TDA8552T/N1,512_技术文档

INTEGRATED CIRCUITS

DATA SHEET

TDA8552T; TDA8552TS

2 x 1.4 W BTL audio amplifiers with

digital volume control and

headphone sensing

Product speciﬁcation

2002 Jan 04

Supersedes data of 1998 Jun 02

File under Integrated Circuits, IC01

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

FEATURES

GENERAL DESCRIPTION

• One pin digital volume control (for each channel)

• Volume setting with up/down pulses

• Auto repeat function on volume setting

• Headphone sensing

The TDA8552T is a two channel audio power amplifier that

provides an output power of 2 × 1.4 W into an 8 Ω load

using a 5 V power supply. The circuit contains two BTL

power amplifiers, two digital volume controls and

standby/mute logic. Volume and balance of the amplifiers

are controlled using two digital input pins which can be

driven by simple push-buttons or by a microcontroller.

• Maximum gain set by selection pin

• Low sensitivity for EMC radiation

• Internal feedback resistors

Using the selection pin (GAINSEL) the maximum gain can

be set at 20 or 30 dB. The headphone sense input (HPS)

can be used to detect if a headphone is plugged into the

jack connector. If a headphone is plugged into the jack

connector the amplifier switches from the BTL to the SE

mode and the BTL loudspeakers are switched off. This

also results in a reduction of quiescent current

consumption.

• Flexibility in use

• Few external components

• Low saturation voltage of output stage

• Standby mode controlled by CMOS compatible levels

• Low standby current

• No switch-on/switch-off plops

The TDA8552T is contained in a 20-pin small outline

package. For the TDA8552TS, which is contained in a

20-pin very small outline package, the maximum output

power is limited by the maximum allowed ambient

temperature. More information can be found in Section

“Thermal design considerations”. The SO20 package has

the four corner leads connected to the die pad so that the

thermal behaviour can be improved by the PCB layout.

• High supply voltage ripple rejection

• Protected against electrostatic discharge

• Outputs short-circuit safe to ground, V_DDand across the

load

• Thermally protected.

APPLICATIONS

• Portable consumer products

• Notebook computers

• Communication equipment.

ORDERING INFORMATION

PACKAGE

TYPE

NUMBER

NAME

DESCRIPTION

plastic small outline package; 20 leads; body width 7.5 mm

SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm

VERSION

SOT163-1

SOT266-1

TDA8552T

SO20

TDA8552TS

2002 Jan 04

2

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

QUICK REFERENCE DATA

SYMBOL

PARAMETER

supply voltage

CONDITIONS

MIN.

2.7

TYP.

MAX.

5.5

UNIT

V_DD

I_q

5

V

quiescent supply current BTL mode; V_DD= 5 V

BTL mode; V_DD= 3.3 V

−

1

−

50

14

10

8.5

5

20

15

12

8

mA

µA

W

SE mode; V_DD= 5 V

SE mode; V_DD= 3.3 V

I_stb

P_o

G_v

standby current

1

10

−

output power

voltage gain

THD = 10%; R_L= 8 Ω; V_DD= 5 V

1.4

20

−60

30

−50

64

0.1

−

low gain; maximum volume

low gain; minimum volume

high gain; maximum volume

high gain; minimum volume

−

dB

−

N_step

THD

number of volume steps

total harmonic distortion

−

P_o= 0.5 W

−

%

SVRR

supply voltage ripple

rejection

−

dB

2002 Jan 04

3

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

BLOCK DIAGRAM

V

3

V

8

V

handbook, full pagewidth

DD1

DD2

DD3

13

DD4

18

17

IN1

VOLUME

CONTROL

20

12

OUT1+

kΩ

MASTER

0.5V

15 kΩ

DD

20 dB

30 dB

3.4 kΩ

1.6 kΩ

20 kΩ

UP/DOWN

COUNTER

V

DD

up

down

UP/DOWN1

SVR

6

0.5V

DD

19

OUT1−

INTERFACE

SLAVE

15 kΩ

0.5V

DD

16

0.5V

DD

TDA8552T

15 kΩ

15

IN2

VOLUME

CONTROL

20

2

OUT2+

kΩ

MASTER

15 kΩ

0.5V

DD

20 dB

30 dB

3.4 kΩ

1.6 kΩ

20 kΩ

UP/DOWN

COUNTER

V

DD

up

down

7

UP/DOWN2

0.5V

DD

9

OUT2−

INTERFACE

15 kΩ

0.5V

SLAVE

0.5V

DD

15 kΩ

5

4

MODE

HPS

GAIN

SELECTION

STANDBY/MUTE

AND OPERATING

14

1, 10, 11, 20

GND1 to GND4

MGM608

GAINSEL

Fig.1 Block diagram.

