TDA1563 [NXP]
2 x 25 W high efficiency car radio power amplifier; 2× 25瓦高效率的汽车收音机功率放大器
| 型号： | TDA1563 |
| 厂家： | 
NXP |
| 描述： | 2 x 25 W high efficiency car radio power amplifier |
| 文件： | 总32页 (文件大小：272K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1563Q
2 × 25 W high efficiency car radio
power amplifier
Product specification
2000 Feb 09
Supersedes data of 1998 Jul 14
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
FEATURES
GENERAL DESCRIPTION
The TDA1563Q is a monolithic power amplifier in a
• Low dissipation due to switching from Single-Ended
(SE) to Bridge-Tied Load (BTL) mode
17-lead DIL-bent-SIL plastic power package. It contains
two identical 25 W amplifiers. The dissipation is minimized
by switching from SE to BTL mode when a higher output
voltage swing is needed. The device is primarily
developed for car radio applications.
• Differential inputs with high Common Mode Rejection
Ratio (CMRR)
• Mute/standby/operating (mode select pin)
• Zero crossing mute circuit
• Load dump protection circuit
• Short-circuit safe to ground, to supply voltage and
across load
• Loudspeaker protection circuit
• Device switches to SE operation at excessive junction
temperatures
• Thermal protection at high junction temperature (170°C)
• Diagnostic information (clip detection and
protection/temperature)
• Clipping information can be selected between
THD = 2.5% or 10%
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
DC biased
MIN.
TYP. MAX. UNIT
6
14.4
−
18
30
45
4
V
non-operating
load dump
−
V
−
−
V
IORM
Iq(tot)
Istb
repetitive peak output current
total quiescent current
standby current
−
−
A
RL = ∞
−
95
1
150
50
150
−
mA
µA
kΩ
W
−
Zi
input impedance
90
−
120
38
25
20
26
80
65
−
Po
output power
RL = 4 Ω; EIAJ
RL = 4 Ω; THD = 10%
RL = 4 Ω; THD = 2.5%
23
18
25
−
−
W
Vselclip
−
W
Gv
closed loop voltage gain
common mode rejection ratio
supply voltage ripple rejection
DC output offset voltage
channel separation
27
−
dB
dB
dB
mV
dB
dB
CMRR
SVRR
∆VO
αcs
f = 1 kHz; Rs = 0 Ω
f = 1 kHz; Rs = 0 Ω
45
−
−
100
−
Rs = 0 Ω
40
−
70
−
∆Gv
channel unbalance
1
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA1563Q
DBS17P
plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
2000 Feb 09
2
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
BLOCK DIAGRAM
V
V
P2
P1
5
13
+
−
SLAVE
CONTROL
10
11
OUT2−
OUT2+
MUTE
−
+
16
17
IV
−
IN2−
VI
+
−
+
IN2+
VI
60
kΩ
60
kΩ
V
P
4
V
ref
CSE
25 kΩ
3
−
+
CIN
60
kΩ
60
kΩ
+
−
VI
2
1
IN1−
IN1+
+
−
+
−
VI
7
8
OUT1−
OUT1+
IV
MUTE
−
+
SLAVE
CONTROL
TDA1563Q
STANDBY
LOGIC
CLIP AND
DIAGNOSTIC
6
12
14
15
9
MGR173
MODE
SC
DIAG
CLIP
GND
Fig.1 Block diagram.
3
2000 Feb 09
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
PINNING
SYMBOL
PIN
DESCRIPTION
non-inverting input 1
handbook, halfpage
1
2
IN1+
IN1−
CIN
IN1+
IN1−
1
2
inverting input 1
3
CIN
3
common input
CSE
4
electrolytic capacitor for SE mode
supply voltage 1
4
CSE
VP1
5
V
5
P1
MODE
OUT1−
OUT1+
GND
OUT2−
OUT2+
SC
6
mute/standby/operating
inverting output 1
6
MODE
OUT1−
OUT1+
GND
7
7
8
non-inverting output 1
ground
8
9
9
TDA1563Q
10
11
12
13
14
15
16
17
inverting output 2
10
11
12
13
14
15
16
17
non-inverting output 2
selectable clip
OUT2−
OUT2+
SC
VP2
supply voltage 2
DIAG
CLIP
IN2−
diagnostic: protection/temperature
diagnostic: clip detection
inverting input 2
V
P2
DIAG
CLIP
IN2−
IN2+
IN2+
non-inverting input 2
MGR174
Fig.2 Pin configuration.
