TDA8601T [NXP]
RGB/YUV and fast blanking switch; RGB / YUV和快速消隐开关
| 型号： | TDA8601T |
| 厂家： | 
NXP |
| 描述： | RGB/YUV and fast blanking switch |
| 文件： | 总20页 (文件大小：240K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8601
RGB/YUV and fast blanking switch
1996 Jun 27
Product specification
Supersedes data of July 1994
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
FEATURES
GENERAL DESCRIPTION
• YUV/RGB and fast blanking switch
• 3-state output
The device is intended for switching between two RGB or
YUV video sources. The outputs can be set to a
high-impedance state to enable parallel connection of
several devices.
• Selectable clamp:
– passive (with diodes) or
– active clamp
A HIGH level on SEL (pin 5) selects the video inputs of
Channel 2. The IOCNTR control pin (pin 16) defines the
3-state outputs and clamp inputs:
• Bandwidth greater than 22 MHz
• Fully ESD protected
• Latch-up free.
• HIGH = 3-state outputs (also for test; active clamp)
• LOW = passive clamp at the video inputs (diode)
• Sandcastle: the video signal is clamped with an active
clamp during the sync pulse.
APPLICATIONS
• Standard and high definition television sets
• Peri-television sets.
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
7.2
TYP.
8.0
MAX.
8.8
UNIT
V
Gv
B
voltage gain
bandwidth
−0.5
22
0
−
−
+0.5
−
dB
at 3 dB
fi = 5 MHz
MHz
dB
αct
crosstalk attenuation between two
video channels
−60
−
Tamb
operating ambient temperature
0
−
70
°C
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
NUMBER
NAME
VERSION
TDA8601
DIP16
SO16
plastic dual in-line package; 16 leads (300 mil); long body
plastic small outline package; 16 leads; body width 3.9 mm
SOT38-1
TDA8601T
SOT109-1
1996 Jun 27
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
BLOCK DIAGRAM
Fig.1 Block diagram.
1996 Jun 27
3
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
PINNING
SYMBOL
PIN
DESCRIPTION
supply voltage (8 V)
VP
1
2
VIDIa1
VIDIb1
VIDIc1
SEL
video input a (channel 1)
video input b (channel 1)
video input c (channel 1)
channel selection
3
4
5
VIDIa2
VIDIb2
VIDIc2
GND
6
video input a (channel 2)
video input b (channel 2)
video input c (channel 2)
ground
7
8
9
VIDOc
VIDOb
VIDOa
FBO
10
11
12
13
14
video output c
video output b
video output a
fast blanking output signal
FBI2
fast blanking input signal
(channel 2)
FBI1
15
16
fast blanking input signal
(channel 1)
IOCNTR
control of video input or video
output
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
−0.3
MAX.
+12
UNIT
VP
Vi
supply voltage
V
input voltage (pins 2 to 4 and 6 to 8) referenced to ground
junction temperature
0
8.8
V
Tj
−
150
+150
°C
°C
Tstg
IC storage temperature
−55
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
ESD in accordance with “MIL STD 883C” - “Method 3015”:
1. Human body model: 1500 Ω, 100 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground.
Class 2: 2000 to 3999 V.
2. Machine model: 0 Ω, 200 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground. The IC
withstands 200 V.
1996 Jun 27
4
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
DIP16
SO16
70
K/W
K/W
115
OPERATING CHARACTERISTICS
The operating characteristics are the conditions within the IC when it is functional; these conditions can have any value.
