TDA8758G [NXP]

YC 8-bit low-power analog-to-digital video interface; YC 8位低功耗模拟 - 数字视频接口
TDA8758G
型号: TDA8758G
厂家: NXP    NXP
描述:

YC 8-bit low-power analog-to-digital video interface
YC 8位低功耗模拟 - 数字视频接口

转换器 模数转换器
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中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
TDA8758  
YC 8-bit low-power  
analog-to-digital video interface  
1996 Feb 01  
Product specification  
Supersedes data of 1995 Mar 22  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital  
video interface  
TDA8758  
FEATURES  
APPLICATIONS  
Two 8-bit ADCs:  
Video signal decoding  
Digital picture processing  
Frame grabbing  
– one Luminance or CVBS channel  
– one Chrominance channel  
Sampling rate up to 32 MHz  
Multimedia with the Philips Desktop Video chip set (and  
especially SAA7196 multistandard decoder and scaler).  
Binary or two's complement 3-state TTL outputs for  
each channel  
GENERAL DESCRIPTION  
Internal reference voltage regulator  
TTL-compatible digital inputs and outputs  
Power dissipation of 530 mW (typical)  
The TDA8758 is an 8-bit video high-speed low-power  
analog-to-digital conversion (ADC) interface for YC and  
CVBS signal processing. It converts 1-of-3 CVBS input  
signals or 1-of-2 YC input signals into binary or two’s  
complement words at a sampling rate of 32 MHz.  
All analog signal inputs are digitally clamped and an ADC  
interface is provided on the Y/CVBS channel. A fast  
precharge on clamp and AGC is provided for start-up.  
All digital inputs and outputs are TTL compatible.  
Input selector circuit (five selectable video inputs for  
CVBS or YC processing)  
Peak white enable input  
Clamp and Automatic Gain Control (AGC) functions for  
Y/CVBS channel (clamping on code 64 and Peak White  
level control at code 255)  
Clamp function for C channel (code 128)  
No sample-and-hold circuit required.  
QUICK REFERENCE DATA  
SYMBOL  
VCCA  
PARAMETER  
analog supply voltage  
CONDITIONS  
MIN.  
4.75  
TYP.  
5.0  
MAX.  
5.25  
UNIT  
V
VCCD  
VCCO  
ICCA  
ICCD  
ICCO  
ILE  
digital supply voltage  
4.75  
5.0  
5.0  
59  
5.25  
5.25  
70  
V
output stages supply voltage  
analog supply current  
digital supply current  
4.75  
V
mA  
mA  
mA  
LSB  
LSB  
bits  
28  
40  
output supply current  
CL = 15 pF  
19  
28  
DC integral linearity error  
DC differential linearity error  
±0.75  
±0.4  
7.1  
±1.5  
±1.0  
DLE  
EB  
effective bits  
(from video input to digital outputs)  
fclk = 32 MHz;  
fi = 4.43 MHz  
fclk(max)  
B
maximum clock frequency  
30  
32  
15  
MHz  
MHz  
maximum 3 dB bandwidth  
full-scale; 0 dB gain  
(input preamplifier)  
αct  
crosstalk between Y and C channels  
and each video input  
63  
55  
dB  
Ptot  
total power dissipation  
530  
724  
mW  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TDA8758G  
LQFP48  
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm  
SOT313-2  
1996 Feb 01  
2
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
BLOCK DIAGRAM  
V
CCA  
REG1 REG2  
DEC2  
DEC1  
V
V
SEL2  
5
CCD  
CCO2  
SDN  
8
DEC3  
15  
V
V
CCO1  
CCA  
ANOUTC  
C
CLPC  
10  
21  
41  
32  
48  
45  
44  
17  
1
46  
2
4
CLAMP  
LEVEL 128  
C7 to C0  
8
CHROM2  
CHROM1  
ADC  
TTL  
33  
to  
40  
COMPARATOR  
OFC  
CLK  
OFY  
47  
42  
TDA8758  
6
TIMING  
INPUT  
CVBS3  
GENERATOR  
SELECTOR  
22  
COMPARATORS  
ADC  
9
23  
to  
30  
Y2/CVBS2  
Y1/CVBS1  
AGC &  
CLAMP 64  
11  
TTL  
Y7 to Y0  
8
12  
14  
19 20  
7
13  
16  
31  
43  
18  
3
C
C
MGB469 - 1  
CLPY  
AGC  
ANOUTY  
SEL1  
GATE A  
PWE  
OGND2  
DGND  
AGND  
OGND1  
GATE B  
Fig.1 Block diagram.  
