TDA9901TS [NXP]
Wideband differential digital controlled variable gain amplifier; 宽带差分数字控制可变增益放大器器
| 型号： | TDA9901TS |
| 厂家： | 
NXP |
| 描述： | Wideband differential digital controlled variable gain amplifier |
| 文件： | 总20页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA9901
Wideband differential digital
controlled variable gain amplifier
Product specification
1999 Oct 08
Supersedes data of 1998 Apr 15
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
FEATURES
GENERAL DESCRIPTION
• 130 MHz, −3 dB small signal bandwidth
• Digitally controlled gain
The TDA9901 is a wideband, low noise amplifier with
differential inputs and outputs. The TDA9901 incorporates
an AGC function with digital control. The TDA9901 is
optimized for fast switching between different gain
settings, preserving small phase and amplitude error.
• TTL/CMOS compatible digital inputs (3.3 or 5 V)
• TTL single ended or differential clock input with PECL
compatibility
The TDA9901 presents an excellent combination of low
noise and good linearity for a wide input frequency range.
• 24 dB gain control range
• Five steps of 6 dB plus 6 dB fixed gain
• 30 dB gain maximum
The TDA9901 is optimized for processing IF signals in
GSM base stations. It is also suited for many other
applications as a general purpose digitally controlled
variable gain amplifier.
• High impedance differential inputs
• Low impedance differential outputs
• High power supply rejection
The TDA9901 is able to operate from 4.75 to 5.25 V
supply for the analog part and from 3.0 to 5.25 V for the
digital part.
• 125 nV/√Hz output voltage noise density at 30 dB gain
• Fast gain settling
• Dual control modes: transparent or latched.
APPLICATIONS
• Linear AGC systems
• IF amplifier in IF conversion systems (e.g. base stations
or satellite receivers)
• Instrumentation
• Multi-purpose amplifier
• Driver for differential ADCs (e.g. TDA8768).
QUICK REFERENCE DATA
SYMBOL
VDDA
PARAMETER
analog supply voltage
digital supply voltage
analog supply current
digital supply current
differential gain
CONDITIONS
MIN.
4.75
TYP.
5.0
MAX.
5.25
UNIT
V
V
VDDD
IDDA
IDDD
Gdif
3.0
−
3.3
5.25
36
30
mA
mA
dB
−
3.0
5.0
6.46
31.5
−
minimum gain
5.7
29.3
110
6.11
30.5
130
maximum gain
dB
B−3dB
Ptot
−3 dB small signal bandwidth
Vo(dif)(p-p) = 0.125 V;
Tamb = 25 °C
MHz
total power dissipation
−
160
216
mW
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA9901TS
1999 Oct 08
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
2
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
BLOCK DIAGRAM
V
GRAY1
20
V
GRAY0 CLK CLKN
TE GRAY2
DDD
18
SSD
17
2
19
1
3
4
DECODER
LATCHES
TDA9901
6
7
15
14
OUT
IN
OUTN
INN
0, 6, 12, 18 or 24 dB
6 dB
5
16
REFERENCE
GENERATOR
REFERENCE
GENERATOR
CMADC
CMVGA
11
8, 9, 10, 13
12
MGM962
V
n.c.
V
SSA
DDA
Fig.1 Block diagram.
1999 Oct 08
3
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
PINNING
SYMBOL
PIN
DESCRIPTION
GRAY0
1
digital control signal bit 0 input
(LSB)
TE
2
3
4
transparent enable input
CLK
CLKN
clock input for gain control setting
inverting clock input for gain
control setting (active low)
handbook, halfpage
GRAY0
TE
20 GRAY1
1
2
CMVGA
5
regulator output common mode
VGA input
19
18
17
GRAY2
IN
6
non-inverting analog input
inverting analog input (active low)
not connected
V
CLK
3
DDD
INN
7
V
CLKN
4
SSD
n.c.
8
CMVGA
IN
16 CMADC
15 OUT
5
n.c.
9
not connected
TDA9901TS
6
n.c.
10
11
12
13
14
15
16
not connected
INN
n.c.
OUTN
14
7
VDDA
VSSA
n.c.
analog supply voltage
analog ground
8
13 n.c.
V
not connected
n.c.
9
12
11
SSA
DDA
OUTN
OUT
CMADC
inverting analog output (active low)
non-inverting analog output
V
n.c.
10
MGM963
regulator output common mode
ADC input
VSSD
17
18
19
digital ground
VDDD
digital supply voltage
GRAY2
digital control signal bit 2 input
(MSB)
Fig.2 Pin configuration.
