TDA8707 [NXP]
Triple RGB 6-bit video analog-to-digital interface; 三重RGB 6位视频模拟 - 数字接口
| 型号： | TDA8707 |
| 厂家： | 
NXP |
| 描述： | Triple RGB 6-bit video analog-to-digital interface |
| 文件： | 总16页 (文件大小：97K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8707
Triple RGB 6-bit video
analog-to-digital interface
1996 Feb 01
Product specification
Supersedes dat of March 1995
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
It converts the analog inputs into 6-bit binary coded digital
words at a sampling rate of 35 MHz. All analog signal
inputs are clamped.
FEATURES
• Triple analog-to-digital converter (ADC)
• 6-bit resolution
Analog-to-digital converter
• Sampling rate up to 35 MHz
• Power dissipation of 335 mW (typical)
• Internal clamping function
The TDA8707 implements 3 independent 6-bit
analog-to-digital converters in CMOS process. These
converters use a full-flash approach.
• TTL compatible digital inputs
• −40 to +85 °C operating temperature
• CMOS digital outputs.
Clamping feature
An internal clamping circuit is provided in each of the
3 analog channels. The analog pins INR, ING and INB are
switched, through series capacitors, to on-chip clamping
levels during an active pulse on the clamp input CLP.
Clamping level in the R, G and B channels is Code 0.
APPLICATIONS
• High-speed analog-to-digital conversion for video
signals
• VGA signal treatment.
Input buffers
Internal buffers are provided to drive the analog-to-digital
converter inputs. Their ratio can be adjusted externally at
1.5 or 2.0 with select input SLT.
DESCRIPTION
The TDA8707 is a CMOS triple 6-bit video low-power
analog-to-digital converter (ADC) for RGB signals.
QUICK REFERENCE DATA
SYMBOL
VDDA
PARAMETER
analog supply voltage
CONDITIONS
MIN.
4.5
TYP. MAX. UNIT
5.0
5.0
60
5
5.5
5.5
80
8
V
VDDD
IDDA
IDDD
INL
digital supply voltage
analog supply current
digital supply current
integral non-linearity
4.5
−
V
mA
mA
LSB
fclk = 35 MHz
−
fclk = 35 MHz; ramp input;
−
±0.35 ±0.6
Tamb = 25 °C
DNL
differential non-linearity
fclk = 35 MHz; ramp input;
−
±0.35 ±0.6
LSB
Tamb = 25 °C
EB
fclk
effective bits
note 1
−
5.3
−
−
bits
maximum clock conversion rate
total power dissipation
35
−
−
MHz
mW
Ptot
fclk = 35 MHz; note 2
335
485
Notes
1. The number of effective bits is measured with a clock frequency of 35 MHz. This value is given for a 4.43 MHz
frequency on the R, G and B channels.
2. The external resistor (value 15 kΩ) between VDDA and CLREF, fixing internal static currents, influences Ptot.
ORDERING INFORMATION
PACKAGE
DESCRIPTION
TYPE
NUMBER
NAME
VERSION
TDA8707H QFP44 plastic quad flat package; 44 leads; lead length 1.3 mm; body 10 × 10 × 1.75 mm SOT307-2
1996 Feb 01
2
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
BLOCK DIAGRAM
CLREF
24
CLP
CLK
23
10
33
35
V
V
DDA1
SSA1
38,
40-44
6-BIT
ADC
CLAMPING
CIRCUIT
34
BUFFER
BUFFER
BUFFER
R0 to R5
INR
6
30
32
V
V
DDA2
SSA2
6-BIT
ADC
3-8
6
CLAMPING
CIRCUIT
31
ING
G0 to G5
27
29
V
V
DDA3
SSA3
TDA8707
14-16,
18-20
6-BIT
ADC
CLAMPING
CIRCUIT
28
INB
B0 to B5
6
22
26
25
V
V
CREFH
CREFL
DDD2
SSD2
21
36
11
9
MGA919
V
V
SLT
DDD1
SSD1
Fig.1 Block diagram.
1996 Feb 01
3
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
PINNING
SYMBOL PIN
DESCRIPTION
SYMBOL PIN
DESCRIPTION
not connected
CLP
CLREF
CREFL
CREFH
VDDA3
INB
23 clamping input
n.c.
n.c.
G0
1
2
3
4
5
6
7
8
9
24 ADCs current reference level input
25 converter reference LOW level input
26 converter reference HIGH level input
27 analog supply voltage 3
28 BLUE analog input
not connected
GREEN data output; bit 0 (LSB)
GREEN data output; bit 1
GREEN data output; bit 2
GREEN data output; bit 3
GREEN data output; bit 4
GREEN data output; bit 5 (MSB)
digital supply ground 1
G1
G2
G3
VSSA3
VDDA2
ING
29 analog supply ground 3
30 analog supply voltage 2
31 GREEN analog input
G4
G5
VSSD1
CLK
VDDD1
n.c.
n.c.
