TDA8761A [NXP]

9-bit analog-to-digital converter for digital video; 9位模拟 - 数字转换器,用于数字视频
TDA8761A
型号: TDA8761A
厂家: NXP    NXP
描述:

9-bit analog-to-digital converter for digital video
9位模拟 - 数字转换器,用于数字视频

转换器
文件: 总24页 (文件大小:169K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
TDA8761A  
9-bit analog-to-digital converter for  
digital video  
1998 Nov 03  
Product specification  
Supersedes data of 1997 Aug 21  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
FEATURES  
APPLICATIONS  
9-bit resolution  
Analog-to-digital conversion for:  
Video data digitizing  
Sampling rate up to 40 MHz  
DC sampling allowed  
Digital Video Broadcasting (DVB)  
Cable TV.  
One clock cycle conversion only  
High signal-to-noise ratio over a large analog input  
frequency range (8.2 effective bits at 10 MHz full-scale  
input at fclk = 30 MHz)  
GENERAL DESCRIPTION  
The TDA8761A is a 9-bit Analog-to-Digital Converter  
(ADC) for professional video and digital video set box  
applications. It converts the analog input signal into 9-bit  
binary-coded digital words at a maximum sampling rate of  
40 MHz. Its linearity performance ensures the required  
conversion accuracy in the event of 256-QAM  
demodulator concept and for all symbol frequencies.  
All digital inputs and outputs are TTL and CMOS  
compatible, although a low-level sine wave clock input  
signal is allowed.  
No missing codes guaranteed  
In Range (IR) CMOS output  
Levels TTL and CMOS compatible digital inputs  
3 to 5 V CMOS digital outputs  
Low-level AC clock input signal allowed  
External reference voltage regulator  
Power dissipation only 158 mW (typical)  
Low analog input capacitance, no buffer amplifier  
required  
No sample-and-hold circuit required.  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
VCCA  
VCCD  
VCCO  
ICCA  
ICCD  
ICCO  
INL  
analog supply voltage  
digital supply voltage  
output stages supply voltage  
analog supply current  
digital supply current  
4.75  
4.75  
3.0  
5.0  
5.0  
3.3  
18  
5.25  
5.25  
5.25  
24  
V
V
V
mA  
mA  
mA  
LSB  
LSB  
13  
18  
output stages supply current fclk = 30 MHz; ramp input  
1
2
integral non-linearity  
f
clk = 30 MHz; ramp input  
±0.8  
±1.6  
AINL  
AC integral non-linearity  
full-scale input sine wave; note 1  
±0.75 0.9  
50% full-scale input sine wave; note 1  
±0.5  
±0.3  
±0.5  
±0.3  
±0.75 LSB  
±0.7 LSB  
±0.75 LSB  
DNL  
differential non-linearity  
fclk = 30 MHz; ramp input  
ADNL  
AC differential non-linearity  
full-scale input sine wave; note 1  
50% full-scale input sine wave; note 1  
±0.5  
LSB  
MHz  
mW  
fclk(max)  
Ptot  
maximum clock frequency  
total power dissipation  
40  
158  
173  
Note  
1. fi = 10 MHz and fclk = 30 MHz; fi = 8 MHz and fclk = 20 MHz.  
1998 Nov 03  
2
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TDA8761AM  
SSOP28  
plastic shrink small outline package; 28 leads; body width 5.3 mm  
SOT341-1  
BLOCK DIAGRAM  
V
CLK  
1
V
CCD2  
OE  
10  
CCA  
3
11  
2
CLOCK DRIVER  
TC  
TDA8761A  
V
RT  
9
25 D8  
24 D7  
23 D6  
22 D5  
21 D4  
20 D3  
19 D2  
18 D1  
17 D0  
MSB  
R
LAD  
V
I
8
7
ANALOG -TO - DIGITAL  
CONVERTER  
analog  
voltage input  
CMOS  
OUTPUTS  
LATCHES  
data outputs  
V
RM  
LSB  
V
CCO  
13  
V
RB  
6
28  
26  
V
CCD1  
IR  
IN RANGE LATCH  
CMOS OUTPUT  
output  
12  
27  
4
14  
OGND  
AGND  
DGND2  
DGND1  
MBG910  
analog ground  
output ground  
digital grounds  
Fig.1 Block diagram.  
