TDA3608Q/N3,112 [NXP]
TDA3608Q; TDA3608TH - Multiple voltage regulators with switch ZIP 13-Pin;
| 型号： | TDA3608Q/N3,112 |
| 厂家： | 
NXP |
| 描述： | TDA3608Q; TDA3608TH - Multiple voltage regulators with switch ZIP 13-Pin |
| 文件： | 总22页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA3608Q; TDA3608TH
Multiple voltage regulators with
switch
Product specification
2003 Nov 28
Supersedes data of 2001 Jun 29
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
FEATURES
General
• Delayed foldback current limit protection for power
switch (at short-circuit); delay time fixed by reset delay
capacitor
• Two VP-state controlled regulators (regulator 1 and
regulator 3) and a power switch
• All regulator outputs and power switch are
DC short-circuited safe to ground and VP.
• Regulator 2 and reset circuit operate during load dump
and thermal shutdown
GENERAL DESCRIPTION
• Separate control pins for switching regulator 1,
The TDA3608 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. It contains:
regulator 3 and power switch
• Supply voltage range from −18 to +50 V
• Low reverse current of regulator 2
• Two fixed output voltage regulators with a foldback
current protection (regulator 1 and regulator 3) and one
fixed output voltage regulator (regulator 2) intended to
supply a microcontroller, which also operates during
load dump and thermal shutdown
• Low quiescent current (when regulator 1, regulator 3
and power switch are switched off)
• Hold output circuit for regulator 1 (only valid when
regulator 3 output voltage >1.3 V)
• A power switch with protections, operated by an enable
input
• Reset and hold outputs (open-collector outputs)
• Adjustable reset delay time
• Reset and hold outputs that can be used to interface
with the microcontroller; the reset output can be used to
call up the microcontroller and the hold output indicates
that the regulator 1 output voltage is available and within
the range
• High ripple rejection
• Backup capacitor connection to supply regulator 2 and
reset circuit up to 25 V.
Protections
• A supply pin which can withstand load dump pulses and
• Reverse polarity safe (down to −18 V without high
negative supply voltages
reverse current)
• Regulator 2 which is switched on at a backup voltage
higher than 6.5 V and switched off when the regulator 2
output drops below 1.9 V
• Able to withstand voltages up to 18 V at the outputs
(supply line may be short circuited)
• ESD protection on all pins
• Thermal protection
• A provision for the use of a reserve (backup) supply
capacitor that will hold enough energy for regulator 2
(5 V continuous) to allow a microcontroller to prepare for
loss of voltage.
• Load dump protection
• Foldback current limit protection for regulator 1,
regulator 2 and regulator 3
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA3608Q
DBS13P
HSOP20
plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT141-6
SOT418-3
TDA3608TH
2003 Nov 28
2
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
QUICK REFERENCE DATA
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VP
supply voltage
operating
9.5
14.4
14.4
−
18
18
−18
30
50
V
V
V
V
V
regulator 2 on
2.4
−
reverse polarity; non-operating
jump start for t ≤ 10 minutes
−
−
load dump protection for
−
−
t ≤ 50 ms and tr ≥ 2.5 ms
Iq
quiescent supply current
junction temperature
standby mode; VP = 12.4 V
−
500
600
µA
Tj
−40
−
+150 °C
Voltage regulators
VREG1
VREG2
VREG3
output voltage of regulator 1
1 mA ≤ IREG1 ≤ 600 mA
0.5 mA ≤ IREG2 ≤ 150 mA
1 mA ≤ IREG3 ≤ 400 mA
8.15
4.75
4.75
8.5
5.0
5.0
8.85
5.25
5.25
V
V
V
output voltage of regulator 2
output voltage of regulator 3
Power switch
Vdrop
dropout voltage
peak current
ISW = 1 A
−
−
2
0.45
1.0
−
0.7
1.8
−
V
V
A
ISW = 1.8 A
IM
2003 Nov 28
3
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
BLOCK DIAGRAM
V
POWER SWITCH
(17) 13 SW
(14.2 V/1.8 A)
1 (3)
P
(14.4 V)
TEMPERATURE
AND LOAD DUMP
PROTECTION
7 (10)
ENSW
&
BACKUP SWITCH
(16) 12
BU
(14.2 V/100 mA)
BACKUP CONTROL
(15) 11 REG2
(5) 3 REG3
(5 V/150 mA)
(5 V/400 mA)
REGULATOR 2
REGULATOR 3
REGULATOR 1
&
&
4 (6)
6 (9)
EN3
EN1
(4) 2 REG1
(8.5 V/600 mA)
(11) 8
HOLD
hold enable
TDA3608Q
RES
(8) 5
(TDA3608TH)
C
9 (12)
RES
(1, 2, 7, 13, 18, 19, 20)
n.c.
