TDA4672 [NXP]
Picture Signal Improvement PSI circuit with enhanced peaking function; 图像信号PSI改善电路具有增强调峰功能
| 型号： | TDA4672 |
| 厂家： | 
NXP |
| 描述： | Picture Signal Improvement PSI circuit with enhanced peaking function |
| 文件： | 总16页 (文件大小：100K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA4672
Picture Signal Improvement (PSI)
circuit with enhanced peaking
function
1996 Dec 11
Product specification
Supersedes data of August 1993
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
FEATURES
• Luminance signal delay from 20 ns to 1100 ns
(minimum step 45 ns)
• Selectable luminance signal peaking with symmetrical
overshoots
• Selectable 2.6 or 5 MHz peaking centre frequency and
degree of peaking from −6 dB to +9 dB in 16 steps of
GENERAL DESCRIPTION
1 dB each
The TDA4672 delays the luminance signal. The luminance
signal can also be improved by peaking and noise
reduction (coring).
• Selectable noise reduction by coring
• Selectable 5 or 12 V sandcastle input voltage
• All controls selected via the I2C-bus
• Timing pulse generation for clamping and delay time
control synchronized by sandcastle pulse
• Automatic luminance signal delay correction using a
control loop
• Luminance input signal clamping with coupling capacitor
• 4.5 to +8.8 V supply voltage
• Minimum of external components.
QUICK REFERENCE DATA
SYMBOL
VP
IP(tot)
td(Y)
Vi(Y)(p-p)
GY
PARAMETER
MIN.
4.5
TYP.
MAX.
8.8
UNIT
supply voltage (pin 1)
total supply current
Y signal delay time
5
V
26
20
−
37
−
46
mA
ns
1130
640
−
composite Y input signal (peak-to-peak value, pin 16)
voltage gain of Y channel
450
−1
−
mV
dB
°C
−
Tamb
operating ambient temperature
0
70
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA4672
DIP18
plastic dual in-line package; 18 leads (300 mil)
SOT102-1
1996 Dec 11
2
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
BLOCK DIAGRAM
EM7D56
a n d b o o k , f u l l p a g e w
1996 Dec 11
3
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
PINNING
SYMBOL PIN
DESCRIPTION
VP
1
2
positive supply voltage
CDL
capacitor of delay time control
Vi(R − Y)
±(R − Y) colour-difference input
signal; note 1
3
handbook, halfpage
Vo(R − Y)
±(R − Y) colour-difference output
signal; note 1
V
GND1
SAND
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
4
5
6
P
C
DL
n.c.
not connected
V
V
i(R − Y)
iY
Vo(B − Y)
±(B − Y) colour-difference output
signal; note 2
V
C
o(R − Y)
ref
Vi(B − Y)
±(B − Y) colour-difference input
signal; note 2
C
n.c.
TDA4672
CLP2
7
C
V
CLP1
o(B − Y)
GND2
SDA
SCL
8
9
ground 2 (0 V)
I2C-bus serial data input/output
10 I2C-bus serial clock input
V
V
i(B − Y)
oY
C
GND2
COR
CCOR
VoY
11 coring capacitor
SDA
SCL
12 delayed luminance output signal
13 black level clamping capacitor 1
14 black level clamping capacitor 2
15 capacitor of reference voltage
16 luminance input signal
MED757
CCLP1
CCLP2
Cref
ViY
SAND
GND1
17 sandcastle pulse input
Fig.2 Pin configuration.
18 ground 1 (0 V)
Notes
1. Pin 3 is connected directly to pin 4.
2. Pin 7 is connected directly to pin 6.
1996 Dec 11
4
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
The peaking section uses a transversal filter circuit with
selectable centre frequencies of 2.6 and 5.0 MHz.
FUNCTIONAL DESCRIPTION
The TDA4672 contains luminance signal processing.
The luminance signal section comprises a variable,
integrated luminance delay line with luminance signal
peaking and noise reduction by coring.
It provides selectable degrees of peaking from −6 to +9 dB
and noise reduction by coring, which attenuates the
high-frequency noise introduced by peaking.
The output buffer stage ensures a low-ohmic Video
Blanking Synchronization (VBS) output signal on pin 12
(<160 Ω). The gain of the luminance signal path from
pin 16 to pin 12 is unity.
All functions and parameters are controlled via the
I2C-bus.
Y-signal path
An oscillation signal of the delay time control loop is
present on output pin 12 instead of the VBS signal. It is
present during the vertical blanking interval of the burst key
pulses in lines 16 (330) to 18 (332). This sync should not
be applied for synchronization.
The video and blanking signal is AC-coupled to the input
pin 16. Its black porch is clamped to a DC reference
voltage to ensure the correct operating range of the
luminance delay stage.
The luminance delay line consists of all-pass filter sections
with delay times of 45, 90, 100, 180 and 450 ns
(see Fig.1). The luminance signal delay is controlled via
the I2C-bus in steps of 45 ns in the range of 20 to 1100 ns,
this ensures that the maximum delay difference between
the luminance and colour-difference signals is ±22.5 ns.
