TDA2611A/N5,112 [NXP]
TDA2611A - 5 W audio power amplifier;
| 型号： | TDA2611A/N5,112 |
| 厂家： | 
NXP |
| 描述： | TDA2611A - 5 W audio power amplifier 局域网 放大器 商用集成电路 |
| 文件： | 总15页 (文件大小：98K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA2611A
5 W audio power amplifier
Product specification
November 1982
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
The TDA2611A is a monolithic integrated circuit in a 9-lead single in-line (SIL) plastic package with a high supply voltage
audio amplifier. Special features are:
• possibility for increasing the input impedance
• single in-line (SIL) construction for easy mounting
• very suitable for application in mains-fed apparatus
• extremely low number of external components
• thermal protection
• well defined open loop gain circuitry with simple quiescent current setting and fixed integrated closed loop gain.
QUICK REFERENCE DATA
Supply voltage range
VP
6 to 35 V
1,5 A
Repetitive peak output current
Output power at dtot = 10%
VP = 18 V; RL = 8 Ω
IORM
<
Po
typ.
typ.
typ.
typ.
typ.
typ.
4,5 W
5 W
VP = 25 V; RL = 15 Ω
Po
Total harmonic distortion at Po < 2 W; RL = 8 Ω
Input impedance
dtot
|Zi|
0,3 %
45 kΩ
25 mA
55 mV
Total quiescent current at VP = 18 V
Sensitivity for Po = 2,5 W; RL = 8 Ω
Operating ambient temperature
Storage temperature
Itot
Vi
Tamb
Tstg
−25 to + 150 °C
−55 to + 150 °C
PACKAGE OUTLINE
9-lead SIL; plastic (SOT110B); SOT110-1.
November 1982
2
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
1
D1
R2
TR4
R5
R6
R11
D2
TR14
D8
TR5 TR7
TR18
TR20
R15
TR12
D9
C1
D5
R17
R9
TR11
TR15
TR16
TR13
TR10
R14
TR19
D6
D7
TR8
TR1
TR3
D3
D4
R13
TR2
2
R7
R3
R4
TR21
TR6
R1
R8
R10
R12
R16
TR9
TR17
6
4
MGD831
8
5
7
9
Fig.1 Circuit diagram; pin 3 not connected.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage
VP
max.
max.
max.
35 V
3 A
Non-repetitive peak output current
Repetitive peak output current
Total power dissipation
IOSM
IORM
1,5 A
see derating curves Fig. 2
Storage temperature
Tstg
−55 to + 150 °C
−25 to + 150 °C
Operating ambient temperature
Tamb
November 1982
3
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
MBL006
8
P
tot
(W)
6
infinate
heatsink
4
2
0
without
heatsink
−50
0
50
100
150
T
(°C)
amb
Fig.2 Power derating curves.
HEATSINK EXAMPLE
Assume VP = 18 V; RL = 8 Ω; Tamb = 60 °C maximum; Tj = 150 °C (max. for a 4 W application into an 8 Ω load, the
maximum dissipation is about 2,2 W).
The thermal resistance from junction to ambient can be expressed as:
150 – 60
Rth j-a = Rth j-tab + Rth tab-h + Rth h-a
=
= 41 K/W.
----------------------
2, 2
Since Rth j-tab = 11 K/W and Rth tab-h = 1 K/W, Rth h-a = 41 − (11 + 1) = 29 K/W.
November 1982
4
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
D.C. CHARACTERISTICS
Supply voltage range
VP
6 to 35 V
Repetitive peak output current
Total quiescent current at VP = 18 V
IORM
Itot
<
1,5 A
typ.
25 mA
A.C. CHARACTERISTICS
Tamb = 25 °C; VP = 18 V; RL = 8 Ω; f = 1 kHz unless otherwise specified; see also Fig. 3
A.F. output power at dtot = 10%
>
4 W
4,5 W
1,7 W
0,65 W
6 W
VP = 18 V; RL = 8 Ω
Po
typ.
typ.
typ.
typ.
typ.
typ.
<
VP = 12 V; RL = 8 Ω
VP = 8,3 V; RL = 8 Ω
VP = 20 V; RL = 8 Ω
VP = 25 V; RL = 15 Ω
Po
Po
Po
Po
5 W
0,3 %
1 %
Total harmonic distortion at Po = 2 W
dtot
Frequency response
Input impedance
>
15 kHz
45 kΩ(1)
0,2 mV
0,5 mV
55 mV
|Zi|
typ.
typ.