B0
VSSA2
VDDA1
INR
32 analog supply ground 2
33 analog supply voltage 1
34 RED analog input
10 clock input
11 digital supply voltage 1
12 not connected
VSSA1
SLT
35 analog supply ground 1
36 select input buffer ratio
37 not connected
13 not connected
14 BLUE data output; bit 0 (LSB)
15 BLUE data output; bit 1
16 BLUE data output; bit 2
17 not connected
n.c.
B1
R0
38 RED data output; bit 0 (LSB)
39 not connected
B2
n.c.
n.c.
B3
R1
40 RED data output; bit 1
41 RED data output; bit 2
42 RED data output; bit 3
43 RED data output; bit 4
44 RED data output; bit 5 (MSB)
18 BLUE data output; bit 3
19 BLUE data output; bit 4
20 BLUE data output; bit 5 (MSB)
21 digital supply ground 2
22 digital supply voltage 2
R2
B4
R3
B5
R4
VSSD2
VDDD2
R5
1996 Feb 01
4
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
index
corner
1
2
3
4
5
6
7
8
9
V
V
n.c.
n.c.
G0
G1
G2
33
32
DDA1
SSA2
31 ING
V
V
30
29
28
27
26
25
DDA2
SSA3
TDA8707
INB
G3
G4
V
DDA3
G5
CREFH
CREFL
V
V
SSD1
24 CLREF
23 CLP
CLK 10
11
DDD1
MGA920
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDDA
PARAMETER
CONDITIONS
MIN.
−0.3
MAX.
+6.5
UNIT
analog supply voltage (pins 27, 30 and 33)
digital supply voltage (pins 11 and 22)
supply voltage difference between VDDA and VDDD
input voltage (pins 28, 31 and 34)
V
VDDD
∆VDD
VI
−0.3
−0.5
−
+6.5
+0.5
VDDA
VDDD
V
V
V
V
referenced to VSSA
referenced to VSSD
Vi(p-p)
AC input voltage for switching
−
(pins 10 and 23; peak-to-peak value)
Tstg
Tamb
Tj
storage temperature
−55
−40
−
+150
+85
°C
°C
°C
operating ambient temperature
junction temperature
+125
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
75
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
K/W
1996 Feb 01
5
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
CHARACTERISTICS (see Tables 1 and 2)
V
T
DDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD short-circuited together; VDDA − VDDD = −0.5 to +0.5 V;
amb = −40 to +85 °C; SLT = 0 V; CREFH = 2 V, CREFL = 0.5 V, CL = 15 pF; typical values measured at
VDDA = VDDD = 5 V; VSSA = VSSD = 0 V and Tamb = 25 °C; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
VDDA
VDDD
IDDA
analog supply voltage
note 1
note 1
note 1
4.5
5.0
5.5
5.5
80
8
V
digital supply voltage
analog supply current
digital supply current
4.5
−
5.0
60
5
V
mA
mA
IDDD
fclk = 35 MHz
−
Inputs
DIGITAL INPUTS (CLK: PIN 10 AND CLP: PIN 23)
VIL
VIH
ILI
LOW level input voltage
HIGH level input voltage
input leakage current
input capacitance
0
−
−
−
7
0.8
VDDD
+10
−
V
2.0
−10
−
V
µA
pF
CI
CLAMP AND REFERENCES (CLREF: PIN 24, CREFL: PIN 25 AND CREFH: PIN 26)
ACL
clamping accuracy
−
±0.5
−
−
LSB
µA
ICL
input clamping current
−200
10
+400
CCL
external series clamping capacitor
22
15
−
−
nF
RCLREF
external resistor on CLREF pin for
current reference of converter
note 2
12
kΩ
VREFH
VREFL
∆REF
ZCREF
converter reference voltage HIGH level referenced to VSSA
applied to CREFH pin
1.5
0.25
−
2.0
0.5
1.5
300
2.5
0.75
−
V
V
V
Ω
converter reference voltage LOW level referenced to VSSA
applied to CREFL pin
reference voltage difference between
REFH and VREFL
note 3
V
internal ladder impedance between
pins CREFH and CREFL
−
−
ANALOG INPUTS (INR: PIN 34, ING: PIN 31 AND INB: PIN 28)
VI(p-p)
full-range input voltage (peak-to-peak
value)
SLT = logic 0;
gain = 1.5; note 4
−
−
1.0
−
−
V
V
SLT = logic 1;
0.75
gain = 2.0; note 4
II
input current
clamp off
−
−
5
7
100
15
nA
pF
CI
input capacitance
1996 Feb 01
6
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
INPUT ISOLATION
αct
