TDA4680 [NXP]
Video processor with automatic cut-off and white level control; 具有自动切断和白电平控制视频处理器
| 型号： | TDA4680 |
| 厂家： | 
NXP |
| 描述： | Video processor with automatic cut-off and white level control |
| 文件： | 总28页 (文件大小：246K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA4680
Video processor with automatic
cut-off and white level control
1996 Oct 25
Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
FEATURES
• Operates from an 8 V DC supply
• Black level clamping of the colour difference, luminance
and RGB input signals with coupling-capacitor DC level
storage
• Two fully-controlled, analog RGB inputs, selected either
by fast switch signals or via I2C-bus
GENERAL DESCRIPTION
• Saturation, contrast and brightness adjustment via
The TDA4680 is a monolithic integrated circuit with a
colour difference interface for video processing in TV
receivers. Its primary function is to process the luminance
and colour difference signals from multistandard colour
decoders, TDA4555, TDA4650/T, TDA4655/T or
TDA4657, Colour Transient Improvement (CTI) IC,
TDA4565, Picture Signal Improvement (PSI) IC,
TDA4670, or from a feature module.
I2C-bus
• Same RGB output black levels for Y/CD and RGB input
signals
• Timing pulse generation from either a 2 or 3-level
sandcastle pulse for clamping, horizontal and vertical
synchronization, cut-off and white level timing pulses
• Automatic cut-off control with picture tube leakage
The required input signals are:
current compensation
• Luminance and negative colour difference signals
• Software-based automatic white level control or fixed
white levels via I2C-bus
• 2 or 3-level sandcastle pulse for internal timing pulse
generation
• Cut-off and white level measurement pulses in the last
4 lines of the vertical blanking interval (I2C-bus selection
for PAL, SECAM, or NTSC, PAL-M)
• I2C-bus data and clock signals for microcontroller
control.
• Increased RGB signal bandwidths for progressive scan
Two sets of analog RGB colour signals can also be
inserted, e.g. one from a peritelevision connector and the
other from an on-screen display generator; both inputs are
fully-controlled internally. The TDA4680 includes full
I2C-bus control of all parameters and functions with
automatic cut-off and white level control of the picture tube
cathode currents. It provides RGB output signals for the
video output stages.
and 100 Hz operation (selected via I2C-bus)
• Two switch-on delays to prevent discolouration before
steady-state operation
• Average beam current and peak drive limiting
• PAL/SECAM or NTSC matrix selection via I2C-bus
• Three adjustable reference voltage levels (via I2C-bus)
for automatic cut-off and white level control
There is a very similar IC TDA4681 available. The only
differences are in the NTSC matrix.
• Emitter-follower RGB output stages to drive the video
output stages
• Hue control output for the TDA4555, TDA4650/T,
TDA4655/T or TDA4657.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA4680
DIP28
plastic dual in-line package; 28 leads (600 mil)
plastic leaded chip carrier; 28 leads
SOT117-1
SOT261-2
TDA4680WP
PLCC28
1996 Oct 25
2
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
7.2
TYP.
8.0
MAX.
8.8
UNIT
VP
supply voltage (pin 5)
supply current (pin 5)
V
IP
−
−
−
−
85
−
−
−
−
mA
V
V8(p-p)
V6(p-p)
V7(p-p)
V14
luminance input (peak-to-peak value)
0.45
1.33
1.05
−(B − Y) input (peak-to-peak value)
V
−(R − Y) input (peak-to-peak value)
V
3-level sandcastle pulse
H + V
−
−
−
2.5
4.5
8.0
−
−
−
V
V
V
H
BK
2-level sandcastle pulse
H + V
−
−
−
−
0
2.5
4.5
0.7
2.0
−
−
V
BK
−
V
Vi(p-p)
Vo(b-w)
Tamb
RGB input signals at pins 2, 3, 4, 10, 11 and 12 (peak-to-peak value)
RGB outputs at pins 24, 22 and 20 (black-to-white value)
operating ambient temperature
−
V
−
V
70
°C
1996 Oct 25
3
Philips Semiconductors
Product specification
Video processor with automatic cut-off and
white level control
TDA4680
BLOCK DIAGRAM
EM6D93
a n d b o o k , f u l l p a g e w
1996 Oct 25
4
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
PINNING
SYMBOL PIN
DESCRIPTION
SYMBOL PIN
DESCRIPTION
fast switch 2 input
CPDL
storage capacitor for peak drive
limiting
FSW2
R2
1
2
3
4
5
6
7
8
9
16
red input 2
CL
17 storage capacitor for leakage current
18 white level measurement input
19 cut-off measurement input
20 blue output
G2
green input 2
WI
B2
blue input 2
CI
VP
supply voltage
BO
−(B − Y)
−(R − Y)
Y
colour difference input −(B − Y)
colour difference input −(R − Y)
luminance input
ground
CB
21 blue cut-off storage capacitor
22 green output
GO
CG
RO
CR
23 green cut-off storage capacitor
24 red output
GND
R1
10 red input 1
25 red cut-off storage capacitor
G1
11 green input 1
HUE
SDA
SCL
26 hue control output
B1
12 blue input 1
27 I2C-bus serial data input/output
28 I2C-bus serial clock input
FSW1
SC
13 fast switch 1 input
14 sandcastle pulse input
15 average beam current limiting input
BCL
handbook, halfpage
FSW
R
1
2
28 SCL
27 SDA
26 HUE
2
2
2
2
G
3
V
5
6
25 C
R
P
B
4
25
24
23
22
21
20
C
R
C
R
O
G
−(B − Y)
−(R − Y)
Y
24 R
O
V
5
P
7
23 C
G
−(B − Y)
6
8
22 G
21 C
TDA4680WP
O
−(R − Y)
Y
7
G
C
O
TDA4680
GND
9
B
8
B
R
1
10
11
20 B
O
GND
9
B
O
G
1
19 CI
R
1
10
11
12
19 CI
18 WI
G
1
MED695
B
1
17
16
C
C
L
FSW 13
1
PDL
SC 14
15 BCL
MED694
Fig.2 Pin configuration for DIP-version.
