TDA1521Q [NXP]
2 x 12 W hi-fi audio power amplifier; 2× 12瓦的高保真音频功率放大器
| 型号： | TDA1521Q |
| 厂家： | 
NXP |
| 描述： | 2 x 12 W hi-fi audio power amplifier |
| 文件： | 总14页 (文件大小：154K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
July 1994
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
GENERAL DESCRIPTION
The TDA1521/TDA1521Q is a dual hi-fi audio power amplifier encapsulated in a 9-lead plastic power package.
The device is especially designed for mains fed applications (e.g. stereo tv sound and stereo radio).
Features
• Requires very few external components
• Input muted during power-on and off
(no switch-on or switch-off clicks)
• Low offset voltage between output and ground
• Excellent gain balance between channels
• Hi-fi according to IEC 268 and DIN 45500
• Short-circuit-proof
• Thermally protected
QUICK REFERENCE DATA
Stereo applications
Supply voltage range
Output power at THD = 0,5%,
VP = ± 16 V
VP
± 7,5 to ± 21,0
V
PO
typ.
typ.
typ.
typ.
typ.
12
30
0,2
60
70
70
W
Voltage gain
Gv
dB
dB
dB
dB
µV
Gain balance between channels
Ripple rejection
∆Gv
SVRR
α
Channel separation
Noise output voltage
Vno(rms) typ.
PACKAGE OUTLINES
TDA1521: 9 leads in-line; plastic power (SOT131); SOT131-1; 1996 August 20.
TDA1521Q: 9 leads SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 August 20.
July 1994
2
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
Fig.1 Block diagram.
PINNING
negative supply (symmetrical)
1
2
−INV1
non-inverting input 1
inverting input 1
ground (symmetrical)
1⁄2 VP (asymmetrical)
output 1
5
−VP
ground (asymmetrical)
output 2
INV1
GND
OUT1
6
7
8
9
OUT2
+VP
3
4
positive supply
INV2
−INV2
inverting input 2
non-inverting input 2
July 1994
3
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
FUNCTIONAL DESCRIPTION
This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and
asymmetrical power supply systems. An output power of 2 × 12 watts (THD = 0,5%) can be delivered into an 8 Ω load
with a symmetrical power supply of ± 16 V.
The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the
amplifiers (0,2 dB).
A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off.
Referring to Fig.13, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed
reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the
non-inverting inputs on pins 1 and 9.
Two thermal protection circuits are provided, one monitors the average junction temperature and the other the
instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to
a maximum junction temperature of 150°C without added distortion.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
Supply voltage
CONDITIONS
pin 7
SYMBOL
VP = V7-3
MIN.
MAX.
+21
UNIT
−
−
V
V
pin 5
−VP = V5-3
−21
Non-repetitive peak
output current
pins 4 and 6
see Fig.2
IOSM
Ptot
Tstg
Tj
−
4
A
Total power dissipation
Storage temperature range
Junction temperature
Short-circuit time:
outputs short-circuited
to ground
−55
+150
150
°C
°C
−
see note
symmetrical
power supply
asymmetrical
power supply;
VP < 32 V
(full signal drive)
tsc
−
−
1
1
hour
hour
(unloaded);
Ri ≥ 4 Ω
tsc
Note
For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to VP = 28 V.
If the total internal resistance of the supply (Ri) > 4 Ω, the maximum unloaded supply voltage is increased to 32 V.
July 1994
4
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
Fig.2 Power derating curve.
THERMAL RESISTANCE
From junction to case
Rth j-c = 2,5 K/W
HEATSINK DESIGN EXAMPLE
With derating of 2,5 K/W, the value of heatsink thermal resistance is calculated as follows:
given RL = 8 Ω and VP = ±16 V, the measured maximum dissipation is 14,6 W; then, for a maximum ambient temperature
of 65 °C, the required thermal resistance of the heatsink is
150 – 65
Rth
=
– 2,5= 3,3 K ⁄ W
----------------------
14, 6
h – a
Note: The internal metal block (heatsink) has the same potential as pin 5 (−VP).
