TDA2546A [NXP]

Quasi-split-sound circuit with 5,5 MHz demodulation; 准分音电路5,5 MHz的解调
TDA2546A
型号: TDA2546A
厂家: NXP    NXP
描述:

Quasi-split-sound circuit with 5,5 MHz demodulation
准分音电路5,5 MHz的解调

文件: 总10页 (文件大小:88K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
TDA2546A  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
February 1985  
Product specification  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
GENERAL DESCRIPTION  
The TDA2546A is a monolithic integrated circuit for quasi-split-sound processing, including 5,5 MHz demodulation, in  
television receivers.  
Features  
1st i.f. (V.C.: vision carrier plus S.C.: sound carrier)  
3-stage gain controlled i.f. amplifier  
A.G.C. circuit  
Reference amplifier and limiter amplifier for vision carrier (V.C.) processing  
Linear multiplier for quadrature demodulation  
2nd i.f. (5,5 MHz signal)  
8-stage limiter amplifier  
Quadrature demodulator  
A.F. amplifier with de-emphasis  
AV switch  
QUICK REFERENCE DATA  
Supply voltage (pin 15)  
VP = V15-16  
IP = I15  
typ.  
typ.  
typ.  
typ.  
typ.  
typ.  
12  
V
Supply current (pin 15)  
57  
mA  
µV  
mV  
mV  
dB  
Minimum i.f. vision carrier input voltage (r.m.s. value)  
Output voltage; 5,5 MHz (r.m.s. value)  
Output voltage; 5,742 MHz (r.m.s. value)  
I.F. control range  
VVC1-18 (rms)  
V14-16(rms)  
V14-16(rms)  
Gv  
150  
100  
45  
64  
Signal-to-weighted-noise ratio (rel. to 1 kHz; 30 kHz deviation)  
at 5,5 MHz  
S + W/W  
typ.  
58  
dB  
for 2T/20T pulses with white bars  
at 5,742 MHz  
S + W/W  
typ.  
typ.  
56  
dB  
V
A.F. output voltage (r.m.s. value)  
Vo6-16(rms)  
0,6  
PACKAGE OUTLINES  
18-lead DIL; plastic (SOT 102); SOT102-1; 1996 November 19.  
February 1985  
2
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
February 1985  
3
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Supply voltage (pin 15)  
VP = V15-16  
max. 13,2  
max. 7  
V
Input current (pin 4)  
I4  
mA  
Storage temperature range  
Operating ambient temperature range  
Tstg  
Tamb  
25 to +150 °C  
0 to +70 °C  
February 1985  
4
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
CHARACTERISTICS  
VP = V15-16 = 12 V; Tamb = 25 °C; measured at fVC = 38,9 MHz, fSC1 = 33,4 MHz, fSC2 = 33,158 MHz:  
Vision carrier (V.C.) modulated with different video signals (see below); modulation depth 100% (proportional to 10%  
residual carrier).  
Vision carrier amplitude (r.m.s. value) is VVC = 10 mV.  
Vision-to-sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB.  
Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation f = ± 30 kHz.  
For measuring circuit see Fig.2; unless otherwise specified.  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply (pin 15)  
Supply voltage  
Supply current  
VP = V15-16  
10,8  
12  
13,2  
V
IP = I15  
40  
57  
75  
mA  
I.F. amplifier  
Input voltage for start of gain control  
(intercarrier signals 3 dB)  
Input voltage for end of gain control  
(intercarrier signals + 1 dB)  
I.F. gain control range  
VVC1-18(rms)  
150  
200  
µV  
VVC1-18 (rms)  
Gv  
100  
60  
4
250  
64  
mV  
dB  
V
Control voltage range (see Fig.3)  
Input resistance  
V3-16  
Vp  
R1-18  
2,5  
1,5  
kΩ  
pF  
Input capacitance  
C1-18  
Intercarrier generation  
Output voltage; 5,5 MHz (r.m.s. value)  
Output voltage; 5,742 MHz (r.m.s. value)  
D.C. output voltage  
V14-16(rms)  
V14-16(rms)  
V14-16  
60  
27  
100  
45  
5,9  
140  
63  
mV  
mV  
V
Allowable d.c. load resistance at the output  
Allowable output current  
R14-16  
7
V
I14  
1
mA  
Frequency demodulator (measured at f = 5,5 MHz)  
Input voltage vor start of limiting (r.m.s. value)  
Maximum input voltage (r.m.s. value)  
D.C. output voltage  
V12-16(rms)  
V12-16 (rms)  
V11,12,13-16  
V6-16(rms)  
v6-16  
100  
µV  
mV  
V
200  
2,2  
600  
4
A.F. output voltage (r.m.s. value)  
D.C. output voltage  
450  
810  
mV  
V
Allowable d.c. load resistance at the output  
Allowable a.c. load impedance at the output  
Total harmonic distortion  
R6-16  
27  
10  
kΩ  
kΩ  
%
Z6-16  
THD  
1
Internal de-emphasis resistance  
Switching voltage (pin 4)  
Ri5-16  
1
kΩ  
for mute  
V4-16  
V4-16  
9
V
V
for a.f. on  
2,5  
February 1985  
5
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Intercarrier signal-to-noise  
(measured behind the FM demodulators)  
Signal-to-weighted-noise ratio according to  
CCIR 468-2, quasi-peak 2T/20T pulses with white  
bars (see also Fig.4)  
at 5,5 MHz  
at 5,742 MHz  
6 kHz sine wave  
at 5,5 MHz  
S+W/W  
53  
51  
58  
dB  
S+W/W  
56  
dB  
S+W/W  
S+W/W  
50  
50  
53  
53  
dB  
dB  
at 5,742 MHz  
with black level (vision carrier modulated with sync  
pulses only)  
at 5,5 MHz  
S+W/W  
S+W/W  
60  
58  
65  
63  
dB  
dB  
at 5,742 MHz  
Notes to the characteristics  
1. Incidential phase on the vision carrier, caused by TV-transmitter, has to be less than 0,5 degrees for black to white  
transient.  
(Equivalent to S+W/W = 56 dB for 6 kHz sine wave).  
February 1985  
6
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
(1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.)  
Fig.2 Measuring circuit for TDA2546A.  
Fig.3 Control voltage at pin 3 as a function of the input voltage VVC1-18(rms).  
February 1985  
7
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
Fig.4 Signal-to-weighted-noise ratio depending on video modulation.  
February 1985  
8
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
PACKAGE OUTLINE  
DIP18: plastic dual in-line package; 18 leads (300 mil)  
SOT102-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
b
2
18  
10  
M
H
pin 1 index  
E
1
9
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
2
(1)  
(1)  
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.40  
1.14  
0.53  
0.38  
1.40  
1.14  
0.32  
0.23  
21.8  
21.4  
6.48  
6.20  
3.9  
3.4  
8.25  
7.80  
9.5  
8.3  
4.7  
0.51  
3.7  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
0.85  
0.055 0.021 0.055 0.013  
0.044 0.015 0.044 0.009  
0.86  
0.84  
0.26  
0.24  
0.15  
0.13  
0.32  
0.31  
0.37  
0.33  
inches  
0.19  
0.020  
0.15  
0.033  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
93-10-14  
95-01-23  
SOT102-1  
February 1985  
9
Philips Semiconductors  
Product specification  
Quasi-split-sound circuit  
with 5,5 MHz demodulation  
TDA2546A  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and  
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for  
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often  
used.  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our  
“IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the  
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may  
be necessary immediately after soldering to keep the temperature within the permissible limit.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more  
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
February 1985  
10  

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