Fig.3 Pin configuration for PLCC-version.
1996 Oct 25
5
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
I2C-BUS
Control
I2C-BUS RECEIVER (MICROCONTROLLER WRITE MODE)
Each transmission to/from the I2C-bus transceiver
consists of at least three bytes following the START bit.
Each byte is acknowledged by an acknowledge bit
immediately following each byte. The first byte is the
Module Address (MAD) byte, also called slave address
byte. This consists of the module address, 1000100 for the
TDA4680, plus the R/W bit (see Fig.4). When the
TDA4680 is a slave receiver (R/W = 0) the module
address byte is 10001000 (88H). When the TDA4680 is a
slave transmitter (R/W = 1) the module address byte is
10001001 (89H).
The I2C-bus transmitter/receiver provides the data bytes to
select and adjust the following functions and parameters:
• Brightness adjust
• Saturation adjust
• Contrast adjust
• Hue control voltage
• RGB gain adjust
• RGB reference voltage levels
• Peak drive limiting
The length of a data transmission is unrestricted, but the
module address and the correct sub-address must be
transmitted before the data byte(s). The order of data
transmission is shown in Figs 5 and 6.
Without auto-increment (BREN = 0 or 1) the module
address (MAD) byte is followed by a Sub-Address (SAD)
byte and one data byte only (see Fig.5).
• Selection of the vertical blanking interval and
measurement lines for cut-off and white level control
according to transmission standard
• Selects either 3-level or 2-level (5 V) sandcastle pulse
• Enables/disables input clamping pulse delay
• Enables/disables white level control
• Enables cut-off control; enables output clamping
• Enables/disables full screen white level
• Enables/disables full screen black level
• Selects either PAL/SECAM or NTSC matrix
• Enables saturation adjust; enables nominal saturation
• Enables/disables synchronization of the execution of
I2C-bus commands with the vertical blanking interval
• Reads the result of the comparison of the nominal and
actual RGB signal levels for automatic white level
control.
I2C-bustransmitter/receiver and data transfer
I2C-BUS SPECIFICATION
The I2C-bus is a bidirectional, two-wire, serial data bus for
intercommunication between ICs in a system.
The microcontroller transmits/receives data from the
I2C-bus transceiver in the TDA4680 over the serial data
line SDA (pin 27) synchronized by the serial clock line SCL
(pin 28). Both lines are normally connected to a positive
voltage supply through pull-up resistors. Data is
transferred when the SCL line is LOW. When SCL is HIGH
the serial data line SDA must be stable. A HIGH-to-LOW
transition of the SDA line when SCL is HIGH is defined as
a START bit. A LOW-to-HIGH transition of the SDA line
when SCL is HIGH is defined as a STOP bit.
Each transmission must start with a START bit and end
with a STOP bit. The bus is busy after a START bit and is
only free again after a STOP bit has been transmitted.
1996 Oct 25
6
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
MSB
LSB
0
1
0
0
0
1
0
X
ACK
module address
R/W
MED696
Fig.4 The module address byte.
STA MAD SAD
START
STO
MED697
STOP
condition
condition
data byte
Fig.5 Data transmission without auto-increment (BREN = 0 or 1).
STA MAD SAD
START
STO
MED698
STOP
condition
condition
data byte
data bytes
Fig.6 Data transmission with auto-increment (BREN = 0).
7
1996 Oct 25
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
WPEN (White Pulse Enable):
AUTO-INCREMENT
0 = white measuring pulse disabled
The auto-increment format enables quick slave receiver
initialization by one transmission, when the I2C-bus control
bit BREN = 0 (see control register bits of Table 1).