10 (14)
GND
MGK602
Numbers in parenthesis refer to type number TDA3608TH.
Fig.1 Block diagram.
2003 Nov 28
4
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
PINNING
PIN
SYMBOL
DESCRIPTION
TDA3608Q
TDA3608TH
VP
1
2
3
4
supply voltage
REG1
REG3
EN3
regulator 1 output
regulator 3 output
3
5
4
6
regulator 3 enable input
reset output
RES
EN1
5
8
6
9
regulator 1 enable input
power switch enable input
hold output
ENSW
HOLD
CRES
GND
REG2
BU
7
10
11
12
14
15
16
17
8
9
reset delay capacitor connection
ground
10
11
12
13
−
regulator 2 output
backup capacitor connection
power switch output
SW
n.c.
1, 2, 7, 13, 18,19 not connected
and 20
handbook, halfpage
V
1
2
P
REG1
REG3
EN3
handbook, halfpage
n.c. 20
n.c. 19
1
2
n.c.
n.c.
3
4
V
P
n.c. 18
3
RES
EN1
5
SW 17
4
REG1
REG3
EN3
6
BU 16
5
ENSW
HOLD
7
TDA3608Q
TDA3608TH
REG2 15
GND 14
n.c. 13
6
8
7
n.c.
C
9
RES
8
RES
10
11
12
13
GND
REG2
BU
C
12
9
EN1
RES
HOLD 11
10
ENSW
MGT566
SW
MGK601
Fig.2 Pin configuration of TDA3608Q.
Fig.3 Pin configuration of TDA3608TH.
2003 Nov 28
5
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
FUNCTIONAL DESCRIPTION
The hold output is only activated when VREG3 > 1.3 V.
When pin HOLD is connected via a pull-up resistor to the
output of regulator 3 spikes will be minimized to 1.3 V
(maximum value) because the hold output is only disabled
when VREG3 < 1.3 V.
The TDA3608 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. Because of low-voltage operation of the
car radio, low-voltage drop regulators are used in the
TDA3608.
Pin HOLD will be forced LOW when the load dump
protection is activated and also in the standby mode.
Backup supply
Power switch
The charge of the backup capacitor connected to pin BU
can be used to supply regulator 2 for a short period when
the supply voltage VP drops to 0 V (the time depends on
the value of the capacitor).
The power switch can be controlled by means of enable
pin ENSW (see Fig.6).
Protections
Regulator 1
All output pins are fully protected.
When the output voltage of regulator 2 and the supply
voltage (VP > 4.5 V) are both available, regulator 1 can be
operated by means of enable pin EN1 (see Fig.4).
The regulators are protected against load dump
(regulator 1 and regulator 3 switch off at VP > 18 V) and
short-circuit (foldback current protection).
Regulator 2
The power switch contains a foldback current protection,
but this protection is delayed at a short-circuit condition by
the reset delay capacitor. During this time the output
current is limited to at least 2 A (peak value) and
1.8 A (continuous value) at VP ≤ 18 V. During the foldback
mode the current is limited to 0.5 A (typical value).
Regulator 2 switches on (see Fig.5) when the backup
voltage exceeds 6.5 V for the first time and switches off
when the output voltage of regulator 2 drops below 1.9 V
(this is far below an engine start).
Regulator 3
The timing diagram is shown in Fig.7.
