TEA1111AT [NXP]
Speech circuit with dialler interface, regulated supply and earpiece volume control; 语音电路拨号接口，稳压电源和耳机音量控制
| 型号： | TEA1111AT |
| 厂家： | 
NXP |
| 描述： | Speech circuit with dialler interface, regulated supply and earpiece volume control |
| 文件： | 总24页 (文件大小：133K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TEA1111A
Speech circuit with dialler interface,
regulated supply and earpiece
volume control
Product specification
1999 Nov 22
Supersedes data of 1999 Sep 28
File under Integrated Circuits, IC03
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
FEATURES
APPLICATIONS
• Low DC line voltage; operates down to 1.5 V (excluding
voltage drop across external polarity guard)
• Line powered telephone sets with LCD module
• Cordless telephones
• Line voltage regulator with adjustable DC voltage
• Fax machines
• 3.25 V regulated strong supply point for peripheral
circuits compatible with:
• Answering machines.
– Speech mode
– Ringer mode
GENERAL DESCRIPTION
The TEA1111A is a bipolar integrated circuit that performs
all speech and line interface functions required in fully
electronic telephone sets. It performs electronic switching
between speech and dialling. The IC operates at a line
voltage down to 1.5 V DC (with reduced performance) to
facilitate the use of telephone sets connected in parallel.
– Trickle mode.
• Transmit stage with:
– Microphone amplifier with symmetrical high
impedance inputs
– DTMF amplifier with confidence tone on earpiece.
When the line current is high enough, a fixed amount of
current is derived from the LN pin in order to create a
strong supply point at pin VDD. The voltage at pin VDD is
regulated to 3.25 V to supply peripherals such as dialler,
LCD module and microcontroller.
• Receive stage with:
– Earpiece amplifier with adjustable gain and volume
control.
• MUTE input for pulse or DTMF dialling
• AGC line loss compensation for microphone and
earpiece
• LED control output.
QUICK REFERENCE DATA
Iline = 15 mA; VEE = 0 V; VVCI = 0 V; RSLPE = 20 Ω; AGC pin connected to VEE; Zline = 600 Ω; f = 1 kHz; measured
according to test circuits given in Figs 14, 15 and 16; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
line current operating range
CONDITIONS
MIN. TYP. MAX. UNIT
Iline
normal operation
11
1
−
−
140
11
mA
mA
with reduced
performance
VLN
ICC
DC line voltage
3.7
−
4.0
4.3
V
internal current consumption
VCC = 3.3 V
1.15 1.4
3.3
mA
V
VCC
VDD
supply voltage for internal circuitry (unregulated) IP = 0 mA
regulated supply voltage for peripherals
−
−
speech mode
IDD = −3 mA
2.95 3.25 3.55
V
ringer mode
IDD = 75 mA
3.0
3.3
3.6
V
IDD
available supply current for peripherals
typical voltage gain for microphone amplifier
typical voltage gain for earpiece amplifier
volume control range for earpiece amplifier
−
−
−3
mA
Gv(TX)
Gv(QR)
∆Gv(QR)
∆Gv(trx)
VMIC = 4 mV (RMS)
VIR = 4 mV (RMS)
43.2 44.2 45.2 dB
26.4 27.4 28.4 dB
0
14.5
6.0
−
−
dB
dB
gain control range for microphone and earpiece Iline = 85 mA
amplifiers with respect to Iline = 15 mA
−
∆Gv(trx)(m) gain reduction for microphone and earpiece
MUTE = LOW
−
80
−
dB
amplifiers
1999 Nov 22
2
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
DESCRIPTION
VERSION
TEA1111AT
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
BLOCK DIAGRAM
VCI
9
GAR
12
receive
amplifier
4
IR
V
I
VOLUME
CONTROL
11
QR
earpiece
amplifier
8
MUTE
V
I
CURRENT AND
VOLTAGE
0.5V
CC
REFERENCE
6
DTMF
ATTENUATOR
16
7
V
V
CC
DD
V
DD
REGULATOR
V
I
13
14
1
MIC+
MIC−
LN
V
I
microphone
amplifier
AGC
CIRCUIT
10
V
EE
LOW VOLTAGE
CIRCUIT
5
AGC
LED CONTROL
15
TEA1111A
3
2
FCA051
REG
LEDC
SLPE
Fig.1 Block diagram.
3
1999 Nov 22
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
PINNING
SYMBOL PIN
DESCRIPTION
positive line terminal
LN
1
2
3
4
5
SLPE
REG
IR
slope (DC resistance) adjustment
line voltage regulator decoupling
receive amplifier input
handbook, halfpage
V
LN
SLPE
REG
IR
1
2
3
4
5
6
7
8
16
15
14
13
CC
AGC
automatic gain control/
line loss compensation
LEDC
MIC−
MIC+
DTMF
VDD
6
7
8
dual-tone multi-frequency input
regulated supply for peripherals
TEA1111A
MUTE
mute input to select speech or
dialling mode (active LOW)
AGC
DTMF
12 GAR
11 QR
VCI
9
volume control input
V
V
10
9
DD
EE
VEE
10 negative line terminal
VCI
MUTE
QR
11 earpiece amplifier output
12 earpiece amplifier gain adjustment
FCA052
GAR
MIC+
13 non-inverting microphone amplifier
input
MIC−
LEDC
VCC
14 inverting microphone amplifier input
15 LED control output
Fig.2 Pin configuration.
