TDA7056B/N1,112 [NXP]
TDA7056B - 5 W mono BTL audio amplifier with DC volume control;
| 型号： | TDA7056B/N1,112 |
| 厂家： | 
NXP |
| 描述： | TDA7056B - 5 W mono BTL audio amplifier with DC volume control 商用集成电路 |
| 文件： | 总15页 (文件大小：90K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA7056B
5 W mono BTL audio amplifier with
DC volume control
Product specification
1997 Aug 15
Supersedes data of 1996 May 28
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
FEATURES
GENERAL DESCRIPTION
DC volume control
The TDA7056B is a mono Bridge-Tied Load (BTL) output
amplifier with DC volume control.
It is designed for use in TV and monitors, but is also
suitable for battery-fed portable recorders and radios.
The device is contained in a 9-pin medium power package.
Few external components
Mute mode
Thermal protection
Short-circuit proof
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for headphone
applications (single-ended).
No switch-on and switch-off clicks
Good overall stability
Low power consumption
Low HF radiation
ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
CONDITIONS
MIN.
4.5
TYP.
MAX.
18
UNIT
supply voltage
output power
V
PO
VP = 12 V
RL = 16
RL = 8
3
3.5
W
5
5.5
W
Gv(max)
maximum total voltage gain
gain control
39.5
68
40.5
73.5
9.2
41.5
dB
dB
mA
%
Iq(tot)
THD
total quiescent current
total harmonic distortion
VP = 12 V; RL =
13
1
PO = 0.5 W
0.3
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA7056B
SIL9MPF plastic single in-line medium power package with fin; 9 leads
SOT110-1
1997 Aug 15
2
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
BLOCK DIAGRAM
V
P
2
1
n.c.
TDA7056B
9
n.c.
I + i
6
positive output
3
5
input
DC volume control
I
– i
8
negative output
STABILIZER TEMPERATURE
PROTECTION
V
ref
4
7
MSA708 - 1
signal
ground
power
ground
Fig.1 Block diagram.
PINNING
SYMBOL
n.c.
PIN
DESCRIPTION
handbook, halfpage
1
2
3
4
5
6
7
8
9
not connected
positive supply voltage
voltage input
n.c.
1
2
3
4
5
6
7
8
9
VP
V
P
VI
V
I
GND1
VC
signal ground
GND1
VC
DC volume control
positive output
power ground
TDA7056B
OUT+
GND2
OUT
n.c.
OUT
GND2
OUT
n.c.
negative output
not connected
MSA707
Fig.2 Pin configuration.
1997 Aug 15
3
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
FUNCTIONAL DESCRIPTION
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to 33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.
The TDA7056B is a mono BTL output amplifier with DC
volume control, designed for use in TV and monitor but is
also suitable for battery-fed portable recorders and radios.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low. In the TDA7056B
the DC volume control stage is integrated into the input
stage so that no coupling capacitors are required. With this
configuration, a low offset voltage is still maintained and
the minimum supply voltage remains low.
The amplifier is short-circuit proof to ground, VP and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
The BTL principle offers the following advantages:
Power dissipation
Lower peak value of the supply current
Assume VP = 12 V; RL = 16 .
The maximum sine wave dissipation is = 1.8 W.
The frequency of the ripple on the supply voltage is twice
the signal frequency.
The Rth vj-a of the package is 55 K/W.
Therefore Tamb (max) = 150 55 1.8 = 51 C.
Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS
supply voltage
MIN.
MAX.
18
UNIT
VP
V
V
A
A
V3, 5
IORM
IOSM
Ptot
Tamb
Tstg
Tvj
input voltage pins 3 and 5
repetitive peak output current
non-repetitive peak output current
total power dissipation
5
1.25
1.5
9
Tcase 60 C
W
C
C
C
h
operating ambient temperature
storage temperature
40
55
+85
+150
+150
1
virtual junction temperature
short-circuit time
Tsc
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
K/W
K/W
Rth j-a
Rth j-c
thermal resistance from junction to ambient in free air
thermal resistance from junction to case
55
10
1997 Aug 15
4
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.13).
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
VP
positive supply voltage
total quiescent current
4.5
18
13
V
Iq(tot)
note 1; RL =
9.2
mA
Maximum gain (V5 = 1.4 V)
PO
output power
THD = 10%; RL = 16
THD = 10%; RL = 8
PO = 0.5 W
3
3.5
5.5
0.3
W
5
W
THD
Gv(max)
VI
total harmonic distortion
maximum total voltage gain
input signal handling (RMS value)
noise output voltage (RMS value)
bandwidth
1
%
39.5
1.0
40.5
41.5
dB
V
Gv(max) = 0 dB; THD 1%
note 2; f = 500 kHz
at 1 dB
Vno
210
V
kHz
dB
mV
k
B
0.02 to 300
SVRR
VO
ZI
supply voltage ripple rejection
DC output offset voltage
input impedance (pin 3)
note 3
34
38
0
V8 v6
200
25
15
20
Mute position
VO
output voltage in mute position
note 4; V5 0.4 V;
35
45
V
VI = 1.0 V
DC volume control; note 5
gain control
68
73.5
dB
I5
control current
V5 = 0 V
20
25
30
A
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and B = 5 kHz.