4

2002 Jan 04

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

PINNING

SYMBOL

GND1

PIN⁽¹⁾

DESCRIPTION

1

2

ground 1, substrate/leadframe

OUT2+

positive loudspeaker terminal

output channel 2

V_DD1

HPS

3

4

supply voltage 1

digital input for headphone

sensing

handbook, halfpage

GND1

20 GND4

1

2

MODE

5

digital trinary input for mode

selection (standby, mute and

operating)

19

18

17

OUT2+

OUT1−

V

3

DD1

DD4

UP/DOWN1

UP/DOWN2

6

7

digital trinary input for volume

control channel 1

HPS

IN1

4

digital trinary input for volume

control channel 2

MODE

16 SVR

15 IN2

5

TDA8552T

UP/DOWN1

UP/DOWN2

6

V_DD2

8

9

supply voltage 2

GAINSEL

7

14

13

12

11

OUT2−

negative loudspeaker terminal

output channel 2

V

8

DD2

DD3

GND2

GND3

OUT1+

10

11

12

ground 2, substrate/leadframe

ground 3, substrate/leadframe

OUT2−

OUT1+

9

GND2

GND3

10

positive loudspeaker terminal

output channel 1

MGM610

V_DD3

13

14

15

16

supply voltage 3

GAINSEL

IN2

digital input for gain selection

audio input channel 2

SVR

half supply voltage, decoupling

ripple rejection

IN1

17

18

19

audio input channel 1

supply voltage 4

V_DD4

OUT1−

negative loudspeaker terminal

output channel 1

Fig.2 Pin configuration.

GND4

20

ground 4, substrate/leadframe

Note

1. For the SO20 (SOT163-1) package only: the ground

pins 1, 10, 11 and 20 are mechanically connected to

the leadframe and electrically to the substrate of the

die. On the PCB the ground pins can be connected to

a copper area to decrease the thermal resistance.

2002 Jan 04

5

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

FUNCTIONAL DESCRIPTION

Volume control

The TDA8552T is a 2 × 1.4 W BTL audio power amplifier

capable of delivering 2 × 1.4 W output power into an 8 Ω

load at THD = 10% using a 5 V power supply. The gain of

the amplifier can be set by the digital volume control.

The gain in the maximum volume setting is 20 dB (low

gain) or 30 dB (high gain). This maximum gain can be

selected by the gain selection pin. The headphone sense

input (HPS) can be used to detect if a headphone is

plugged into the jack connector. If a headphone is plugged

into the jack connector the amplifier switches from the BTL

to the SE mode and the BTL loudspeakers are switched

off. This also results in a reduction of quiescent current

consumption. Using the MODE pin the device can be

switched to the standby condition, the mute condition or

the normal operating condition. The device is protected by

an internal thermal shutdown protection mechanism.

Each attenuator is controlled with its own UP/DOWN pin

(trinary input):

• Floating UP/DOWN pin: volume remains unchanged

• Negative pulses: decreasing volume

• Positive pulses: increasing volume.

Each pulse on the UP/DOWN pin results in a change in

80

gain of

= 1.25 dB (typical value).

------

64

In the basic application the UP/DOWN pin is switched to

ground or V_DDby a double push-button. When the supply

voltage is initially connected, after a complete removal of

the supply, the initial state of the volume control is an

attenuation of 40 dB (low volume), so the gain of the total

amplifier is −20 dB in the low gain setting or −10 dB in the

high gain setting. After powering-up, some positive pulses

have to be applied to the UP/DOWN pin for turning up to

listening volume.

Power ampliﬁer

The power amplifier is a Bridge-Tied Load (BTL) amplifier

with a complementary CMOS output stage. The total

voltage loss for both output power MOS transistors is

within 1 V and with a 5 V supply and an 8 Ω loudspeaker

an output power of 1.4 W can be delivered. The total gain

of this power amplifier can be set at 20 or 30 dB by the

gain selection pin.

Auto repeat

If the UP/DOWN pin is LOW or HIGH for the wait time (t_wait

in seconds) (one of the keys is pressed) then the device

starts making up or down pulses by itself with a frequency

1

t_rep

given by

(repeat function).

-------

Gain selection

The wait time and the repeat frequency are set using an

internal RC oscillator with an accuracy of ±10%.

The gain selection can be used for a fixed gain setting,

depending on the application. The gain selection pin must

be hard wired to ground (20 dB) or to V_DD(30 dB). Gain

selecting during the operation is not advised, switching is

not guaranteed plop free.