If BREN = 1 auto-increment is not possible.
1 = white measuring pulse enabled.
BREN (Buffer Register Enable):
0 = new data is executed as soon as it is received
If the auto-increment format is selected, the MAD byte is
followed by a SAD byte and by the data bytes of
consecutive sub-addresses (Fig.6).
1 = data is stored in buffer registers and is transferred to
the data registers during the next vertical blanking
interval.
All sub-addresses from 00H to 0FH are automatically
incremented, the sub-address counter wraps round from
0FH to 00H. Reserved sub-addresses 0BH, 0EH and 0FH
are treated as legal but have no effect. Sub-addresses
outside the range 00H and 0FH are not acknowledged by
the device and neither auto-increment nor any other
internal operation takes place (for versions V1 to V5
sub-addresses outside the range 00H and 0FH are
acknowledged but neither auto-increment nor any other
internal operation takes place).
The I2C-bus transceiver does not accept any new data
until this data is transferred into the data registers.
DELOF (Delay Off) delays the leading edge of clamping
pulses:
0 = delay enabled
1 = delay disabled.
SC5 (SandCastle 5 V):
0 = 3-level sandcastle pulse
1 = 2-level (5 V) sandcastle pulse.
Sub-addresses are stored in the TDA4680 to address the
following parameters and functions (see Table 1):
CONTROL REGISTER 2
• Brightness adjust
• Saturation adjust
FSON2 (Fast Switch 2 ON)
FSDIS2 (Fast Switch 2 Disable)
FSON1 (Fast Switch 1 ON)
FSDIS1 (Fast Switch 1 Disable)
• Contrast adjust
• Hue control voltage
• RGB gain adjust
• RGB reference voltage levels
• Peak drive limiting adjust
• Control register functions.
The RGB input signals are selected by FSON2 and
FSON1 or FSW2 and FSW1:
• FSON2 has priority over FSON1
• FSW2 has priority over FSW1
The data bytes D7 to D0 (see Table 1) provide the data of
the parameters and functions for video processing.
• FSDIS1 and FSDIS2 disable FSW1 and FSW2
(see Table 3).
CONTROL REGISTER 1
BCOF (Black level Control Off):
VBWx (Vertical Blanking Window):
0 = automatic cut-off control enabled
x = 0, 1 or 2. VBWx selects the vertical blanking interval
and positions the measurement lines for cut-off and
white level control.
1 = automatic cut-off control disabled; RGB outputs are
clamped to fixed DC levels.
FSBL (Full Screen Black Level):
0 = normal mode
The actual lines in the vertical blanking interval after the
start of the vertical pulses selected as measurement lines
for cut-off and white level control are shown in Table 2.
1 = full screen black level (cut-off measurement level
during full field).
The standards marked with (*) are for progressive line
scan at double line frequency (2fL), i.e. approximately
31 kHz.
FSWL (Full Screen White Level):
0 = normal mode
NMEN (NTSC Matrix Enable):
0 = PAL/SECAM matrix
1 = NTSC matrix.
1 = full screen white level (white measurement level
during full field).
1996 Oct 25
8
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
SATOF (Saturation control Off):
0 = saturation control enabled
2-BIT WHITE LEVEL ERROR SIGNAL (see Table 4)
CB1, CB0 = 2-bit white level of the blue channel.
CG1, CG0 = 2-bit white level of the green channel.
CR1, CR0 = 2-bit white level of the red channel.
1 = saturation control disabled, nominal saturation
enabled.
I2C-BUS TRANSMITTER (MICROCONTROLLER READ MODE)
As an I2C-bus transmitter, R/W = 1, the TDA4680 sends a
data byte from the status register to the microcontroller.
The data byte consists of following bits: PONRES, CB1,
CB0, CG1, CG0, CR1, CR0 and 0, where PONRES is the
most significant bit.
PONRES (Power On Reset) monitors the state of
TDA4680’s supply voltage:
0 = normal operation
1 = supply voltage has dropped below approximately
6.0 V (usually occurs when the TV receiver is switched
on or the supply voltage was interrupted).
When PONRES changes state from a logic LOW to a logic
HIGH all data and function bits are set to logic LOW.
Table 1 Sub-address (SAD) and data bytes; note 1
MSB
SAD
LSB
D0
FUNCTION
(HEX)
D7
D6
D5
D4
D3
D2
D1
Brightness
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
0
0
0
0
0
0
0
0
0
0
0
0
X
A05
A15
A25
A35
A45
A55
A65
A75
A85
A95
AA5
X
A04
A14
A24
A34
A44
A54
A64
A74
A84
A94
AA4
X
A03
A13
A23
A33
A43
A53
A63
A73
A83
A93
AA3
X
A02
A12
A22
A32
A42
A52
A62
A72
A82
A92
AA2
X
A01
A11
A21
A31
A41
A51
A61
A71
A81
A91
AA1
X
A00
A10
A20
A30
A40
A50
A60
A70
A80
A90
AA0
X
Saturation
0
Contrast
0
Hue control voltage
Red gain
0
0
Green gain
0
Blue gain
0
Red level reference
Green level reference
Blue level reference
Peak drive limit
Reserved
0
0
0
0
X
Control register 1
Control register 2
Reserved
SC5
DELOF BREN WPEN NMEN VBW2
VBW1
VBW0
SATOF FSWL
FSBL
BCOF FSDIS2 FSON2 FSDIS1 FSON1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Reserved