Colour-difference signal paths
The colour-difference input signals (on pins 3 and 7) are
connected directly to the output pins.
This is for compatibility with other Philips Semiconductors
PSI-circuits.
An automatic luminance delay time adjustment in an
internal control loop (with the horizontal frequency as a
reference) is used to correct changes in the delay time,
due to component tolerances. The control loop is
automatically enabled between the burst key pulses of
lines 16 (330) and 17 (331) during the vertical blanking
interval. The control voltage is stored in the capacitor CDL
connected to pin 2.
1996 Dec 11
5
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). GND1 and GND2 are connected together.
SYMBOL PARAMETER CONDITIONS MIN. MAX.
VP supply voltage (pin 1) 8.8
UNIT
0
V
VI
input voltage (pins 2 to 7 and pins 11 to 16)
input voltage at pins 9 and 10
input voltage at pin 17
−0.1
−0.1
−0.1
−
VP
V
V9,10
V17
I8-18
I3-4
+8.8
+12
±20
±4
V
V
current between pins 8 and 18
current between pins 3 and 4
current between pins 6 and 7
total power dissipation
mA
mA
mA
W
−
I6-7
−
±4
Ptot
Tstg
Tamb
VESD
0
0.97
+150
70
storage temperature
−25
0
°C
°C
operating ambient temperature
electrostatic handling
note 1
for pin 17
−
−
−
+250
−500
±500
V
V
V
for other pins
Note
1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
82
UNIT
thermal resistance from junction to ambient in free air
K/W
CHARACTERISTICS
VP = 5 V; nominal video amplitude VVB = 315 mV; tH = 64 µs; tBK = 4 µs (burst key); Tamb = 25 °C and measurements
taken in Fig.4; unless otherwise specified.
SYMBOL
VP
PARAMETER
CONDITIONS
MIN.
4.5
TYP.
MAX.
8.8
UNIT
supply voltage (pin 1)
total supply current
5
V
IP(tot)
26
37
46
mA
mV
Y-signal path
Vi(Y)(p-p)
VBS input signal on pin 16
(peak-to-peak value)
−
450
640
V16
I16
black level clamping voltage
input current
−
3.1
−
−
V
during clamping
±95
±190
±0.1
−
µA
µA
MΩ
pF
ns
ns
outside clamping
outside clamping
−
−
R16
input resistance
5
−
C16
input capacitance
−
3
10
td(Y)(max)
td(Y)(min)
maximum Y delay time
minimum Y delay time
set via I2C-bus
set via I2C-bus
1070
1100
20
1130
−
−
1996 Dec 11
6
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
SYMBOL
∆td(Y)
PARAMETER
minimum delay step
CONDITIONS
set via I2C-bus
MIN.
40
TYP.
45
MAX.
50
UNIT
ns
group delay time difference
f = 0.5 to 5 MHz;
maximum delay
−
0
±25
ns
td(peak)
GY
minimum delay time for peaking
185
215
245
0
ns
VBS signal gain measured on
output pin 12 (composite signal,
peak-to-peak value)
V12/V16; f = 500 kHz;
maximum delay
−2
−1
dB
I12
output current (emitter-follower
with constant current source)
source current
sink current
−1
0.4
−
−
−
−
−
mA
mA
Ω
−
R12
f
output resistance
160
frequency response for
maximum delay
f = 0.5 to 3 MHz
−2
−4
−1
−3
0
dB
dB
f = 0.5 to 5 MHz
−1
LIN
signal linearity for
αmin/αmax; note 1
VVBS = 450 mV (p-p)
VVBS = 640 mV (p-p)
video contents of 315 mV (p-p)
video contents of 450 mV (p-p)
0.85
0.60
−
−
−
−
−
−
Luminance peaking, selected via I2C-bus
fpeak
peaking frequency
fC1; LCF-bit = 0
4.5
2.3
5
5.5
2.9
MHz
MHz
fC2; LCF-bit = 1
2.6
Vpeak
peaking amplitude for grade of
peaking (fC amplitude over
0.5 MHz amplitude)
Y delay = 215 ns;
peaking delay only
selectable values
from
−
−
−
−
−
−6
+9
1
−
−
−
−
1
dB
dB
dB
%
to
each step
no limitation of peaking
−
Vn(rms)
COR
noise voltage on pin 12
(RMS value)
without peaking;
f = 0 to 5 MHz
−
mV
coring of peaking
COR-bit = 1
−
20
−
%
(coring part referred to 315 mV)
1996 Dec 11
7
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Sandcastle pulse, input voltage selectable via I2C-bus
V17
input voltage threshold for
H and V sync
SC5-bit = 0 (+12 V)
1.1
1.5
1.9
V
input voltage threshold for burst
SC5-bit = 0 (+12 V)
SC5-bit = 1 (+5 V)
5.5
1.1
6.5
1.5
7.5
1.9
V
V
input voltage threshold for
H and V sync
input voltage threshold for burst
input resistance
SC5-bit = 1 (+5 V)
+12 V input level
+5 V input level
3.0
30
15
−
3.5
40
20
4
4.0
50
25
8
V
R17
kΩ
kΩ
pF
µs
µs
C17
tBK
td
input capacitance
burst key pulse width
3.0
−
4.0
1
4.6
−
leading edge delay for clamping
pulse
referenced to tBK
note 2
np
number of required burst key
pulses vertical blanking interval
4
−
31
−
I2C-bus control, SDA and SCL
VIH
HIGH level input voltage on
pins 9 and 10
3
0
−
−
5
V
V
VIL
LOW level input voltage on pins 9
and 10
1.5
I9,10
input current on pins 9 and 10
−
−
−
−
±10
µA
Vo(ACK)
output voltage at acknowledge on Io(ACK) = 3 mA
pin 9
0.4
V
Io(ACK)
output current at acknowledge on sink current
pin 9
3
−
−
mA
Notes
1. αmin: minimum differential voltage gain of the luminance video signal;
αmax: maximum differential voltage gain of the luminance video signal.