Volume settings in standby mode

When the device is switched with the MODE select pin to

the mute or the standby condition, the volume control

attenuation setting keeps its value, under the assumption

that the voltage on the V_DDpin does not fall below the

minimum supply voltage. After switching the device back

to the operation mode, the previous volume setting is

maintained. In the standby mode the volume setting is

maintained as long as the minimum supply voltage is

available. The current consumption is very low,

Input attenuator

The volume control operates as a digitally controlled input

attenuator between the audio input pin and the power

amplifier. In the maximum volume control setting the

attenuation is 0 dB and in the minimum volume control

setting the typical attenuation is 80 dB. The attenuation

can be set in 64 steps by the UP/DOWN pin. Both

attenuators for channels 1 and 2 are separated from each

other and are controlled by there own UP/DOWN pin.

Balance control can be arranged by applying UP/DOWN

pulses only on pins 6 and 7, see Fig.5.

approximately 1 µA (typ.). In battery fed applications the

volume setting can be maintained during battery exchange

if there is a supply capacitor available.

2002 Jan 04

6

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

Mode select pin

When no headphone is plugged in, the voltage level at the

HPS pin will remain LOW. A voltage less than V_DD− 1 V at

the HPS pin will keep the device in the BTL mode, thus the

loudspeakers can be operational. If the HPS pin is not

connected then the device will remain in the BTL mode.

The device is in the standby mode (with a very low current

consumption) if the voltage at the MODE pin is between

V_DDand V_DD− 0.5 V. At a mode select voltage level of less

than 0.5 V the amplifier is fully operational. In the range

between 1 V and V_DD− 1 V the amplifier is in the mute

condition. The mute condition is useful for using it as a ‘fast

mute’, in this mode the output signal is suppressed, while

the volume setting remains at its value. It is advised to

keep the device in the mute condition while the input

capacitor is being charged. This can be achieved by

holding the MODE pin at a level of 0.5V_DD, or by waiting

approximately 100 ms before giving the first volume-UP

pulses.

When a headphone is plugged into the connector, the

voltage at the HPS pin will be set to V_DD. The device then

switches to the Single-Ended (SE) mode, this means that

the slave power amplifiers at the outputs OUT1− and

OUT2− will be switched to the standby mode. This results

in floating outputs OUT1− and OUT2−, the loudspeaker

signal is thus attenuated by approximately 80 dB and only

the headphone can operate.

One of the benefits of this system is that the loudspeaker

current does not flow through the jack connector switch,

which could give some output power loss. The other

benefit is that the quiescent current is reduced when the

headphone jack is inserted.

Headphone sense pin (HPS)

A headphone can be connected to the amplifier by using a

coupling capacitor for each channel. The common ground

pin of the headphone is connected to the ground of the

amplifier, see Fig.4. By using the HPS pin as illustrated in

Fig.4, the TDA8552T detects if a headphone jack plug is

inserted into the connector.

2002 Jan 04

7

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL

V_DD

PARAMETER

CONDITIONS

operating

MIN.

−0.3

MAX.

+5.5

UNIT

supply voltage

input voltage

V

A

V_i

−0.3

−

V_DD+ 0.3

1

I_ORM

T_stg

T_amb

V_sc

repetitive peak output current

storage temperature

−55

−40

−

+150

+85

5.5

°C

V

operating ambient temperature

AC and DC short-circuit safe voltage

maximum power dissipation

P_tot

SO20

−

2.2

W

SSOP20

−

1.1

THERMAL CHARACTERISTICS

See Section “Thermal design considerations” in Chapter “Test and application information”.

SYMBOL

R_th(j-a)

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to ambient

for the TDA8552T (SO20)

in free air

60

55

K/W

extra copper

in free air

for the TDA8552TS (SSOP20)

110

80

extra copper

Table 1 Power rating; note 1

MUSIC POWER

SO20

P_{o (w)}

THD = 10%

V

_DD(V)

R_L(Ω)

OPERATION

T_amb(max)(°C)

P_max(W)

SSOP20

3.3

5.0

4

8

0.9

0.6

BTL

0.55

0.28

0.14

0.03

1.25

0.65

0.32

0.07

120

106

127

139

150

50

134

16

0.3

BTL

142

32SE

4

0.035

2.0

headphone

BTL

150

81

8

1.4

BTL

114

98

16

0.8

BTL

132

124

144

32SE

0.09

headphone

146

continuous sine wave

3.3

5

4

8

0.9

1.4

BTL

1.1

89

81

62

50

1.25

Note

1. The power rating is based on R_th(j-a)with recommended copper pattern of at least 4 × 1 cm²to the corner leads and

copper under the IC package.