3
1998 Nov 03  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
PINNING  
SYMBOL PIN  
DESCRIPTION  
CLK  
TC  
1
2
3
4
5
6
7
8
9
clock input  
two’s complement input (active LOW)  
analog supply voltage (5 V)  
analog ground  
VCCA  
AGND  
n.c.  
VRB  
VRM  
VI  
not connected  
handbook, halfpage  
reference voltage BOTTOM input  
reference voltage MIDDLE  
analog input voltage  
V
CLK  
TC  
1
2
28  
CCD1  
27 DGND1  
V
3
IR  
26  
CCA  
VRT  
OE  
reference voltage TOP input  
AGND  
n.c.  
4
25 D8  
24 D7  
23 D6  
22 D5  
10 output enable input (CMOS level  
input, active LOW)  
5
VCCD2  
DGND2  
VCCO  
11 digital supply voltage 2 (5 V)  
12 digital ground 2  
V
6
RB  
V
7
RM  
13 supply voltage for output stages  
(3 to 5 V)  
TDA8761A  
V
I
D4  
8
21  
20 D3  
D2  
V
9
OGND  
n.c.  
n.c.  
D0  
14 output ground  
RT  
15 not connected  
OE  
10  
11  
19  
16 not connected  
V
18 D1  
17 D0  
16 n.c.  
15 n.c.  
CCD2  
17 data output; bit 0 (LSB)  
18 data output; bit 1  
19 data output; bit 2  
20 data output; bit 3  
21 data output; bit 4  
22 data output; bit 5  
23 data output; bit 6  
24 data output; bit 7  
25 data output; bit 8 (MSB)  
26 in range data output  
27 digital ground 1  
DGND2 12  
D1  
V
13  
CCO  
D2  
OGND 14  
D3  
MBG909  
D4  
D5  
D6  
D7  
D8  
IR  
DGND1  
VCCD1  
Fig.2 Pin configuration.  
28 digital supply voltage 1 (5 V)  
1998 Nov 03  
4
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VCCA  
PARAMETER  
CONDITIONS  
note 1  
MIN.  
0.3  
MAX.  
UNIT  
analog supply voltage  
digital supply voltage  
+7.0  
+7.0  
+7.0  
V
V
V
VCCD  
VCCO  
VCC  
note 1  
note 1  
0.3  
0.3  
output stages supply voltage  
supply voltage differences  
between  
V
V
V
CCA and VCCD  
CCD and VCCO  
CCA and VCCO  
1.0  
1.0  
1.0  
0.3  
+1.0  
+4.0  
+4.0  
+7.0  
VCCD  
V
V
V
V
V
VI  
input voltage  
referenced to AGND  
referenced to DGND  
Vi(p-p)  
AC input voltage for switching  
(peak-to-peak value)  
IO  
output current  
10  
mA  
°C  
°C  
°C  
Tstg  
Tamb  
Tj  
storage temperature  
operating ambient temperature  
junction temperature  
55  
0
+150  
+70  
+150  
Note  
1. The supply voltages VCCA, VCCD and VCCO may have any value between 0.3 and +7.0 V provided that the supply  
voltage differences VCC are respected.  
