TDA8735 [NXP]

PLL frequency synthesizer; PLL频率合成器
TDA8735
型号: TDA8735
厂家: NXP    NXP
描述:

PLL frequency synthesizer
PLL频率合成器

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INTEGRATED CIRCUITS  
DATA SHEET  
TDA8735  
PLL frequency synthesizer  
1998 Oct 23  
Product specification  
Supersedes data of September 1994  
File under Integrated Circuits, IC01  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
FEATURES  
Complete 30 MHz single-chip tuning system  
Loop amplifier included  
2-level current amplifier (charge pump) for adjusting the  
loop gain  
A powerful digital memory phase detector  
GENERAL DESCRIPTION  
Programmable reference frequencies of 1 kHz, 10 kHz  
or 25 kHz  
I2C-bus interface  
The TDA8735 is a single-chip PLL synthesizer designed  
for satellite receivers. The device can be set to two  
different addresses which can be used in applications  
where independently tuned VCOs are required.  
Programmable address select input  
Software controlled switch output.  
To adapt to different frequency accuracy, 3 reference  
frequencies are selectable via the I2C-bus. The charge  
pump current can be set to 2 values with a ratio of 1 : 100  
via the I2C-bus.  
APPLICATIONS  
Satellite sound receiver  
A programmable switch (open-collector) is integrated to  
enable mode or normal switching, or other types of  
application.  
Radio receiver: LW, MW and SW.  
QUICK REFERENCE DATA  
SYMBOL  
VCC1  
VCC2  
ICC1  
PARAMETER  
supply voltage (pin 3)  
CONDITIONS  
MIN.  
4.5  
TYP.  
5.0  
MAX.  
5.5  
UNIT  
V
supply voltage (pin 16)  
supply current (pin 3)  
VCC1  
12  
0.2  
30  
8.5  
20  
0.5  
12  
28  
1
V
outputs unloaded  
outputs unloaded  
mA  
mA  
MHz  
kHz  
mV  
W
ICC2  
supply current (pin 16)  
maximum input frequency  
minimum input frequency  
input voltage (RMS value)  
total power dissipation  
fi(max)  
fi(min)  
Vi(rms)  
Ptot  
512  
500  
30  
0.14  
Tamb  
operating ambient temperature  
30  
+85  
°C  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TDA8735  
DIP16  
SO16  
plastic dual in-line package; 16 leads (300 mil); long body  
plastic small outline package; 16 leads; body width 7.5 mm  
SOT38-1  
TDA8735T  
SOT162-1  
1998 Oct 23  
2
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,kfullapgwedhit  
reference  
oscillator  
input  
2
1
VCO  
input  
7
6
13-BIT  
PROGRAMMABLE  
DIVIDER  
DIGITAL  
PHASE  
DETECTOR  
PRESCALER  
3 : 4  
REFERENCE  
OSCILLATOR  
3 1  
MULTIPLEXER  
REFERENCE  
COUNTER  
reference  
oscillator  
output  
prescaler  
decoupling  
unit  
16  
15  
V
CC2  
4-BIT  
SWALLOW  
COUNTER  
SWITCH  
external loop  
filter output  
3
4
V
CC1  
POWER  
SUPPLY  
PROGRAMMABLE  
CURRENT  
FREQUENCY  
LATCHES  
tuning voltage  
amplifier input  
14  
V
EE  
AMPLIFIER  
serial data  
input (SDA)  
10  
11  
2
I C-BUS  
serial clock  
input (SCL)  
CONTROL  
address  
select  
input  
8
band switch  
output  
TDA8735  
12  
SWITCH  
MGH651  
Fig.1 Block diagram.  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
PINNING  
SYMBOL PIN  
DESCRIPTION  
XTAL1  
XTAL2  
VCC1  
VEE  
1
2
3
4
5
6
7
8
9
reference oscillator output  
reference oscillator input  
supply voltage 1  
handbook, halfpage  
XTAL1  
XTAL2  
1
2
3
4
5
6
7
8
16  
V
CC2  
ground  
15  
14  
13  
12  
11  
10  
9
LOOP  
LOOP  
n.c.  
O
I
n.c.  
not connected  
V
CC1  
DEC  
VCOFI  
BS  
prescaler decoupling  
VCO input frequency  
band switch output  
not connected  
V
EE  
TDA8735  
n.c.  
DEC  
AS  
SCL  
SDA  
n.c.  
n.c.  