crosstalk between INR, ING and INB
−
−
−40
dB
Outputs (R0 to R5: pins 38 and 40 to 44; G0 to G5: pins 3 to 8; B0 to B5: pins 14 to 16 and 18 to 20)
VOL
VOH
LOW level output voltage
HIGH level output voltage
0
−
−
0.5
V
V
4.0
VDDD
Switching characteristics
CLOCK INPUT CLK (see Fig.3)
fclk(max)
tCPH
maximum clock frequency
35
10
12
−
−
−
−
−
−
MHz
ns
clock pulse width HIGH
clock pulse width LOW
tCPL
ns
Analog signal processing (50% clock duty cycle) fclk = 35 MHz
LINEARITY
INL
integral non-linearity
ramp input; Tamb = 25 °C
ramp input; Tamb = 25 °C
−
−
±0.35
±0.35
±0.6
±0.6
LSB
LSB
DNL
differential non-linearity
BANDWIDTH (see Fig.5 and note 7)
B
−3 dB analog bandwidth
−
−
−
9
−
MHz
ns
tSTLH
tSTHL
analog input settling time LOW-to-HIGH full scale square wave
analog input settling time HIGH-to-LOW full scale square wave
13
11
16
14
ns
HARMONICS; note 6
f1
fundamental harmonic
harmonics, all components
−
−
−
0
dB
dB
fall
−37
−
EFFECTIVE BITS
EB
effective bits
fi = 4.43 MHz
−
−
−
5.3
3
−
−
−
bits
%
DIFFERENTIAL GAIN; note 5
Gdiff
differential gain
PAL modulated ramp
PAL modulated ramp
DIFFERENTIAL PHASE; note 5
ϕdiff
Timing (see Figs 3 and 4)
tdS sampling delay time
th
differential phase
2
deg
−
6
−
3
3
3
3
−
−
5
5
4
−
ns
ns
ns
ns
ns
µs
output hold time
output delay time
clock rise time
−
td
note 8
16
−
tr
tf
clock fall time
−
tCLP
active clamping duration
−
1996 Feb 01
7
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
Notes to the characteristics
1. VDDA and VDDD should be supplied from the same power supply and decoupled separately.
2. The analog supply current is directly proportional to the series resistance between VDDA and CLREF.
3. CREFH and CREFL are connected respectively to the top and bottom reference ladders of the 3 analog-to-digital
converters.
4. VI(p-p) = (VREFL − VREFH)/buffer gain factor. See Table for gain factor selection. When clamping at code 0 is used,
(VREFH – VREFL
)
active video signal amplitude VACT should be:VACT
=
----------------------------------------------
buffer gain factor
5. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a
digital-to-analog converter.
6. VI(p-p) = ∆REF with fi = 4.43 MHz.
7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square-wave signal) in order to sample the signal and obtain correct output data.
8. Output data acquisition: output data is available after the maximum delay time of td.
Table 1 Typical output coding (VREFH = 2 V; VREFL = 0.5 V referenced to VSSA, SLT = logic 0; buffer ratio = 1.5;
Tamb = 25°C)
BINARY OUTPUT BITS
STEP
VI(p-p)
D5
D4
D3
D2
D1
D0
V REFL
−
0
0
0
0
0
0
<0.333 =
----------------
1.5
0
1
0.349
0
0
.
0
0
0
0
.
0
0
.
0
0
.
0
1
.
0.364
.
.
62
63
1.317
1.333
1
1
1
1
1
1
1
1
1
1
0
1
V REFH
−
1
1
1
1
1
1
>1.333 =
----------------
1.5
Table 2 Mode selection
SLT
BUFFER RATIO
TYPICAL VI(p-p) FULL SCALE
V
REFH – VREFL
0
1
1.5
---------------------------------------
1.5
V REFH – VREFL
---------------------------------------
2.0
2.0
1996 Feb 01
8
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
TIMING DIAGRAMS
t
CPL
t
CPH
1.4 V
CLK
sample N
sample N + 1
sample N + 2
IN R, G, B
t
t
dS
h
2.4 V
1.4 V
0.4 V
DATA
D0 to D5
DATA
N - 2
DATA
N - 1
DATA
N
DATA
N + 1
t
d
MLB759
Fig.3 Input timing.
digital
output
level
63
black-level
clamping
0
time
MGA922
CLP
t
CLP
Fig.4 Clamp timing.
9
1996 Feb 01
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
t
t
STLH
STHL
50 %
code 64
V
I
50 %
code 0
2 ns
2 ns
CLK
50 %
50 %
MLD208
0.5 ns
0.5 ns
Fig.5 Analog input settling-time diagram.