1996 Feb 01  
3
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
DEC1  
1
decoupling input 1  
CHROM2  
AGND  
CHROM1  
SEL2  
CVBS3  
CCLPY  
SDN  
2
chrominance analog voltage input 2  
analog ground  
3
4
chrominance analog voltage input 1  
selection control input 2  
5
6
luminance analog voltage input 3  
Y channel clamping capacitor  
stabilizer decoupling node  
luminance analog voltage input 2  
analog supply voltage (+5 V)  
luminance analog voltage input 1  
selection control input 1  
7
8
Y2/CVBS2  
VCCA  
Y1/CVBS1  
SEL1  
CAGC  
PWE  
DEC3  
ANOUTY  
REG2  
DGND  
GATE A  
GATE B  
VCCD  
OFY  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
AGC capacitor  
peak white enable input (active LOW)  
decoupling input 3  
analog output for Y channel  
decoupling input 2 (internal stabilization loop decoupling)  
digital ground  
AGC control input  
clamp control input  
digital supply voltage (+5 V)  
Y channel output format/chip enable (3-state input)  
Y channel data output; bit 7 (MSB)  
Y channel data output; bit 6  
Y channel data output; bit 5  
Y channel data output; bit 4  
Y channel data output; bit 3  
Y channel data output; bit 2  
Y channel data output; bit 1  
Y channel data output; bit 0 (LSB)  
output ground 2  
Y7  
Y6  
Y5  
Y4  
Y3  
Y2  
Y1  
Y0  
OGND2  
VCCO2  
C7  
output supply voltage 2 (+5 V)  
C channel data output; bit 7 (MSB)  
C channel data output; bit 6  
C channel data output; bit 5  
C channel data output; bit 4  
C channel data output; bit 3  
C channel data output; bit 2  
C channel data output; bit 1  
C channel data output; bit 0 (LSB)  
C6  
C5  
C4  
C3  
C2  
C1  
C0  
1996 Feb 01  
4
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
SYMBOL  
PIN  
DESCRIPTION  
VCCO1  
CLK  
41  
42  
43  
44  
45  
46  
47  
48  
output supply voltage 1 (+5 V)  
clock input  
OGND1  
REG1  
output ground 1  
decoupling input 1 (internal stabilization loop decoupling)  
analog output for C channel  
ANOUTC  
DEC2  
OFC  
decoupling input 2  
C channel output format/chip enable (3-state input)  
C channel clamping capacitor  
CCLPC  
pin 1  
index  
corner  
1
2
36 C4  
35 C5  
DEC1  
CHROM2  
3
34  
33  
32  
31  
30  
29  
28  
AGND  
CHROM1  
SEL2  
C6  
4
C7  
V
5
CCO2  
CVBS3  
6
OGND2  
Y0  
TDA8758  
C
7
CLPY  
SDN  
8
Y1  
Y2/CVBS2  
9
Y2  
V
27 Y3  
26  
10  
11  
12  
CCA  
Y1/CVBS1  
SEL1  
Y4  
25 Y5  
MGB470  
Fig.2 Pin configuration.  
5
1996 Feb 01  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
FUNCTIONAL DESCRIPTION  
Synchronization pulses  
The TDA8758 provides a simple interface between CVBS  
or Y/C analog signals and a digital colour decoder.  
GATE A and GATE B pulses are synchronization pulses  
occurring during the sync period and rear porch  
respectively. They should be distinct.  
Video inputs selection  
On the Y channel, the digital output of the ADC is  
compared to internal digital reference levels. The resultant  
outputs control the charge or discharge current of a  
capacitor connected to the CAGC pin. The voltage across  
this capacitor controls the gain of the video amplifier.  
This is the control loop.  
The input selector allows a choice from different video  
sources, and has one of the following configurations:  
A: Two Y/C and one CVBS signals  
B: One Y/C and two CVBS signals  
C: Three CVBS signals (only the Y channel is used).  
The sync level comparator is active during a positive-going  
pulse at the GATE A input. This means that sync pulse of  
the composite video signal is used as an amplitude  
reference. The bottom of the sync pulse is adjusted to  
obtain a digital output of logic 1 at the converter Y output.  
As the black level is digital level 64, the sync pulse will  
have a digital amplitude of 64 LSBs.  
The wiring of the five video inputs (pins 2, 4, 6, 9 and 11)  
and the control of the two selection inputs (pins 5 and 12)  
will depend on the available video sources.  
In configuration A, connect as follows:  
– Y1 to pin 11  
– C1 to pin 4  
The Peak White control loop is active when the selection  
pin PWE is LOW. Then, if the Y video signal exceeds the  
digital code of 255, it will be limited to avoid any over-range  
of the converter.  
– Y2 to pin 9  
– C2 to pin 2  
– CVBS3 to pin 6.  
The clamp level control is accomplished by using the same  
techniques as used for the gain control. On both Y and C  
channels, the black level digital comparators are active  
during a positive-going pulse at the GATE B input. On the  
Y channel, the clamping capacitor connected to the CCLPY  
pin will be charged or discharged to adjust the digital  
output to code 64. On the C channel, the clamping  
capacitor connected to the CCLPC pin will be charged or  
discharged to adjust the digital output to code 128.  
Keep SEL2 (pin 5) LOW and select Y1/C1 or Y2/C2 by  
switching SEL1 (pin 12).  