2002 Jan 04

8

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

QUALITY SPECIFICATION

Quality specification in accordance with “SNW-FQ-611 part E”, if this type is used as an audio amplifier.

DC CHARACTERISTICS

V_DD= 5 V; T_amb= 25 °C; R_L= 8 Ω; V_MODE= 0 V; total gain setting at 7 dB; according to Fig.4.; unless otherwise

speciﬁed.

SYMBOL

V_DD

PARAMETER

supply voltage

CONDITIONS

MIN.

2.7

TYP.

MAX.

5.5

UNIT

5

V

I_DD

supply current

BTL mode; V_DD= 5 V;

−

14

20

mA

R_L= ∞; note 1

SE mode; V_DD= 5 V

−

8.5

10

12

15

mA

BTL mode; V_DD= 3.3 V;

R_L= ∞; note 1

SE mode; V_DD= 3.3 V

V_MODE= V_DD

−

5

8

mA

µA

V

I_stb

V_O

standby current

1

10

−

DC output voltage

note 2

2.5

−

V_OUT+− V_OUT−differential output offset

GAINSEL = 0 V

GAINSEL = V_DD

50

150

mV

voltage

−

Mode select pin

V_MODE

input voltage

standby

V_DD− 0.5 −

V_DD

V

mute

1

−

V

_DD− 1.4 V

operating

0 < V_MODE< V_DD

note 3

0

−

0.5

1

V

I_MODE

input current

−

µA

dB

α_mute

mute attenuation

80

tbf

−

Gain select pin

V_GAINSEL

input voltage

input current

low gain (20 dB)

high gain (30 dB)

0

−

0.6

V_DD

1

V

4.1

−

V

I_GAINSEL

µA

Headphone sense pin

V_HPSinput voltage

SE mode; headphone

detected

V

_DD− 1

−

V_DD

1

V

I_HPS

input current

−

µA

2002 Jan 04

9

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Volume control

t_W

pulse width

50

−

ns

t_rep

pulse repetition time

100

4.1

ns

V

V_th(up)

UP/DOWN pin UP threshold

level

V_DD

3.4

−

V_ﬂoat(max)

V_ﬂoat(min)

V_th(down)

UP/DOWN pin ﬂoating high

level

−

V

UP/DOWN pin ﬂoating low

level

1.0

0

UP/DOWN pin DOWN

threshold level

0.6

I_I(up/down)

t_wait

input current UP/DOWN pin 0 < V_UP/DOWN< V_DD

auto repeat wait time

−

200

−

µA

ms

500

130

t_rep

repeat time

key pressed

−

Volume attenuator

G_v(l)

low gain; maximum volume

(including power ampliﬁer)

19

tbf

29

tbf

20

21

tbf

31

tbf

dB

low gain; minimum volume

(including power ampliﬁer)

−60

30

G_v(h)

high gain; maximum volume

(including power ampliﬁer)

high gain; minimum volume

(including power ampliﬁer)

−50

N_step

∆G_v

number of gain steps

variation of gain per step

input impedance

−

64

1.25

20

−

dB

kΩ

V

Z_i

14

−

V_i(max)(rms)

maximum input voltage

(RMS value)

1.75

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

DC output offset voltage

to 2 ×

----------------------------------------------------------------

R_L

2. The DC output voltage with respect to ground is approximately 0.5V_DD

.

3. Output voltage in mute position is measured with an input of 1 V (RMS) in a bandwidth of 20 kHz, so including noise,

gain select pin is LOW (0 V).

2002 Jan 04

10

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

AC CHARACTERISTICS (V_DD= 3.3 V)

T_amb= 25 °C; R_L= 8 Ω; f = 1 kHz; total gain setting at 7 dB; V_MODE= 0 V; gain select pin is at 0 V

(maximum gain = 20 dB); according to Fig.4.

SYMBOL PARAMETER

output power

CONDITIONS

MIN.

TYP.

0.9

MAX.

UNIT

P_o

THD = 10%; R_L= 4 Ω

THD = 10%; R_L= 8 Ω

THD = 10%; R_L= 16 Ω

THD = 0.5%; R_L= 4 Ω

THD = 0.5%; R_L= 8 Ω

THD = 0.5%; R_L= 16 Ω

P_o= 0.1 W; note 1

note 2

−

W

%

−

0.6

0.3

0.6

0.4

0.2

0.1

60

−

THD

total harmonic distortion

noise output voltage

−

V_o(n)

−

µV

SVRR

supply voltage ripple

rejection

note 3

tbf

55

dB

V_i(max)

maximum input voltage

THD = 1%;

−

1.1

V

G_v= −50 to 0 dB

α_sup

α_cs

channel suppression

channel separation

V_HPS= V_DD; note 4

−

80

55

−

dB

Notes

1. Volume setting at maximum.

2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted),

R_source= 0 Ω, gain select pin is LOW (0 V).

