TDA1576T [NXP]

FM/IF amplifier/demodulator circuit; FM / IF放大器器/解调器电路


型号：	TDA1576T
厂家：	NXP
描述：	FM/IF amplifier/demodulator circuit FM / IF放大器器/解调器电路消费电路商用集成电路接收器集成电路放大器光电二极管
文件：	总16页 (文件大小：114K)
中文：	中文翻译
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INTEGRATED CIRCUITS

DATA SHEET

TDA1576T

FM/IF amplifier/demodulator circuit

1998 Nov 18

Product speciﬁcation

Supersedes data of February 1991

File under Integrated Circuits, IC01

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

FEATURES

GENERAL DESCRIPTION

• Fully balanced 4-stage limiting IF amplifier

• Symmetrical quadrature demodulator

• Field strength indication output for 1 mA ammeter

• Detune detector for side response and noise attenuation

• Detune voltage output

The TDA1576T is a monolithic integrated FM/IF amplifier

circuit for use in mono and stereo FM-receivers of car

radios or home sets.

• Internal muting circuit

• 0° and 180° AF output signals

• Reference voltage output

• Electronic smoothing of the supply voltage.

QUICK REFERENCE DATA

SYMBOL

V_P

PARAMETER

supply voltage (pin 1)

CONDITIONS

MIN.

7.5

−3 dB before limiting 14

TYP.

8.5

MAX.

UNIT

I_P

supply current

−

µV

V_iIF(rms)

input sensitivity (RMS value)

S/N = 26 dB

S/N = 46 dB

−

V_oAF(rms)

THD

AF output voltage (RMS value)

−

total harmonic distortion with double

resonant circuits

0.02

S/N

α_AM

signal-to-noise ratio

V_i> 1 mV

f = 100 Hz

−

°C

AM suppression

−

ripple rejection

−

I₁₅

maximum indicator output current

operating ambient temperature

T_amb

−30

−

+80

ORDERING INFORMATION

TYPE

PACKAGE

DESCRIPTION

NUMBER

NAME

VERSION

TDA1576T

SO20 plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

1998 Nov 18

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handbook, full pagewidth

field strength

1 mA

detune

voltage

2 V (RMS)

zero adjustment

field strength

indicator

reference

voltage

3.6 kΩ

iIF

1 nF

0.47 µF

0.1 µF

+4.9 V

n.c.

GND

iIF

ref

o(det)

i(det)

FB1

FB2

4-STAGE

LIMITER/

AMPLIFIER

REFERENCE

VOLTAGE

kΩ

LEVEL DETECTOR

kΩ

MUTE

ATTENUATOR

0.5

DETUNE

DETECTOR

TDA1576T

QUADRATURE

DEMODULATOR

3.7 kΩ

8.3 kΩ

IF1

RES1 FMON RES2

IF2

n.c.

oAF1

oAF2

33 pF

+8.5 V

10 Ω

MEH139

0.1 µF

47 µF

6.8 nF

33 pF

560 pF

audio

outputs

= 20

−V

= 10.7 MHz

Fig.1 Block diagram.

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

PINNING

SYMBOL PIN

DESCRIPTION

positive supply voltage

V_P

C_PS

smoothing capacitor of power supply

IF signal to resonant circuit

resonant circuit input 1

IF1

handbook, halfpage

RES1

FMON

RES2

IF2

GND

FM-ON, standby switch

FB1

resonant circuit input 2

IF1

RES1

FMON

RES2

IF2

FB2

IF signal to resonant circuit

AF output voltage 1 (0° phase)

AF output voltage 2 (180° phase)

iIF

V_oAF1

V_oAF2

n.c.

TDA1576T

10 not connected

11 not connected

n.c.

ref

V_i(det)

12 detune detector input voltage for

external audio reference

oAF1

o(det)

i(det)

oAF2

V_o(det)

V_ref

13 detune detector output voltage

14 reference voltage output

15 level output for field strength

16 zero adjust voltage for ﬁeld strength

17 FM/IF input signal voltage

18 DC feedback 2

n.c. 10

11 n.c.