2000 Feb 09
4
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
FUNCTIONAL DESCRIPTION
To avoid plops during switching from ‘mute’ to ‘on’ or from
‘on’ to ‘mute/standby’ while an input signal is present, a
built-in zero-crossing detector only allows switching at
zero input voltage. However, when the supply voltage
drops below 6 V (e.g. engine start), the circuit mutes
immediately, avoiding clicks from the electronic circuit
preceding the power amplifier.
The TDA1563Q contains two identical amplifiers with
differential inputs. At low output power (up to output
amplitudes of 3 V (RMS) at VP = 14.4 V), the device
operates as a normal SE amplifier. When a larger output
voltage swing is needed, the circuit switches to BTL
operation.
The voltage of the SE electrolytic capacitor (pin 4) is kept
at 0.5VP by a voltage buffer (see Fig.1). The value of this
capacitor has an important influence on the output power
in SE mode. Especially at low signal frequencies, a high
value is recommended to minimize dissipation.
With a sine wave input signal, the dissipation of a
conventional BTL amplifier up to 2 W output power is more
than twice the dissipation of the TDA1563Q (see Fig.10).
In normal use, when the amplifier is driven with music-like
signals, the high (BTL) output power is only needed for a
small percentage of the time. Assuming that a music signal
has a normal (Gaussian) amplitude distribution, the
dissipation of a conventional BTL amplifier with the same
output power is approximately 70% higher (see Fig.11).
The two diagnostic outputs (clip and diag) are
open-collector outputs and require a pull-up resistor.
The clip output will be LOW when the THD of the output
signal is higher than the selected clip level (10% or 2.5%).
The heatsink has to be designed for use with music
signals. With such a heatsink, the thermal protection will
disable the BTL mode when the junction temperature
exceeds 150 °C. In this case, the output power is limited to
5 W per amplifier.
The diagnostic output gives information:
• about short circuit protection:
– When a short circuit (to ground or the supply voltage)
occurs at the outputs (for at least 10 µs), the output
stages are switched off to prevent excessive
dissipation. The outputs are switched on again
approximately 50 ms after the short circuit is
removed. During this short circuit condition, the
protection pin is LOW.
The gain of each amplifier is internally fixed at 26 dB. With
the MODE pin, the device can be switched to the following
modes:
• Standby with low standby current (<50 µA)
• Mute condition, DC adjusted
• On, operation.
– When a short circuit occurs across the load (for at
least 10 µs), the output stages are switched off for
approximately 50 ms. After this time, a check is made
to see whether the short circuit is still present.
The power dissipation in any short circuit condition is
very low.
The information on pin 12 (selectable clip) determines at
which distortion figures a clip detection signal will be
generated at the clip output. A logic 0 applied to pin 12 will
select clip detection at THD = 10%, a logic 1 selects
THD = 2.5%. A logic 0 can be realised by connecting this
pin to ground. A logic 1 can be realised by connecting it to
• during startup/shutdown, when the device is internally
muted.
• temperature detection: This signal (junction temperature
> 145°C) indicates that the temperature protection will
become active. The temperature detection signal can be
used to reduce the input signal and thus reduce the
power dissipation.
V
logic (see Fig.7) or the pin can also be left open. Pin 12
may not be connected to VP because its maximum input
voltage is 18 V (VP > 18 V under load dump conditions).
The device is fully protected against a short circuit of the
output pins to ground and to the supply voltage. It is also
protected against a short circuit of the loudspeaker and
against high junction temperatures. In the event of a
permanent short circuit to ground or the supply voltage, the
output stage will be switched off, causing low dissipation.
With a permanent short circuit of the loudspeaker, the
output stage will be repeatedly switched on and off. In the
‘on’ condition, the duty cycle is low enough to prevent
excessive dissipation.
2000 Feb 09
5
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
PARAMETER
CONDITIONS
operating
MIN.
MAX.