GRAY1
20
digital control signal bit 1 input
FUNCTIONAL DESCRIPTION
The TDA9901 provides a digitally controlled variable gain function for high-frequency applications.
The TDA9901 can be operated in two different modes, depending on the value at pin TE. When TE is at logic 1, the gain
can be instantly controlled when the clock signal is HIGH (transparent mode). The gain is fixed during the LOW period
of the clock. When TE is at logic 0 the gain of the TDA9901 is changed at the rising edge of the clock signal.
1999 Oct 08
4
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDDA
PARAMETER
MIN.
−0.3
MAX.
UNIT
analog supply voltage
digital supply voltage
+7.0
+7.0
+4.0
+7.0
10
V
V
V
V
VDDD
∆VDD
VI
−0.3
−1.0
−0.3
−
supply voltage difference between VDDA and VDDD
input voltage level
IO
output current
mA
°C
°C
°C
Tstg
Tamb
Tj
storage temperature
−55
−40
−
+150
+85
150
ambient temperature
junction temperature
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
120
K/W
CHARACTERISTICS
VDDA = V11 to V12 = 4.75 to 5.25 V; VDDD = V18 to V17 = 3.0 to 5.25 V; VSSA and VSSD shorted together;
amb = −40 to +85 °C; typical values measured at VDDA = 5.0 V; VDDD = 3.3 V and Tamb = 25 °C; unless otherwise
T
specified; note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDDA
analog supply voltage
digital supply voltage
4.75
5.0
3.3
−
5.25
V
VDDD
3.0
5.25
+2.5
V
V
∆VDD
voltage difference
−0.2
between VDDA and VDDD
IDDA
IDDD
analog supply current
digital supply current
−
−
30
36
mA
mA
3.0
5.0
Variable gain amplifier transfer characteristics
B−3dB
−3 dB small signal
bandwidth
Vo(dif)(p-p) = 0.125 V; 110
Tamb = 25 °C
130
2.5
−
−
MHz
ns
td(g)
group delay time
up to fi = 20 MHz;
minimum gain;
Tamb = 25 °C
−
−
∆td(g)
group delay difference
6 dB gain step;
−
300
ps
Tamb = 25 °C
1999 Oct 08
5
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
SYMBOL
PARAMETER
settling time
CONDITIONS
MIN.
TYP.
MAX.
UNIT
ns
tst
10 to 90% maximum −
−
3.6
output transition;
CL(max) = 5 pF on
each output;
Tamb = 25 °C
Gstep
gain step size
DC input
T
amb = 25 °C
all temperatures
DC input
amb = 25 °C
all temperatures
DC input
amb = 25 °C
all temperatures
5.88
6.09
6.09
6.28
6.56
dB
dB
5.6
G(min)
G(max)
∆G/∆T
minimum gain setting
maximum gain setting
T
5.76
5.7
6.11
6.11
6.40
6.46
dB
dB
T
29.9
29.3
−
30.5
30.5
−1.0
−7.5
15
30.9
31.5
−
dB
dB
gain stability as a function minimum gain
mdB/°C
mdB/°C
mdB/V
of temperature
maximum gain
−
−
|∆G/∆VDD
∆Vi(offset)
F
|
gain stability as a function minimum gain
of power supply
−
25
input offset voltage
difference
6 dB gain step
−
0.8
−
mV
noise figure
Rs = 100 Ω;
fi = 20 MHz
minimum gain
maximum gain
−
−
29.1
9.9
−
−
dB
dB
Vn(o)(eq)
equivalent output noise
voltage spectral density
Rs = 100 Ω;
fi = 20 MHz;
Tamb = 25 °C
G = 6 dB
−
−
−
−
−
75
82
97
91
124
−
−
−
−
−
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
G = 12 dB
G = 18 dB
G = 24 dB
G = 30 dB
PSRR(VDDA)
PSRR(VDDD)
CMRR
power supply ripple
rejection of VDDA
minimum gain
0 to 20 MHz
20 to 100 MHz
minimum gain
0 to 20 MHz
20 to 100 MHz
0 to 20 MHz
20 to 150 MHz
−
−
57
39
−
−
dB
dB
dB
dB
dB
dB
dB
power supply ripple
rejection of VDDD
−
−
−
−
67
51
75
45
−
−
−
−
common mode rejection
ratio
1999 Oct 08
6
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Analog inputs
Vi(max)(p-p)
maximum input voltage
(peak-to-peak value)
minimum gain
maximum gain
−
1.0
−
−
V
V
−
60.4
2.7
mV
V
Vi(cm)
common mode input
voltage
2.0
DDA − 1.9
Ii
input current
Vi(cm) = 2.7 V
−
55
−
−
−
5
µA
kΩ
pF
Ri
Ci