HANDLING  
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is  
desirable to take normal precautions appropriate to handling integrated circuits.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
in free air  
VALUE  
UNIT  
Rth(j-a)  
thermal resistance from junction to ambient  
110  
K/W  
1998 Nov 03  
5
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
CHARACTERISTICS  
VCCA = V3 to V4 = 4.75 to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 to 5.25 V; VCCO = V13 to V14 = 3.0 to 5.25 V;  
AGND and DGND shorted together; Tamb = 0 to 70 °C; typical values measured at VCCA = VCCD = 5 V and  
VCCO = 3.3 V; Vi(p-p) = 1.8 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
Supplies  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VCCA  
VCCD  
VCCO  
VCC  
analog supply voltage  
digital supply voltage  
4.75  
5.0  
5.25  
V
V
V
4.75  
3.0  
5.0  
3.3  
5.25  
5.25  
output stages supply voltage  
supply voltage differences  
between  
VCCA and VCCD  
0.2  
0.2  
0.2  
+0.2  
+2.25  
+2.25  
24  
V
V
V
V
CCA and VCCO  
CCD and VCCO  
V
ICCA  
ICCD  
ICCO  
analog supply current  
digital supply current  
18  
13  
1
mA  
mA  
mA  
18  
output stages supply current  
fclk = 30 MHz; ramp input  
2
Inputs  
CLOCK INPUT CLK (REFERENCED TO DGND); note 1  
VIL  
VIH  
IIL  
LOW-level input voltage  
HIGH-level input voltage  
LOW-level input current  
HIGH-level input current  
input impedance  
0
0
2
2
2
0.8  
VCCD  
+1  
10  
V
2
V
Vclk = 0.8 V  
Vclk = 2 V  
1  
µA  
µA  
kΩ  
pF  
IIH  
Zi  
fclk = 30 MHz  
Ci  
input capacitance  
INPUTS OE AND TC (REFERENCED TO DGND); see Table 2  
VIL  
VIH  
IIL  
LOW-level input voltage  
HIGH-level input voltage  
LOW-level input current  
HIGH-level input current  
0
0.8  
VCCD  
V
2
V
VIL = 0.8 V  
VIH = 2.0 V  
1  
µA  
µA  
IIH  
1
VI (ANALOG INPUT VOLTAGE REFERENCED TO AGND)  
IIL  
IIH  
Zi  
LOW-level input current  
HIGH-level input current  
input impedance  
VI = VRB = 1.3 V  
VI = VRT = 3.43 V  
fi = 10 MHz  
17  
35  
8
µA  
µA  
kΩ  
pF  
Ci  
input capacitance  
5
1998 Nov 03  
6
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Reference voltages for the resistor ladder; see Table 1  
VRB  
VRT  
Vdiff  
reference voltage BOTTOM  
reference voltage TOP  
1.2  
3.2  
2
1.3  
2.45  
V
3.43  
2.13  
VCCA 0.8 V  
differential reference voltage  
3.0  
V
VRT VRB  
Iref  
reference current  
resistor ladder  
V
RT VRB = 2.13 V  
8.7  
mA  
RLAD  
TCRLAD  
245  
1860  
456  
160  
160  
1.81  
temperature coefficient of the  
resistor ladder  
ppm  
m/K  
mV  
mV  
V
VosB  
VosT  
Vi(p-p)  
offset voltage BOTTOM  
offset voltage TOP  
note 2  
note 2  
note 3  
analog input voltage  
(peak-to-peak value)  
1.7  
2.55  
Outputs  
DIGITAL OUTPUTS D8 TO D0 AND IR (REFERENCED TO OGND)  
VOL  
VOH  
IOZ  
LOW-level output voltage  
HIGH-level output voltage  
output current in 3-state mode  
IOL = 1 mA  
0
0.5  
V
IOH = 1 mA  
V
CCO 0.5 −  
VCCO  
+20  
V
0.5 V < VO < VCCO  
20  
µA  
Switching characteristics  
CLOCK INPUT CLK; see Fig.4; note 1  
fclk(max)  
tCPH  
maximum clock frequency  
clock pulse width HIGH  
clock pulse width LOW  
40  
10  
10  
MHz  
ns  
tCPL  
ns  
Analog signal processing  
LINEARITY  
INL  
integral non-linearity  
fclk = 30 MHz; ramp input  
±0.4  
±1  
LSB  
LSB  
AINL  
AC integral non-linearity  
full-scale input sine  
wave; note 4  
±0.75  
±0.9  
50% full-scale input sine  
wave; note 4  
±0.5  
±0.75  
LSB  
DNL  
differential non-linearity  
f
clk = 30 MHz; ramp input  
±0.3  
±0.5  
±0.7  
LSB  
LSB  
ADNL  
AC differential non-linearity  
full-scale input sine  
wave; note 4  
±0.75  
50% full-scale input sine  
wave; note 4  
±0.3  
±1  
±0.5  
LSB  
LSB  
OFER  
GER  
offset error  
middle code;  
V
RB = 1.3 V;  
VRT = 3.43 V  
gain error (from  
device to device)  
VRB = 1.3 V;  
±0.1  
%
VRT = 3.43 V; note 5  