CVBS3 is selected with SEL1 and SEL2 HIGH.  
In configuration B, replace Y1 (or Y2) by a CVBS input  
(no more C1 or C2). The selection mode is the same.  
In configuration C, connect as follows:  
– CVBS1 to pin 11  
– CVBS2 to pin 9  
– CVBS3 to pin 6.  
Use both SEL1 and SEL2 to select inputs.  
Remark: the video inputs selection is a static selection.  
1996 Feb 01  
6
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
analog supply voltage  
CONDITIONS  
MIN.  
0.3  
MAX.  
+7.0  
UNIT  
VCCA  
VCCD  
VCCO  
VCC  
V
V
V
V
V
V
V
V
digital supply voltage  
0.3  
0.3  
1.0  
1.0  
1.0  
+7.0  
+7.0  
+1.0  
+1.0  
+1.0  
5.0  
output supply voltage  
supply voltage difference between VCCA and VCCD  
supply voltage difference between VCCO and VCCD  
supply voltage difference between VCCA and VCCO  
input voltage  
VI  
referenced to AGND  
Vclk(p-p)  
IO  
AC input voltage for switching (peak-to-peak value) referenced to DGND  
VCCO  
+6  
output current  
mA  
°C  
°C  
°C  
Tstg  
Tamb  
Tj  
storage temperature  
operating ambient temperature  
junction temperature  
55  
0
+150  
+70  
+150  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
72  
UNIT  
Rth j-a  
thermal resistance from junction to ambient in free air  
K/W  
CHARACTERISTICS  
VCCA = V10 to V3 = 4.75 to 5.25 V; VCCD = V21 to V18 = 4.75 to 5.25 V; VCCO1 = V41 to V43 = 4.75 to 5.25 V;  
VCC02 = V32 to V31 = 4.75 to 5.25 V; AGND and DGND shorted together; VCCA to VCCD = 0.25 to +0.25 V;  
VCCO to VCCD = 0.25 to +0.25 V; VCCA to VCCO = 0.25 to +0.25 V; Tamb = 0 to +70 °C; typical values measured  
at VCCA = VCCD = VCCO = 5 V and Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Supplies  
VCCA  
analog supply voltage  
4.75  
5.0  
5.25  
5.25  
5.25  
70  
V
VCCD  
VCCO  
ICCA  
digital supply voltage  
4.75  
4.75  
5.0  
5.0  
59  
28  
19  
V
output stages supply voltage  
analog supply current  
digital supply current  
V
mA  
mA  
mA  
ICCD  
40  
ICCOtot  
total output supply current  
CL = 15 pF  
28  
Video amplifier inputs  
Y1/CVBS1, Y2/CVBS2, CVBS3, CHROM1 AND CHROM2 INPUTS  
VI(p-p)  
input voltage (peak-to-peak value)  
AGC load with external  
capacitor; note 1  
Y channel  
0.7  
1.4  
V
C channel  
1.0  
25  
2
V
|Zi|  
input impedance  
input capacitance  
fi = 6 MHz  
fi = 6 MHz  
kΩ  
pF  
CI  
1996 Feb 01  
7
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
SEL1 AND SEL2 TTL INPUTS; see Table 1  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
0
0.8  
V
2.0  
400  
VCCD  
V
VI = 0.4 V  
µA  
µA  
IIH  
VI = 2.7 V  
20  
GATE A AND GATE B TTL INPUTS; see Figs 5 and 6  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
0
0.8  
VCCD  
V
2.0  
400  
V
VI = 0.4 V  
VI = 2.7 V  
µA  
µA  
IIH  
20  
AGC INPUT (PIN 13); see Fig.8  
V13(min)  
V13(max)  
I12  
AGC voltage for minimum gain at 3 dB  
3.3  
V
V
AGC voltage for maximum gain at +3 dB  
AGC output current  
3.75  
see Table 2  
C-CHANNEL CLAMP INPUT (PIN 48)  
V48  
I48  
CLAMP voltage for code 128 output  
CLAMP output current  
3.45  
V
see Table 3  
Y-CHANNEL CLAMP INPUT (PIN 7)  
V7  
I7  
CLAMP voltage for code 64 output  
CLAMP output current  
3.70  
V
see Table 3  
Video amplifier dynamic characteristics  
αct  
crosstalk between video inputs  
(pins 2, 4, 6, 9 and 11)  
VCCA = 4.75 to 5.25 V  
63  
55  
dB  
B
3 dB bandwidth  
15  
MHz  
dB  
G  
Gstab  
gain range  
3  
+3  
gain stability as a function of:  
supply voltage  
fi = 4.43 MHz  
0.5  
6
%
%
supply voltage and temperature  
Analog-to-digital converter inputs  
CLK INPUT (PIN 42)  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
input capacitance  
0
2
0.8  
VCCD  
V
2.0  
400  
V
Vclk = 0.4 V  
Vclk = 2.7 V  
fclk = 32 MHz  
µA  
µA  
pF  
IIH  
CI  
20  
1996 Feb 01  
8
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