Note
1. X = don’t care.
1996 Oct 25
9
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
Table 2 Cut-off and white level measurement lines; notes 1 to 3
VBW2
VBW1
VBW0
R
G
B
WHITE
STANDARD
0
0
0
1
1
1
0
0
1
0
0
1
0
1
0
0
1
0
19
16
20
17
21
18
22
19
PAL/SECAM
NTSC/PAL M
22
23
24
25
PAL/SECAM (EB)
PAL*/SECAM*
38, 39
32, 33
44, 45
40, 41
34, 35
46, 47
42, 43
36, 37
48, 49
44, 45
38, 39
50, 51
NTSC*/PAL M*
PAL*/SECAM* (EB)
Notes
1. The line numbers given are those of the horizontal pulse counts after the start of the vertical component of the
sandcastle pulse.
2. * line frequency of approximately 31 kHz.
3. (EB) is extended blanking.
Table 3 Signal input selection by the fast source switches; notes 1 to 4
I2C-BUS CONTROL BITS
ANALOG SWITCH SIGNALS
INPUT SELECTED
RGB1
FSW2
FSW1
FSON2 FSDIS2 FSON1 FSDIS1
RGB2
Y/CD
(PIN 1)
(PIN 13)
L
L
L
L
L
L
L
H
X
X
X
X
X
L
ON
ON
ON
H
L
ON
ON
ON
L
L
L
L
L
L
H
L
H
X
L
ON
H
L
H
X
X
X
X
X
H
ON
ON
H
X
X
X
ON
ON
L
L
H
H
X
L
H
X
H
X
X
H
ON
Notes
1. H: logical HIGH implies that the voltage >0.9 V.
2. L: logical LOW implies that the voltage <0.4 V.
3. X = don’t care.
4. ON indicates the selected input signal.
1996 Oct 25
10
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
Table 4 2-bit white level error signals; bits CX1 and CX0
CX1
CX0
INTERPRETATION
0
1
1
0
0
0
1
1
RAR (Reset-After-Read): no new measurements since last read
actual (measured) white level less than the tolerance range
actual (measured) white level within the tolerance range
actual (measured) white level greater than the tolerance range
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
8.8
UNIT
VP
Vi
supply voltage (pin 5)
−
V
V
V
V
input voltage (pins 1 to 8, 10 to 13, 16, 21, 23 and 25)
input voltage (pins 14, 15, 18 and 19)
input voltage (pins 27 and 28)
average current (pins 20, 22 and 24)
peak current (pins 20, 22 and 24)
input current
−0.1
−0.7
−0.1
+4
+VP
VP + 0.7
+8.8
−10
−20
2
Iav
IM
mA
mA
mA
mA
°C
+4
I18
I26
0
output current
+0.5
−20
0
−8
Tstg
Tamb
Ptot
storage temperature
+150
70
operating ambient temperature
total power dissipation
°C
SOT117-1
−
−
1.2
1.0
W
W
SOT261-2
1996 Oct 25
11
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
CHARACTERISTICS
All voltages are measured in test circuit of Fig.10 with respect to GND (pin 9); VP = 8.0 V; Tamb = 25 °C; nominal signal
amplitudes (black-to-white) at output pins 24, 22 and 20; nominal settings of brightness, contrast, saturation and white
level control; without beam current or peak drive limiting; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin 5)
VP
IP
supply voltage
supply current
7.2
8.0
8.8
V
−
85
110
mA
Colour difference inputs [−(B − Y): pin 6; −(R − Y): pin 7]
V6(p-p)
V7(p-p)
V6,7
−(B − Y) input (peak-to-peak value)
−(R − Y) signal (peak-to-peak value)
internal DC bias voltage
notes 1 and 2
−
1.33
1.05
3.1
−
−
V
notes 1 and 2
−
−
V
at black level clamping
during line scan
−
−
V
I6,7
input current
−
0.15
−
µA
µA
MΩ
at black level clamping
100
10
−
R6,7
AC input resistance
−
−
Luminance/sync (VBS; Y: pin 8)
Vi(p-p)
luminance input voltage at pin 8
note 2
−
0.45
−
V
(peak-to-peak value)
internal DC bias voltage
input current
V8(bias)
I8
at black level clamping
during line scan
−
3.1
−
−
V
−
0.15
−
µA
µA
MΩ
at black level clamping
100
10
−
R8
AC input resistance
−
−
RGB input 1 (R1: pin 10; G1: pin 11; B1: pin 12)
Vi(p-p)
input voltage at pins 10, 11 and 12
(peak-to-peak value)
note 2
−
0.7
−
V
V10/11/12(bias) internal DC bias voltage
at black level clamping
during line scan
−
5.4
−
−
V
I10/11/12
input current
−
0.15
−
µA
µA
MΩ
at black level clamping
100
10
−
R10/11/12
AC input resistance
−
−
RGB input 2 (R2: pin 2, G2: pin 3, B2: pin 4)