For example, condition VIL (pin 5) is fixed at 0.5 V. The IC will then operate over the full temperature range and supply
voltage range.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
7.2
8.0
8.8
V
Video inputs (pins 1 to 3 and 6 to 8)
Vi(p-p)
input video signal amplitude
(peak-to-peak value)
R, G, B signals
−
−
−
0.7
1
1
V
V
V
V
Y signal; active clamp
1.4
1.5
1.9
−
−(B − Y) signal; active clamp
1.05
1.33
47
−(R − Y) signal; active clamp −
Ci
input clamp capacitor
−
nF
Control inputs (pins 5 and 16)
VIH
VIL
VIH
VIL
Vsc
HIGH level input voltage (pin 5)
LOW level input voltage (pin 5)
IIH = 10 µA
IIL = −10 µA
0.9
−
VP
0.5
VP
0.8
1.1
3.1
5.5
−
V
−
−
V
HIGH level input voltage (pin 16) IIH = 10 µA
2.0
−
−
V
LOW level input voltage (pin 16)
IIL = −10 µA
zero level
−
V
sandcastle input voltage level
(pin 16)
−
−
V
blanking level
clamp level
SECAM mode
PAL mode
2.0
3.9
−
−
V
−
V
tW
clamp pulse width
3.6
2.5
µs
µs
−
−
Fast blanking inputs (pins 14 and 15)
VIH
VIL
HIGH level input voltage
LOW level input voltage
0.95
−
−
VP
V
V
−
0.5
Video outputs (pins 10 to 12)
CL
RL
output load capacitor
output load resistor
−
40
100
pF
note 1
1
−
−
kΩ
1996 Jun 27
5
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Fast blanking output (pin 13)
CL
RL
output load capacitor
output load resistor
−
40
100
pF
kΩ
note 1
1
−
−
Note
1. For the DIP16 package, the thermal resistance is lower. The minimum value for the output load resistor is 270 Ω.
CHARACTERISTICS
The typical values are given for VP = 8 V; Tamb = 25 °C. CL = 40 pF; no load resistor; measured in application circuit of
Fig.8 over full supply voltage and temperature range; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
IP
supply current
supply voltage rejection ratio
no resistive load on the
outputs
−
33
40
mA
SVRR
fi = 40 Hz to 50 kHz; note 1
fi = 40 Hz; note 1
−
−
−
−36
−36
dB
dB
−51
Video inputs (pins 1 to 3 and 4 to 6)
Ri
input resistance
for each type of clamp
10
−
−
kΩ
pF
V
Ci(max)
Vclamp
maximum input capacitance
input clamping voltage level
−
3
−
Ii = −50 mA; passive clamp
1.05
2.05
1.21
2.42
1.35
2.70
Ii = 50 mA; active clamp;
VIOCNTR = 3.9 V
V
Ii = −50 mA; active clamp;
2.05
2.37
2.70
V
VIOCNTR = 3.9 V
Isink
input sink current
Vi = 2 V; passive clamp
0.5
1.6
3
µA
µA
Iclamp
maximum absolute input clamping Vi = Vclamp + 0.5 V;
current active clamp
200
−
−
1996 Jun 27
6
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Video outputs (pins 10 to 12)
Ro
output resistance
output resistance
maximum output capacitance
voltage gain
−
−
−
3
0
−
−
50
Ω
RoZ
CoZ(max)
Gv
3-state output
0.1
−
−
MΩ
pF
3-state output
fi = 1 MHz
at ±0.5 dB
at ±1 dB
−
−0.5
5
+0.5
−
dB
B
bandwidth
MHz
MHz
MHz
dB
10
−
at ±3 dB
22
40
−
−
αct
crosstalk attenuation between two fi = 5 MHz; note 2
video channels
−60
−50
−40
−60
−50
−40
100
−
−
fi = 10 MHz; note 2
−
−
dB
fi = 22 MHz; note 2
−
−
dB
αoff
isolation of the 3-state
configuration
fi = 5 MHz; note 2
fi = 10 MHz; note 2
fi = 22 MHz; note 2
−
−
dB
−
−
dB
−
−
dB
SR
slew rate
120
−
−
V/µs
dB
∆Gm
gain matching between two
different signals of the same
channel
fi = 5 MHz
0.5
Vo(bl)
output blanking level voltage
output blanking offset voltage
2.1
2.23
2.7
5
V
Vos(bl)
Vi(ch1) = 0.7 V (p-p) (white);
Vi(ch2) = 0 V (p-p) (black);
active clamp; note 3
−
−
mV
V
i(ch1) = 0.7 V (p-p) (white);
−
−
−
−
−
−
15
5
mV
mV
mV
Vi(ch2) = 0 V (p-p) (black);
passive clamp; note 3
∆Vos(bl)
matching of output blanking offset Vi(ch1) = 0.7 V (p-p) (white);
voltage
Vi(ch2) = 0 V (p-p) (black);
active clamp; note 3
Vi(ch1) = 0.7 V (p-p) (white);
5
Vi(ch2) = 0 V (p-p) (black);
passive clamp; note 3
Fast blanking inputs (pins 14 and 15)
Zi input impedance
Fast blanking output (pin 13)
10
−
−
kΩ
VOH
VOL
Zo
HIGH level output voltage
2
0
−
2.35
0.15
−
3
V
V
Ω
LOW level output voltage
output impedance
0.3
50
SEL input (pin 5)
Zi
input impedance
10
−