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R_source= 0 Ω at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the

positive supply rail, gain select pin is LOW (0 V).

4. Channel suppression is measured at the output with a source impedance of R_source= 0 Ω at the input and a

frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 2 V (RMS).

2002 Jan 04

11

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

AC CHARACTERISTICS (V_DD= 5 V)

T_amb= 25 °C; R_L= 8 Ω; f = 1 kHz; total gain setting at 7 dB; V_MODE= 0 V; Gain select pin is at 0 V

(maximum gain = 20 dB); according to Fig.4; package is SO20.

SYMBOL

PARAMETER

output power

CONDITIONS

MIN.

1.0

TYP.

1.4

MAX.

UNIT

P_o

THD = 10%; R_L= 8 Ω

THD = 10%; R_L= 16 Ω

THD = 0.5%; R_L= 8 Ω

THD = 0.5%; R_L= 16 Ω

P_o= 0.1 W; note 1

P_o= 0.5 W; note 1

GAINSEL. = 0 V; note 2

GAINSEL. = V_DD; note 2

note 3

−

W

%

−

0.8

1.0

0.6

0.15

0.1

60

0.6

−

THD

V_o(n)

total harmonic distortion

noise output voltage

−

0.4

0.3

100

−

µV

dB

−

100

55

SVRR

V_i(max)

supply voltage ripple

rejection

50

−

a maximum input voltage THD = 1%;

G_v= −50 to 0 dB

V_HPS= V_DD; note 4

−

1.75

V

α_sup

α_cs

channel suppression

channel separation

70

50

80

−

dB

−

Notes

1. Volume setting at maximum.

2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted),

R_source= 0 Ω.

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R_source= 0 Ω at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the

positive supply rail, gain select pin is LOW (0 V).

4. Channel suppression is measured at the output with a source impedance of R_source= 0 Ω at the input and a

frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 1 V (RMS).

2002 Jan 04

12

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

AC CHARACTERISTICS (FOR HEADPHONE; R_L= 32 Ω; CONNECTED SE)

V_DD= 5 V; T_amb= 25 °C; f = 1 kHz; total gain setting at 20 dB; V_MODE= 0 V; gain select pin is 0 V

(maximum gain = 20 dB); according to Fig.4.

SYMBOL PARAMETER

output power

CONDITIONS

MIN.

TYP.

MAX.

UNIT

mW

P_o

THD = 10%; V_DD= 3.3 V

THD = 10%; V_DD= 5.0 V

−

35

90

25

60

−

mW

%

THD = 0.5%; V_DD= 3.3 V −

THD = 0.5%; V_DD= 5.0 V −

THD

total harmonic distortion

noise output voltage

P_o= 60 mW

note 1

−

0.04

60

V_o(n)

−

100

µV

SVRR

supply voltage ripple

rejection

note 2

50

55

−

dB

V_i(max)

maximum input voltage

THD = 1%;

G_v= −50 to 0 dB

−

1.75

V

α_cs

channel separation

50

−

dB

Notes

1. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted),

_source= 0 Ω, gain select pin is LOW (0 V).

R

2. Supply voltage ripple rejection is measured at the output, with a source impedance of R_source= 0 Ω at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the

positive supply rail, gain select pin is LOW (0 V).

handbook, full pagewidth

t

w

r

rep

V

DD

th(UP)

float(max)

increasing volume

floating

V

UP/DOWN

V

float(min)

V

th(DOWN)

0

decreasing volume

t

w

r

rep

MGM611

The rise time (t_r) of the pulse may have any value.

Fig.3 Timing UP/DOWN pin.