Vi(p-p)
input voltage at pins 2, 3 and 4
(peak-to-peak value)
note 2
−
0.7
−
V
V2/3/4
I2/3/4
internal DC bias voltage
input current
at black level clamping
during line scan
−
5.4
−
−
V
−
0.15
−
µA
µA
MΩ
at black level clamping
100
10
−
R2/3/4
AC input resistance
−
−
1996 Oct 25
12
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Fast signal switch FSW1 (pin 13) to select Y, CD or R1, G1, B1 inputs (control bits: see Table 3)
V13
voltage to select Y and CD
−
−
0.4
V
voltage range to select R1, G1, B1
internal resistance to ground
0.9
−
−
5.0
−
V
R13
4.0
−
kΩ
ns
∆t
difference between transit times for
signal switching and signal insertion
−
10
Fast signal switch FSW2 (pin 1) to select Y, CD/R1, G1, B1 or R2, G2, B2 inputs (control bits: see Table 3)
V1
voltage to select Y, CD/R1, G1, B1
voltage to select R2, G2, B2
internal resistance to ground
−
−
0.4
5.0
−
V
0.9
−
−
V
R1
4.0
−
kΩ
ns
∆t
difference between transit times for
signal switching and signal insertion
−
10
Saturation adjust [acts on internal RGB signals under I2C-bus control; sub-address 01H (bit resolution 1.5%
of maximum saturation); data byte 3FH for maximum saturation, data byte 23H for nominal saturation and
data byte 00H for minimum saturation]
ds
saturation below maximum
at 23H
−
−
5
−
−
dB
dB
at 00H; f = 100 kHz
50
Contrast adjust [acts on internal RGB signals under I2C-bus control; sub-address 02H (bit resolution 1.5% of
maximum contrast); data byte 3FH for maximum contrast, data byte 2CH for nominal contrast and data byte
00H for minimum contrast]
dc
contrast below maximum
at 2CH
at 00H
−
−
3
−
−
dB
dB
22
Brightness adjust [acts on internal RGB signals under I2C-bus control; sub-address 00H (bit resolution 1.5%
of brightness range); data byte 3FH for maximum brightness, data byte 27H for nominal brightness and data
byte 00H for minimum brightness]
dbr
black level shift of nominal signal
amplitude referred to cut-off
measurement level
at 3FH
at 00H
−
−
30
−
−
%
%
−50
White potentiometers [under I2C-bus control; sub-addresses 04H (red), 05H (green) and 06H (blue); data byte
3FH for maximum gain; data byte 22H for nominal gain and data byte 00H for minimum gain]; note 3
∆Gv
relative to nominal gain
increase of AC gain
decrease of AC gain
at 3FH
at 00H
−
−
60
60
−
−
%
%
1996 Oct 25
13
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
RGB outputs (pins 24, 22 and 20; positive going output signals and no peak drive limitation;
sub-address 0AH = 3FH); note 4
Vo(b-w)
nominal output signals
(black-to-white value)
−
2.0
−
−
V
maximum output signals
(black-to-white value)
3.2
−
V
∆Vo
spread between RGB output signals
output voltages
−
−
10
%
V
Vo
6.8
2.3
−
0.8
2.7
V24,22,20
voltage of cut-off measurement line
output clamping
(BCOF = 1)
2.5
V
Iint
Ro
internal current sources
output resistance
−
−
5.0
65
−
mA
110
Ω
Frequency response
frequency response of Y path
d
f = 10 MHz
f = 8 MHz
f = 10 MHz
−
−
−
−
−
−
3
3
3
dB
dB
dB
(from pin 8 to pins 24, 22, 20)
frequency response of CD path
(from pins 7 to 24 and 6 to 20)
frequency response of RGB1 path
(from pins 10 to 24, 11 to 22 and
12 to 20)
frequency response of RGB2 path
f = 10 MHz
−
−
3
dB
(from pins 2 to 24, 3 to 22 and 4 to 20)
Sandcastle pulse detector (pin 14)
CONTROL BIT SC5 = 0; 3-LEVEL; notes 5 and 6
V14
sandcastle pulse voltage
for horizontal and vertical blanking
pulses
2.0
2.5
3.0
5.0
V
V
for horizontal pulses (line count)
for burst key pulses
4.0
6.3
4.5
−
VP + 0.7 V
CONTROL BIT SC5 = 1; 2-LEVEL; note 5
V14
sandcastle pulse voltage
for horizontal and vertical blanking
pulses
2.0
4.0
2.5
4.5
3.0
V
for burst key pulses
VP + 0.7 V
1996 Oct 25
14
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