MEH140

V_F

V_F0

V_iIF

V_FB2

V_FB1

GND

19 DC feedback 1

Fig.2 Pin configuration.

20 ground (0 V)

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

V_P

V_{2, 5, 16}

P_tot

supply voltage (pin 1)

voltage on pins 2, 5 and 16

total power dissipation

V_P

450

°C

T_stg

storage temperature

−55

−30

+150

+80

T_amb

operating ambient temperature

°C

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

VALUE

UNIT

K/W

R_{th j-a}

thermal resistance from junction to ambient in free air

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

CHARACTERISTICS

V_P= 8.5 V; f_IF= 10.7 MHz; R_S= 60 Ω; f_m= 400 Hz with ∆f = ±22.5 kHz; 50 µs de-emphasis (C_8-9= 6.8 nF);

_amb= 25 °C and measurements taken in Fig.1; unless otherwise speciﬁed. The demodulator circuit is adjusted at

minimum second harmonic distortion for V_iIF= 1 mV and a deviation ∆f = ±75 kHz.

SYMBOL

PARAMETER

supply voltage (pin 1)

supply current

CONDITIONS

MIN.

7.5

TYP.

8.5

MAX.

UNIT

V_P

I_P

V₅= V₉= V₁₃= 0

Reference voltage

V_ref

reference voltage (pin 14)

I₁₄= −1 mA

−

4.9

0.3

−

∆V_ref

reference voltage dependence on

temperature

%/K

∆V₁₄

----------------------

₁₄× ∆T

I₁₄

maximum output current

short-circuit current

₁₄< 1.2 mA

7.5

R₁₄

−

150

Ω

∆V ₁₄

output resistor

------------

∆I₁₄

IF ampliﬁer

V_iIF(rms)

R_17-18

input sensitivity (RMS value; pin 17)

input resistance

−3 dB before limiting

V_iIF= 200 mV (RMS)

−

µV

kΩ

C_17-18

input capacitance

−

V_oIF(p-p)

output voltage at pins 3 and 7

(peak-to-peak value)

Z_{3, 7}= 10 pF parallel to 610

1 MΩ

680

750

R_3-7

output resistance

200

250

300

Ω

Demodulator

R_4-6

C_4-6

R_{8, 9}

V_{8, 9}

input resistance

−

kΩ

input capacitance

output resistance

2.5

4.5

±100

2.9

3.7

kΩ

DC offset voltage on output pins at

V_4-6= 0

V₅> 3 V or V_3-7= 0 or

V₁₃< 0.3 V

−

demodulator efﬁciency

−

mV/°

∆ V

-------

∆ ϕ

∆V _8-9

-------------

∆ϕ

demodulator efﬁciency dependent on

supply voltage

−

6.2

V _8-9

-----------------------------------------

∆ϕ (V_P– 3V_BE

)

V/V

DC voltage ratio

0.653

0.667

10⁻⁵

0.680

V/V

1/K

V ₈+ V ₉

-------------------

2V₂

dependence on temperature

−

∆ V

-------

∆ T

V ₈+ V ₉

∆

-------------------

2V₂

-----------------------

∆ T

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Field strength output; see Fig.4

V₁₅

output voltage

V_iIF= 0

0.1

0.25

1.9

4.1

−

V_iIF= 1 mV (RMS)

1.1

3.2

−

1.5

V_iIF= 250 mV (RMS)

3.6

control steepness

0.85

150

0.3

V/dec

Ω

R₁₅

output resistance

−

200

−

dependence on temperature

−

%/K

∆V

-------

∆T

∆V₁₅

V _iIF

----------------------

∆T × V₁₅

V₅≥ 3 V; V₁₅= 0 to 5 V

I₁₅

standby operational cut-off current

−

µA

Zero level adjustment

V₁₆

R₁₆

internal bias voltage

−

260

−

kΩ

input resistance

−

control steepness

0.87

1.0

1.2

V/V

V_iIF= 100 mV;

