TDA3833 [NXP]
BTSC-stereo/SAP/DBX decoder and DBX expander; BTSC立体声/ SAP / DBX解码器和DBX扩展
| 型号： | TDA3833 |
| 厂家： | 
NXP |
| 描述： | BTSC-stereo/SAP/DBX decoder and DBX expander |
| 文件： | 总13页 (文件大小：96K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA3833
BTSC-stereo/SAP/DBX decoder
and DBX expander
September 1992
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
FEATURES
QUICK REFERENCE DATA
SYMBOL
• DBX decoder, MPX decoder
and SAP decoder on chip
PARAMETER
TYP.
UNIT
VP
IP
positive supply voltage (pin 32)
supply current
5
V
• Extensive switching
possibilities for the AF outputs
and the extra headphone
output
42
mA
mV
Vi
input signal, 100% modulated, mono
(RMS value, pin 1)
100
Vo
AF output signal (RMS value, pins 7, 23 and 24) 550
mV
dB
dB
dB
dB
%
• Stereo and SAP signal
available simultaneously
S/N(W)
S/N
signal-to-noise ratio, weighted
signal-to-noise ratio
50
60
26
60
0.2
• Reliable stereo/SAP
identification by means of the
noise detector
αCH
stereo channel separation
crosstalk attenuation
αCR
• Integrated filters
THD
total harmonic distortion
• DAC control possible for most
alignments
ORDERING INFORMATION
EXTENDED
• Few external components
PACKAGE
MATERIAL
• Low power consumption
(200 mW)
PIN
POSITION
TYPE NUMBER
PINS
CODE
• +5 V supply voltage
TDA3833
32
32
SDIL
SO
plastic
plastic
SOT232AG(1)
SOT287AH(2)
GENERAL DESCRIPTION
TDA3833T
The TDA3833 is a sound
processor for stereo/second
audio program (SAP) baseband
signals in accordance with the
BTSC standard for television
receivers and video tape
recorders.
Note
1. SOT232-1; 1996 December 13.
2. SOT287-1; 1996 December 13.
September 1992
2
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX
expander
TDA3833
September 1992
3
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
PINNING
SYMBOL
PIN
DESCRIPTION
Vi
1
composite input signal (MPX/SAP)
input level control
ILV
2
fref
3
adjustment of filter reference
SAP identity smoothing capacitor
SAP noise detector smoothing capacitor
SAP indicator output (sink)
CSAP
4
CND
5
SAPI
Vo HP
Vo SAP
SAPLV
LRLV
MODE
C1SPB
DBXLV
C1WB
DBXT
C2SPB
C2WB
C1DC
C2DC
EMPH1
DBXIN
EMPH2
VoAF1
VoAF2
GND
6
7
SAP/mono headphone output
output signal SAP/(L-R) without DBX
SAP level control
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
(L-R) level control
4-state mode control
spectral band timing capacitor
DBX spectral adjust
wideband timing capacitor
DBX timing adjust
spectral RMS-detector smoothing capacitor
wideband RMS-detector smoothing capacitor
DC decoupling capacitor 1 for offset compensation
DC decoupling capacitor 2 for offset compensation
time constant for variable emphasis
DBX signal input
time constant for variable emphasis
AF output signal right/SAP or mono
AF output signal left/SAP or mono
ground (0 V)
Cref
smoothing capacitor for internal reference voltage
VCO free running frequency adjustment
phase detector loop filter
VCO
LOOP
STERI
PILOT
Cpil
stereo indicator output (sink)
pilot cancel adjustment
pilot detector smoothing capacitor, VCO/4 output
+5 V supply voltage
Fig.2 Pin configuration.
VP
September 1992
4
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC134)
SYMBOL
PARAMETER
supply voltage (pin 32)
MIN.
MAX.
UNIT
VP
V1
0
8
V
V
V
composite input voltage
0
VP
V11
MODE input voltage
0
8
I7,23,24
I6,29
output current (AF outputs)
output current (indication outputs)
total power dissipation
0
5
mA
mA
mW
°C
0
5
Ptot
0
500
+150
+70
±4000
Tstg
storage temperature range
operating ambient temperature range
electrostatic handling for all pins (note 1)
−55
0
Tamb
VESD
°C
−
V
Note to the limiting values
1. Equivalent to discharging a 100 pF capacitor through an 1.5 kΩ series resistor.
CHARACTERISTICS
VP = 5 V; Tamb = +25 °C; for MPX: ∆f = 25 kHz for L+R (100% modulation); fmod = 1 kHz; and for SAP: ∆f = 10 kHz;
fmod = 1 kHz, unless otherwise specified. Measurements taken in Fig. 1 including all adjustments.