13

2002 Jan 04

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

TEST AND APPLICATION INFORMATION

V

= 5 V

DD

handbook, full pagewidth

100

nF

V

DD3, 4

DD1, 2

C3

C4

220 µF

3, 8

13, 18

C1

330 nF

17

IN1

VOLUME

CONTROL

20

C5

12

OUT1+

kΩ

V

IN1

MASTER

220 µF

R1

1 kΩ

0.5V

15 kΩ

DD

20 dB

30 dB

3.4 kΩ

1.6 kΩ

20 kΩ

UP/DOWN

COUNTER

8 Ω

V

DD

V

DD

up

down

R5

UP/DOWN1

6

volume

control

0.5V

DD

0.5V

19

OUT1−

INTERFACE

SLAVE

2.2 kΩ

15 kΩ

100

nF

headphone jack

tip

down

DD

C7

C3

16

SVR

0.5V

DD

220 µF

ring

sleeve

TDA8552T

15 kΩ

C2

15

IN2

VOLUME

CONTROL

330 nF

20

kΩ

C6

2

OUT2+

V

IN2

MASTER

220 µF

R4

1 kΩ

15 kΩ

0.5V

DD

20 dB

30 dB

3.4 kΩ

1.6 kΩ

20 kΩ

UP/DOWN

COUNTER

V

8 Ω

DD

V

DD

up

down

up

R6

7

UP/DOWN2

volume

control

0.5V

DD

0.5V

9

OUT2−

INTERFACE

15 kΩ

0.5V

SLAVE

2.2 kΩ

C8

100 nF

down

DD

15 kΩ

V

DD

standby

5

4

MODE

HPS

mute

GAIN

SELECTION

STANDBY/MUTE

AND OPERATING

operating

14

1, 10, 11, 20

V

DD

GAINSEL

GND1 to GND4

R2

820 kΩ

R3

100 kΩ

ground

MGM609

V

DD

Fig.4 Test and application diagram.

14

2002 Jan 04

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

Test conditions

BTL application

T_amb= 25°C if not specially mentioned; V_DD= 5 V;

f = 1 kHz, R_L= 8 Ω, G_v= 20 dB, audio band-pass

22 Hz to 22 kHz. The thermal resistance (in standard print,

without extra copper) = 110 K/W for the SSOP20; the

maximum sine wave power dissipation is:

The BTL application diagram is illustrated in Fig.4.

The quiescent current has been measured without any

load impedance. The total harmonic distortion as a

function of frequency was measured with a low-pass filter

of 80 kHz. The value of capacitor C3 influences the

behaviour of the SVRR at low frequencies, increasing the

value of C3 increases the performance of the SVRR.

150 – 25

= 1.14 W

----------------------

110

For T_amb= 60 °C the maximum total power dissipation is:

150 – 60

Headphone application

= 0.82 W

----------------------

110

T_amb= 25°C if not specially mentioned, V_DD= 5 V,

f = 1 kHz, R_L= 32 Ω, G_v= 14 dB, audio band-pass

22 Hz to 22 kHz.

Thermal design considerations

For headphone application diagram see: Fig.4

The ‘measured’ thermal resistance of the IC package is

highly dependent on the configuration and size of the

application board. All surface mount packages rely on the

traces of the PCB to conduct heat away from the package.

To improve the heat flow, a significant area on the PCB

must be attached to the (ground) pins. Data may not be

comparable between different semiconductor

If a headphone is plugged into the headphone jack, the

HPS pin will switch-off the outputs of the SLAVE output

stage, this results in a mute attenuation >80 dB for the

loudspeakers. In this condition the quiescent current will

be reduced.

manufacturers because the application boards and test

methods are not (yet) standardized. Also, the thermal

performance of packages for a specific application may be

different than presented here, because the configuration of

the application boards (copper area) may be different.

Philips Semiconductors uses FR-4 type application boards

with 1 oz copper traces with solder coating Solder Resist

Mask (SRM).

General remarks

Reduction of the value of capacitor C3 results in a

decrease of the SVRR performance at low frequencies.

The capacitor value of C5 and C6 in combination with the

load impedance of the headphone determines the low

frequency behaviour.

To prevent against high output currents during inserting

the headphone into the headphone jack, resistors of 5.1 Ω

have to be connected in series with the SE output lines.

The SSOP20 package has improved thermal conductivity

which reduces the thermal resistance. Using a practical

PCB layout (see Fig.18) with wider copper tracks to the

corner pins and just under the IC, the thermal resistance

from junction to ambient can be reduced to approximately

80 K/W. For T_amb= 60 °C the maximum total power

The UP/DOWN pin can be driven by a 3-state logic output

stage (microprocessor) without extra external

components. If the UP/DOWN pin is driven by

push-buttons, then it is advised to have an RC-filter

between the buttons and the UP/DOWN pin. Advised

values for the RC-filter are 2.2 kΩ and 100 nF. Resistor R4

is not necessary for basic operation, but is advised to

keep C6 charged to a voltage of 0.5V_DDThis has the

advantage that the plop noise when inserting the

headphone plug is minimal. If the headphone sense

function (HPS) is not used then the HPS-pin 4 should be

hard-wired to ground. This pin should never be left

unconnected.