input resistance
input capacitance
10
−
−
Analog outputs; note 2
Vo(max)(p-p)
maximum differential
output voltage
(peak-to-peak value)
maximum gain
minimum gain
2.0
2.0
−
−
−
−
V
V
Vo(cm)
common mode output
voltage
referenced to VDDA
Tamb = 25 °C
;
VDDA − 2.56 VDDA − 2.42 VDDA − 2.29 V
∆Vo(cm)/∆T
common mode output
voltage variation with
temperature
−
−1.8
−
−
mV/°C
V/µs
SRo(se)
single-ended output slew
rate
−
275
Ro
Co
output resistance
−
−
15
3
26
Ω
output capacitance
−
pF
Variable gain amplifier dynamic performance; CL = 5 pF; RL = 680 Ω (see Figs 6, 7, 8, 9 and 10)
HD2
2nd harmonic distortion
Vo = Vo(max)
fi = 0.5 MHz
fi = 4.43 MHz
fi = 12.5 MHz
fi = 21.4 MHz
−
−
−
−
−80
−77
−76
−74
−67
−67
−65
−62
dBc
dBc
dBc
dBc
HD3
3rd harmonic distortion
Vo = Vo(max);
Tamb = 25 °C
fi = 0.5 MHz
fi = 4.43 MHz
fi = 12.5 MHz
fi = 21.4 MHz
fi = 21.4 MHz
−
−
−
−
−
−64
−64
−62
−61
80
−60
−59
−58
−57
−
dBc
dBc
dBc
dBc
∆HD3/∆T
3rd harmonic distortion
mdB/°C
variation with temperature
Reference voltage output ADC: pin CMADC
Vref(CMADC)
ADC reference output
voltage
referenced to VDDA
Tamb = 25 °C
;
VDDA − 1.64 VDDA − 1.45 VDDA − 1.26 V
Ro(CMADC)
output resistance
Tamb = 25 °C
−
−
17
26
Ω
∆Vref(CMADC)/∆T ADC reference output
voltage variation with
−0.11
−
mV/°C
temperature
1999 Oct 08
7
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
mA
pF
Io(CMADC)(max)
Co(CMADC)
maximum output current
output capacitance
−
−
1.0
3
−
−
Reference voltage output VGA: pin CMVGA
Vref(CMVGA)
VGA reference output
voltage
referenced to VDDA
Tamb = 25 °C
;
VDDA − 2.48 VDDA − 2.30 VDDA − 2.17 V
Ro(CMVGA)
output resistance
Tamb = 25 °C
−
−
9
20
Ω
∆Vref(CMVGA)/∆T VGA reference output
voltage variation with
1.75
−
mV/°C
temperature
Io(CMVGA)(max)
Co(CMVGA)
maximum output current
output capacitance
−
−
1.0
3
−
−
mA
pF
Gain switching characteristics (in latched mode); fCLK = 52 MHz; Tamb = 25°C; (see Fig.3)
th
input data hold time
input data set-up time
input data pulse width
propagation delay time
gain settling time
2.0
3.8
5.8
−
−
−
ns
ns
ns
ns
ns
tsu
−
−
tW
−
−
tPD1
tset1
4.2
2.6
5.9
3.2
10 to 90% full scale
if ±6 dB gain
−
change; note 3
Gain switching characteristics (in transparent mode); fCLK = 52 MHz; Tamb = 25°C; (see Fig.4)
tPD2
tset2
propagation delay time
gain settling time
−
−
6.7
5.4
9.5
6.9
ns
ns
10 to 90% full scale
if ±6 dB gain
change; note 4
Clock timing input: pins CLK and CLKN (see Fig.3)
fCLK(max)
maximum clock frequency
clock LOW pulse width
clock HIGH pulse width
rise time
52
4.0
4.0
−
−
−
−
4
4
−
−
−
−
−
MHz
ns
tCPL
tCPH
tr
ns
ns
tf
fall time
−
ns
Digital inputs: pins TE, GRAY0, GRAY1 and GRAY2
VIL
VIH
IIH
IIL
LOW-level input voltage
HIGH-level input voltage
HIGH-level input current
LOW-level input current
input capacitance
0
−
−
−
−
−
0.8
VDDD
+10
+10
3
V
2.0
−10
−10
−
V
µA
µA
pF
Ci
Clock inputs in TTL mode
VIL
VIH
IIH
LOW-level input voltage
note 5
note 5
0
−
−
−
−
0.8
V
HIGH-level input voltage
HIGH-level input current
LOW-level input current
2.0
15
−40
VDDD
80
V
µA
µA
IIL
−10
1999 Oct 08
8
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
pF
Ci
input capacitance
−
−
2
Clock inputs in differential mode
VIL
LOW-level input voltage
VDDA = 5.0 V; note 6 3.19
−
−
−
−
−
−
3.52
4.12
80
V
VIH
HIGH-level input voltage
HIGH-level input current
LOW-level input current
input capacitance
VDDA = 5.0 V; note 6 3.83
V
IIH
15
−40
−
µA
µA
pF
V
IIL
−5
Ci
2
∆Vi(CLK )(p-p)
differential AC input
voltage for switching
CLK or CLKN
DC voltage
0.1
2.0
level = 2.5 V
(peak-to-peak value)