GENERAL
I14
td
input current
V14 < 0.5 V
−100
−
−
−
−
−
µA
µs
µs
µs
leading edge delay of the clamping
pulse
control bit DELOF = 0
control bit DELOF = 1
−
−
3
1.5
0
tBK
required burst key pulse time
control bit DELOF = 0;
normally used with fL
−
control bit DELOF = 1;
normally used with 2fL
1.5
4
−
−
−
−
µs
−
npulse
required horizontal or burst key pulses e.g. at interlace scan
29
57
during vertical blanking interval
(VBW2 = 0)
e.g. at progressive line
scan (VBW2 = 1)
8
−
Average beam current limiting (pin 15); note 7
Vc(15)
contrast reduction starting voltage
−
−
4.0
−
−
V
V
∆Vc(15)
voltage difference for full contrast
reduction
−2.0
Vbr(15)
brightness reduction starting voltage
−
−
2.5
−
−
V
V
∆Vbr(15)
voltage difference for full brightness
reduction
−1.6
Peak drive limiting voltage [pin 16; internal peak drive limiting level (Vpdl) acts on RGB outputs under I2C-bus
control; sub-address 0AH]; note 8
V20/22/24
RGB output voltages
at 00H
at 3FH
−
−
3.0
−
V
6.5
−
−
V
I16
charge current
−1
5
−
µA
mA
V
discharge current
during peak white
−
−
V16
internal voltage limitation
contrast reduction starting voltage
4.5
−
−
−
Vc(16)
∆Vc(16)
4.0
−2.0
−
V
voltage difference for full contrast
reduction
−
−
V
Vbr(16)
brightness reduction starting voltage
−
−
2.5
−
−
V
V
∆Vbr(16)
voltage difference for full brightness
reduction
−1.6
1996 Oct 25
15
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Automatic cut-off and white level control (pins 19 and 18); notes 9 to 11; see Fig.8
V19
I19
permissible voltage (also during
scanning period)
−
−
VP − 1.4 V
output current
−
−
−
−140
µA
input current
150
−
−
−
−
µA
mA
V
additional input current
warming up amplitude (under I2C-bus switch-on delay 1
control; sub-address 0AH)
only during warming up
0.5
V24,22,20
V19(th)
Vref
−
V
pdl − 0.7
voltage threshold for picture tube
cathode warming up
switch-on delay 1
−
−
5.0
3.0
−
−
V
V
internally controlled voltage
during leakage
measurement period
DATA BYTE 07H FOR RED REFERENCE LEVEL, DATA BYTE 08H FOR GREEN REFERENCE LEVEL AND DATA BYTE 09H FOR BLUE
REFERENCE LEVEL
∆V19
difference between VMEAS (cut-off or
white level measurement voltage) and
Vref
3FH (maximum VMEAS
20H (nominal VMEAS
00H (minimum VMEAS
)
1.5
−
−
−
V
)
1.0
−
−
V
)
−
0.5
800
−
V
I18
input current
white level measurement −
to Vref; I18 ≤ 800 µA
white level measurement −
−
µA
Ω
R18
∆V19
internal resistance
−
100
250
white level register (measured value
within tolerance range)
−
mV
Storage of cut-off control voltage/output clamping voltage (pins 25, 23 and 21)
I21/23/25
charge and discharge currents
during cut-off
−
0.3
−
mA
measurement lines
input currents of storage inputs
outside measurement
time
−
−
0.1
µA
Storage of leakage information (pin 17)
I17
charge and discharge currents
during leakage
−
0.4
−
mA
measurement period
leakage current
outside time LM
−
−
−
−
0.1
3.0
µA
V17
voltage for reset to switch-on below
V
Hue control (under I2C-bus control; sub-address 03H; data byte 3FH for maximum voltage; data byte 20H for
nominal voltage and data byte 00H for minimum voltage); note 12
V26
output voltage
at 3FH
at 20H
at 00H
4.8
−
−
−
V
3.0
−
−
V
−
1.0
−
V
Iint
current of the internal current source
at pin 26
500
−
µA
1996 Oct 25
16
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I2C-bus transceiver clock SCL (pin 28)
fSCL
VIL
VIH
IIL
IIH
tL
input frequency range
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
clock pulse LOW
0
−
−
−
−
−
−
−
−
−
100
kHz
V
−
1.5
6.0
−
3.0
−10
−
V
V28 = 0.4 V
µA
µA
µs
µs
µs
µs
10
−
4.7
4.0
−
tH
clock pulse HIGH
rise time
−
tr
1.0
0.3
tf
fall time
−
I2C-bus transceiver data input/output SDA (pin 27)