∆V ₁₅

A =

------------

∆V₁₆

Detuning detector

I₁₂

input bias current

−

100

Z₁₂

input impedance

−

MΩ

5 V

∆I₁₂

Z ₁₂

; see Fig.5

---------

output voltage ratio for

∆ϕ = ϕ(V_3-7) − ϕ(V_4-6) − 90°

V₁= V₂= 7.5 V;

R_13-14= 10 kΩ; pins 9

and 12 short-circuit;

see Fig.6

V ₁₃

--------

V₁₄

∆ϕ = 9.2° (43 kHz); Q = 20

∆ϕ = 3.5° (16 kHz); Q = 20

∆ϕ = 14° (65 kHz); Q = 20

maximum output current

cut-off current

_{9, 12}= 334 mV

V_{9, 12}= 138 mV

_{9, 12}= 501 mV

0.45

0.75

0.335

0.4

0.5

0.8

0.345

0.5

−

0.55

0.85

0.355

0.6

V/V

I₁₃

V₁₃= 6 V; see Fig.7

V₁₃= 2.5 V; V_{9, 12}= 0

−

−100

Internal audio attenuation; see Fig.8

output voltage ratio

α = attenuation factor

α = 1 dB

V ₁₃

--------

V₁₄

0.11

0.095

−

0.12

0.1

0.06

−

0.13

0.105

−

V/V

α = 7.2 dB

α ≥ 40 dB

I₁₃

input current

₁₃≤ 0.1 V

−

−225

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Standby switch; see Fig.9

V₅

input voltage for FM on

2.4

2.5

−

V_{3, 7}

----------------------

V_{3, 7(max)}

= 0.9 ;

input voltage for FM off

linear range

−

2.9

350

−

V₁₉= 0.3 V

I₅

input current

V₅= 0 to 2 V

−

−100

µA

V₅= 3.5 to 15 V

−

µA

temperature dependence

FM on (3.5V_BE

FM off (5V_BE

)

mV/K

V₅

------

)

∆T

Supply voltage smoothing

V_1-2

internal voltage drop

proportional to

V₁− 3V_BE

210

8.3

400

R_1-2

internal resistor

5.8

10.8

kΩ

OPERATING CHARACTERISTICS

V_P= 8.5 V; f_IF= 10.7 MHz; R_S= 60 Ω; f_m= 400 Hz with ∆f = ±22.5 kHz; 50 µs de-emphasis (C_8-9= 6.8 nF);

T_amb= 25 °C and measurements taken in Fig.1; unless otherwise speciﬁed. The demodulator circuit is adjusted at

minimum second harmonic distortion with V_iIF= 1 mV.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

IF ampliﬁer and demodulator

V_iIF(rms)

input sensitivity (RMS value)

−3 dB before limiting

S/N = 26 dB

µV

−

µV

S/N = 46 dB

−

V_oAF(rms)AF output voltage (RMS value)

−

V_oN

noise voltage for V_iIF= 0 (RMS value;

pins 8 and 9)

R_S= 300 Ω;

f = 250 to 15000 Hz

900

weighted noise voltage

signal-to-noise ratio (pins 8 and 9)

AM suppression

in accordance with

“DIN 45405”

−

S/N

V_iIF= 1 mV (RMS);

see Fig.3

α_AM

V_iIF= 0.5 to 200 mV;

FM: 70 Hz; ±15 kHz;