150 – 60

dissipation for this PCB layout is:

= 1.12 W

----------------------

80

The thermal resistance for the SO20 is approximately

55 K/W if applied to a PCB with wider copper tracks to the

corner pins and just under the body of the IC.

The maximum total power dissipation for this practical

application is:

150 – 60

= 1.63 W

----------------------

55

Using double push buttons, the volume step for both

channels can be controlled. When for the balance control

only a single contact is used, the balance steps are

1.25 dB. If double contacts are used for the balance

buttons and the dashed connection is made, then the

balance steps are 2.5 dB.

2002 Jan 04

15

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

Application without volume control

If pins 6, 7 and 8 are hardwired together the device operates with the volume control setting at maximum.

When the supply voltage is connected and the device is switched from standby to mute or operating for the first time then

the gain is ramped up from −20 dB to +20 dB. This takes approximately 5 s.

This maximum gain setting is maintained until the supply voltage drops below the minimum value.

balance left

handbook, full pagewidth

V

DD

2.2 kΩ

up

UP/DOWN1

6

7

100 nF

TDA8552T

volume

UP/DOWN2

100 nF

down

MGM612

V

DD

balance right

Fig.5 Volume and balance control using buttons.

2002 Jan 04

16

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

MGR005

MGR006

20

40

handbook, halfpage

G

(dB)

I

DD

(mA)

20

0

15

10

5

(1)

−20

−40

(2)

0

2

−60

3

4

5

6

0

20

40

60

80

V

(V)

volume steps

DD

V_DD= 5 V; R_L= 8 Ω.

(1) G_v= 30 dB (max.).

(2) G_v= 20 dB (max.).

R_L= ∞.

Fig.6 I_DDas a function of V_DD

.

Fig.7 Gain as a function of volume steps.

MGR007

MGR008

10

handbook, halfpage

THD

(%)

THD

(%)

1

(1)

(2)

(1)

(2)

(3)

(4)

−1

10

−2

10

−2

−1

−2

−1

10

1

10

1

10

P

(W)

P

(W)

o

V_DD= 5 V; R_L= 8 Ω; f = 1 kHz; G_v= 30 dB (max.).

(1) G_v= 0 dB.

V_DD= 5 V; R_L= 8 Ω; f = 1 kHz; G_v= 20 dB (max.).

(1) G_v= 0 dB.

(2) G_v= 7 dB.

(3) G_v= 20 dB.

(2) G_v= 7 dB.

(4) G_v= 30 dB.

(3) G_v= 20 dB.

Fig.8 THD as a function of P_o.

Fig.9 THD as a function of P_o.

2002 Jan 04

17

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

MGR009

MGR010

10

handbook, halfpage

THD

(%)

THD

(%)

(1)

1

(2)

(3)

(2)

(3)

−1

10

−2

10

−2

−1

−2

−1

10

1

10

1

10

P

(W)

P

(W)

o

V_DD= 5 V; R_L= 8 Ω; G_v= 20 dB (max.).

(1) f = 10 kHz.

V_DD= 5 V; R_L= 8 Ω; G_v= 30 dB (max.).

(1) f = 10 kHz.

(2) f = 1 kHz.

(3) f = 100 Hz.

Fig.10 THD as a function of P_o.

Fig.11 THD as a function of P_o.

MGR011

MGR012

10

handbook, halfpage

THD

(%)

THD

(%)

1

(1)

(2)

(3)

(2)

(3)

−1

10

−2

10

2

3

4

5

2

3

4

5

10

f (Hz)

V_DD= 5 V; R_L= 8 Ω; P_o= 0.1 W; G_v= 20 dB (max.).

(1) G_v= 0 dB.

V_DD= 5 V; R_L= 8 Ω; P_o= 0.1 W; G_v= 30 dB (max.).

(1) G_v= 0 dB.

(2) G_v= 7 dB.

(3) G_v= 20 dB.

(3) G_v= 30 dB.

Fig.12 THD as a function of frequency.

Fig.13 THD as a function of frequency.

2002 Jan 04

18

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

MGR014

MGR013

2.4

0

handbook, halfpage

V

(1)

(2)

i

SVRR (1)

(dB)

(V)

2

(2)

−20

1.6

1.2

0.8

0.4

(3)

(4)

−40

(5)

(6)

−60

0

−50

−80

2

3

4

5

−30

−10

0

10

30

10

f (Hz)

G (dB)

V_DD= 5 V; R_L= 8 Ω; V_ref= 100 mV.

(1) C3 = 10 µF; G_v= 20 dB.

(2) C3 = 10 µF; G_v= 7 dB.

(3) C3 = 100 µF; G_v= 20 dB.

