SZA1010 [NXP]

Digital Servo Driver 3 DSD-3; 数字式伺服驱动器3 DSD- 3
SZA1010
型号: SZA1010
厂家: NXP    NXP
描述:

Digital Servo Driver 3 DSD-3
数字式伺服驱动器3 DSD- 3

驱动器
文件: 总16页 (文件大小:91K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
SZA1010  
Digital Servo Driver 3 (DSD-3)  
1997 Apr 07  
Preliminary specification  
File under Integrated Circuits, IC01  
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
FEATURES  
GENERAL DESCRIPTION  
The SZA1010 or Digital Servo Driver 3 (DSD-3) consists of  
1-bit class-D power drivers, which are specially designed  
for digital servo applications. Three such amplifiers are  
integrated in one chip, to drive the focus and radial  
actuators and the sledge motor of a compact disc optical  
system.  
Servo functions  
1-bit class-D focus actuator driver (4 )  
1-bit class-D radial actuator driver (4 )  
1-bit class-D sledge motor driver (2 ).  
Other features  
The main benefits of using this principle are its higher  
efficiency grade compared to conventional analog power  
amplifiers, its higher integration level, its differential output  
and the fact that only a few external components are  
needed. When using these digital power drivers in a digital  
servo application, the statement ‘complete digital servo  
loop’ becomes more realistic.  
Supply voltage 5 V only  
Small package (SOT163-1)  
Higher efficiency, compared with conventional drivers,  
due to the class-D principle  
Built-in digital notch filters for higher efficiency  
Enable input for focus and radial driver  
Enable input for sledge driver  
3-state input for radial driver  
Doubled clock frequency  
Differential outputs for all drivers  
Separate power supply pins for all drivers.  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
MIN.  
4.5  
TYP.  
MAX.  
5.5  
UNIT  
VDDD  
digital supply voltage  
V
VDDA(F)  
VDDA(R)  
VDDA(S)  
IDDDq  
analog supply voltage focus actuator  
analog supply voltage radial actuator  
analog supply voltage sledge actuator  
quiescent digital supply current  
analog supply current focus actuator  
analog supply current radial actuator  
analog supply current sledge actuator  
input clock frequency  
4.5  
4.5  
4.5  
5.5  
5.5  
5.5  
10  
V
V
V
µA  
mA  
mA  
mA  
MHz  
mW  
°C  
IDDA(F)  
IDDA(R)  
IDDA(S)  
fi(clk)  
126  
20  
250  
250  
560  
150  
8.4672 10  
Ptot  
total power dissipation  
tbf  
Tamb  
operating ambient temperature  
40  
+85  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
SZA1010T  
SO20  
plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
1997 Apr 07  
2
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
BLOCK DIAGRAM  
d
V
V
V
V
DDA(R)  
13  
DDD  
6
DDA(S)  
1
DDA(F)  
14  
11  
12  
RA+  
DIGITAL  
NOTCH FILTER  
END STAGE  
HBRIDGE  
4
RAC  
RA−  
SZA1010  
15  
16  
FO+  
FO−  
DIGITAL  
NOTCH FILTER  
END STAGE  
HBRIDGE  
3
FOC  
19  
20  
SL+  
SL−  
DIGITAL  
NOTCH FILTER  
END STAGE  
HBRIDGE  
2
SLC  
7
CLI  
8
EN1  
EN2  
CONTROL  
9
5
10  
17  
18  
MBK013  
V
/V  
SSA(S) SSA(F)  
3-STATE  
V
V
SSA(R)  
SSD  
Fig.1 Block diagram.  
1997 Apr 07  
3
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
PINNING  
SYMBOL  
VDDA(S)  
PIN  
DESCRIPTION  
analog supply voltage for sledge  
motor driver  
1
SLC  
2
3
PDM input for sledge driver  
PDM input for focus driver  
PDM input for radial driver  
digital ground  
handbook, halfpage  
V
FOC  
RAC  
VSSD  
VDDD  
CLI  
1
2
20  
SL−  
DDA(S)  
4
19 SL+  
SLC  
FOC  
5
V
/V  
3
18  
17  
16  
SSA(S) SSA(F)  
6
digital supply voltage  
clock input  
3-STATE  
RAC  
4
7
V
5
FO−  
EN1  
8
enable input 1  
SSD  
SZA1010  
EN2  
9
enable input 2  
V
6
15 FO+  
DDD  
CLI  
VSSA(R)  
RA+  
10  
11  
12  
analog ground for radial driver  
radial driver (positive output)  
radial driver (negative output)  
V
7
14  
13  
DDA(F)  
DDA(R)  
V
8
EN1  
EN2  
RA−  
9
12 RA−  
11  
VDDA(R)  
analog supply voltage for radial  
driver  
13  
V
10  
RA+  
SSA(R)  
MBK012  
VDDA(F)  
FO+  
14  
15  
16  
17  
analog supply voltage for focus  
focus driver (positive output)  
focus driver (negative output)  
radial 3-state input  
FO−  
3-STATE  
VSSA(S)  
VSSA(F)  
/
analog ground for sledge  
driver/focus  
18  
SL+  
19  
20  
sledge driver (positive output)  
sledge driver (negative output)  
Fig.2 Pin configuration.  