1998 Nov 03  
7
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
BANDWIDTH (fclk = 30 MHZ)  
B
analog bandwidth  
full-scale sine wave;  
note 6  
15  
MHz  
75% full-scale sine wave;  
note 6  
20  
MHz  
MHz  
small signal at mid-scale;  
VI = ±10 LSB at  
350  
code 256; note 6  
tSTLH  
tSTHL  
analog input settling time  
LOW-to-HIGH  
full-scale square wave;  
Fig.6; note 7  
1.5  
1.5  
3.0  
3.0  
ns  
ns  
analog input settling time  
HIGH-to-LOW  
full-scale square wave;  
Fig.6; note 7  
HARMONICS (fclk = 30 MHZ); see Figs 7 and 8  
THD total harmonic distortion  
fi = 10 MHz  
56  
dB  
dB  
SIGNAL-TO-NOISE RATIO; see Figs 7 and 8; note 8  
SNR signal-to-noise ratio (full scale) without harmonics;  
clk = 30 MHz;  
fi = 10 MHz  
53  
55  
f
EFFECTIVE BITS; see Figs 7 and 8; note 8  
ENOB effective bits  
f
clk = 30 MHz  
fi = 4.43 MHz  
fi = 10 MHz  
8.8  
8.2  
bits  
bits  
TWO-TONE; note 9  
TTIR two-tone intermodulation  
rejection  
f
clk = 30 MHz  
56  
dB  
BIT ERROR RATE  
BER  
bit error rate  
fclk = 30 MHz;  
fi = 10 MHz;  
VI = ±16 LSB at  
code 256  
1013  
times/  
sample  
DIFFERENTIAL GAIN; note 10  
Gdiff  
differential gain  
fclk = 30 MHz;  
PAL modulated ramp  
0.5  
0.3  
%
DIFFERENTIAL PHASE; note 10  
ϕdiff  
differential phase  
fclk = 30 MHz;  
°C  
PAL modulated ramp  
1998 Nov 03  
8
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Timing (fclk = 30 MHz; CL = 15 pF); see Fig.4; note 11  
tds  
th  
sampling delay time  
output hold time  
4
3
ns  
ns  
ns  
ns  
pF  
td  
output delay time  
VCCO = 4.75 V  
CCO = 3.15 V  
10  
12  
13  
15  
15  
V
CL  
digital output load  
3-state output delay times; see Fig.5  
tdZH  
tdZL  
tdHZ  
tdLZ  
enable HIGH  
enable LOW  
disable HIGH  
disable LOW  
5.5  
12  
19  
12  
8.5  
15  
24  
15  
ns  
ns  
ns  
ns  
Notes  
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock  
must not be less than 0.5 ns.  
2. Analog input voltages producing code 0 up to and including code 511:  
a) VosB (voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and  
the reference voltage BOTTOM (VRB) at Tamb = 25 °C.  
b) VosT (voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which  
produces data outputs equal to code 511 at Tamb = 25 °C.  
3. In order to ensure the optimum linearity performance of such converter architecture the lower and upper extremities  
of the converter reference resistor ladder (corresponding to output codes 0 and 511 respectively) are connected to  
pins VRB and VRT via offset resistors ROB and ROT as shown in Fig.3.  
V
RT VRB  
a) The current flowing into the resistor ladder is IL  
=
and the full-scale input range at the converter,  
˙
-----------------------------------------  
R
OB + RL + ROT  
R L  
to cover code 0 to code 511, is V = R × I =  
× (V  
VRB ) = 0.852 × (V RT VRB )  
RT  
-----------------------------------------  
I
L
L
R
OB + RL + ROT  
b) Since RL, ROB and ROT have similar behaviour with respect to process and temperature variation, the ratio  
RL  
will be kept reasonably constant from device to device. Consequently variation of the output  
-----------------------------------------  
OB + RL + ROT  
R
codes at a given input voltage depends mainly on the difference VRT VRB and its variation with temperature and  
supply voltage. When several ADCs are connected in parallel and fed with the same reference source, the  
matching between each of them is then optimized.  
4. fi = 10 MHz and fclk = 30 MHz; fi = 8 MHz and fclk = 20 MHz.  
(V511 V0) V  
5. GER =  
i(p-p) × 100  
---------------------------------------------------  
Vi(p-p)  
6. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.  
No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.  
7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale  
input (square wave signal) in order to sample the signal and obtain correct output data.  