OFY AND OFC INPUTS; 3-STATE; see Table 4  
VIL  
VIH  
VI  
LOW level input voltage  
0
0.2  
V
HIGH level input voltage  
input voltage in high impedance state  
LOW level input current  
2.6  
VCCD  
V
1.15  
300  
500  
V
IIL  
370  
µA  
µA  
IIH  
HIGH level input current  
700  
Analog-to-digital converter outputs  
ANOUTY AND ANOUTC OUTPUTS (PINS 16 AND 45); see Table 5  
VANOUT  
VANOUT  
output voltage  
output voltage  
digital output = 00  
digital output = 255  
2.6  
3.6  
1.0  
V
V
V
VANOUT(p-p) output voltage amplitude  
(peak-to-peak value)  
DIGITAL OUTPUTS Y0 TO Y7, C0 TO C7  
VOL  
VOH  
LOW level output voltage  
HIGH level output voltage  
IOL = 2 mA  
0
0.6  
V
V
IOL = 0.4 mA  
2.4  
VCCD  
Switching characteristics; see Fig.9  
fclk(max)  
tCPH  
CLK input maximum frequency  
clock pulse width HIGH  
clock pulse with LOW  
note 2  
30  
12  
12  
32  
MHz  
ns  
tCPL  
ns  
Analog signal processing from video input to digital output on both channels; 0 dB gain (fclk = 32 MHz)  
INL  
DC integral non-linearity  
DC differential non-linearity  
AC integral non linearity  
AC differential non-linearity  
total harmonic distortion  
effective bits  
±0.75 ±1.5  
LSB  
LSB  
LSB  
LSB  
dB  
DNL  
AINL  
ADNL  
THD  
EB  
±0.4  
±1.5  
±0.5  
52  
7.1  
±1.0  
fi = 4.43 MHz  
fi = 4.43 MHz  
note 3  
fi = 4.43 MHz; note 4  
bits  
%
Gdiff  
differential gain  
V16,45 = 1.0 V (p-p);  
see Fig.4; PAL  
1.5  
3.0  
modulated ramp; note 5  
ϕdiff  
differential phase  
see Fig.5; PAL  
modulated ramp; note 5  
0.6  
1.5  
5
deg  
%/V  
SVRR2  
supply voltage ripple rejection  
note 6  
1996 Feb 01  
9
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Timing (fclk = 32 MHz); see Fig.9  
DIGITAL OUTPUTS (CL = 15 pF)  
tds  
th  
sampling delay time  
output hold time  
2
ns  
10  
ns  
ns  
µs  
td  
output delay time  
clamp pulse width  
15  
3
18  
tW  
see Figs 6 and 7  
2
3-state output delay times; see Fig.10  
tdZH  
tdZL  
tdHZ  
tdLZ  
enable HIGH  
enable LOW  
disable HIGH  
disable LOW  
12  
10  
58  
70  
14  
12  
62  
74  
ns  
ns  
ns  
ns  
Notes  
1. 0 dB is obtained at the AGC amplifier when applying VI(p-p) = 1.0 V on Y channel.  
2. It is recommended that the rise and fall times of the clock are 1 ns. In addition, a ‘good layout’ for the digital and  
analog grounds is recommended.  
3. THD (total harmonic distortion) is obtained with the addition of the first five harmonics:  
F
THD = 20 log---------------------------------------------------------------------------------------------------------------  
2
2
2
2
2
(2nd) + (3rd) + (4th) + (5th) + (6th)  
a) F being the fundamental harmonic referenced at 0 dB for a full-scale sine wave input.  
4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8 K acquisition points per equivalent  
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency  
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.  
5. Measurement carried out using video analyser VM700A, where video analog signal is reconstructed through a  
digital-to-analog converter.  
6. The supply voltage ripple rejection is the relative variation of the analog signal (full-scale signal at input) for 0.5 V of  
supply variation:  
(VI (00) VI (FF) ) × (VI (00) VI (FF)  
)
SVRR2 =  
-----------------------------------------------------------------------------------------------------  
VCCA  
1996 Feb 01  
10  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
SEL2  
SEL2  
5
5
2
2
4
CHROM2  
CHROM2  
C CHANNEL  
Y CHANNEL  
C CHANNEL  
Y CHANNEL  
4
6
CHROM1  
CHROM1  
CVBS3  
6
CVBS3  
9
9
Y2/CVBS2  
Y1/CVBS1  
Y2/CVBS2  
Y1/CVBS1  
11  
11  
12  
12  
SEL1  
SEL1  
(a)  
(b)  
SEL2  
5
2
4
CHROM2  
C CHANNEL  
Y CHANNEL  
CHROM1  
CVBS3  
6
9
Y2/CVBS2  
Y1/CVBS1  
11  
12  
SEL1  
MGB471  
(c)  
Fig.3 Video inputs selector.  