SL−  
1997 Apr 07  
4
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
The amplitude transfer as a function of frequency is given  
in Fig.7.  
FUNCTIONAL DESCRIPTION  
Principle of a class-D digital power driver  
Figure 7 shows that the filter has a zero on 12fs, thereby  
filtering out the Idle pattern (101010). The output of this  
filter is a three-level code (1.5-bit). For the control of the  
switches three states (1.5-bit) can be distinguished: the  
two states as described earlier and a third one. This state  
is used when an idling pattern is supplied.  
Figure 3 shows the block diagram of one of the digital  
drivers integrated in the DSD-3. It consists of a timing  
block and four CMOS switches. The input signal is a 1-bit  
Pulse Density Modulated (PDM) signal, the output of the  
digital servo ICs.  
The maximum operating clock frequency of the device is  
10 MHz. In combination with most frequently used Philips  
digital servo ICs, the operating frequency of the digital  
drivers is 8.4672 MHz (192 × 44.1 kHz). The sampling  
frequency of the 1-bit code however is 2.1168 MHz, so  
internally in the DSD-3 the clock speed of the switches will  
be 2.1168 MHz.  
The higher input clock frequency is used to make  
non-overlapping pulses to prevent short-circuits between  
the supply voltages. For the control of the switches, two  
states can be distinguished. If the 1-bit code contains a  
logic 1, switches A and D are closed and current will flow  
in the direction as shown in Fig.4.  
Switches C and D are closed (see Fig.8). In this Idle mode,  
no current will flow and thus the efficiency will be improved.  
This mode is also used to short-circuit the inductive  
actuator/motor. In this way, high induction voltages are  
prevented because the current can commutate via the  
filter and the short-circuit in the switches. All three drivers  
(radial, focus and sledge) contain a digital notch filter as  
described (see Fig.6). Each driver has its own power  
supply pins to reduce crosstalk due to of the relative high  
current flowing through the pins.  
Compared to the DSD-2, the DSD-3 has a 3-state mode  
for the radial output, which is useful when active damping  
of the radial actuator is needed. When fast access times  
are required, the sledge has to move with high  
accelerations. To prevent the radial actuator from moving  
too far from its centre position due to the acceleration,  
active damping is applied. In order to measure the  
displacement of the radial actuator, the voltage induced by  
the actuator itself is measured, which is proportional to its  
speed. The damping consists of a sequence of controlling,  
waiting, measuring and controlling etc. To be able to  
measure the induced voltage properly, the influence of the  
DSD-3 is eliminated by switching it into 3-state mode.  
If the 1-bit code contains a logic 0, switches B and C are  
closed and current will flow in the opposite direction, as  
shown in Fig.5.  
This indicates that the difference between the mean  
number of ones and zeros in the PDM signal determines  
the direction in which the actuator or motor will rotate.  
If the mean number of ones and zeros is equal (Idle mode)  
the current through the motor or actuator is alternated  
between the positive and negative direction at a speed of  
half the sample frequency of 2.1168 MHz. This results in a  
high dissipation and the motor does not move.  
To improve the efficiency, a digital notch filter is added at  
the input of the digital drivers. This filters the Idle mode  
pattern (1010101010 etc.) see Fig.6.  
1997 Apr 07  
5
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
V
V
DD  
DD  
I
pos  
A
B
1-bit  
code  
'1'  
1-bit  
code  
(1)  
(1)  
M
M
TIMING  
TIMING  
clock  
clock  
C
D
MBG786  
MBG787  
V
V
SS  
SS  
(1) Sledge motor; focus/radial motor.  
(1) Sledge motor; focus/radial motor.  
Fig.3 One of the digital drivers.  