July 1994
5
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
CHARACTERISTICS
PARAMETER
Supply voltage range
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
operating mode
input mute mode
Repetitive peak
output current
VP
VP
± 7,5
± 16,0
± 21,0
± 5,8
V
V
± 2,0
−
IORM
2,2
−
−
A
Operating mode: symmetrical power supply; test circuit as per Fig.12;
VP = ± 16 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz
Total quiescent current
Output power
without RL
Itot
PO
PO
18
10
12
40
12
15
70
−
mA
W
THD = 0,5%
THD = 10%
−
W
Total harmonic
distortion
PO = 6 W
THD = 0,5%
note 1
THD
B
−
0,15
0,2
%
Power bandwidth
20 to
20k
30
Hz
dB
dB
Voltage gain
GV
29
31
Gain balance
∆GV
−
0,2
1,0
Noise output voltage
(r.m.s, value);
unweighted (20 Hz to 20 kHz)
Input impedance
Ripple rejection
Channel separation
Input bias current
DC output offset
voltage
RS = 2 kΩ
Vno(rms)
−
70
20
60
70
0,3
140
26
−
µV
kΩ
dB
dB
µA
|Zi
SVRR
α
14
40
46
−
note 2
RS = 0 Ω
−
Iib
−
with respect
to ground
VOFF
−
30
200
mV
Input mute mode: symmetrical power supply; test circuit as per Fig.12;
VP = ± 4V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz
Total quiescent current
Output voltage
without RL
Itot
9
30
40
mA
mV
Vi = 600 mV
Vout
−
0,6
1,8
Noise output voltage
(r.m.s. value);
unweighted (20 Hz to 20 kHz)
Ripple rejection
RS = 2 kΩ
note 2
Vno(rms)
SVRR
−
70
55
140
µV
35
−
dB
DC output offset
voltage
with respect
to ground
VOFF
−
40
200
mV
July 1994
6
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Operating mode: asymmetrical power supply; test circuit as per Fig.13;
VS = 24 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz
Total quiescent current
Output power
Itot
Po
Po
18
40
70
mA
THD = 0,5%
THD = 10%
5
6
8
−
−
W
W
6,5
Total harmonic
distortion
PO = 4 W
THD = 0,5%
note 1
THD
−
0,13
40 to
20k
30
0,2
%
Power bandwidth
B
Hz
dB
dB
Voltage gain
GV
∆GV
29
31
1
Gain balance
−
0,2
Noise output voltage
(r.m.s. value);
unweighted (20 Hz to 20 kHz)
Input impedance
Ripple rejection
RS = 2 kΩ
RS = 0 Ω
Vno(rms)
−
70
20
44
45
140
26
−
µV
kΩ
dB
dB
Zi
14
35
−
SVRR
α
Channel separation
−
Notes
1. Power bandwidth at Po max −3 dB.
2. Ripple rejection at RS = 0 Ω, f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or
negative supply rail.
July 1994
7
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
APPLICATION INFORMATION
Input mute circuit
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 1/2 supply
voltage (at pin 3) with an internally fixed reference voltage (Vref), derived directly from the supply voltage. When the
voltage at pin 3 is lower than Vref the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage
at pin 3 is determined by an internal voltage divider and the external 100 µF capacitor.
During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the
input terminal is disconnected, (as illustrated in Fig.3).
Fig.3 Input mute circuit; time delay.
July 1994
8
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
Fig.4 Output power as a function of supply
voltage; symmetrical supply;
RL = 8 Ω; f = 1 kHz.
Fig.5 Distortion as a function of frequency;
symmetrical supply; VP = ± 16 V;
RL = 8 Ω; Po = 6 W.
Fig.6 Supply voltage ripple rejection;
symmetrical supply; VP = ± 16 V;
VRR = 200 mV.
Fig.7 Power dissipation as a function of
output power; symmetrical supply;
VP = ± 16 V; RL = 8 Ω; f = 1 kHz.
July 1994
9
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
Fig.8 Output power as a function of
supply voltage; asymmetrical
supply; RL = 8 Ω; f = 1 kHz.
Fig.9 Distortion as a function of frequency;
asymmetrical supply; VS = 24 V;
RL = 8 Ω; Po = 4 W.
Fig.10 Supply voltage ripple rejection;
asymmetrical supply; VS = 24 V;
VRR = 200 mV.
Fig.11 Output power as a function of
supply voltage; asymmetrical
supply; RL = 4 Ω; f = 1 kHz.
July 1994
10
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
(1) To be connected as close as possible to the IC
Fig.12 Test and application circuit; symmetrical power supply.
(1) To be connected as close as possible to the IC
Fig.13 Test and application circuit; asymmetrical power supply.
July 1994
11
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
PACKAGE OUTLINES
SIL9P: plastic single in-line power package; 9 leads
SOT131-2
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
E
j
A
1
b
L
c
1
9
e
Q
w
M
Z
b
p
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
b
max.
1
(1)
(1)
(1)
UNIT
A
b
c
D
d
D
E
e
E
h
j
L
Q
w
x
Z
2
p
h
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
12.2
11.8
3.4
3.1
17.2
16.5
2.00
1.45
2.1
1.8
6
mm
2.0
1.1
10
2.54
0.25
0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT131-2
July 1994
12
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
SOT157-2
non-concave
D
h
x
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
1
9
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.2 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
5.08 2.54 5.08
4.3
0.8 0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-12
95-03-11
SOT157-2
July 1994
13
Philips Semiconductors
Product specification
TDA1521
TDA1521Q
2 x 12 W hi-fi audio power amplifier
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
14
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