<
Noise output voltage at RS = 5 kΩ; B = 60 Hz to 15 kHz
Vn
typ.
Sensitivity for Po = 2,5 W
Vi
44 to 66 mV
Note
1. Input impedance can be increased by applying C and R between pins 5 and 9 (see also Figures 6 and 7).
November 1982
5
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
0.1 μF
C1
C2
7
6
5
8
C5
220
pF
0.1 μF
1
4
2
TDA2611A
R
S
C4
470 μF
(16 V)
C3
V
p
0.1 μF
9
V
i
C6
22 μF
(16 V)
C
R1
3.3 Ω
R
= 8 Ω
R
L
MBL007
Fig.3 Test circuit; pin 3 not connected.
MBL008
10
handbook, halfpage
d
tot
(%)
8
(1)
(2)
6
4
2
0
−1
10
1
10
P
(W)
o
Typical values
(1) L = 8 Ω; VP = 18 V.
R
(2) RL = 15 Ω; VP = 25 V.
Fig.4 Total harmonic distortion as a function of output power.
November 1982
6
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
MBL009
15
handbook, half
not guaranteed in
view of I
= 1,5 A
ORM
P
o
(W)
R
= 8 Ω
L
10
R
= 15 Ω
5
L
0
0
10
20
30
V
40
(V)
p
Typical values:
f = 1 kHz.
dtot = 10%.
Fig.5 Output power as a function of supply voltage.
MBL010
3
Z
i
(MΩ)
2
1
a
b
0
10
2
3
4
5
10
10
10
10
f (Hz)
Fig.6 Input impedance as a function of frequency; curve a for C = 1 μF, R = 0 Ω; curve b for
C = 1 μF, R = 1 kΩ; circuit of Fig. 3; C2 = 10 pF; typical values.
November 1982
7
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
MBL011
3
10
Z
i
(kΩ)
typ
2
10
10
10
2
3
4
5
10
10
10
R (Ω)
Fig.7 Input impedance as a function of R in circuit of Fig. 3; C = 1 μF; f = 1 kHz.
MBL012
6
d
tot
(%)
4
typ
2
0
2
3
4
5
6
10
10
10
10
10
R
(Ω)
S
Fig.8 Total harmonic distortion as a function of RS in the circuit of Fig. 3; Po = 3,5 W; f = 1 kHz.
November 1982
8
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
MBL013
5
P
tot
(W)
2,5
(1)
(2)
0
100
η
(%)
50
(1)
(2)
0
10
−2
−1
10
1
10
P
(W)
o
(1) VP = 25 V; RL = 15 Ω; f = 1 khz.
(2)
VP = 18 V; RL = 8 Ω; f = 1 khz.
Fig.9 Total power dissipation and efficiency as a function of output power.
9
November 1982
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
APPLICATION INFORMATION
C5
C7
R1
22 μF
47 μF
volume
8
100
nF
V
220 kΩ
p
1MΩ
7
6
(log)
C1
560 pF
C3
1
3
R4
220 μF
2
1MΩ
(log)
C4
100 pF
TDA2611A
R3
51
kΩ
C9
C8
V
i
4
R2
100
nF
9
tone
R
L
5
8 Ω
1
kΩ
R5
10 Ω R6
C2
10 nF
C6
1 μF
MBL014
Fig.10 Ceramic pickup amplifier circuit.
MBL015
10
d
tot
(%)
7,5
5
2,5
0
(1)
(2)
−2
−1
10
10
1
10
Po (W)
(1) With tone control.
(2) Without tone control.
Fig.11 Total harmonic distortion as a function of output power; in circuit of Fig. 10; typical values.
November 1982
10
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
MBL016
5
P
o
(dB)
(1)
(2)
0
−5
−10
2
3
4
10
10
10
10
f (Hz)
(1) Tone control min. high.
(2) Tone control max. high.
Fig.12 Frequency characteristics of the circuit of Fig. 10; Po relative to 0 dB = 3 W; typical values.
MBL017
10
P
o
(dB)
5
0
typ
−5
2
3
4
10
10
10
10
f (Hz)
Fig.13 Frequency characteristic of the circuit of Fig. 10; volume control at the top; tone control max. high.
November 1982
11
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
P
2
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
2
Z
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
max.
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25
1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-02-25
03-03-12
SOT110-1
November 1982
12
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
SOLDERING
Introduction
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
(including negligence), warranty, breach of contract or any
other legal theory.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
November 1982
13
NXP Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Semiconductors’ product specifications.
November 1982
14
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
RM5/02/pp15
Date of release: November 1982
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