2. A number of more than 31 burst key pulses repeats the counter cycle of delay time control.
1996 Dec 11
8
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
I2C-BUS FORMAT
S(1)
SLAVE ADDRESS(2)
ACK(3)
SUBADDRESS(4)
ACK(3)
DATA(5)
P(6)
Notes
1. S = START condition.
2. SLAVE ADDRESS = 1000 100X.
3. ACK = acknowledge, generated by the slave.
4. SUBADDRESS = subaddress byte, see Table 1.
5. DATA = data byte, see Table 1.
6. P = STOP condition.
7. X = read/write control bit.
X = 0, order to write (the circuit is slave receiver).
X = 1, order to read (the circuit is slave transmitter).
If more than 1 byte of DATA is transmitted, then auto-increment of the subaddress is performed.
Table 1 I2C-bus transmission; see Table 2
DATA
FUNCTION
SUBADDRESS
D7
0
D6
D5
0
D4
DL4
0
D3
D2
D1
DL1
D0
Y delay/SC
Peaking and coring
00010000
00010001
SC5
DL3
DL2
DL0
COR
PEAK
LCF
PCON3 PCON2 PCON1 PCON0
Table 2 Function of the bits
DATA
FUNCTION
LOGIC 1
45 ns
LOGIC 0
0 ns
DL0
set delay in luminance channel
DL1
90 ns
0 ns
DL2
180 ns
0 ns
DL3
180 ns
0 ns
DL4
450 ns
0 ns
SC5
LCF
select sandcastle pulse voltage
set peaking frequency response
set peaking delay
+5 V
+12 V
5.0 MHz
inactive
inactive
2.6 MHz
active (190 ns)
active
PEAK
COR
PCONx
set coring control
set peaking amplification
see Table 3
1996 Dec 11
9
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
Table 3 Peaking amplification
GRADE OF PEAKING
PCON3
PCON2
PCON1
PCON0
(dB)
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
−6
−5
−4
−3
−2
−1
0
+1
+2
+3
+4
+5
+6
+7
+8
+9
Remarks to the subaddress bytes
Subaddresses 00H to 0FH are reserved for colour decoders and RGB processors.
Subaddresses 10 and 11 only are acknowledged.
General call address is not acknowledged.
Power-on reset: D7 to D1 bits of data bytes are set to logic 0, D0 bit is set to logic 1.
1996 Dec 11
10
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
INTERNAL CIRCUITRY
EM7D59
b o o k , f u l l p a g e w i d t h
1996 Dec 11
11
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
TEST AND APPLICATION INFORMATION
SDA
2
I C-bus
SDA
SCL
10
9
8
7
6
5
4
3
2
C
COR
GND2
11
0.1 µF
V
V
i(B − Y)
oY
(VBS)
12
13
14
15
16
17
18
C
V
CLP1
CLP2
o(B − Y)
0.1 µF
C
n.c.
TDA4672
0.1 µF
C
V
ref
o(R − Y)
0.1 µF
V
V
i(R − Y)
iY
(VBS)
0.1 µF
C
SAND
GND1
DL
sandcastle
pulse input
0.1 µF
+5 V
47 µF
15 Ω
V
P
1
MED758
V
B
Fig.4 Test and application circuit.
12
1996 Dec 11
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
18
10
M
H
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
0.85
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.15
0.13
0.32
0.31
0.37
0.33
inches
0.19
0.020
0.15
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-10-14
95-01-23
SOT102-1
1996 Dec 11
13
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Dec 11
14
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
NOTES
1996 Dec 11
15
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
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Tel. +48 22 612 2831, Fax. +48 22 612 2327
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51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
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Tel. +1 800 234 7381
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Tel. +7 095 247 9145, Fax. +7 095 247 9144
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Tel. +852 2319 7888, Fax. +852 2319 7700
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Slovakia: see Austria
Slovenia: see Italy
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04552-903 São Paulo, SÃO PAULO - SP, Brazil,
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Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
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Tel. +34 3 301 6312, Fax. +34 3 301 4107
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Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/03/pp16
Date of release: 1996 Dec 11
Document order number: 9397 750 01473
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