Notes
1. Due to on-chip regulator behaviour a warm-up time of 1 minute (typical) is recommended for optimal performance.
2. The analog output voltages are positive with respect to AGND.
3. In latching mode (TE = 0), the gain settling is latched at the rising edge of the clock input.
4. In transparent mode, the gain settling is directly controlled by the input data pattern.
5. The circuit may be used with a single TTL clock on CLK or CLKN. The non used clock pin has to be decoupled to
ground with a 100 nF capacitance.
6. There are four modes of operation for the clock inputs in non TTL mode:
a) PECL mode 1: (DC level vary 1 : 1 with VDDA) CLK and CLKN inputs are differential PECL levels.
b) PECL mode 2: (DC level vary 1 : 1 with VDDA) CLK input is at PECL level and gain change takes place on the
rising edge of the clock input signal when in latched mode. A DC level of 3.65 V has to be applied on CLKN
decoupled to VSSD via a 100 nF capacitor.
c) PECL mode 3: (DC level vary 1 : 1 with VDDA) CLKN input is at PECL level and gain change takes place on the
rising edge of the clock input signal when in latched mode. A DC level of 3.65 V has to be applied on CLK
decoupled to VSSD via a 100 nF capacitor.
d) AC driving mode 4: when driving the CLK input directly and with any AC signal of minimum 0.1 V (p-p) and with
a DC level of 2.5 V, the gain change takes place on the rising edge of the clock signal. When driving the CLKN
input with the same signal, gain change takes place on the falling edge of the clock signal. It is recommended to
decouple the CLKN or CLK input to VSSD via a 100 nF capacitor.
Table 1 Input coding
GREY INPUT DATA CODE
STATE
GAIN (dB)
minimum
D2
D1
D0
0
0
0
0
0
1
−
0
0
1
1
1
−
0
1
1
0
0
−
1
minimum + 6
minimum + 12
minimum + 18
minimum + 24
minimum + 24
2
3
4
Other
1999 Oct 08
9
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
t
t
f
r
LOW
HIGH
CLK
50 %
t
t
CPL
CPH
LOW
HIGH
GRAY0
GRAY1
GRAY2
gain N + 1
gain N
50 %
t
t
su
h
V
o(max)
OUT
and
OUTN
90 %
10 %
gain N + 1
gain N
0.5V
0 V
o(max)
t
set1
t
PD1
MGM964
Fig.3 Latched mode timing diagram.
LOW
GRAY0
GRAY1
GRAY2
gain N + 1
gain N
50 %
HIGH
V
o(max)
OUT
and
OUTN
90 %
10 %
gain N + 1
gain N
0.5V
0 V
o(max)
t
set2
t
PD2
MGM965
Fig.4 Transparent mode timing diagram with CLK HIGH.
10
1999 Oct 08
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
47 nF
V
CMVGA
5
OUT
i
42
15
(1)
C1
IN
680 Ω
6
FILTER
12
D0...11
TDA9901TS
TDA8768
100
Ω
(ADC)
sine wave
generator
100 Ω
100
nF
680 Ω
V
7
INN
OUTN
i
14
43
36
(1)
47 nF
C2
CLK
30 MHz
(2)
(3)
dB
FCE306
(1) C1 and C2 represent the board line capacitance. They represent about 5 pF with the TDA8768 input capacitance. Special
care has to be taken to minimize this load in order to have the best dynamic performance.
(2) The HD2 and HD3 of the TDA8768 is lower than that measured on the TDA9901.This measurement method is preferred to
conventional methods due to its low contribution to the HD2.
(3) The chain measurement shows the harmonic distortion of the TDA9901 as the measurement from TDA8768 is negligible.
Fig.5 Dynamic distortion measurement diagram.
FCE307
FCE308
−55
handbook, halfpage
HD
−55
handbook, halfpage
HD
(dBc)
(dBc)
−60
−60
(1)
(2)
−65
−70
−75
−80
−85
−65
−70
−75
−80
−85
(1)
(2)
−1
2
−1
2
10
1
10
10
10
1
10
10
f (MHz)
f (MHz)
(1) HD3
(2) HD2
(1) HD3
(2) HD2
Typical condition; 2 V (p-p) differential output.