Fig.4 1-bit code is logic 1.  
V
DD  
I
neg  
A
B
1-bit  
code  
'0'  
1-bit  
1.5-bit  
1/Z  
(1)  
M
TIMING  
clock  
MBG789  
C
D
MBG788  
V
SS  
The filter consists of a simple delay element (flip-flop) and an adder.  
The transfer from input-to-output is: H(z) = 1 + z1  
(1) Sledge motor; focus/radial motor.  
.
Fig.5 1-bit code is logic 0.  
Fig.6 Notch filter at input of digital drivers.  
1997 Apr 07  
6
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
MBG790  
V
DD  
|H|  
A
B
1-bit  
code  
'idle'  
(1)  
M
TIMING  
clock  
C
D
I
idle  
MBG791  
1/2f  
V
s
SS  
(1) Sledge motor; focus/radial motor.  
Fig.7 Amplitude transfer.  
Fig.8 Idling pattern.  
Switches  
Timing of input and output signals  
The digital part of the power drivers consists of standard  
cells. The power switches are specifically designed for CD  
applications. The most important feature is their  
on-resistance. In the applications, they have to drive very  
low-ohmic actuators and/or motors. The switches are  
designed to have an on-resistance of 2 for the actuator  
drivers and 1 for the sledge motor driver. In any mode,  
there are always two switches in series with the  
All internal timing signals are derived from the externally  
supplied CLI signal.  
Sampling of the data inputs (SLC, FOC and RAC) occurs  
at a frequency of 14CL. For each channel, the clocking-in  
occurs at a different positive edge of CLI. Because there  
are only 3 channels, and the clock frequency CLI is  
divided-by-4, only 3 out of 4 positive edges are effective for  
sampling one of the inputs.  
actuator/motor. The total loss due to the switches is 4 for  
the actuators and 2 for the sledge motor.  
The switching of the outputs occurs in a similar way,  
except that in this event the negative edge of CLI is used.  
In this way, the input signals are immune to the noise  
radiated by the switching of the outputs. It is possible that  
an output transition will have a noticeable effect on the  
power supply voltage or the ground voltage. To avoid  
simultaneous transitions of all outputs, the outputs of each  
bridge are also clocked at a different phase of CLI.  
Consequently there are only 3 out of 4 negative edges  
effective.  
3-state input  
When the 3-STATE input (pin 17) is made HIGH, the four  
CMOS switches of the radial driver are opened.  
Consequently, the radial output pins RA+ (pin 11) and RA−  
(pin 12) switch into a high impedance state.  
To set the circuit into 3-state mode, the clock signal (CLI)  
is not required; the 3-STATE input is a direct,  
asynchronous input. It has an internal pull-down resistor.  
To reset the circuit, both the reset condition and the clock  
should be present, because all flip-flops are reset  
synchronously. The clock signal is also required to obtain  
one of the possible modes of operation indicated in  
Table 1.  
1997 Apr 07  
7
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
Table 1 Possible modes of operation  
FOCUS/RADIAL  
DRIVER  
EN1  
EN2  
SLEDGE DRIVER  
MODE  
0
0
1
1
0
1
0
1
off  
off  
off  
on  
off  
on  
off  
on  
standby  
partly operating  
reset  
operating  
The timing diagram as shown in Fig.9 gives the relationship between the different clocks.  
The negative edge of the signals called ncl0 to ncl2 is used to process the incoming data (see Table 2).  
The negative edge of all signals called cl0s to cl2s is used to trigger the outputs (see Table 2).  
Table 2 Signals ncl0 to ncl2 and cl0s to cl2s  
SIGNAL  
ncl0  
DESCRIPTION  
sledge input sampling clock  
focus input sampling clock  
radial input sampling clock  
sledge output trigger clock  
focus output trigger clock  
radial output trigger clock  
ncl1  
ncl2  
cl0s  
cl1s  
cl2s  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL PARAMETER  
VDDD  
VDDA(x)  
SSD VSSA(x)  
MIN.  
0.5  
MAX.  
+6.5  
UNIT  
digital supply voltage  
analog supply voltage  
V
V
0.5  
5  
+6.5  
+5  
V
ground supply voltage difference  
total power dissipation  
mV  
mW  
°C  
Ptot  
tbf  
Tstg  
Tamb  
storage temperature  
55  
40  
+150  
+85  
operating ambient temperature  
°C  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
75  
UNIT  
K/W  
Rth j-a  
thermal resistance from junction to ambient in free air  
1997 Apr 07  
8
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
CHARACTERISTICS  
VDDD = VDDA(x) = 5 V; VSSD = VSSA(x) = 0 V; Tamb = 25 °C; unless otherwise specified.  