When the output voltage of regulator 2 and the supply
voltage (VP > 4.5 V) are both available, regulator 3 can be
operated by means of enable pin EN3 (see Fig.4).
The foldback protection is activated when VSW < 4 V.
When regulator 2 is out-of-regulation and generates a
reset, the power switch is in the foldback mode
immediately when VSW < 4 V.
Reset
In the standby mode the voltage on the reset delay
capacitor is about 4 V and the voltage on the power switch
output is VP − 0.45 V (typical value) at ISW = 1 A. During
an overload condition or short-circuit the reset delay
capacitor will be charged to a higher voltage. The power
switch is in the high current mode while the capacitor is
charged, after this the switch is in the foldback mode
(VSW < 4 V). While the reset delay capacitor is charged the
power switch output can reach its correct output voltage.
Now the voltage on the reset delay capacitor is decreased
rapidly to 4 V. The reset output voltage is not influenced by
this change of voltages. The time of the high current mode
depends on the value of the reset delay capacitor.
When regulator 2 is switched on and the output voltage of
this regulator is within its voltage range, the reset output
(see Fig.5) will be enabled (pin RES goes HIGH through
an external pull-up resistor) to generate a reset to the
microcontroller.
The reset cycles can be extended by means of an external
capacitor connected to pin CRES. This start-up feature is
included to secure a smooth start-up of the microcontroller
at first connection, without uncontrolled switching of
regulator 2 during the start-up sequence.
Hold
At VP > 18 V the power switch is clamped at maximum
17.2 V (to avoid that external connected circuitry is being
damaged by an overvoltage) and the power switch will
switch off at load dump.
Regulator 1 has an open-collector hold output (see Fig.4)
indicating that the output voltage is settled at 8.5 V.
Pin HOLD is held HIGH by an external pull-up resistor.
When the supply voltage VP drops or during high load, the
output voltage drops out-of-regulation and pin HOLD goes
LOW.
2003 Nov 28
6
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
load dump
18.0 V
9.5 V
V
P
4.5 V
4.0 V
≥2.2 V
≤2.0 V
enable
regulator 1
8.5 V
0 V
regulator 1
≥2.2 V
≤2.0 V
enable
regulator 3
5.0 V
0 V
regulator 3
hold output
MGT568
Fig.4 Timing diagram of regulator 1, regulator 3 and hold output.
load dump
18.0 V
V
P
4.0 V
6.5 V
5.4 V
backup
5.0 V
regulator 2
1.9 V
0 V
reset
delay
capacitor
5.0 V
3.0 V
0 V
5.0 V
reset
output
MGT567
t
d(res)
Fig.5 Timing diagram of backup, regulator 2 and reset output.
7
2003 Nov 28
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
load dump
18.0 V
V
4.5 V
4.0 V
P
enable
power
switch
≥2.2 V
≤2.0 V
16.2 V
power
switch
output
0 V
MGT569
Fig.6 Timing diagram of power switch output.
regulator 2
5 V
t
d(sw)
t
6.4 V
d(res)
reset
delay
voltage
4 V
3 V
0 V
5 V
reset
output
0 V
>
<
2.2 V
enable
power
switch
2.0 V
14 V
power
switch
voltage
4 V
0 V
2 A
power
switch
current
0.5 A
0 A
foldback mode
foldback mode
MGT570
current limit mode
Fig.7 Timing diagram of current protection of power switch.