Table 1 Video input selection  
SEL1  
SEL2  
X(1)  
0
Y-CHANNEL  
C-CHANNEL  
CHROM1  
CHROM2  
CHROM2  
FIGURE 3  
0
1
1
Y1/CVBS1  
Y2/CVBS2  
CVBS3  
(a)  
(b)  
(c)  
1
Note  
1. X = don't care.  
1996 Feb 01  
11  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
Table 2 AGC output current  
Table 4 OFY and OFC input coding  
DIGITAL  
OUTPUT  
OFY (or OFC)  
Y0 to Y7 (or C0 TO C7)  
active, twos complement  
high impedance  
PWE  
GATE A  
IAGC  
0 µA  
0
1
0
0
output < 255  
output > 255  
output < 0  
+540 µA  
+8 µA  
8 µA  
+540 µA  
0 µA  
open circuit(1) active, binary  
0
1
Note  
1. Use C 10 pF to DGND.  
0 < output < 255  
output > 255  
X(1)  
1
1
0
1
output < 0  
+8 µA  
8 µA  
0 < output < 255  
Note  
1. X = don't care.  
Table 3 CLAMP output current  
DIGITAL  
OUTPUT  
CLAMP  
GATE B  
ICLAMP  
C
1
output < 128  
output > 128  
X(1)  
+54 µA  
54 µA  
0 µA  
X(1)  
Y
0
1
output < 64  
64 < output  
+54 µA  
54 µA  
Note  
1. X = don't care.  
Table 5 Output coding and ANOUTY (or ANOUTC) voltage (typical values)  
BINARY OUTPUTS  
TWOS COMPLIMENT  
STEP  
VI  
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0  
Underflow  
2.6  
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
1
1
1
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
254  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
255  
3.6  
Overflow  
1996 Feb 01  
12  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
MBE455  
1.0  
DIFFERENTIAL  
GAIN  
(%)  
(2)  
(1)  
0.0  
1.0  
2.0  
3.0  
(4)  
(5)  
(3)  
(6)  
1st  
2nd  
3rd  
4th  
5th  
6th  
step number  
(1) = 0.00; (2) = 0.09; (3) = 0.63; (4) = 0.45; (5) = 0.45; (6) = 1.23.  
Differential gain = max. (2) min. (6) = 1.32%.  
Fig.4 Typical differential gain result on VM700A.  
MBE456  
2.0  
1.0  
0
DIFFERENTIAL  
PHASE  
(deg)  
(1)  
(2)  
(5)  
(6)  
(4)  
(3)  
1.0  
2.0  
1st  
2nd  
3rd  
4th  
5th  
6th  
step number  
(1) = 0.00; (2) = 0.03; (3) = 0.53; (4) = 0.32; (5) = 0.01; (6) = 0.08.  
Differential phase = max. (2) min. (3) = 0.56 deg.  
Fig.5 Typical differential phase result on VM700A.  
13  
1996 Feb 01  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
digital  
output  
level  
255  
safety  
margin  
peak-level gain control  
213  
standard picture  
level  
black-level  
clamping  
64  
0
sync-level control  
t
time  
W
GATE A  
GATE B  
MGB472  
t
W
Fig.6 Control mode Y channel.  
digital  
output  
level  
255  
black-level  
clamping  
128  
0
time  
t
W
GATE B  
MGB473  
Fig.7 Control mode C-channel.  
14  
1996 Feb 01  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
MBE463  
8
AGC  
GAIN  
(dB)  
6
4
2
0
2
4
6
8
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
voltage (V)  
4.0  
C
AGC  
Dotted line: Typical curve (Tamb = 25 °C; VCC = 5 V).  
Full line: Maximum envelope (Tamb = 0 to 70 °C; VCC = 4.75 to 5.25 V).  
Fig.8 AGC behaviour as a function temperature and supply voltage for ANOUTY output; fi = 4.43 MHz, Vi = 0 dB.  
t
CPL  
t
CPH  
1.4 V  
CLK  
sample N  
sample N + 1  
sample N + 2  
V
l
t
t
ds  
h
2.4 V  
1.4 V  
0.4 V  
DATA  
C0 to C7  
Y0 to Y7  
DATA  
N - 2  
DATA  
N - 1  
DATA  
N
DATA  
N + 1  
t
d
MBE454  
Fig.9 Timing diagram.  
15  
1996 Feb 01  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
V
CCD  
OFC  
OFY  
50 %  
dZH  
1.15 V  
t
t
dHZ  
HIGH  
90 %  
output  
data  
50 %  
HIGH Z  
t
t
dZL  
dLZ  
HIGH Z  
output  
data  
50 %  
LOW  
10 %  
TEST  
S1  
V
CCD  
t
t
t
t
V
CCD  
dLZ  
dZL  
dHZ  
dZH  
3.3 kΩ  
15 pF  
V
CCD  
GND  
GND  
S1  
TDA8758  
OFC  
OFY  
MBE453  
fOFC = fOFY = 100 kHz.  