18
UNIT
supply voltage
−
−
−
−
−
−
−
V
V
V
V
V
A
non-operating
30
45
18
6
load dump; tr > 2.5 ms
VP(sc)
Vrp
short-circuit safe voltage
reverse polarity voltage
repetitive peak output current
total power dissipation
storage temperature
IORM
Ptot
4
60
+150
150
−
W
Tstg
Tvj
−55
−
°C
°C
°C
virtual junction temperature
ambient temperature
Tamb
−40
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-c)
Rth(j-a)
thermal resistance from junction to case
thermal resistance from junction to ambient
see note 1
1.3
40
K/W
K/W
Note
1. The value of Rth(c-h) depends on the application (see Fig.3).
Heatsink design
There are two parameters that determine the size of the
heatsink. The first is the rating for the virtual junction
temperature and the second is the ambient temperature at
which the amplifier must still deliver its full power in the
BTL mode.
virtual junction
OUT 1
handbook, halfpage
OUT 1
OUT 2
OUT 2
With a conventional BTL amplifier, the maximum power
dissipation with a music-like signal (at each amplifier) will
be approximately two times 6.5 W.
3.6 K/W
3.6 K/W
3.6 K/W
3.6 K/W
At a virtual junction temperature of 150 °C and a maximum
ambient temperature of 65 °C, Rth(vj-c) = 1.3 K/W and
0.6 K/W
0.6 K/W
Rth(c-h) = 0.2 K/W, the thermal resistance of the heatsink
150 – 65
2 × 6.5
should be:
– 1.3 – 0.2 = 5 K/W
----------------------
MGC424
0.1 K/W
Compared to a conventional BTL amplifier, the TDA1563Q
has a higher efficiency. The thermal resistance of the
145 – 65
2 × 6.5
case
heatsink should be:1.7
– 1.3 – 0.2 = 9 K/W
----------------------
Fig.3 Thermal equivalent resistance network.
2000 Feb 09
6
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in Fig.7; unless otherwise specified.
SYMBOL
Supplies
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VP
supply voltage
note 1
6
−
−
−
−
−
14.4 18
V
Iq(tot)
Istb
total quiescent current
RL = ∞
95
1
150
mA
µA
V
standby current
50
VC
average electrolytic capacitor voltage at pin 4
DC output offset voltage
7.1
−
−
∆VO
on state
100
100
mV
mV
mute state
−
Mode select switch (see Fig.4)
Vms
voltage at mode select pin (pin 6)
standby condition
mute condition
operating condition
Vms = 5 V
0
2
4
−
−
1
V
−
3
V
5
VP
40
V
Ims
switch current through pin 6
25
µA
Diagnostic
Vdiag
output voltage at diagnostic outputs (pins 14 and during any fault condition
15): protection/temperature and detection
−
−
0.5
V
Idiag
VSC
current through pin 14 or 15
during any fault condition
clip detect at THD = 10%
2
−
−
−
−
mA
V
input voltage at selectable clip pin (pin 12)
−
0.5
18
clip detect at THD = 2.5% 1.5
V
Protection
Tpre
prewarning temperature
BTL disable temperature
−
145
150
−
−
°C
°C
Tdis(BTL)
note 2
−
Notes
1. The circuit is DC biased at VP = 6 to 18 V and AC operating at VP = 8 to 18 V.
2. If the junction temperature exceeds 150 °C, the output power is limited to 5 W per channel.
2000 Feb 09
7
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
V
18
mode
handbook, halfpage
Operating
4
3
2
1
0
Mute
Standby
MGR176
Fig.4 Switching levels of the mode select switch.
2000 Feb 09
8
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 Ω; CSE = 1000 µF; f = 1 kHz; Tamb = 25 °C; measured in Fig.7; unless otherwise specified.
SYMBOL
PARAMETER
output power
CONDITIONS
THD = 0.5%
MIN.
TYP.