VCOFI  
BS  
SDA  
SCL  
10 serial data input (I2C-bus)  
11 serial clock input (I2C-bus)  
12 address select input (I2C-bus)  
13 not connected  
MGH650  
AS  
n.c.  
LOOPI  
LOOPO  
VCC2  
14 tuning voltage amplifier input  
15 external loop filter output  
16 supply voltage 2  
Fig.2 Pin configuration.  
FUNCTIONAL DESCRIPTION  
Controls  
The TDA8735 contains the following parts and facilities:  
The TDA8735 is controlled via the 2-wire I2C-bus. As slave  
receiver for programming there is one module address, a  
logic 0 (R/W bit), a subaddress byte and four data bytes.  
The subaddress determines which one of the four data  
bytes is transmitted first. The module address contains a  
programmable address bit (D1) which with address select  
input AS (pin 12) makes it possible to operate two  
TDA8735 in one system.  
Input amplifier VCO signal  
A prescaler with the divisors 3 : 4 and a 2-bit  
programmable swallow counter  
A 13-bit programmable counter  
A digital memory phase detector  
A reference frequency channel comprised of a 4 MHz  
crystal oscillator followed by a reference counter; the  
reference frequency can be 1, 10 or 25 kHz and is  
applied to the digital memory phase detector  
The auto increment facility of the I2C-bus allows  
programming of the TDA8735 within one transmission  
(address + subaddress + 4 data bytes).  
An I2C-bus interface with data latches and control logic;  
the I2C-bus is intended for communication between  
microcontrollers and different ICs or modules. Detailed  
information on the I2C-bus specification is available on  
request.  
The TDA8735 can also be partially programmed.  
Transmission must then be ended by a stop condition.  
The bit organization of the 4 data bytes is illustrated in  
Fig.3 and is described below.  
The divider number is defined by 15-bit words, bits  
S0 to S14. To calculate the lock frequency, the divider  
number has to be multiplied by the selected reference  
frequency.  
A software-controlled switch output  
A programmable current amplifier (charge pump) which  
consists of a 5 and a 500 µA current source, this allows  
adjustment of loop gain, thus providing high-current  
high-speed tuning and low current-stable tuning.  
The output at the loop amplifier can deliver a tuning  
voltage of up to 10.5 V (VCC2 1.5 V).  
1998 Oct 23  
4
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
Table 1 Divider number setting; note 1  
ON  
DIVIDER NUMBER SETTING  
(S0 + S1) × 21 to + S13 × 213 + S14 × 214  
INPUT  
0
ON  
Note  
1. Where the minimum divider ratio is: 26 = 64 to 215 1 = 32761.  
Table 2 Bit CP (used to control the charge pump;  
Table 4 Bit OPAMP (used to control the switch in the  
tuning voltage amplifier output circuitry;  
DB2 : D4)  
DB0 : D0)  
CP  
CURRENT  
OPAMP  
SWITCH  
0
1
LOW  
HIGH  
1
0
on  
off  
Table 3 Bits REF1 and REF2 (used to set the reference  
frequency applied to the phase detector;  
DB2 : D7 and D6)  
Table 5 Bit BS (used to control the open-collector switch  
output; DB2 : D2)  
REF1  
REF2  
FREQUENCY (kHz)  
BS  
SWITCH OUTPUT  
0
0
1
1
0
1
0
1
1
10  
25  
0
1
0
sink current  
floating  
The data byte DB3 must be set to 0 to 0. It is also used for  
test purposes (see Fig.3).  