1998 Nov 03  
9
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
8. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8 K acquisition points per equivalent  
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency  
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = ENOB × 6.02 + 1.76 dB.  
9. Intermodulation measured relative to either tone with analog input frequencies of 10.0 and 10.10 MHz. The two input  
signals have the same amplitude and the total amplitude of both signals provides full-scale to the converter.  
10. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a  
digital-to-analog converter.  
11. Output data acquisition: the output data is available after the maximum delay time of td.  
handbook, halfpage  
9
V
RT  
R
OT  
code 511  
R
L
7
V
I
RM  
L
R
LAD  
code 0  
R
OB  
6
V
RB  
MGD233  
Fig.3 Explanation of note 3.  
1998 Nov 03  
10  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
Table 1 Output coding and input voltage (typical values; referenced to AGND, VRB = 1.3 V, VRT = 3.43 V)  
BINARY OUTPUT BITS TWO’S COMPLEMENT OUTPUT BITS  
D8 D7 D6 D5 D4 D3 D2 D1 D0 D8 D7 D6 D5 D4 D3 D2 D1 D0  
STEP VI(p-p) IR  
U/F  
0
<1.46  
0
1
1
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
1
1
1
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
1.46  
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
510  
511  
O/F  
.
1
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
3.27  
>3.27  
Table 2 Mode selection  
TC OE  
D8 to D0  
IR  
X
0
1
1
0
0
high impedance  
high impedance  
active  
active; two’s complement  
active; binary  
active  
t
CPL  
t
CPH  
V
CCD  
50%  
0 V  
CLK  
sample N  
sample N + 1  
sample N + 2  
V
l
t
t
ds  
h
V
CCO  
DATA  
D0 to D8  
DATA  
N - 2  
DATA  
N - 1  
DATA  
N
DATA  
N + 1  
50%  
0 V  
t
d
MBG908  
Fig.4 Timing diagram.  
11  
1998 Nov 03  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
V
CCD  
n
OE  
50 %  
dZH  
t
t
dHZ  
HIGH  
90 %  
output  
data  
50 %  
LOW  
t
t
dZL  
dLZ  
HIGH  
output  
data  
50 %  
LOW  
10 %  
TEST  
S1  
V
CCD  
t
t
t
t
V
CCD  
dLZ  
dZL  
dHZ  
dZH  
3.3 kΩ  
15 pF  
V
CCD  
DGND  
DGND  
S1  
TDA8761A  
OE  
MBG907  
fOE = 100 kHz.  
Fig.5 Timing diagram and test conditions of 3-state output delay time.  
t
t
STLH  
STHL  
50 %  
code 511  
V
I
50 %  
code 0  
2 ns  
2 ns  
CLK  
50 %  
50 %  
MGC359  
0.5 ns  
0.5 ns  
Fig.6 Analog input settling-time diagram.  
12  
1998 Nov 03  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
MBG912  
0
amplitude  
(dB)  
20  
40  
60  
80  
100  
120  
0
1.25  
2.50  
3.76  
5.01  
6.26  
7.51  
8.77  
10.0  
f (MHz)  
Effective bits: 8.70; THD = 68.68 dB.  
Harmonic levels (dB): 2nd = 78.40; 3rd = 72.08; 4th = 75.85 dB; 5th = 76.26; 6th = 80.23.  
Fig.7 Typical Fast Fourier Transform (fclk = 30 MHz; fi = 4.43 MHz).  
MBG911  
0
amplitude  
(dB)  
20  
40  
60  
80  
100  
120  
0
1.87  
3.75  
5.62  
7.50  
9.37  
11.2  
13.1  
15.0  
f (MHz)  
Effective bits: 8.25; THD = 56.72 dB.  
Harmonic levels (dB): 2nd = 62.21; 3rd = 58.58; 4th = 80.29; 5th = 71.71; 6th = 72.04.  
Fig.8 Typical Fast Fourier Transform (fclk = 30 MHz; fi = 10 MHz).  
13  
1998 Nov 03  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
FCE166  
1
LSB  
0.8  
0.6  
0.4  
0.2  
0
0.2  
0.4  
0.6  
0.8  
1  
0
100  
200  
300  
400  
500  
Code  
Fig.9 Typical AC INL (fclk = 30 MHz; fi = 10 MHz).  