8
2003 Nov 28
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
UNIT
VP
operating
−
−
−
−
18
V
V
V
V
reverse polarity; non-operating
−18
30
jump start for t ≤ 10 minutes
load dump protection for t ≤ 50 ms and
tr ≥ 2.5 ms
50
Ptot
total power
dissipation
−
62
W
Tstg
Tamb
Tj
storage temperature
non-operating
−55
−40
−40
+150
+85
°C
°C
°C
ambient temperature operating
junction temperature operating
+150
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-c)
thermal resistance from junction to case
TDA3608Q
2
K/W
K/W
K/W
TDA3608TH
3.5
50
Rth(j-a)
thermal resistance from junction to ambient in free air
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Fig.12; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
operating
9.5
14.4
14.4
−
18
18
30
50
V
regulator 2 on; note 1
2.4
−
V
V
V
jump start for t ≤ 10 minutes
load dump protection for
−
−
t ≤ 50 ms and tr ≥ 2.5 ms
Iq
quiescent supply
current
standby mode; note 2
VP = 12.4 V
−
−
500
520
600
µA
µA
VP = 14.4 V
−
Schmitt trigger supply voltage for regulator 1, regulator 3 and power switch
Vthr
Vthf
Vhys
rising threshold
voltage
4.0
3.5
−
4.5
4.0
0.5
5.0
4.5
−
V
V
V
falling threshold
voltage
hysteresis voltage
Schmitt trigger supply voltage for regulator 2
Vthr
rising threshold
voltage
6.0
6.5
7.1
V
2003 Nov 28
9
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SYMBOL
PARAMETER
CONDITIONS
MIN.
1.7
TYP.
MAX.
UNIT
Vthf
falling threshold
voltage
1.9
4.6
2.2
V
Vhys
hysteresis voltage
−
−
V
Schmitt trigger voltage for enable input (regulator 1, regulator 3 and power switch)
Vthr
rising threshold
voltage
1.7
2.2
2.7
2.5
V
V
Vthf
falling threshold
voltage
1.5
2.0
Vhys
ILI
hysteresis voltage
IREG = ISW = 1 mA
0.1
1
0.2
5
0.5
10
V
input leakage current VEN = 5 V
µA
Schmitt trigger voltage for reset
Vthr
Vthf
Vhys
rising threshold
voltage of regulator 2
VP rising; IREG2 = 50 mA; note 3
−
V
REG2 − 0.15
REG2 − 0.35
V
REG2 − 0.075 V
falling threshold
voltage of regulator 2
VP falling; IREG2 = 50 mA; note 3 4.3
0.1
V
−
V
hysteresis voltage
0.2
0.3
V
Schmitt trigger voltage for hold
Vthr
Vthf
Vhys
rising threshold
voltage of regulator 1
VP rising; note 3
VP falling; note 3
−
V
REG1 − 0.15
REG1 − 0.35
V
REG1 − 0.075 V
falling threshold
voltage of regulator 1
7.7
0.1
V
−
V
hysteresis voltage
0.2
0.3
V
Reset and hold output
IsinkL
LOW-level sink
current
Vo ≤ 0.8 V
2
−
−
−
mA
ILO
output leakage
current
Vo = 5 V; VP = 14.4 V
−
2
µA
tr
tf
rise time
fall time
note 4
note 4
−
−
7
1
50
50
µs
µs
Reset delay capacitor circuit
Ich
charge current
2
3
4
µA
µA
V
Idch
discharge current
500
2.8
800
3.0
−
Vthr(res)
rising threshold
voltage for delayed
reset pulse
3.2
Vthr(sw)
rising threshold
voltage for delayed
power switch foldback
mode
note 5
−
6.4
47
−
V
td(res)
reset delay time
C7 = 47 nF; note 6
32
70
ms
2003 Nov 28
10
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Regulator 1; IREG1 = 5 mA; unless otherwise specified
VREG1(off) output voltage with