VIL
VIH
IIL
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
LOW level output current
rise time
−
−
−
−
−
−
−
−
−
1.5
6.0
−
V
3.0
−10
−
V
V27 = 0.4 V
V27 = 0.4 V
µA
µA
mA
µs
µs
µs
IIH
10
−
IOL
tr
3.0
−
1.0
0.3
−
tf
fall time
−
tSU;DAT
data set-up time
0.25
Notes to the characteristics
1. The values of the −(B − Y) and −(R − Y) colour difference input signals are for a 75% colour-bar signal.
2. The pins are capacitively coupled to a low ohmic source, with a recommended maximum output impedance of 600 Ω.
3. The white potentiometers affect the amplitudes of the RGB output signals including the white measurement pulses.
4. The RGB outputs at pins 24, 22 and 20 are emitter followers with current sources.
5. Sandcastle pulses are compared with internal threshold voltages independent of VP. The threshold voltages
separate the components of the sandcastle pulse. The particular component is generated when the voltage on pin 14
exceeds the defined internal threshold voltage.
The internal threshold voltages (control bit SC5 = 0) are:
1.5 V for horizontal and vertical blanking pulses
3.5 V for horizontal pulses
6.0 V for the burst key pulse.
The internal threshold voltages (control bit SC5 = 1) are:
1.5 V for horizontal and vertical blanking pulses
3.5 V for the burst key pulse.
6. A sandcastle pulse with a maximum voltage equal to (VP + 0.7 V) is obtained by limiting a 12 V sandcastle pulse.
7. Average beam current limiting reduces the contrast, at minimum contrast it reduces the brightness.
8. Peak drive limiting reduces the RGB outputs by reducing the contrast, at minimum contrast it reduces the brightness.
The maximum RGB outputs are determined via the I2C-bus under sub-address 0AH. When an RGB output exceeds
the maximum voltage, peak drive limiting is delayed by one horizontal line.
1996 Oct 25
17
Philips Semiconductors
Product specification
Video processor with automatic cut-off and
white level control
TDA4680
9. The vertical blanking interval is defined by a vertical pulse which contains 4 (8) or more horizontal pulses; it begins
with the start of the vertical pulse and ends with the end of the white measuring line. If the vertical pulse is longer
than the selected vertical blanking window the blanking period ends with the end of the complete line after the end
of the vertical pulse. The counter cycle time is 31 (63) horizontal pulses. If the vertical pulse contains more than
29 (57) horizontal pulses, the black level storage capacitors will be discharged while all signals are blanked.
During leakage current measurement, the RGB channels are blanked to ultra-black level. During cut-off
measurement one channel is set to the measurement pulse level, the other channels are blanked to ultra-black.
Since the brightness adjust shifts the colour signal relative to the black level, the brightness adjust is disabled during
the vertical blanking interval (see Figs 7 and 8).
10. During picture cathode warming up (first switch-on delay) the RGB outputs (pins 24, 22 and 20) are blanked to the
ultra-black level during line scan. During the vertical blanking interval a white-level monitor pulse is fed out on the
RGB outputs and the cathode currents are measured. When the voltage threshold on pin 19 is greater than 5.0 V,
the monitor pulse is switched off and cut-off and white level control are activated (second switch-on delay). As soon
as cut-off control stabilizes, RGB output blanking is removed.
11. Range of cut-off measurement level at the RGB outputs is 1 to 5 V. The recommended value is 3 V.
12. The hue control output at pin 26 is an emitter follower with current source.
Table 5 Demodulator axes and amplification factors
PARAMETER
(B − Y)* demodulator axis
NTSC
0°
PAL
0°
(R − Y)* demodulator axis
(R − Y)* amplification factor
(B − Y)* amplification factor
115°
1.97
2.03
90°
1.14
2.03
Table 6 PAL/SECAM and NTSC matrix; notes 1 and 2
MATRIX
PAL/SECAM
NTSC
NMEN
0
1
Notes
1. PAL/SECAM signals are matrixed by the equation: VG − Y = −0.51VR − Y − 0.19VB − Y
NTSC signals are matrixed by the equations (hue phase shift of −5 degrees):
VR − Y* = 1.57VR − Y − 0.41VB − Y; VG − Y* = −0.43VR − Y − 0.11VB − Y; VB − Y* = VB − Y
In the matrix equations: VR − Y and VB − Y are conventional PAL demodulation axes and amplitudes at the output of
the NTSC demodulator. VG − Y*, VR − Y* and VB − Y* are the NTSC-modified colour difference signals; this is equivalent
to the demodulator axes and amplification factors shown in Table 5. VG − Y* = −0.27VR − Y* − 0.22VB − Y*
.
2. The vertical blanking interval is selected via the I2C-bus (see Table 2 and Fig.8). Vertical blanking is determined by
the vertical component of the sandcastle pulse; this vertical component has priority when it is longer than the vertical
blanking interval of the transmission standard.