MAX. UNIT
Po
15
23
−
19
25
38
16
20
0.1
−
−
−
−
−
−
W
W
W
W
W
%
W
Hz
THD = 10%
EIAJ
VP = 13.2 V; THD = 0.5%
VP = 13.2 V; THD = 10%
Po = 1 W; note 1
−
−
THD
Pd
total harmonic distortion
dissipated power
−
see Figs 10 and 11
Bp
power bandwidth
THD = 1%; Po = −1 dB
−
20 to 15000 −
with respect to 15 W
fro(l)
low frequency roll-off
−1 dB; note 2
−1 dB
−
25
−
−
Hz
fro(h)
Gv
high frequency roll-off
130
25
−
kHz
dB
closed loop voltage gain
supply voltage ripple rejection
Po = 1 W
26
27
SVRR
Rs = 0 Ω; Vripple = 2 V (p-p)
on/mute
45
65
−
−
dB
dB
dB
kΩ
%
standby; f = 100 Hz to 10 kHz 80
−
CMRR
Zi
common mode rejection ratio
input impedance
Rs = 0 Ω
−
80
120
1
−
90
−
150
−
∆Zi
mismatch in input impedance
SE to BTL switch voltage level
VSE-BTL
note 3
−
3
−
V
Vo(mute) output voltage mute (RMS value)
Vi = 1 V (RMS)
on; Rs = 0 Ω; note 4
on; Rs = 10 kΩ; note 4
mute; note 5
−
100
100
105
100
70
−
150
150
−
µV
µV
µV
µV
dB
dB
Vn(o)
noise output voltage
−
−
−
150
−
αcs
channel separation
channel unbalance
Rs = 0 Ω; Po = 15 W
40
−
∆Gv
1
Notes
1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz.
2. Frequency response externally fixed (input capacitors determine low frequency roll-off).
3. The SE to BTL switch voltage level depends on VP.
4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage is independent of Rs.
2000 Feb 09
9
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, halfpage
I
o
10 µs
max
MGR177
handbook, halfpage
V
o
t
0
short circuit
removed
max
short circuit
to ground
DIAG
CLIP
0
t
50
ms
50
ms
50
ms
0
t
maximum current
short circuit to supply pins
MGR178
Fig.5 Clip detection waveforms.
Fig.6 Protection waveforms.
2000 Feb 09
10
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
TEST AND APPLICATION INFORMATION
V
220 nF
2200 µF
P
V
5
V
P1
P2
13
TDA1563Q
−
+
100 nF
3.9 Ω
OUT2−
10
0.5R
0.5R
s
IN2− 16
100 nF
220 nF
4 Ω
11 OUT2+
3.9 Ω
−
+
s
IN2+ 17
220 nF
60
60
kΩ
kΩ
V
ref
25 kΩ
4
CIN
3
2
CSE
1000 µF
1 µF
60
kΩ
60
kΩ
0.5R
0.5R
s
IN1−
+
−
7
8
OUT1−
220 nF
3.9 Ω
4 Ω
OUT1+
s
IN1+
1
100 nF
100 nF
3.9 Ω
+
−
220 nF
CLIP AND
DIAGNOSTIC
STANDBY
LOGIC
signal ground
power ground
6
12 14
15
9
MODE
SC DIAG CLIP
GND
V
ms
R
pu
V
logic
R
pu
2.5%
10%
MGR180
Connect Boucherot filter to pin 8 or pin 10 with the shortest possible connection.
Fig.7 Application diagram.
11
2000 Feb 09
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
76.20
35.56
+
Out2
−
−
Out2
+
RL-98
Mode
2.5%
−
In2
+
−
In1
+
10%
Mute
Prot
Clip
gnd
On
Off
gnd
Vp
TDA1563Q
GND
MGR189
Dimensions in mm.
Fig.8 PCB layout (component side) for the application of Fig.7.
12
2000 Feb 09
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
76.20
35.56
2× 25 W high efficiency
Out2
Out1
1
1 µF
17
220 nF
220 nF
220 nF
In2
In1
GND
Vp
MGR190
Dimensions in mm.
Fig.9 PCB layout (soldering side) for the application of Fig.7.
13
2000 Feb 09
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
MBH692
MBH693
25
25
handbook, halfpage
handbook, halfpage
P
P
d
d
(W)
20
(W)
20
(1)
(2)
(1)
(2)
15
10
15
10
5
5
0
0
0
0
2
4
6
8
10
2
4
6
8
10
P
(W)
P
(W)
o
o
(1) For a conventional BTL amplifier.