Fig.10 Timing diagram and test conditions of 3-state output delay time.  
1996 Feb 01  
16  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
APPLICATION INFORMATION  
V
AGND  
CCA  
V
(
CCO1  
5 V)  
(1)  
OFC  
ANOUTC  
OGND1  
3.3  
C0  
40  
C1  
39  
C2  
38  
C3  
37  
CLK  
42  
1 nF  
18  
nF  
nF  
C
CLPC  
DEC2  
REG1  
22 nF  
48  
47  
46  
45  
44  
43  
41  
DEC1  
CHROM2  
AGND  
AGND  
1
2
36  
35  
C4  
C5  
1 µF  
75 Ω  
3
4
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
C6  
C7  
4.7 µF  
4.7 µF  
CHROM1  
SEL2  
75 Ω  
V
( 5 V)  
5
CCO2  
OGND2  
Y0  
CVBS3  
6
75 Ω  
TDA8758  
18 nF  
22 nF  
C
CLPY  
SDN  
7
8
Y1  
Y2  
Y3  
Y4  
Y5  
AGND  
4.7 µF  
Y2/CVBS2  
75 Ω  
9
V
CCA  
10  
11  
12  
75 Ω  
4.7 µF  
Y1/CVBS1  
SEL1  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
Y7  
24  
Y6  
DEC3  
REG2  
470  
nF  
V
C
CCD  
5 V)  
AGC  
1 nF  
3.3  
nF  
MGB476  
GATE A  
(
(1)  
V
PWE  
ANOUTY  
DGND  
GATE B  
OFY  
AGND  
CCA  
(1) It is recommended that pin 16 and pin 45 are not loaded in order to avoid any distortion.  
Fig.11 Application diagram.  
1996 Feb 01  
17  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
9
1
61  
n
60  
U2  
10  
26  
33 CHR7  
CHR7  
4.7 µF  
C27  
C26  
C25  
4
2
34 CHR6  
35 CHR5  
36 CHR4  
37 CHR3  
38 CHR2  
39 CHR1  
40 CHR0  
CHROMA1  
CHROMA2  
Y1/CVBS1  
Y2/CVBS2  
CVBS3  
SEL1  
CHROMA IN  
CHR6  
CHR5  
CHR4  
CHR3  
CHR2  
CHR1  
CHR0  
SAA7151B  
4.7 µF  
C11  
11  
9
LUMA IN  
CVBS1 IN  
CVBS2 IN  
4.7 µF  
44  
27  
43  
4.7 µF  
6
U4  
68LLC50  
CHR0 to 7  
DEC_UV0  
12  
5
IN0  
IN1  
23 CVBS7  
24 CVBS6  
25 CVBS5  
26 CVBS4  
27 CVBS3  
28 CVBS2  
29 CVBS1  
30 CVBS0  
to 7  
CHR7  
CHR6  
CHR5  
CHR4  
CHR3  
CHR2  
CHR1  
CHR0  
13  
12  
11  
10  
9
55 DEC_UV7  
Y7  
Y6  
Y5  
Y4  
Y3  
Y2  
Y1  
Y0  
CHR7  
CHR6  
CHR5  
CHR4  
CHR3  
CHR2  
CHR1  
CHR0  
UV7  
56 DEC_UV6  
57 DEC_UV5  
58 DEC_UV4  
59 DEC_UV3  
60 DEC_UV2  
SEL2  
UV6  
UV5  
UV4  
UV3  
UV2  
UV1  
UV0  
14  
19  
20  
7
GPSWO  
HSY  
PWE  
GATE A  
GATE B  
CLMP_Y  
CLMP_C  
SDN  
8
HCL  
C12  
7
61  
DEC_UV1  
0.1 µF  
C13  
6
62 DEC_UV0  
CVBS0 to 7  
DEC_Y0  
to 7  
0.1 µF  
48  
8
TDA8758  
45 DEC_Y7  
46 DEC_Y6  
47 DEC_Y5  
48 DEC_Y4  
49 DEC_Y3  
50 DEC_Y2  
53 DEC_Y1  
54 DEC_Y0  
CVBS7 23  
CVBS6 22  
CVBS5 21  
CVBS4 20  
CVBS3 17  
CVBS2 16  
CVBS1 15  
CVBS0 14  
220 Ω  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
42  
CVBS7  
CVBS6  
CVBS5  
CVBS4  
CVBS3  
CVBS2  
CVBS1  
CVBS0  
0.022 µF  
C15  
C14  
C16  
CLK  
DEC_LLC  
R13  
0.022 µF  
0.022 µF  
1
V
DEC1  
CC  
0.022 µF  
C17  
46  
15  
16  
45  
13  
44  
17  
22  
47  
41  
DEC2  
V
V
CCO1  
CCO2  
32  
21  
10  
CX3  
22 µF  
V
CCA  
CCX4  
0.1 µF  
DEC3  
INADCY  
IN_ADC_Y  
IN_ADC_C  
AGC_CAP  
REG1  
V
V
CCD  
CCA  
42  
DEC_HREF  
HREF  
HS  
44  
INADCC  
C18  
V
CCA  
SDAT  
XTAL  
31  
30  
DEC_HS  
DEC_VS  
0.47 µF  
33  
XTAL2  
VS  
SAA7151B  
0.047 µF  
0.047 µF  
C19  
C20  
31  
66  
68  
34  
OGND1  
CX12  
0.1 µF  
XTAL1  
XTAL1  
GTBS  
FSI  
4.7 kΩ  
43  
18  