SYMBOL
PARAMETER
supply voltage range (pin 32)
supply current
CONDITIONS
MIN.
4.75
TYP.
MAX.
5.35
UNIT
VP
IP
5
V
−
−
42
−
−
mA
V
Vn
DC input/output voltage at pins 1, 7, 8,
18, 19, 21, 23 and 24
VP/2
MODE select 4-state input (see Table 1)
V11
input voltage for
mono/SAP
SAP
0
−
VP/2−1
VP/2+0.4
VP
V
V
V
V
VP/2-0.4 −
stereo
VP/2+1
VP+1.4
−
−
mono
8
I11
input current for
mono/SAP
SAP
−
−
−
−
−
−
−
−
15
15
5
µA
µA
µA
µA
stereo
mono
V11 = 7.2 V
300
September 1992
5
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Composite input (pin 1)
Ri
Vi
input resistance on pin 1
14
20
26
kΩ
input signal on pin 1 (RMS value)
see note 1
L+R (all other signals in accordance
with BTSC system specification)
70
100
140
mV
pilot threshold for MPX
stereo on
stereo off
MPX
−
5
−
−
16
−
mV
mV
dB
−
hysteresis of threshold
pilot threshold for SAP
2.5
−
Vi
SAP on
−
−
37
−
mV
mV
dB
dB
V
SAP off
16
−
−
hysteresis of threshold
gain control range
SAP
2
−
Gv
V2
I2
dependent on V2
±5
−
±7.5
1 to 4
−
−
control voltage range (pin 2)
input current (pin 2)
−
V2 = VP/2
−
5
µA
Voltage controlled oscillator (VCO) (pin 27)
fVCO
∆f29
TC
nominal VCO frequency (4fH)
capture range
see note 2
−
−
−
62.94
−
kHz
nominal pilot
−
−
1
kHz
10−6/K
temperature coefficient
50
Stereo indication output (pin 29)
V29
output voltage range
stereo present
stereo not present
stereo present
−
−
−
−
0.5
VP
−
V
VP−0.5
V
I29
output current active LOW
3
mA
SAP/mono output (pin 7)
Vo
output signal (RMS value, pin 7)
see note 3
mono
−
550
9.5
100
−
−
mV
dB
Ω
output signal headroom
output resistance
−
−
R7
−
200
−
RL
load resistance
10
−
kΩ
pF
CL
load capacitance
−
500
THD
total harmonic distortion
SAP signal
−
0.5
0.2
−
−
−
−
%
mono signal
−
%
B
frequency response 50 to 10000 Hz
mono; external
−3
dB
75 µs de-emphasis
S/N(W)
weighted signal-to-noise ratio
(CCIR468-3)
mono; external
75 µs de-emphasis
−
50
−
dB
September 1992
6
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
SAP indication output (pin 6)
V6
output voltage range
SAP present
SAP not present
SAP present
−
−
−
−
0.5
V
VP-0.5
3
VP
V
I6
output current active LOW
−
mA
Audio outputs (pins 23 and 24)
Vo
output signal
see note 3
−
550
−
mV
(RMS value, pins 23 and 24)
output signal headroom
−
−
−
9.5
−
−
3
3
dB
dB
dB
∆VL,R
∆Vo
output signal difference between L and R f = 250 to 6300 Hz
output signal difference after switching
from L or R to SAP
f = 250 to 6300 Hz
−
∆V23,24
R23,24
RL
DC offset voltage after switching
output resistance
stereo/mono/SAP
−
−
±100
300
−
mV
Ω
−
200
−
load resistance
10
−
kΩ
pF
CL
load capacitance
−
500
THD
total harmonic distortion
L and R signal
SAP signal
−
−
0.2
0.5
−
−
%
%
B
L and R frequency response
f = 50 to 10000 Hz
12 kHz related to
1 kHz
−3
−
−
−
dB
dB
−
−3
SAP frequency response
f = 50 to 8000 Hz
−3
−
−
−
dB
dB
S/N(W)
S/N
weighted signal-to-noise ratio
L + R signal;
−
50
CCIR468-3
unweighted signal-to-noise ratio
(RMS value)
L + R signal;
f = 20 to 20000 Hz
−
60
−
dB
αCR
crosstalk
L or R into SAP
SAP into L or R
50
50
20
63
70
26
−
−
−
dB
dB
dB
αCH
channel separation
f = 100 to 5000 Hz
10% 75 µs
(according to DBX requirements)
equivalent input
modulation
1 to 100% 75 µs
15
20
−
dB
equivalent input
modulation
September 1992
7
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DBX section
V9
SAP level control voltage range
(L - R) level control voltage range
spectral band level control voltage range
input current
−
−
−
−
1 to 4
−
−
−
5
V
V10
V13
I9,10,13
S1
1 to 4
1.8 to 3.2
−
V
V
VI = 0.5VP
µA
dB/s
µA
spectral RMS-detector release rate
343
381
419
I12
timing current for nominal release
rate of spectral RMS-detector
see note 4
−
22.5
−
current adjustment range
−
11 to 45
125
µA
S2
I14
wideband RMS-detector release rate
112.5
137.5
dB/s
µA
timing current for nominal release rate
of wideband RMS-detector
0.33l12; see note 4
−
7.5
−
current adjustment range
timing adjustment
−
−
4 to 15
−
−
µA
V15
1.5 to 3.8
V
Notes to the characteristics
1. Requirements for the MPX/SAP input signal to ensure correct system performance:
a) Maximum variation of MPX/SAP signal under operating conditions: to be found (1 dB).