(2) For TDA1563Q.
Input signal 1 kHz, sinusoidal; VP = 14.4 V.
(1) For a conventional BTL amplifier.
(2) For TDA1563Q.
Fig.11 Dissipation; pink noise through IEC-268
filter.
Fig.10 Dissipation; sine wave driven.
2.2 µF
2.2 µF
470 nF
430 Ω
330 Ω
91
nF
68
nF
3.3
kΩ
3.3
kΩ
10
kΩ
input
output
MGC428
Fig.12 IEC-268 filter.
2000 Feb 09
14
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
V
220 nF
2200 µF
P
V
V
P1
P2
13
5
TDA1563Q
−
100 nF
3.9
Ω
OUT2−
10
IN2− 16
+
100 nF
3.9
220 nF
4
Ω
Ω
−
11 OUT2+
IN2+ 17
+
220 nF
60
60
kΩ
kΩ
V
ref
25 kΩ
4
CIN
3
2
CSE
1000 µF
1 µF
IEC-268
FILTER
60
kΩ
60
kΩ
IN1−
+
−
7
8
OUT1−
220 nF
pink
noise
3.9
Ω
4
Ω
IN1+
220 nF
1
100 nF
100 nF
3.9
Ω
+
−
OUT1+
CLIP AND
DIAGNOSTIC
STANDBY
LOGIC
signal ground
power ground
6
12 14
15
9
MODE
SC DIAG
CLIP
GND
V
ms
R
pu
V
logic
R
pu
MGR181
Fig.13 Test and application diagram for dissipation measurements with a music-like signal (pink noise).
2000 Feb 09
15
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
MDA845
MDA844
150
250
handbook, halfpage
handbook, halfpage
I
p
I
(mA)
q
(mA)
200
100
150
100
50
50
0
0
0
0
8
16
24
2
4
6
V
(V)
V
(V)
ms
p
Vms = 5 V; RI = ∞.
VP = 14.4 V; Vi = 25 mV
Fig.14 Quiescent current as a function of VP.
Fig.15 IP as a function of Vms (pin 3).
MDA843
MDA842
60
10
handbook, halfpage
handbook, halfpage
P
o
THD + N
(%)
(W)
(1)
40
1
(1)
(2)
(3)
(2)
(3)
−1
20
10
−2
10
0
2
−1
−2
8
10
12
14
16
18
1
10
10
10
10
P
(W)
V
(V)
o
p
(1) EIAJ, 100 Hz.
(2) THD = 10 %.
(3) THD = 0.5 %.
(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.
Fig.16 Output power as a function of VP.
Fig.17 THD + noise as a function of Po.
2000 Feb 09
16
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
MDA841
MDA840
10
28
handbook, halfpage
handbook, halfpage
G
v
(dB)
THD + N
(%)
26
(1)
(2)
1
24
22
−1
10
−2
10
20
10
2
3
5
4
2
3
4
5
6
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
(1) Po = 10 W.
(2) Po = 1 W.
Vi = 100 mV.
Fig.18 THD + noise as a function of frequency.
Fig.19 Gain as a function of frequency.
MDA838
MDA839
−10
0
handbook, halfpage
handbook, halfpage
α
cs
SVRR
(dB)
(dB)
−30
−20
−40
−60
−50
−70
−90
(1)
(2)
2
−80
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
(1) Po = 10 W.
(2) Po = 1 W.
Vripple(p-p) = 2 V.
Fig.20 Channel separation as a function of
frequency.
Fig.21 SVRR as a function of frequency.
2000 Feb 09
17
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
MDA846
0.8
handbook, halfpage
P
o
(W)
0.6
0.4
0.2
0
0
8
16
24
V
(V)
p
Vi = 70 mV.
Fig.22 AC operating as a function of VP.
2000 Feb 09
18
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
MGL914
V
P
V
load
0
−V
P
V
P
V
master
1/2 V
P
0
V
P
V
slave
1/2 V
P
0
0
1
2
t (ms)
3
See Fig.7:
Vload = V7 − V8 or V11 − V10
Vmaster = V7 or V11
Vslave = V8 or V10
Fig.23 Output waveforms.