REG2  
OGND2  
DGND  
24  
R64  
IN0  
GPSW1  
GPSW2  
65  
39  
32  
64  
63  
MUXC  
ODD  
25  
OE_Y  
IN1  
V
V
DEC_FI  
CC  
CC  
3
OE_C  
AGND  
RTCO  
FEIN  
DEC_RTC  
29  
HSY  
HSY  
1
2
3
1
26  
HCL  
HCL  
JP14  
JP15  
2
GPSWO  
GPSWO  
RSVRD  
IICSA  
27  
DEC_LLC  
LL27  
CREF  
LFCO  
RES  
48  
37  
24  
39  
43  
4
3
DEC_REF  
36  
1
36  
LFCO  
HEADER 3  
3SIP100  
HEADER 3  
3SIP100  
3
RES  
TDA8758  
40  
41  
SDA  
SCL  
SDA  
SCL  
V
CCA  
PAD100  
TEST PT  
J10  
PAD100  
TEST PT  
J9  
V
CC  
12  
25  
37  
5
1
V
SP  
AP  
13  
DDA  
2
V
DD1  
INADCY  
INADCC  
18  
35  
V
V
3
2
1
DD2  
SSA  
V
CX14  
0.1 µF  
CC  
28  
52  
19  
38  
51  
67  
V
V
DD3  
SS1  
JP5  
V
V
V
DD4  
SS2  
CC  
CX5  
0.1 µF  
CX6  
22 µF  
V
HEADER 3  
3SIP100  
SS3  
V
CC  
V
SS4  
V
CC  
PAD100  
J24  
GROUND GROUND  
PAD100  
J25  
V
CCA  
U3  
GND  
33 R14  
10  
7
LL1 to 5A  
LL3A  
LFCO  
LFCO2  
CE  
LL1 to 5B  
LL3B  
1
3
2
4
DEC_LLC  
DEC_LLC2  
DEC_CREF  
RES  
33 Ω  
14  
20  
16  
JP16  
11  
19  
2
R15  
5
7
6
8
LFCOSEL  
33 Ω  
V
V
CC  
CCA  
15  
3
CLKREF  
PORD  
XTAL2  
4.7 kΩ  
C21  
R16  
Y2  
SAA7197  
RES  
10 pF  
1
4
HEADER  
4X2  
8HH100  
24.576 MHz  
2SIP100  
R12  
MS  
V
C24  
CX7  
0.1 µF  
CX13  
0.1 µF  
SSA  
12  
5
6
0.1 µF  
RES  
RES  
V
XTAL1  
SSD  
22 kΩ  
9
C22  
C23  
V
V
DDA  
SSD  
8
13  
18  
10 pF  
0.001 µF  
R11  
V
V
DDD  
SSD  
17  
L2  
V
V
DDD  
SSD  
10 µH  
20SOP300  
MBH012  
Fig.12 Example of system application (DPC71 evaluation board).  
18  
1996 Feb 01  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
PACKAGE OUTLINE  
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm  
SOT313-2  
c
y
X
36  
25  
A
E
37  
24  
Z
E
Q
e
H
E
A
2
A
(A )  
3
A
1
w
p
M
θ
pin 1 index  
b
L
p
L
13  
48  
detail X  
1
12  
Z
v
M
M
D
A
e
w
M
b
p
D
B
H
v
B
D
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.  
7o  
0o  
0.20 1.45  
0.05 1.35  
0.27 0.18 7.1  
0.17 0.12 6.9  
7.1  
6.9  
9.15 9.15  
8.85 8.85  
0.75 0.69  
0.45 0.59  
0.95 0.95  
0.55 0.55  
1.60  
mm  
0.25  
0.5  
1.0  
0.2 0.12 0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
93-06-15  
94-12-19  
SOT313-2  
1996 Feb 01  
19  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
If wave soldering cannot be avoided, the following  
conditions must be observed:  
SOLDERING  
Introduction  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave)  
soldering technique should be used.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
The footprint must be at an angle of 45° to the board  
direction and must incorporate solder thieves  
downstream and at the side corners.  
Even with these conditions, do not consider wave  
soldering LQFP packages LQFP48 (SOT313-2),  
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all LQFP  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
Wave soldering  
Wave soldering is not recommended for LQFP packages.  
This is because of the likelihood of solder bridging due to  
closely-spaced leads and the possibility of incomplete  
solder penetration in multi-lead devices.  