Typical condition; 2 V (p-p) differential output.
Fig.6 Harmonic distortion as a function of
frequency for minimum gain.
Fig.7 Harmonic distortion as a function of
frequency for minimum gain plus 6 dB.
1999 Oct 08
11
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
FCE309
FCE310
−55
handbook, halfpage
HD
−55
handbook, halfpage
HD
(dBc)
−60
(dBc)
−60
(1)
−65
−65
−70
−75
−80
−85
(1)
−70
−75
(2)
(2)
−80
−85
−1
2
−1
2
10
10
1
10
10
10
1
10
f (MHz)
f (MHz)
(1) HD3
(2) HD2
(1) HD3
(2) HD2
Typical condition; 2 V (p-p) differential output.
Typical condition; 2 V (p-p) differential output.
Fig.8 Harmonic distortion as a function of
Fig.9 Harmonic distortion as a function of
frequency for minimum gain plus 18 dB.
frequency for minimum gain plus 12 dB.
FCE311
−55
handbook, halfpage
HD
(dBc)
−60
−65
−70
−75
−80
−85
(1)
(2)
−1
2
10
1
10
10
f (MHz)
(1) HD3
(2) HD2
Typical condition; 2 V (p-p) differential output.
Fig.10 Harmonic distortion as a function of
frequency for minimum gain plus 24 dB.
1999 Oct 08
12
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
APPLICATION INFORMATION
GRAY1
GRAY2
GRAY0
TE
1
2
3
4
5
20
19
18
17
16
100 nF
CLK
3.3 V
(1)
CLKN
100
nF
47
µF
100
nF
47
µF
(2)
(2)
TDA9901TS
R1
R2
47 nF
47 nF
100 nF
IN
V
6
15
OUT
IN
100 Ω
100 Ω
INN
7
14
13
12
11
OUTN
1:1
n.c.
n.c.
n.c.
n.c.
8
9
100 nF
10
5 V
MGM966
(1) Single-ended clock signal can be applied if required.
(2) R1 and R2 should be at least 680 Ω.
Fig.11 Application diagram.
1999 Oct 08
13
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
PACKAGE OUTLINE
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A
X
c
y
H
v
M
A
E
Z
11
20
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
10o
0o
0.15
0
1.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.45
0.65
0.45
0.48
0.18
mm
1.5
0.65
1.0
0.2
0.25
0.13
0.1
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
90-04-05
95-02-25
SOT266-1
1999 Oct 08
14
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Oct 08
15
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Oct 08
16
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
NOTES
1999 Oct 08
17
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
NOTES
1999 Oct 08
18
Philips Semiconductors
Product specification
Wideband differential digital controlled
variable gain amplifier
TDA9901
NOTES
1999 Oct 08
19
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Pakistan: see Singapore
Belgium: see The Netherlands
Brazil: see South America
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America
Czech Republic: see Austria
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/25/02/pp20
Date of release: 1999 Oct 08
Document order number: 9397 750 05272
相关型号：
TDA9910
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC) direct/ultra high IF sampling
NXP
TDA9910HW/6
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC) direct/ultra high IF sampling
NXP
TDA9910HW/8
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC) direct/ultra high IF sampling
NXP
TDA9910HW/8/C1
IC 1-CH 12-BIT RESISTANCE LADDER ADC, PARALLEL ACCESS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, PLASTIC, SOT545-2, MS-026, HTQFP-48, Analog to Digital Converter
NXP
TDA9917HW/12/C1
IC 1-CH 8-BIT RESISTANCE LADDER ADC, PARALLEL ACCESS, PQFP48, 7 X 7 MM, 1.00 MM HEIGHT, PLASTIC, MS-026, SOT545-2, QFP-48, Analog to Digital Converter
NXP
TDA9917HW/25/C1
IC 1-CH 8-BIT RESISTANCE LADDER ADC, PARALLEL ACCESS, PQFP48, 7 X 7 MM, 1.00 MM HEIGHT, PLASTIC, MS-026, SOT545-2, QFP-48, Analog to Digital Converter
NXP
TDA9923AHW
IC 4-CH 12-BIT RESISTANCE LADDER ADC, SERIAL ACCESS, PQFP48, 7 X 7 MM, 1.00 MM HEIGHT, PLASTIC, MS-026, SOT545-3, QFP-48, Analog to Digital Converter
NXP
©2020 ICPDF网 联系我们和版权申明