19
2000 Feb 09
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
APPLICATION NOTES
5. Connect the supply decoupling capacitors of 220 nF
as closely as possible to the TDA1563Qs.
Example of the TDA1563Q in a car radio system
solution
6. Place the tracks of the differential inputs as close
together as possible. If disturbances are injected at the
inputs, they will be amplified 20 times. Oscillation may
occur if this is not done properly.
The PCB shown here is used to demonstrate an audio
system solution with Philips Semiconductors devices for
car audio applications. The board includes the SAA7705H:
a high-end CarDSP (Digital Signal Processor), the
TDA3617J: a voltage regulator providing 9 V, 5 V and
3.3 V outputs, and two TDA1563Qs to provide four 25 W
power outputs. A complete kit (application report, software
and demo board) of this “car-audio chip-set demonstrator”
is available.
7. The SE line output signal of the CarDSP here is
offered as a quasi differential input signal to the
amplifiers by splitting the 100 Ω unbalance series
resistance into two 47 Ω balanced series resistances.
The return track from the minus inputs of the amplifiers
are not connected to ground (plane) but to the line out
reference voltage of the CarDSP, VrefDA.
The TDA1563Q is a state of the art device, which is
different to conventional amplifiers in power dissipation
because it switches between SE mode and conventional
BTL mode, depending on the required output voltage
swing. As a result, the PCB layout is more critical than with
conventional amplifiers.
8. The output signal of the CarDSP needs an additional
1st order filter. This is done by the two balanced series
resistances of 47 Ω (see note 7) and a ceramic
capacitor of 10 nF. The best position to place these
10 nF capacitors is directly on the input pins of the
amplifiers. Now, any high frequency disturbance at the
inputs of the amplifiers will be rejected.
NOTES AND LAYOUT DESIGN RECOMMENDATIONS
9. Only the area underneath the CarDSP is a ground
plane. A ground plane is necessary in PCB areas
where high frequency digital noise occurs. The audio
outputs are low frequency signals. For these outputs,
it is better to use two tracks (feed and return) as closely
as possible to each other to make the disturbances
common mode. The amplifiers have differential inputs
with a very high common mode rejection.
1. The TDA1563Q mutes automatically during switch-on
and switch-off and suppresses biasing clicks coming
from the CarDSP circuit preceding the power amplifier.
Therefore, it is not necessary to use a plop reduction
circuit for the CarDSP. To mute or to enlarge the mute
time of the system, the voltage at the mode pin of the
amplifiers should be kept between 2 V and 3 V.
2. The input reference capacitor at pin 3 is specified as
1 µF but has been increased to 10 µF to improve the
switch-on plop performance of the amplifiers. By doing
this, the minimum switch-on time increases from
standby, via internal mute, to operating from 150 ms to
600 ms.
10. The ground pin of the voltage regulator is the
reference for the regulator outputs. This ground
reference should be connected to the ground plane of
the CarDSP by one single track. The ground plane of
the CarDSP may not be connected to “another” ground
by a second connection.
3. It is important that the copper tracks to and from the
electrolytic capacitors (SE capacitors and supply
capacitors) are close together. Because of the
switching principle, switching currents flow here.
Combining electrolytic capacitors in a 4-channel
application is not recommended.
11. Prevent power currents from flowing through the
ground connection between CarDSP and voltage
regulator. The currents in the ground from the
amplifiers are directly returned to the ground pin of the
demo board. By doing this so, no ground interference
between the components will occur.
4. Filters at the outputs are necessary for stability
reasons. The filters at output pins 8 and 10 to ground
should be connected as close as possible to the
device (see layout of PCB).
2000 Feb 09
20
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
(3)
(3)
Car-audio chip-set demonstrator
TDA3617J
TDA1563Q
TDA1563Q
+
+
Rear
V
Front
−
FL
+
+
2.5%
10%
FR
BATT
−
Line-in
−
RL
+
+
IO-98
RR
Error On Diag Clip
−
Car DSP
10 V to 16 V
SAA7704/05/08
on bottom side
Left
V
battery
GND
Right
Power ON
Mute
2
I C
PHILIPS Semiconductors
Top copper layer
(4)
(5)
(6)
(8)
Car-audio chip-set demonstrator
Version 0.1
DSP
MGS827
Bottom copper layer
Fig.24 PCB layout.