1998 Oct 23  
5
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
programmable address bit (D1)  
STOP condition  
START  
condition  
acknowledge  
R/W  
MSB  
LSB MSB  
LSB MSB  
LSB MSB  
LSB  
MODULE  
SUBADDRESS  
BYTE  
DATA BYTE 0  
DATA BYTE 1  
DATA BYTE 2  
A
DATA BYTE 3  
A
P
S
ADDRESS  
BYTE  
A
A
A
A
A7  
A0  
D7  
D0 D7  
D0 D7  
D0 D7  
D0  
MSB  
LSB  
1
0
1
0
0
0
0
0
0
0
1
1/0  
0
MODULE ADDRESS  
SUBADDRESS  
A7  
A0  
0
0/1  
S0  
S8  
NU  
0/1  
MSB  
S6  
LSB  
CP  
S5  
S13  
S4  
S12  
0
S3  
S11  
1
S2  
S10  
S1  
S9  
BS  
DATA BYTE 0 (DB0)  
DATA BYTE 1 (DB1)  
DATA BYTE 2 (DB2)  
DATA BYTE 3 (DB3)  
D7  
D0  
LSB  
MSB  
S14  
S7  
D7  
D0  
MSB  
LSB  
NOT  
USED  
REF 1  
REF 2  
NU  
D7  
D0  
MSB  
LSB  
NOT  
USED  
NOT  
USED  
NOT  
USED  
NOT  
USED  
NOT  
USED  
T1  
T2  
T3  
D7  
examples using auto-increment facility  
D0  
ADDRESS  
ADDRESS  
ADDRESS  
A
A
A
SUBADDRESS 02  
SUBADDRESS 00  
SUBADDRESS 03  
A
DB2  
DB0  
DB3  
A
A
A
DB3  
DB1  
DB0  
A
A
A
S
S
S
P
A
A
P
DB1  
A
DB2  
A
P
MGL509  
Fig.3 Bit organization.  
6
1998 Oct 23  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
MIN.  
MAX.  
UNIT  
VCC1  
VCC2  
Ptot  
supply voltage (pin 3)  
supply voltage (pin 16)  
total power dissipation  
0.3  
+5.5  
12.5  
0.85  
+85  
V
VCC1  
V
W
°C  
°C  
Tamb  
Tstg  
operating ambient temperature  
storage temperature  
30  
65  
+150  
HANDLING  
Every pin withstands the ESD test in accordance with “MIL-STD-883C category B” (2000 V).  
CHARACTERISTICS  
VCC1 = 5 V; VCC2 = 8.5 V; Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Supplies  
VCC1  
supply voltage (pin 3)  
4.5  
5.0  
5.5  
12  
28  
V
VCC2  
supply voltage (pin 16)  
supply current (pin 3)  
supply current (pin 16)  
VCC1  
12  
8.5  
20  
0.5  
1
V
ICC1  
no outputs loaded  
no outputs loaded  
TDA8735T only  
mA  
mA  
mA  
ICC2  
0.2  
0.7  
1
1.5  
I2C-bus inputs (SDA and SCL)  
VIH  
VIL  
IIH  
HIGH-level input voltage  
LOW-level input voltage  
HIGH-level input current  
LOW-level input current  
3.0  
0.3  
5.0  
+1.5  
10  
V
V
µA  
µA  
IIL  
10  
SDA output  
VOL  
LOW-level output voltage  
open-collector;  
IOL = 3.0 mA  
0.4  
V
AS input  
VIH  
VIL  
IIH  
HIGH-level input voltage  
LOW-level input voltage  
HIGH-level input current  
LOW-level input current  
AS = C6  
AS = C4  
3.0  
0.3  
5.0  
+1.0  
10  
V
V
µA  
µA  
IIL  
10  
RF input  
fi(max)  
fi(min)  
Vi(rms)  
Ri  
maximum input frequency  
minimum input frequency  
input voltage (RMS value)  
input resistance  
30  
MHz  
kHz  
mV  
kΩ  
512  
500  
measured in Fig.4  
30  
5.9  
2
Ci  
input capacitance  
pF  
1998 Oct 23  
7
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Oscillator (XTAL1 and XTAL2)  
Rxtal  
crystal resonance  
resistance (4 MHz)  
see Fig.5  
150  
Programmable charge pump  
ICHP  
output current to loop filter  
bit CP  
logic 0  
3
5
7
µA  
µA  
µA  
logic 1  
400  
3
500  
5
600  
9
logic 0;  
TDA8735T only  
Ripple rejection  
RR  
fripple = 100 Hz  
fripple = 100 Hz  
40  
40  
50  
50  
dB  
dB  
VCC1  
20log-----------------  
VO  
VCC2  
20log-----------------  
VO  
Band switch output (pin 8)  
VOH  
VOL  
ILO  
HIGH-level output voltage  
12  
0.8  
10  
V
LOW-level output voltage  
output leakage current  
IOL = 3 mA  
VOH = 12 V  
V
µA  
Tuning voltage amplifier output (pin 15)  
Vo(max)  
Vo(min)  
Isource  
Isink  
maximum output voltage  
Isource = 0.5 mA  
Isink = 1 mA  
V
CC2 1.5  
1
V
minimum output voltage  
0.8  
V
maximum output source current  
maximum output sink current  
impedance of switched off output  
input bias current (absolute value)  
0.5  
1.0  
5
mA  
mA  
MΩ  
nA  
Zo(off)  
Ibias  
5
1998 Oct 23  
8
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
V
CC1  
3
4
HYBRID  
JUNCTION  
50 Ω  
coaxial  
50 Ω  
coaxial  
AM  
3 dB  
sine wave  
generator  
V
+
TDA8735  
R = 50 Ω  
50 Ω  
coaxial  
10 nF  
3 dB  
7
6
50 Ω  
50 Ω  
10 nF  
MGL510  
Fig.4 Prescaler input sensitivity (set-up measurement).  