b) 3 dB bandwidth ≥ 130 kHz (∆f = 25 kHz).
c) THD (L + R, ∆f = 25 kHz, fmod = 1 kHz): 0.2%.
d) S/N(W), weighted in accordance with CCIR468-3 (L + R, ∆f = 25 kHz for sound carrier, fmod = 1 kHz, 75 µs
de-emphasis; with critical picture modulation): S/N(W) > 44 dB; with sync only: S/N(W) > 54 dB.
e) Spectral spurious attenuation: 40 dB (mainly n × fH; L + R, ∆f = 25 kHz for sound carrier fmod = 1 kHz, 50 Hz to
100 kHz, no de-emphasis).
f) Maximum white noise level (unweighted, 200 Hz to 100 kHz) to avoid malfunctioning of the identification circuits:
500 mV (RMS).
2. Adjustable on pin 27, measurement (fH) on pin 7 with a 2.7 kΩ resistor connected between VP and pin 31.
3. Can also be aligned to 600 mV (RMS), then identification threshold and AF output headroom will be decreased by
1.6 dB.
4. I12 and I14 can be measured via an ammeter connected to 4 V (3.5 to 4.1 V).
September 1992
8
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
Table 1 MODE select; 4-state pin 11
V11 (VP = 5 V)
(V)
AF OUTPUTS
PIN 23 PIN 24
SAP/MONO OUTPUT
MODE
mono
SAP CARRIER
on
PIN 7
8
mono
right
SAP
SAP
mono
right
right
mute
mono
left
SAP without DBX
SAP without DBX
mono
stereo
VP
VP/2
0
on
on
on
off
off
off
off
SAP
SAP
mono
mono
left
mono/SAP
mono
SAP without DBX
mono
8
stereo
VP
VP/2
0
mono
SAP
left
mono
mono/SAP
mono
mono
September 1992
9
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
PACKAGE OUTLINES
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
D
M
E
A
2
A
A
L
1
c
(e )
w M
e
Z
1
b
1
M
H
b
32
17
pin 1 index
E
1
16
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
A
A
2
max.
(1)
(1)
Z
1
w
UNIT
b
b
c
D
E
e
e
L
M
M
H
1
1
E
min.
max.
1.3
0.8
0.53
0.40
0.32
0.23
29.4
28.5
9.1
8.7
3.2
2.8
10.7
10.2
12.2
10.5
mm
4.7
0.51
3.8
1.778
10.16
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT232-1
September 1992
10
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
E
A
X
c
y
H
v
M
A
E
Z
17
32
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
16
1
w M
detail X
b
p
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
E
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
max.
0.3
0.1
2.45
2.25
0.49
0.36
0.27 20.7
0.18 20.3
7.6
7.4
10.65
10.00
1.1
0.4
1.2
1.0
0.95
0.55
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25
0.01
0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.086
0.02 0.011 0.81
0.01 0.007 0.80
0.30
0.29
0.42
0.39
0.043 0.047
0.016 0.039
0.037
0.022
inches 0.10
0.004
0.055
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-25
SOT287-1
September 1992
11
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The longitudinal axis of the package footprint must be
SDIP
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
September 1992
12
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 1992
13
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