ringing frequency
200
15
550
20
1000 kHz
Vvrec(min)
minimum valley recognition
voltage difference
voltage drop on pin DRAIN
25
-
V
td(vrec-swon)
valley recognition to switch-on
delay time
-
100
15
ns
Brownout detection
ton(high)
high on-time
12.5
17.5 s
Driver (pin DRIVER)
Isource(DRIVER)
Isink(DRIVER)
source current on pin DRIVER
1.5 ms maximum; VDRIVER = 2 V
20 s maximum; VDRIVER = 2 V
20 s maximum; VDRIVER = 10 V
VCC > VCC(startup)
-
0.195
0.28
-
A
A
A
V
sink current on pin DRIVER
-
-
-
0.46
-
Vo(DRIVER)max
Vo(DRIVER)min
maximum output voltage on pin
DRIVER
9
10.5
12
minimum output voltage on pin
DRIVER
VCC = VCC(stop)
6.5
7.5
8.5
V
NTC functionality
Vth(high)NTC high threshold voltage on pin NTC
Vth(low)NTC
Vact(tmr)NTC
Vdeact(tmr)NTC
0.47
0.5
0.53
V
V
V
V
low threshold voltage on pin NTC
timer activation voltage on pin NTC
0.325 0.35
0.375
0.325
0.23
0.26
0.17
0.3
0.2
timer deactivation voltage on pin
NTC
tto(deact)NTC
deactivation time-out time on pin
NTC
33
-
46
59
-
s
Ioffset(NTC)
OSP
offset current on pin NTC
47
A
tdet(sc)
short-circuit detection time
high off-time
16
30
20
36
24
42
ms
toff(high)
s
Temperature protection
Tth(act)otp overtemperature protection
160
90
170
100
180
110
C
C
activation threshold temperature
Tth(rel)otp
overtemperature protection
release threshold temperature
[1] An internal clamp sets the supply voltage. The current into the VCC pin must not exceed the maximum IDD value (see Table 4).
[2] This parameter is not tested during production, by design it is guaranteed
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
13 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
12. Application information
An LED driver with the SSL2109AT can be a buck, tapped buck or flyback converter
operating in BCM. Figure 7 shows a buck solution in a low ripple configuration using a
minimum of components.
Capacitor C3 buffers the IC supply voltage, which is powered via the HV pin at start-up
and via C5 during normal operation. Sense resistors R4 and R5 convert the current
through MOSFET Q1 into a voltage on the SOURCE pin. The value of these resistors
determines the maximum primary peak current on MOSFET Q1, and thus the LED
current. Resistor R6 reduces the reverse current into the DRIVER pin. The DRAIN pin is
connected with the drain of Q1 for valley detection.
In the example shown in Figure 7, the NTC pin is used for temperature protection.
Negative Temperature Coefficient (NTC) resistor R3 sets the temperature level. Capacitor
C4 reduces noise on the NTC pin. See the SSL2109AT application note for more
information.
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Fig 7. A typical SSL2109AT buck low ripple application
SSL2109AT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
14 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 8. Package outline SOT96-1 (SOT8)
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
15 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
14. Abbreviations
Table 7.
Abbreviations
Description
Acronym
BCM
Boundary Conduction Mode
Bill Of Materials
BOM
LEB
Leading-Edge Blanking
Light Emitting Diode
LED
MOSFET
OCP
Metal-Oxide Semiconductor Field-Effect Transistor
OverCurrent Protection
OSP
Output Short Protection
OTP
OverTemperature Protection
Printed-Circuit Board
PCB
PWM
UVLO
ZCS
Pulse-Width Modulation
UnderVoltage LockOut
Zero-Current Switching
15. References
[1] AN11041 — SSL21081, SSL21083, and SSL2109 non-dimmable buck converter in
low ripple configurations
[2] AN11263 — 230 V (AC) mains dimmable LED driver using the SSL2129AT or
SSL21084AT
SSL2109AT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
16 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
16. Revision history
Table 8.
Revision history
Document ID
SSL2109AT v.5
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20131003
Product data sheet
-
SSL2109_SER v.4
• Text and graphics have been updated throughout the data sheet.
SSL2109_SER v.4
SSL2109_SER v.3
SSL2109T v.2
SSL2109 v.1.1
SSL2109 v.1
20121026
20120604
20120426
20120410
20120330
Product data sheet
Product data sheet
Product data sheet
Preliminary data sheet
Preliminary data sheet
-
-
-
-
-
SSL2109_SER v.3
SSL2109T v.2
SSL2109 v.1.1
SSL2109 v.1
-
SSL2109AT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
17 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
17.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
18 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
17.4 Trademarks
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SSL2109AT
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 3 October 2013
19 of 20
SSL2109AT
NXP Semiconductors
Compact non-dimmable LED driver IC
19. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.5.4
8.5.5
8.5.6
8.6
8.7
8.8
8.9
8.9.1
Functional description . . . . . . . . . . . . . . . . . . . 5
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Converter operation . . . . . . . . . . . . . . . . . . . . . 5
Driver pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 6
Protective features . . . . . . . . . . . . . . . . . . . . . . 7
UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 7
Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 7
OverCurrent Protection (OCP) . . . . . . . . . . . . . 7
OverTemperature Protection (OTP) . . . . . . . . . 7
Brownout protection . . . . . . . . . . . . . . . . . . . . . 7
Output Short-circuit Protection (OSP). . . . . . . . 8
VCC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
DVDT pin supply. . . . . . . . . . . . . . . . . . . . . . . . 9
VCC regulator. . . . . . . . . . . . . . . . . . . . . . . . . . 9
NTC functionality and PWM regulation. . . . . . . 9
Soft-start function . . . . . . . . . . . . . . . . . . . . . . 10
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics . . . . . . . . . . . . . . . . . 11
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
10
11
12
13
14
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 October 2013
Document identifier: SSL2109AT
相关型号：
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