2000 Feb 09
21
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
VOLTAGE REGULATOR
V
V
V
V
en1
P
MICROCONTROLLER
3
V
BATT
2
1
BATT
TDA3617J
220 nF
GND
power
en3
GND
8
6
7
9
5
PLANE GND
47 nF
REG2 HOLD
V
REG3
4.7 kΩ
en2
power
on
5 V
47 µF
47 µF
47 nF
10 kΩ
GND
GND
GND
5 V
3.3 V DIG 3.3 V ANA
BAS16/A6
A
4.7 kΩ
error
10 kΩ
1 MΩ
BC848B/1k
mute
GND
4.7 kΩ
4.7 kΩ
B
C
diagnostic
clip
5 V
3.3 V DIG
3.3 V ANA
100 nF
PLANE
100 Ω
3.3 V ANA
BLM21A10
100 nF
22 nF
22 nF
22 nF
PLANE PLANE
PLANE
PLANE
100 nF
100 Ω
PLANE
FLV
VDACP
74
75 76
21 22
23
36
37
46
47
48 51 52 55 49 50 53 54 11
1
2
47 Ω
47 Ω
16
15
D
E
100 µF
2.2
nF
VDACN1
FLI
PLANE
330 pF
47 Ω
47 Ω
FRV
FRI
13
14
F
CDLB
CDLI
73
72
2.2
nF
8.2 kΩ
1 µF
15 kΩ
G
LEFT
330 pF
47 Ω
47 Ω
RRV
RRI
CDRB
CDRI
6
7
H
I
71
70
Car DSP
SAA7704/05/08H
8.2 kΩ
LINE
IN
2.2
nF
1 µF
1 µF
15 kΩ
RIGHT
CDGND
47 Ω
47 Ω
CD-GND
77
RLV
RLI
9
8
J
2.2
nF
1 MΩ
82 kΩ
VREFAD
78
K
AMAFR
AMAFL
TAPER
TAPEL
66
67
68
69
VREFDA
12
10
22 µF
V
SSA2
4
3
61
65
62
63
64
42
57 58 56 24 25 26 27 28 29 43 44 45
PLANE
22 µF
47 nF
PLANE
MGS825
220 nF
220
X1
100 nF
220
Ω
PLANE
PLANE
BLM21A10
PLANE
Ω
PLANE
18
pF
18 100
1 to 5
100 pF
PLANE
pF
pF
PLANE
5 V
6
8
7
3.3 V DIG
PLANE PLANE
PLANE
2
I
C
SCL
SDA
Fig.25 Car-audio chip-set demonstrator (continued in Fig.26).
22
2000 Feb 09
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
100 µH/6A
V battery
GND
V
BATT
A
GND PGND
5 V
clip select
2.5%
10%
GND
V
B
C
2200 µF
PGND
BATT
(16 V)
220 nF
V
V
GND
P1 P2
1000 µF
(16 V)
5
6
13
9
4
MODE
CSE
CLIP
DIAG
SC
OUT2+
15
14
12
OUT+
11
10
3.9 Ω
FRONT
LEFT
IN2+
100 nF
OUT2−
17
OUT−
PGND
D
E
220 nF
220 nF
10 nF
3.9 Ω
TDA1563Q
IN2−
100 nF
100 nF
16
1
3.9 Ω
IN1+
PGND
OUT+
F
OUT1+
OUT1−
220 nF
220 nF
8
7
10 nF
100 nF
IN1−
FRONT
RIGHT
2
3
G
3.9 Ω
CIN
OUT−
H
I
10 µF
10 µF
PGND
2× HIGH EFFICIENCY POWER AMPLIFIER
OUT1−
CIN
3
7
OUT−
J
3.9 Ω
IN1+
REAR
RIGHT
1
220 nF
220 nF
100 nF
K
OUT1+
OUT2−
10 nF
8
OUT+
PGND
IN1−
IN2+
2
3.9 Ω
100 nF
100 nF
17
3.9 Ω
TDA1563Q
220 nF
220 nF
PGND
OUT−
10 nF
10
11
IN2−
16
12
14
15
100 nF
SC
REAR
LEFT
3.9 Ω
DIAG
CLIP
OUT2+
OUT+
1000 µF
(16 V)
CSE
MODE
6
5
4
9
13
V
V
GND
P1 P2
220 nF
2200 µF
MGS826
V
PGND
BATT
(16 V)
Fig.26 Car-audio chip-set demonstrator (continued from Fig.25).