regulator off
−
1
400
mV
VREG1
output voltage
1 mA ≤ IREG1 ≤ 600 mA
9.5 V ≤ VP ≤ 18 V
8.15
8.15
−
8.5
8.5
2
8.85
8.85
75
V
V
∆Vline
∆Vload
Iq
line regulation
load regulation
quiescent current
9.5 V ≤ VP ≤ 18 V
mV
mV
mA
dB
1 mA ≤ IREG1 ≤ 600 mA
IREG1 = 600 mA
−
20
25
70
50
−
60
SVRR
supply voltage ripple fi = 3 kHz; Vi = 2 V (p-p)
rejection
60
−
Vdrop
dropout voltage
VP = 8.5 V; IREG1 = 550 mA;
note 7
−
0.4
0.7
V
Im
current limit
VREG1 > 7.5 V; see Fig.8; note 8 0.65
1.2
−
−
A
Isc
short-circuit current
RL ≤ 0.5 Ω; see Fig.8; note 9
250
800
mA
Regulator 2; IREG2 = 5 mA; unless otherwise specified
VREG2
output voltage
0.5 mA ≤ IREG2 ≤ 150 mA
REG2 = 300 mA; note 10
4.75
4.75
4.75
4.75
5.0
5.0
5.0
5.0
5.25
5.25
5.25
5.25
V
V
V
V
I
7 V ≤ VP ≤ 18 V
18 V ≤ VP ≤ 50 V;
I
REG2 ≤ 150 mA
∆Vline
line regulation
load regulation
6 V ≤ VP ≤ 18 V
−
2
50
75
50
100
−
mV
mV
mV
mV
dB
18 V ≤ VP ≤ 50 V
−
15
20
−
∆Vload
1 mA ≤ IREG2 ≤ 150 mA
1 mA ≤ IREG2 ≤ 300 mA
−
−
SVRR
Vdrop
supply voltage ripple fi = 3 kHz; Vi = 2 V (p-p)
rejection
60
70
dropout voltage
normal supply; note 7
VP = 4.75 V; IREG2 = 100 mA
VP = 5.75 V; IREG2 = 200 mA
backup supply; note 11
−
−
0.4
0.8
0.6
1.2
V
V
VBU = 4.75 V; IREG2 = 100 mA −
BU = 5.75 V; IREG2 = 200 mA −
VREG2 > 4.5 V; see Fig.9; note 8 0.32
0.2
0.5
1.0
−
V
V
0.8
V
Im
current limit
0.37
100
A
Isc
short-circuit current
RL ≤ 0.5 Ω; see Fig.9; note 9
20
−
mA
Regulator 3; IREG3 = 5 mA; unless otherwise specified
VREG3(off) output voltage with
regulator off
−
1
400
mV
VREG3
output voltage
1 mA ≤ IREG3 ≤ 400 mA
7 V ≤ VP ≤ 18 V
4.75
4.75
−
5.0
5.0
2
5.25
5.25
50
V
V
∆Vline
line regulation
load regulation
7 V ≤ VP ≤ 18 V
mV
mV
∆Vload
1 mA ≤ IREG3 ≤ 400 mA
−
20
50
2003 Nov 28
11
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SYMBOL
PARAMETER
CONDITIONS
IREG3 = 400 mA
MIN.
TYP.
MAX.
UNIT
Iq
quiescent current
−
15
70
40
mA
dB
SVRR
supply voltage ripple fi = 3 kHz; Vi = 2 V (p-p)
rejection
60
−
Vdrop
Im
dropout voltage
VP = 5.75 V; IREG3 = 400 mA;
note 7
−
1
1.5
−
V
current limit
VREG3 > 4.5 V; see Fig.10;
note 8
0.45
100
0.70
400
A
Isc
short-circuit current
RL ≤ 0.5 Ω; see Fig.10; note 9
−
mA
Power switch
Vdrop
dropout voltage
ISW = 1 A; note 12
−
0.45
1.0
0.7
1.8
17.2
22
V
V
V
V
ISW = 1.8 A; note 12
−
Vcl
Vfb
clamping voltage
VP ≥ 18 V
15
−
16.2
flyback voltage
behaviour
ISW = −100 mA
VP + 3
Idc
IM
continuous current
peak current
VP = 16 V; VSW = 13.5 V
1.8
2
2.0
−
−
−
−
A
A
A
VP = 17 V; see Fig.11; note 13
Isc
short-circuit current
VP = 14.4 V; VSW < 3.5 V;
see Fig.11; note 14
−
0.5
Backup switch
Idc
Vcl
Ir
continuous current
0.3
−
0.35
−
−
A
clamping voltage
reverse current
VP ≥ 16.7 V
16
900
V
VP = 0; VBU = 12.4 V; note 15
−
−
mA
Notes
1. The minimum value is the minimum operating voltage, only if VP has exceeded 6.5 V.
2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulator 1, regulator 3 and
the power switch are grounded and RL(REG2) = ∞.