−
kΩ
1996 Jun 27
7
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Timing
tdSEL;VID
delay time between SEL input and note 4
video output
−
−
12
20
ns
tdSEL;FBO delay time between SEL input and note 5
fast blanking output
15
40
ns
tSWVID
switching time of video output
note 4
note 5
−
−
8.5
8.5
15
15
ns
ns
tSWFBO
switching time of fast blanking
output
tdFB
fast blanking level delay between note 6
input and output
−
−
−
−
13
4
20
20
10
10
ns
ns
ns
ns
tdVID
∆tdVID
video delay between input and
output
note 7
note 7
note 7
delay difference between two
video signals at the output
0.5
5
∆tdFB;VID delay difference between fast
blanking level and video at the
output
Notes
1. The supply voltage rejection ratio is measured at the video outputs (pins 10 to 12) when a sine wave is applied on
the power supply pin (pin 1); where: VDC = 8 V; Vi = 100 mV (p-p). This additional sine wave on the power supply pin
is guaranteed not to cause extraneous oscillations on the video control and fast blanking signals.
2. The 6 video inputs will contain the same signal. The source impedance is 50 Ω.
3. The blanking offset is the level difference between the two channels when they are selected separately and, also, on
one video output. This value is measured on each video signal.
4. The delay between the SEL input and the video output together with the switching time of the video output is
illustrated in Fig.3. The amplitude of the video signal is 1.9 V (p-p) when the clamp is active and 1.0 V (p-p) when the
clamp is passive.
5. The delay between the SEL input and fast blanking output together with the switching time of fast blanking output is
illustrated in Fig.4.
6. The fast blanking delay between input and output is illustrated in Fig.5.
7. The video delay between input and output and delay differences are illustrated in Fig.6. Inputs 1 and 2 are either fast
blanking input plus a video signal or two video signals. The amplitude of the video signal is 0.5 V (p-p). The video
signal levels (i1, i2, o1 and o2) are 50% of the video amplitude. The fast blanking signal levels (i1 and o1) are 0.95 V
when the signal rises and 0.5 V when the signal falls.
1996 Jun 27
8
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
Fig.3 Timing definition: SEL and VIDO.
Fig.4 Timing definition: SEL and FBO.
9
1996 Jun 27
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
Fig.5 Timing definition: fast blanking delay.
Fig.6 Timing definition: video delay.
10
1996 Jun 27
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
INTERNAL PIN CONFIGURATION
Fig.7 Internal pin configuration.
1996 Jun 27
11
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
APPLICATION INFORMATION
Fig.8 Application diagram.
1996 Jun 27
12
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
Fig.9 Schematic diagram of two TDA8601s operating four channels.
1996 Jun 27
13
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
1996 Jun 27
14
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-23
97-05-22
SOT109-1
076E07S
MS-012AC
1996 Jun 27
15
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Jun 27
16
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 27
17
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
NOTES
1996 Jun 27
18
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
NOTES
1996 Jun 27
19
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2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 615 800, Fax. +358 615 80920
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 52 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 648 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com/ps/
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA50
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/25/02/pp20
Date of release: 1996 Jun 27
Document order number: 9397 750 00932
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