SYMBOL PARAMETER CONDITIONS MIN.  
TYP.  
MAX.  
UNIT  
General  
VDDD  
digital supply voltage  
4.5  
5.5  
V
V
VDDA(x)  
IDDDq  
analog supply voltage  
4.5  
5.5  
tbf  
quiescent digital supply current  
µA  
IDDA(F)(max) maximum analog supply current  
focus actuator  
note 1  
126  
250  
mA  
IDDA(R)(max) maximum analog supply current  
radial actuator  
note 1  
note 1  
20  
250  
560  
mA  
mA  
IDDA(S)(max) maximum analog supply current  
sledge actuator  
150  
fi(clk)  
Ptot  
input clock frequency  
8.4672  
10  
MHz  
mW  
°C  
total power dissipation  
tbf  
Tamb  
operating ambient temperature  
40  
+85  
Digital inputs; SLC, FOC, RAC, CLI, 3-STATE, EN1 and EN2  
VIL  
VIH  
ILI  
LOW level input voltage  
HIGH level input voltage  
input leakage current  
Tamb = 40 to +85 °C  
0.2VDDD  
V
Tamb = 40 to +85 °C 0.8VDDD  
V
1
µA  
Clock input; CLI  
fclk  
clock frequency  
8.4672  
10  
MHz  
Analog outputs; FO+ and FO−  
IO  
output current  
250  
4
mA  
RO  
output resistance  
note 2  
note 2  
note 2  
tbf  
Analog outputs; RA+ and RA−  
IO  
output current  
250  
4
mA  
RO  
output resistance  
tbf  
Analog outputs; SL+ and SL−  
IO  
output current  
560  
2
mA  
RO  
output resistance  
tbf  
Notes  
VDDA(x)(max)  
1. Maximum supply current depends on the value of RL: Imax  
=
-----------------------------  
(RO + RL)  
2. Output resistance is defined as the series resistance of the complete bridge.  
1997 Apr 07  
9
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
Timing diagram  
BM7G92  
1997 Apr 07  
10  
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
APPLICATION INFORMATION  
Figure 10 shows an application example.  
An LC filter is connected to each output of the SZA1010 in  
order to remove the PDM square wave signal at the clock  
frequency. This is done to prevent the relatively long wires  
to the actuators and motor from radiating and thereby  
disturbing other circuitry. Therefore it is recommended to  
place the coils as close as possible to the IC. The LC filter  
bandwidth has been chosen as high as 20 kHz to ensure  
that the filter’s poles are far enough outside the relevant  
loop bandwidth, which in this application is approximately  
1 kHz. In this way their influence on the closed loop  
performance is kept to a minimum. Furthermore, the  
corner frequency has not been chosen higher in order to  
filter out noise and spurious products as much as possible,  
because they enlarge the dissipation.  
The various power supply and ground pins are all  
connected together in the schematic, but if desired, the  
focus, radial and sledge power pins can be connected to a  
separate power supply.  
The three ground pins are internally connected and  
therefore should not be separated.  
1997 Apr 07  
11  
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
BM0K14  
a n d b o o k , f u l l p a g e w i d
1997 Apr 07  
12  
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
PACKAGE OUTLINE  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
0.25  
0.01  
1.27  
0.050  
1.4  
0.25 0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.42  
0.39  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-01-24  
SOT163-1  
075E04  
MS-013AC  
1997 Apr 07  
13  
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
SOLDERING  
Introduction  
Wave soldering  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream end.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SO  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
1997 Apr 07  
14  
Philips Semiconductors  
Preliminary specification  
Digital Servo Driver 3 (DSD-3)  
SZA1010  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1997 Apr 07  
15  
Philips Semiconductors – a worldwide company  
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Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,  
Tel. +43 1 60 101, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Czech Republic: see Austria  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 0044  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580920  
South America: Rua do Rocio 220, 5th floor, Suite 51,  
04552-903 São Paulo, SÃO PAULO - SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 829 1849  
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 481 7730  
Hungary: see Austria  
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.  
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874  
Indonesia: see Singapore  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Internet: http://www.semiconductors.philips.com  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1997  
SCA54  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
547027/00/01/pp16  
Date of release: 1997 Apr 07  
Document order number: 9397 750 01953  

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