3. The voltage of the regulator drops as a result of a VP drop.
4. The rise and fall time is measured with a 10 kΩ pull-up resistor and CL = 50 pF.
5. This is the threshold voltage for the delay time of the power switch. The voltage on the reset delay capacitor increases
only at low output voltage of the power switch (for example at short circuit). When the voltage on this capacitor
exceeds this threshold voltage, the power switch is set to the foldback mode. The power switch is also protected by
the temperature protection.
6. Delay time calculation:
C
a) Reset pulse delay: td(res)
=
× V
= C × 1000 × 103 [sec] The delay time is 47 ms for C = 47 nF.
= C × 500 × 103 [sec] The delay time is 23.5 ms for C = 47 nF.
------
Ich
C(th1)
C
b) Power switch delay: td(sw)
=
× V
C(th2)
------
Ich
7. The dropout voltage of regulator 1, regulator 2 and regulator 3 is measured between pin VP and pins REG1, REG2
or REG3 respectively.
8. During current limit, current Im is held constant.
9. The foldback current protection limits the dissipated power at short-circuit.
2003 Nov 28
12
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
10. The peak current of 300 mA can only be applied for short periods (t < 100 ms).
11. The dropout voltage is measured between pins BU and REG2.
12. The dropout voltage of the power switch is measured between pins VP and SW.
13. The maximum output current of the power switch is limited to 1.8 A when VP > 18 V.
14. During short-circuit, current Isc of the power switch is held constant to a lower value than the continuous current after
a delay of at least 10 ms. Furthermore, a foldback function is activated after the delay. When VSW < 3.5 V, the
short-circuit current is reduced to 0.5 A (typical value). The short-circuit protection of the power switch functions best
when C1 = 220 µF and C2 = 10 µF.
15. The reverse current of the backup switch is the current which is flowing out of pin VP at VP = 0 V.
MGT571
handbook, halfpage
8.5
handbook, halfpage
MGT572
V
REG2
V
(V)
REG1
(V)
5.0
2
1
I
I
I
I
m
≥300
≥50
sc
m
sc
I
(mA)
REG2
I
(mA)
REG1
Fig.8 Foldback current protection of regulator 1.
Fig.9 Foldback current protection of regulator 2.
handbook, halfpage
MGT573
MGT574
handbook, halfpage
V
REG3
(V)
14.2
5.0
V
SW
(V)
(1)
3
1
I
I
m
≥200
sc
0.5
2
I
(A)
SW
I
(mA)
REG3
(1) Delayed; time depends on value of capacitor C7.
Fig.10 Foldback current protection of regulator 3.
Fig.11 Current protection of power switch.
2003 Nov 28
13
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
TEST AND APPLICATION INFORMATION
Test information
V
P
SW
14.2 V
(17) 13
1 (3)
(1)
(2)
C9
>
C1
220 nF
R
V
R4
2.2 Ω
L(SW)
P
10 µF
1 kΩ
C2
220 nF
ENSW
EN1
REG2
REG1
REG3
5 V
8.5 V
5 V
7 (10)
6 (9)
4 (6)
(15) 11
(4) 2
C3
10 µF
V
R
ENSW
L(REG2)
1 kΩ
C4
10 µF
R
V
L(REG1)
EN1
TDA3608Q
1 kΩ
(TDA3608TH)
EN3
(5) 3
C5
10 µF
R
V
L(REG3)
EN3
1 kΩ
R2
10 kΩ
C
RES
RES
9 (12)
(8) 5
C7
47 nF
C6
50 pF
R3
10 kΩ
R1
HOLD
BU
12 (16)
(11) 8
1 kΩ
10
C8
C10
50 pF
V
bu
220 nF
GND
mgk605
Numbers in parenthesis refer to type number TDA3608TH.
(1) Capacitor not required for stability.
(2) Value depends on application.
Fig.12 Test circuit.
14
2003 Nov 28
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Application information
Solution
NOISE
Use a tantalum capacitor of 10 µF or a larger electrolytic
capacitor. The use of tantalum capacitors is recommended
to avoid problems with stability at low temperatures.