1996 Feb 01
10
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
INTERNAL CIRCUITRY
V
DDA
V
DDD
V
SSD
V
V
SSA SSA
(a)
(b)
V
DDD
V
V
SSA
V
SSA
SSD
MGA925
(c)
(d)
(a) Digital inputs; pins 10, 23 and 36.
(b) Analog inputs; pins 28, 31 and 34.
(c) Current reference; pin 24.
(d) Digital outputs; pins 3 to 8, 14 to 16, 18 to 20 and 40 to 44.
Fig.6 Internal circuitry.
1996 Feb 01
11
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
APPLICATION INFORMATION
RED
R5
44
R4
43
R3
42
R2
41
R1
40
n.c.
39
R0
38
n.c.
37
SLT
36
22 nF
V
100 nF
INR
SSA1
34
35
V
V
DDA1
n.c.
n.c.
G0
G1
G2
G3
G4
G5
1
2
33
32
31
30
29
28
27
26
25
24
23
SSA2
22 nF
ING
3
GREEN
100 nF
V
DDA2
4
V
SSA3
22 nF
5
INB
6
BLUE
100 nF
TDA8707
V
DDA3
7
CREFH
8
2 V
2.2 nF
0.5 V
V
SSD1
CREFL
CLREF
9
15 k Ω
CLK
V
100
nF
10
11
DDD1
5 V
CLP
12
13
14
B0
15
B1
16
B2
17
18
19
B4
20
B5
21
22
V
V
SSD2 DDD2
n.c.
n.c.
n.c.
B3
100
nF
MGA926
5 V
Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally; also applicable to grounds.
The internal reference currents are set by the series resistor between pin VDDA and CLREF.
The resistor value should be in the range of 12 kΩ and 15 kΩ.
It is recommended, if possible, to connect pins 1, 2, 12, 13, 17, 37 and 39 to VSSD
.
Fig.7 Application diagram.
12
1996 Feb 01
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
PACKAGE OUTLINE
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
y
X
A
33
23
34
22
Z
E
e
Q
H
E
E
A
2
A
(A )
3
A
1
w M
θ
b
p
L
p
pin 1 index
L
12
44
detail X
1
11
w M
Z
v
M
A
D
b
p
e
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
10o
0o
0.25 1.85
0.05 1.65
0.40 0.25 10.1 10.1
0.20 0.14 9.9 9.9
12.9 12.9
12.3 12.3
0.95 0.85
0.55 0.75
1.2
0.8
1.2
0.8
mm
2.10
0.25
0.8
1.3
0.15 0.15 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT307-2
1996 Feb 01
13
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
SOLDERING
Introduction
Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Reflow soldering
Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
Reflow soldering techniques are suitable for all QFP
packages.
QFP100 (SOT382-1) or QFP160 (SOT322-1).
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1996 Feb 01
14
Philips Semiconductors
Product specification
Triple RGB 6-bit video analog-to-digital
interface
TDA8707
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Feb 01
15
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd.,
Tel. (31)40-2783749, Fax. (31)40-2788399
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil,
P.O. Box 7383 (01064-970),
195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430, Johannesburg 2000,
Tel. (011)470-5911, Fax. (011)470-5494
Tel. (011)821-2333, Fax. (011)829-1849
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:
Tel. (800) 234-7381, Fax. (708) 296-8556
Chile: Av. Santa Maria 0760, SANTIAGO,
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (02)773 816, Fax. (02)777 6730
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. (852)2319 7888, Fax. (852)2319 7700
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609,
Fax. (571)217 4549
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 27 70, Fax. (0212)282 67 07
Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,
Denmark: Prags Boulevard 80, PB 1919, DK-2300
COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. (358)0-615 800, Fax. (358)0-61580 920
France: 4 Rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex,
Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: P.O. Box 10 51 40, 20035 HAMBURG,
252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (040)23 53 60, Fax. (040)23 53 63 00
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
India: Philips INDIA Ltd, Shivsagar Estate, A Block,
Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950,
Tel. (02)70-4044, Fax. (02)92 0601
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)7640 000, Fax. (01)7640 200
Italy: PHILIPS SEMICONDUCTORS S.r.l.,
Piazza IV Novembre 3, 20124 MILANO,
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5130, Fax. (03)3740 5077
Korea: Philips House, 260-199 Itaewon-dong,
Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-2724825
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415
SCDS47
© Philips Electronics N.V. 1996
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. (040)2783749, Fax. (040)2788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Printed in The Netherlands
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546
537021/1100/03/pp16
Date of release: 1996 Feb 01
9397 750 00605
Document order number:
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