FCE165  
1
LSB  
0.8  
0.6  
0.4  
0.2  
0
0.2  
0.4  
0.6  
0.8  
1  
0
100  
200  
300  
400  
500  
Code  
Fig.10 Typical AC DNL (fclk = 30 MHz; fi = 10 MHz).  
1998 Nov 03  
14  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
INTERNAL PIN CONFIGURATIONS  
handbook, halfpage  
handbook, halfpage  
V
V
CCO  
CCA  
D8 to D0  
IR  
V
I
OGND  
AGND  
MGD231  
MGC040 - 1  
Fig.11 CMOS data and in range outputs.  
Fig.12 Analog inputs.  
handbook, halfpage  
V
handbook, halfpage  
CCA  
V
CCO  
V
V
RT  
R
LAD  
RM  
OE  
V
RB  
(TC)  
OGND  
AGND  
MBE557  
MGD232  
Fig.13 OE (TC) input.  
Fig.14 VRB, VRM and VRT inputs.  
1998 Nov 03  
15  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
handbook, halfpage  
V
CCD  
1.5 V  
CLK  
DGND  
MBE559 - 1  
Fig.15 CLK input.  
1998 Nov 03  
16  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
APPLICATION INFORMATION  
V
handbook, halfpage  
CLK  
TC  
CCD1  
1
2
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
DGND1  
IR  
V
CCA  
3
AGND  
D8  
4
n.c.  
(1)  
D7  
5
V
RB  
D6  
6
(1)  
100 nF  
V
RM  
D5  
7
AGND  
100 nF  
TDA8761A  
V
I
D4  
8
(1)  
V
RT  
D3  
9
AGND  
100 nF  
OE  
D2  
10  
11  
12  
13  
14  
AGND  
V
D1  
CCD2  
DGND2  
D0  
(2)  
V
n.c.  
CCO  
(2)  
OGND  
n.c.  
MBG906  
The analog and digital supplies should be separated and decoupled.  
The external voltage regulator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. Eventually, the  
reference ladder voltages can be derived from a well regulated VCCA supply through a resistor bridge and a decoupled capacitor.  
(1) VRB, VRM and VRT are decoupled to AGND.  
(2) Pins 15 and 16 may be connected to DGND in order to prevent noise influence.  
Fig.16 Application diagram.  
1998 Nov 03  
17  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
PACKAGE OUTLINE  
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm  
SOT341-1  
D
E
A
X
c
H
v
M
A
y
E
Z
28  
15  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
14  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
10.4  
10.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.1  
0.7  
mm  
2.0  
0.65  
1.25  
0.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
93-09-08  
95-02-04  
SOT341-1  
MO-150AH  
1998 Nov 03  
18  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
If wave soldering cannot be avoided, the following  
conditions must be observed:  
SOLDERING  
Introduction  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave)  
soldering technique should be used.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
The longitudinal axis of the package footprint must  
be parallel to the solder flow and must incorporate  
solder thieves at the downstream end.  
Even with these conditions, only consider wave  
soldering SSOP packages that have a body width of  
4.4 mm, that is SSOP16 (SOT369-1) or  
SSOP20 (SOT266-1).  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SSOP  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
Wave soldering  
Wave soldering is not recommended for SSOP packages.  
This is because of the likelihood of solder bridging due to  
closely-spaced leads and the possibility of incomplete  
solder penetration in multi-lead devices.  
1998 Nov 03  
19  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1998 Nov 03  
20  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
NOTES  
1998 Nov 03  
21  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
NOTES  
1998 Nov 03  
22  
Philips Semiconductors  
Product specification  
9-bit analog-to-digital converter  
for digital video  
TDA8761A  
NOTES  
1998 Nov 03  
23  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Middle East: see Italy  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Fax. +43 160 101 1210  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
Norway: Box 1, Manglerud 0612, OSLO,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belgium: see The Netherlands  
Brazil: see South America  
Pakistan: see Singapore  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Portugal: see Spain  
Romania: see Italy  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
Colombia: see South America  
Czech Republic: see Austria  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,  
Tel. +65 350 2538, Fax. +65 251 6500  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 0044  
Slovakia: see Austria  
Slovenia: see Italy  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580920  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1998  
SCA60  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
545104/750/03/pp24  
Date of release: 1998 Nov 03  
Document order number: 9397 750 04668  

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