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (the
output noise of the regulators is translated into a current
noise by means of the output capacitors). Table 1 shows
the noise figure with the corresponding output capacitor Co
for each regulator. The noise is minimal when a high
frequency capacitor of 220 nF in parallel with an
electrolytic capacitor of 100 µF is connected directly to
pins VP and GND.
MBK100
handbook, halfpage
4
maximum ESR
R
(Ω)
3
Table 1 Noise figure; note 1
stable region
2
1
0
NOISE FIGURE (µV)
REGULATOR
Co = 10 µF Co = 47 µF Co = 100 µF
minimum ESR
1
2
3
225
225
255
150
150
200
135
135
180
1
10
100
C (µF)
Note
1. Measured at a bandwidth of 200 kHz.
Fig.13 Curves for selecting value of output
capacitor for regulator 1 and regulator 3.
STABILITY
The regulators are made stable with the externally
connected output capacitors. The output capacitors can be
selected using the graphs of Figs 13 and 14. When an
electrolytic capacitor is used, the temperature behaviour of
this output capacitor can cause oscillations at low
temperature. The next two examples show how an output
capacitor value is selected.
handbook, halfpage
MBK099
14
12
10
8
maximum ESR
R
(Ω)
Example 1
The regulator 1 is made stable with an electrolytic output
capacitor of 220 µF with ESR = 0.15 Ω. At Tamb = −30 °C
the capacitor value is decreased to 73 µF and the ESR is
increased to 1.1 Ω. The regulator remains stable at
Tamb = −30 °C (see Fig.13).
stable region
6
4
2
minimum ESR
10
0
0.22
1
100
Example 2
C (µF)
The regulator 2 is made stable with an electrolytic
capacitor of 10 µF with ESR = 3 Ω. At Tamb = −30 °C the
capacitor value is decreased to 3 µF and the ESR is
increased to 23.1 Ω. The regulator will be instable at
Tamb = −30 °C (see Fig.14).
Fig.14 Curves for selecting value of output
capacitor for regulator 2.
2003 Nov 28
15
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
PACKAGE OUTLINES
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
2
v
M
1
13
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.4 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
3.4
1.7 5.08
0.8
4.3
0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-17
03-03-12
SOT141-6
2003 Nov 28
16
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
E
A
D
x
X
c
E
H
y
2
v
M
A
E
D
1
D
2
10
1
pin 1 index
Q
A
A
2
(A )
3
E
1
A
4
θ
L
p
detail X
20
11
w M
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
(1)
(2)
(2)
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT
2
3
4
p
1
2
2
8°
0°
+0.08 0.53 0.32
−0.04 0.40 0.23
16.0 13.0 1.1 11.1 6.2
15.8 12.6 0.9 10.9 5.8
2.9
2.5
14.5 1.1
13.9 0.8
1.7
1.5
2.5
2.0
3.5
3.2
mm
1.27
3.5
0.35
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-02-12
03-07-23
SOT418-3
2003 Nov 28
17
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SOLDERING
Introduction
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all the BGA, HTSSON..T and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Through-hole mount packages
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
SOLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
300 and 400 °C, contact may be up to 5 seconds.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Surface mount packages
REFLOW SOLDERING
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
2003 Nov 28
18
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
2003 Nov 28
19
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
MOUNTING
PACKAGE(1)
WAVE
REFLOW(2) DIPPING
Through-hole mount CPGA, HCPGA
suitable
−
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP(4)
suitable(3)
−
−
−
Through-hole-
surface mount
not suitable
not suitable
Surface mount
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,
SSOP-T(5), TFBGA, USON, VFBGA
not suitable
suitable
suitable
−
−
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable(6)
PLCC(7), SO, SOJ
suitable
suitable
−
−
−
−
LQFP, QFP, TQFP
not recommended(7)(8) suitable
not recommended(9)
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L(11), PMFP(10), WQCCN32L(11)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
2003 Nov 28
20
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Nov 28
21
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R32/04/pp22
Date of release: 2003 Nov 28
Document order number: 9397 750 12339
相关型号：
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