23
2000 Feb 09
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
Advantages of high efficiency
• Power conversion improvement (power supply)
V
= 14.4 V
handbook, halfpage
P
Usually, the fact that the reduction of dissipation is
directly related to supply current reduction is neglected.
One advantage is less voltage drop in the whole supply
chain. Another advantage is less stress for the coil in the
supply line. Even the adapter or supply circuit remains
cooler than before as a result of the reduced heat
dissipation in the whole chain because more supply
current will be converted to output power.
Power
dissipation
reduction of 40%
Supply
current
at P = 1.6 W
o
reduction of
32%
Same junction
temperature
Same heatsink
size
choice
• Power dissipation reduction
This is the best known advantage of high efficiency
amplifiers.
• Heatsink size reduction
Heatsink
size
reduction of
50%
Heatsink
temperature
reduction of
40%
The heatsink size of a conventional amplifier may be
reduced by approximately 50% at VP = 14.4 V when the
TDA1563Q is used. In this case, the maximum heatsink
temperature will remain the same.
MGS824
• Heatsink temperature reduction
The power dissipation and the thermal resistance of the
heatsink determine the heatsink temperature rise. When
the same heatsink size is used as in a conventional
amplifier, the maximum heatsink temperature
decreases and also the maximum junction temperature,
which extends the life of this semiconductor device.
The maximum dissipation with music-like input signals
decreases by 40%.
Fig.27 Heatsink design
Advantage of the concept used by the TDA1563Q
The TDA1563Q is highly efficient under all conditions,
because it uses a SE capacitor to create a non-dissipating
half supply voltage. Other concepts rely on both input
signals being the same in amplitude and phase. With the
concept of an SE capacitor, it does not matter what kind of
signal processing is done on the input signals.
For example, amplitude difference, phase shift or delays
between both input signals, or other DSP processing, have
no impact on the efficiency.
It is clear that the use of the TDA1563Q saves a significant
amount of energy. The maximum supply current
decreases by approximately 32%, which reduces the
dissipation in the amplifier as well in the whole supply
chain. The TDA1563Q allows a heatsink size reduction of
approximately 50% or a heatsink temperature decrease of
40% when the heatsink size is not changed.
2000 Feb 09
24
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
INTERNAL PIN CONFIGURATIONS
PIN
NAME
EQUIVALENT CIRCUIT
1, 2, 16,
17 and 3 IN2+ and CIN
IN1+, IN1−, IN2−,
V
V
P1, P2
V
V
P1, P2
1, 2, 16, 17
3
MGR182
4
CSE
V
V
P2
P1
4
MGR183
6
MODE
6
MGR184
7, 11
OUT1−, OUT2+
V
V
P1, P2
7, 11
4
MGR185
2000 Feb 09
25
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
PIN
8, 10
NAME
EQUIVALENT CIRCUIT
OUT1+, OUT2−
V
V
P1, P2
8, 10
4
MGR186
12
SC
V
P2
12
MGR187
14, 15
PROT, CLIP
V
P2
14, 15
MGR188
2000 Feb 09
26
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
D
h
x
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
2
v
M
1
17
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.4 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
2.54 1.27 5.08
0.8
4.3
0.4 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-12-16
99-12-17
SOT243-1
2000 Feb 09
27
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
SOLDERING
The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Feb 09
28
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
NOTES
2000 Feb 09
29
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
NOTES
2000 Feb 09
30
Philips Semiconductors
Product specification
2 × 25 W high efficiency car radio power
amplifier
TDA1563Q
NOTES
2000 Feb 09
31
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5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
69
SCA
© Philips Electronics N.V. 2000
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Printed in The Netherlands
753503/25/02/pp32
Date of release: 2000 Feb 09
Document order number: 9397 750 06309
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