(4) C3 = 10 µF; G_v= 10 dB.

(5) C3 = 100 µF; G_v= 7 dB.

(6) C3 = 100 µF; G_v= 10 dB.

V_DD= 5 V; R_L= 8 Ω; f = 1 kHz; THD = 1%.

(1) G_v= 20 dB (max.).

(2) G_v= 30 dB (max.).

Fig.14 SVRR as a function of frequency.

Fig.15 Input voltage as a function of gain.

MGL436

MGL435

0

handbook, halfpage

α

sup

(dB)

cs

(dB)

−20

−40

−60

−80

−40

−60

(1)

(2)

(1)

(2)

−80

−100

2

3

4

5

2

3

4

5

10

f (Hz)

V_P= 5 V; V_o= 1 V; V_HPS= V_P.

(1) Channel 1.

V_P= 5 V; V_o= 1 V.

(1) G_v= 30 dB.

(2) G_v= 20 dB.

(2) Channel 2.

Fig.16 Channel suppression as a function of

frequency.

Fig.17 Channel separation as a function of

frequency.

2002 Jan 04

19

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

77

handbook, full pagewidth

79

top view

bottom view

GND

+Vdd

220 µF

1.5 kΩ

UP

100 nF

MODE

820

kΩ

IN1

100 kΩ

330 nF

20

1

1.5 kΩ

150 nF

DOWN

220 µF

TDA8552/53TS

IN2

20 dB

30 dB

220 µF

HP

5 Ω

1 kΩ

5 Ω

TDA

8552/53TS

Analog Audio

CIC – Nijmegen

1 kΩ

− OUT1 +

− OUT2 +

MGR015

Fig.18 Printed-circuit board layout.

20

2002 Jan 04

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

PACKAGE OUTLINES

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

D

E

A

X

c

y

H

E

v

M

A

Z

20

11

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

10

w

detail X

e

M

b

p

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

max.

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

θ

1

2

3

p

E

p

Z

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

10.65

10.00

1.1

0.4

1.1

1.0

0.9

0.4

mm

2.65

0.25

0.01

1.27

0.050

1.4

0.25 0.25

0.1

8^o

0^o

0.012 0.096

0.004 0.089

0.019 0.013 0.51

0.014 0.009 0.49

0.30

0.29

0.419

0.394

0.043 0.043

0.016 0.039

0.035

0.016

inches 0.10

0.055

0.01 0.01 0.004

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

97-05-22

99-12-27

SOT163-1

075E04

MS-013

2002 Jan 04

21

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

D

E

A

X

c

y

H

v

M

A

E

Z

11

20

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

10

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

10^o

0^o

0.15

0

1.4

1.2

0.32

0.20

0.13

6.6

6.4

4.5

4.3

6.6

6.2

0.75

0.45

0.65

0.45

0.48

0.18

mm

1.5

0.65

1.0

0.2

0.25

0.13

0.1

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-02-22

99-12-27

SOT266-1

MO-152

2002 Jan 04

22

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

SOLDERING

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certain surface mount ICs, but it is not suitable for fine pitch

SMDs. In these situations reflow soldering is

recommended.

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

Reﬂow soldering

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 220 °C for

thick/large packages, and below 235 °C for small/thin

packages.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

2002 Jan 04

23

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

WAVE

REFLOW⁽¹⁾

not suitable suitable

PACKAGE

BGA, HBGA, LFBGA, SQFP, TFBGA

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS

PLCC⁽³⁾, SO, SOJ

not suitable⁽²⁾

suitable

LQFP, QFP, TQFP

not recommended⁽³⁾⁽⁴⁾suitable

not recommended⁽⁵⁾

suitable

SSOP, TSSOP, VSO

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2002 Jan 04

24

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS⁽¹⁾

STATUS⁽²⁾

DEFINITIONS

Objective data

Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

Product data

Production

This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Changes will be

communicated according to the Customer Product/Process Change

Notiﬁcation (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DEFINITIONS

DISCLAIMERS

Short-form specification

The data in a short-form

Life support applications

These products are not

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

the use of any of these products, conveys no licence or title

under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

Application information

Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

2002 Jan 04

25

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

NOTES

2002 Jan 04

26

Philips Semiconductors

Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

NOTES

2002 Jan 04

27

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA74

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

753503/03/pp28

Date of release: 2002 Jan 04

Document order number: 9397 750 09236


型号：	TDA8552T/N1,512
厂家：	NXP
描述：	TDA8552T; TDA8552TS - 2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing SOP 20-Pin 光电二极管商用集成电路
文件：	总28页 (文件大小：185K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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