1996 Oct 25
18
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
MED701
(1)
(2)
white measurement level
for green signal
cut-off measurement level
for green signal
ultra-black level
(2) Nominal brightness.
(1) Maximum brightness.
Fig.7 Cut-off and white level measurement pulses.
621 622 623 624 625 1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
vertical flyback 850 µs
V component of the sandcastle pulse
LM
(leakage current measurement time)
PAL,
SECAM
vertical blanking interval, 22 complete lines
MR MG MB WR
WG
WB
V component of the sandcastle pulse
LM
NTSC,
PAL M
cut-off and
white level
measurement
pulses
vertical blanking interval, 19 complete lines
MR MG MB WR
WG
WB
V component of the sandcastle pulse
PAL,
SECAM
(with
increased
vertical
blanking
interval)
LM
vertical blanking interval, 25 complete lines
MR MG MB WR
MED702
WG
WB
Fig.8 Leakage current, cut-off and white level current measurement timing diagram.
bnok,lfuapgedwith
1996 Oct 25
19
Philips Semiconductors
Product specification
Video processor with automatic cut-off and
white level control
TDA4680
INTERNAL PIN CONFIGURATION
EM6D9
a n d b o o k , f u l l p a g e w
1996 Oct 25
20
Philips Semiconductors
Product specification
Video processor with automatic cut-off and
white level control
TDA4680
TEST AND APPLICATION INFORMATION
EM7D0
bnok,lfuapgedwith
1996 Oct 25
21
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
PACKAGE OUTLINES
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil)
SOT117-1
D
M
E
A
2
A
L
A
1
c
e
w M
Z
b
1
(e )
1
b
M
H
28
15
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
max.
A
A
Z
(1)
(1)
1
2
UNIT
mm
b
b
c
D
E
e
e
L
M
M
w
1
1
E
H
min.
max.
max.
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
3.9
3.4
15.80
15.24
17.15
15.90
5.1
0.51
4.0
2.54
0.10
15.24
0.60
0.25
0.01
1.7
0.013
0.009
0.066
0.051
0.020
0.014
1.41
1.34
0.56
0.54
0.15
0.13
0.62
0.60
0.68
0.63
inches
0.20
0.020
0.16
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-14
SOT117-1
051G05
MO-015AH
1996 Oct 25
22
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
PLCC28: plastic leaded chip carrier; 28 leads
SOT261-2
e
e
E
E
y
X
A
E
b
p
25
19
b
1
Z
E
18
26
w
M
28
1
H
E
pin 1 index
e
A
A
1
A
4
12
4
k
1
β
(A )
3
k
5
11
L
p
v
M
A
Z
e
D
detail X
D
H
B
v
M
B
D
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
(1)
(1)
A
min.
A
max.
k
1
max.
Z
Z
E
(1)
(1)
1
4
D
UNIT
mm
A
A
b
D
E
e
e
e
H
H
k
L
p
v
w
y
β
b
D
E
D
E
3
p
1
max. max.
4.57
4.19
0.81 11.58 11.58
0.66 11.43 11.43
10.92 10.92 12.57 12.57 1.22
9.91 9.91 12.32 12.32 1.07
1.44
1.02
0.53
0.33
0.51
0.51 0.25 3.05
0.020 0.01 0.12
1.27
0.05
0.18 0.18 0.10 2.16 2.16
0.007 0.007 0.004 0.085 0.085
o
45
0.180
0.165
0.032 0.456 0.456
0.026 0.450 0.450
0.430 0.430 0.495 0.495 0.048
0.390 0.390 0.485 0.485 0.042
0.057
0.040
0.021
0.013
inches
0.020
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT261-2
1996 Oct 25
23
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
WAVE SOLDERING
DIP
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
• The package footprint must incorporate solder thieves at
the downstream corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
REPAIRING SOLDERED JOINTS
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
PLCC
REPAIRING SOLDERED JOINTS
REFLOW SOLDERING
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering techniques are suitable for all PLCC
packages.
The choice of heating method may be influenced by larger
PLCC packages (44 leads, or more). If infrared or vapour
phase heating is used and the large packages are not
absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
1996 Oct 25
24
Philips Semiconductors
Product specification
Video processor with automatic cut-off
and white level control
TDA4680
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Oct 25
25
Philips Semiconductors
Product specification
Video processor with automatic cut-off and
white level control
TDA4680
NOTES
1996 Oct 25
26
Philips Semiconductors
Product specification
Video processor with automatic cut-off and
white level control
TDA4680
NOTES
1996 Oct 25
27
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 247 9145, Fax. +7 095 247 9144
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580/xxx
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/02/pp28
Date of release: 1996 Oct 25
Document order number: 9397 750 00946
相关型号：
©2020 ICPDF网 联系我们和版权申明