3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV
(RMS value) is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted.
5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.
1997 Aug 15
5
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
MBH372
MBH365
40
1
handbook, halfpage
handbook, halfpage
G
v
(dB)
V
no
0
(mV)
−1
−40
−80
10
−2
−120
10
0
0.4
0.8
1.2
1.6
V
2.0
(V)
0
0.4
0.8
1.2
1.6
V
2
(V)
DC
DC
Measured with RS = 5 k unweighted.
Frequency range is 22 Hz to 22 kHz.
Fig.3 Gain control as a function of DC volume
control.
Fig.4 Noise output voltage as a function of DC
volume control.
MBH376
MBH367
25
20
handbook, halfpage
handbook, halfpage
I
DC
(μA)
I
P
(mA)
15
15
5
−5
10
−15
−25
5
0
0.4
0.8
1.2
1.6
V
2.0
(V)
0
4
8
12
16
20
V
(V)
P
DC
Measured with RL = .
Fig.5 Control current as a function of DC volume
control.
Fig.6 Quiescent current versus supply voltage.
1997 Aug 15
6
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
MBH361
MBH362
10
10
handbook, halfpage
handbook, halfpage
THD
(%)
THD
(%)
8
8
6
4
2
0
(1)
(2)
6
4
(1)
2
0
(2)
-1
−2
−1
2
10
1
10
10
10
1
10
10
P
(W)
f (kHz)
O
(1) RL 16 .
(2) RL = 8 .
PO = 0.1 W.
(1) Gv(max) = 40 dB.
(2) Gv(max) = 30 dB.
Fig.7 Total harmonic distortion versus output
power.
Fig.8 Total harmonic distortion versus frequency.
MBH363
MBH364
6
10
handbook, halfpage
handbook, halfpage
P
d
P
O
(W)
(W)
5
8
4
3
2
1
0
6
(2)
(1)
(1)
(2)
4
2
0
0
4
8
12
16
20
0
4
8
12
16
20
V
(V)
V (V)
P
P
Measured at a THD of 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
(1) RL = 8 .
(2) RL = 16 .
(1) RL = 8 .
(2) RL = 16 .
Fig.10 Total worst case power dissipation versus
supply voltage.
Fig.9 Output power versus supply voltage.
1997 Aug 15
7
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
MBH374
MBH375
−20
SVRR
(dB)
2.0
handbook, halfpage
handbook, halfpage
V
I
(V)
1.6
−30
(1)
−40
1.2
0.8
−50
(2)
−60
−70
0.4
0
0
−2
−1
2
10
10
1
10
10
4
8
12
16
20
f (kHz)
V
(V)
P
Measured with VR = 0.2 V.
(1) VDC = 1.4 V.
Measured at a THD of 1% and a voltage gain of 0 dB.
(2)
VDC = 0.4 V.
Fig.11 Supply voltage ripple rejection versus
frequency.
Fig.12 Input signal handling.
1997 Aug 15
8
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
TEST AND APPLICATION INFORMATION
(1)
V
= 12 V
P
100 nF
220 μF
2
1
n.c.
TDA7056B
9
n.c.
I + i
6
+
0.47 μF
input
3
5
R
= 8 Ω
L
I − i
8
−
R
S
TEMPERATURE
PROTECTION
5 kΩ
STABILIZER
DC
volume
control
4
7
MSA709 - 2
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 2.
Fig.13 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1997 Aug 15
9
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
V
= 12 V
handbook, halfpage
handbook, halfpage
P
volume
control
5
100 kΩ
22 kΩ
volume
control
5
1 μF
1 MΩ
1 μF
MSA710
MBH366
Fig.14 Application with potentiometer as volume
control; maximum gain = 34 dB.
Fig.15 Application with potentiometer as volume
control; maximum gain = 40 dB.
1997 Aug 15
10
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
P
2
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
2
Z
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
max.
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25
1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-02-25
03-03-12
SOT110-1
1997 Aug 15
11
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
SOLDERING
Introduction
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
1997 Aug 15
12
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DEFINITIONS
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Product specification The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
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Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
1997 Aug 15
13
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
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Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Semiconductors’ product specifications.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
1997 Aug 15
14
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2011
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
RM5/03/pp15
Date of release: 1997 Aug 15
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