AM: 1 kHz; m = 30%

α_FM

FM suppression for FM off

V_iIF= 500 mV; V₅= 3 V 80

−

∆V_{8, 9}

AFC shift in relation to minimum second

V_iIF= 0.03 to 500 mV

−

harmonic distortion α_2H

DC offset at second harmonic distortion

operating

−

±100

±50

−

mute or FM off

−

α_3H

distortion for third harmonic

−

0.65

ripple rejection V_ripple= 200 mV on V_P

f = 100 Hz

−

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

MEH166

handbook, full pagewidth

V , V

(dB)

S + N

−20

−40

−60

−80

−6

−5

−4

−3

−2

−1

(V)

i 17 (rms)

Fig.3 AF output voltage level on pins 8 and 9 as a function of V_iIFat V_P= 8.5 V; f_m= 1 kHz; Q_L= 20 with

de-emphasis.

MEH143

handbook, full pagewidth

(V)

−6

−5

−4

−3

−2

−1

(V)

iIF (rms)

Fig.4 Field strength output (I₁₆= 0).

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

MEH145

MEH144

handbook, halfpage

13 14

0.5

−1.2

−0.8

−0.4

0.4

0.8

1.2

9, 12

(V)

9, 12

Fig.5 Detuning input impedance.

Fig.6 Detuning curve.

MEH147

MEH146

handbook, halfpage

αV

(dB)

−20

(mA)

0.5

−40

−60

1.2

0.5

9, 12

−80

0.1

0.2

0.3

(V)

13 14

Fig.7 Detuning output.

Fig.8 Internal audio attenuation.

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

MEH148

handbook, halfpage

3-7

3-7 (max)

∆V

(V)

Fig.9 Standby switch.

handbook, full pagewidth

33 pF

39 pF

(1)

560

1 kΩ

TDA1576T

390 Ω

39 pF

MBK240

33 pF

8-9

oAF

Adjustment of the demodulator circuit is obtained with an IF signal which is higher than the 3 dB limiting level; L2 should be short-circuited or detuned;

L1 should be adjusted to minimum d₂distortion, and then L2 to minimum d₂distortion.

(1) Coil data: L1 = L2 = 0.38 µH; Q_o= 70; coil former KAN (C).

Fig.10 An example of the TDA1576T when using a demodulator with two tuned circuits.

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

PACKAGE OUTLINE

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

(A )

pin 1 index

detail X

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

(1)

UNIT

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

10.65

10.00

1.1

0.4

1.1

1.0

0.9

0.4

2.65

0.25

0.01

1.27

0.050

1.4

0.25 0.25

0.01

0.1

8^o

0^o

0.012 0.096

0.004 0.089

0.019 0.013 0.51

0.014 0.009 0.49

0.30

0.29

0.419

0.394

0.043 0.043

0.016 0.039

0.035

0.016

inches 0.10

0.055

0.01 0.004

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-01-24

97-05-22

SOT163-1

075E04

MS-013AC

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

PACKAGE

WAVE

REFLOW⁽¹⁾

BGA, SQFP

not suitable

not suitable⁽²⁾

suitable

HLQFP, HSQFP, HSOP, SMS

PLCC⁽³⁾, SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

suitable

not recommended⁽³⁾⁽⁴⁾

not recommended⁽⁵⁾

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

1998 Nov 18

Philips Semiconductors

Product speciﬁcation

FM/IF ampliﬁer/demodulator circuit

TDA1576T

NOTES

1998 Nov 18

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Colombia: see South America

Czech Republic: see Austria

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 0044

Slovakia: see Austria

Slovenia: see Italy

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615800, Fax. +358 9 61580920

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,

Tel. +27 11 470 5911, Fax. +27 11 470 5494

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Spain: Balmes 22, 08007 BARCELONA,

Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Hungary: see Austria

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Tel. +90 212 279 2770, Fax. +90 212 282 6707

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Tel. +1 800 234 7381

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors,

Internet: http://www.semiconductors.philips.com

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA60

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

545102/750/02/pp16

Date of release: 1998 Nov 18

Document order number: 9397 750 04823

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