handbook, halfpage  
1
2
4 MHz  
27 pF  
TDA8735  
MGL511  
Fig.5 Crystal connection (4 MHz).  
1998 Oct 23  
9
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
APPLICATION INFORMATION  
C2  
CC2  
47 µF  
C
t
V
XTAL1  
XTAL2  
1
2
16  
15  
+12 V  
27 pF 4 MHz  
LOOP  
LOOP  
O
R1  
10 kΩ  
+5 V  
tuning  
voltage  
output  
V
CC1  
I
3
4
14  
13  
12  
C3  
C5  
C1  
47 µF  
220 nF 3.9 nF  
V
EE  
n.c.  
+5 V  
TDA8735  
programmable address  
J1: A1 = 1; Addr. = C6H  
J2: A1 = 0; Addr. = C4H  
J1  
AS  
5
6
7
8
n.c.  
J2  
C
DEC  
SCL  
SDA  
DEC  
11  
10  
10 nF  
2
I C-BUS  
C
VCOFI  
VCO  
input  
AM  
22 nF  
BS  
band switch  
output  
9
n.c.  
10 kΩ  
R
MGL512  
bs  
+5 V  
Loop filter depends on VCO parameters.  
Fig.6 Application example.  
10  
1998 Oct 23  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
PACKAGE OUTLINES  
DIP16: plastic dual in-line package; 16 leads (300 mil); long body  
SOT38-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
2
(1)  
(1)  
1
w
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.  
max.  
min.  
max.  
1.40  
1.14  
0.53  
0.38  
0.32  
0.23  
21.8  
21.4  
6.48  
6.20  
3.9  
3.4  
8.25  
7.80  
9.5  
8.3  
4.7  
0.51  
3.7  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
2.2  
0.021  
0.015  
0.013  
0.009  
0.86  
0.84  
0.32  
0.31  
0.055  
0.045  
0.26  
0.24  
0.15  
0.13  
0.37  
0.33  
inches  
0.19  
0.020  
0.15  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-10-02  
95-01-19  
SOT38-1  
050G09  
MO-001AE  
1998 Oct 23  
11  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
SO16: plastic small outline package; 16 leads; body width 7.5 mm  
SOT162-1  
D
E
A
X
c
H
v
M
A
E
y
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
e
w
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
10.5  
10.1  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
1.27  
0.050  
1.4  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.41  
0.014 0.009 0.40  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-24  
97-05-22  
SOT162-1  
075E03  
MS-013AA  
1998 Oct 23  
12  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
Several techniques exist for reflowing; for example,  
SOLDERING  
Introduction  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
WAVE SOLDERING  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(order code 9398 652 90011).  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
DIP  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
SOLDERING BY DIPPING OR BY WAVE  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
The package footprint must incorporate solder thieves at  
the downstream end.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
REPAIRING SOLDERED JOINTS  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
SO  
REFLOW SOLDERING  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
1998 Oct 23  
13  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
1998 Oct 23  
14  
Philips Semiconductors  
Product specification  
PLL frequency synthesizer  
TDA8735  
NOTES  
1998 Oct 23  
15  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Middle East: see Italy  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Fax. +43 160 101 1210  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
Norway: Box 1, Manglerud 0612, OSLO,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belgium: see The Netherlands  
Brazil: see South America  
Pakistan: see Singapore  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Portugal: see Spain  
Romania: see Italy  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
Colombia: see South America  
Czech Republic: see Austria  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,  
Tel. +65 350 2538, Fax. +65 251 6500  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 0044  
Slovakia: see Austria  
Slovenia: see Italy  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580920  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1998  
SCA60  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
545102/750/02/pp16  
Date of release: 1998 Oct 23  
Document order number: 9397 750 04641  

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