1996 Feb 01  
20  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Feb 01  
21  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
NOTES  
1996 Feb 01  
22  
Philips Semiconductors  
Product specification  
YC 8-bit low-power analog-to-digital video  
interface  
TDA8758  
NOTES  
1996 Feb 01  
23  
Philips Semiconductors – a worldwide company  
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)  
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474  
Tel. (02)805 4455, Fax. (02)805 4466  
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,  
Tel. (01)60 101-1236, Fax. (01)60 101-1211  
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Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,  
Apartado 300, 2795 LINDA-A-VELHA,  
Tel. (01)4163160/4163333, Fax. (01)4163174/4163366  
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Tel. (65)350 2000, Fax. (65)251 6500  
South Africa: S.A. PHILIPS Pty Ltd.,  
Tel. (31)40-2783749, Fax. (31)40-2788399  
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,  
CEP: 04552-903-SÃO PAULO-SP, Brazil,  
P.O. Box 7383 (01064-970),  
195-215 Main Road Martindale, 2092 JOHANNESBURG,  
P.O. Box 7430, Johannesburg 2000,  
Tel. (011)470-5911, Fax. (011)470-5494  
Tel. (011)821-2333, Fax. (011)829-1849  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:  
Tel. (800) 234-7381, Fax. (708) 296-8556  
Chile: Av. Santa Maria 0760, SANTIAGO,  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. (03)301 6312, Fax. (03)301 42 43  
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,  
Tel. (0)8-632 2000, Fax. (0)8-632 2745  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. (02)773 816, Fax. (02)777 6730  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. (852)2319 7888, Fax. (852)2319 7700  
Tel. (01)488 2211, Fax. (01)481 77 30  
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West  
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,  
TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444  
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,  
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609,  
Fax. (571)217 4549  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong,  
Bangkok 10260, THAILAND,  
Tel. (66) 2 745-4090, Fax. (66) 2 398-0793  
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. (0212)279 27 70, Fax. (0212)282 67 07  
Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,  
Denmark: Prags Boulevard 80, PB 1919, DK-2300  
COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. (358)0-615 800, Fax. (358)0-61580 920  
France: 4 Rue du Port-aux-Vins, BP317,  
92156 SURESNES Cedex,  
Tel. (01)4099 6161, Fax. (01)4099 6427  
Germany: P.O. Box 10 51 40, 20035 HAMBURG,  
252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991  
United Kingdom: Philips Semiconductors LTD.,  
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,  
Tel. (0181)730-5000, Fax. (0181)754-8421  
United States:811 East Arques Avenue, SUNNYVALE,  
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556  
Uruguay: Coronel Mora 433, MONTEVIDEO,  
Tel. (040)23 53 60, Fax. (040)23 53 63 00  
Greece: No. 15, 25th March Street, GR 17778 TAVROS,  
Tel. (01)4894 339/4894 911, Fax. (01)4814 240  
India: Philips INDIA Ltd, Shivsagar Estate, A Block,  
Dr. Annie Besant Rd. Worli, Bombay 400 018  
Tel. (022)4938 541, Fax. (022)4938 722  
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,  
P.O. Box 4252, JAKARTA 12950,  
Tel. (02)70-4044, Fax. (02)92 0601  
Tel. (021)5201 122, Fax. (021)5205 189  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. (01)7640 000, Fax. (01)7640 200  
Italy: PHILIPS SEMICONDUCTORS S.r.l.,  
Piazza IV Novembre 3, 20124 MILANO,  
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557  
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,  
Tel. (03)3740 5130, Fax. (03)3740 5077  
Korea: Philips House, 260-199 Itaewon-dong,  
Internet: http://www.semiconductors.philips.com/ps/  
For all other countries apply to: Philips Semiconductors,  
International Marketing and Sales, Building BE-p,  
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,  
Telex 35000 phtcnl, Fax. +31-40-2724825  
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415  
SCDS47  
© Philips Electronics N.V. 1996  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,  
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,  
Tel. 9-5(800)234-7381, Fax. (708)296-8556  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. (040)2783749, Fax. (040)2788399  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
All rights are reserved. Reproduction in whole or in part is prohibited without the  
prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation  
or contract, is believed to be accurate and reliable and may be changed without  
notice. No liability will be accepted by the publisher for any consequence of its  
use. Publication thereof does not convey nor imply any license under patent- or  
other industrial or intellectual property rights.  
Tel. (09)849-4160, Fax. (09)849-7811  
Norway: Box 1, Manglerud 0612, OSLO,  
Printed in The Netherlands  
Tel. (022)74 8000, Fax. (022)74 8341  
Pakistan: Philips Electrical Industries of Pakistan Ltd.,  
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,  
KARACHI 75600, Tel. (021)587 4641-49,  
Fax. (021)577035/5874546  
537021/1100/03/pp24  
Date of release: 1996 Feb 01  
9397 750 00606  
Document order number:  

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