16 supply voltage for internal circuit
FUNCTIONAL DESCRIPTION
The voltage at pin LN is:
All data given in this chapter concerns typical values,
except when otherwise specified.
VLN = Vref + RSLPE × ISLPE
ISLPE = Iline − ICC − IP − ISUP − ILEDC
Supply (pins LN, SLPE, REG, VCC and VDD
)
where:
Iline = line current
The supply for the TEA1111A and its peripherals is
obtained from the telephone line (see Fig.3).
I
CC = current consumption of the IC
IP = supply current for external circuits
THE LINE INTERFACE (PINS LN, SLPE AND REG)
ISUP = current consumed between LN and VEE by the
VDD regulator
The IC generates a stabilized reference voltage (Vref)
across pins LN and SLPE. Vref is temperature
compensated and can be adjusted by using an external
resistor (RVA). Vref equals 3.8 V and can be increased by
connecting RVA between pins REG and SLPE or
decreased by connecting RVA between pins REG and LN.
The voltage at pin REG is used by the internal regulator to
generate Vref and is decoupled by CREG, which is
connected to VEE. This capacitor, converted to an
equivalent inductance, (see Section “Set impedance”)
determines the set impedance conversion from its DC
value (RSLPE) to its AC value (RCC in the audio-frequency
range). The voltage at pin SLPE is proportional to the line
current.
ILEDC = supply current for external LED circuitry.
The preferred value for RSLPE is 20 Ω. Changing RSLPE will
affect more than the DC characteristics; it also influences
the microphone and DTMF gains, the gain control
characteristics, the sidetone level and the maximum
output swing on the line.
The DC line current flowing into the set is determined by
the exchange supply voltage (VEXCH), the feeding bridge
resistance (REXCH), the DC resistance of the telephone
line (Rline) and the reference voltage (Vref). With line
currents below Ilow (9 mA), the internal reference voltage
(generating Vref) is automatically adjusted to a lower value.
1999 Nov 22
4
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
This means that several sets can operate in parallel with
DC line voltages (excluding the polarity guard) down to an
absolute minimum voltage of 1.5 V. At line currents below
Ilow, the circuit has limited sending and receiving levels.
This is called the low voltage area.
The VCC voltage (see also Figs 4 and 5) depends on the
current consumed by the IC and the peripheral circuits as:
VCC0 = VLN − RCC × ICC
VCC = VCC0 − RCC × (IP + Irec
)
Where Irec is the current consumed by the output stage of
the earpiece amplifier.
THE INTERNAL SUPPLY POINT (PIN VCC
)
The internal circuitry of the TEA1111A is supplied from
pin VCC. This voltage supply is derived from the line
voltage by means of a resistor (RCC) and must be
decoupled by a capacitor CVCC. It may also be used to
supply some external circuits.
R
R
I
CC
line
line
I
LEDC
I
I
LN
CC
V
LN
CC
C
VCC
I
P
100 µF
LEDC
LED
CIRCUIT
from preamplifier
I
SUP
internal
circuitry
V
V
DD
DD
REGULATOR
LED
CONTROL
external
circuits
R
I
EXCH
DD
peripherals
TEA1111A
V
EXCH
V
SLPE
REG
C
C
EE
VDD
220 µF
REG
R
SLPE
20 Ω
I
SLPE
4.7 µF
FCA053
Fig.3 Supply configuration.
5
1999 Nov 22
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
R
V
handbook, halfpage
CC
CC
I
EXTERNAL
CIRCUITS
I
rec
P
V
CC0
V
MGK806
EE
Fig.4 VCC used as supply voltage for external circuits.
FCA054
2
handbook, halfpage
I
P
(mA)
1.6
1.2
0.8
(1)
(2)
0.4
0
2.2
2.6
3.0
3.4
V
(V)
CC
VCC ≥ 2.2 V; VLN = 4 V at Iline = 15 mA; RCC = 619 Ω; RSLPE = 20 Ω.
(1) Curve 1 is valid when the earpiece amplifier is driven: VQR(rms) = 150 mV; RL = 150 Ω.
(2) Curve 2 is valid when the earpiece amplifier is not loaded.
Fig.5 Typical current IP available from VCC for peripheral circuitry.
1999 Nov 22
6
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
THE REGULATED SUPPLY POINT (PIN VDD
)
• Ringer mode: The regulator operates as a shunt
stabilizer to keep VDD at 3.3 V. The input voltage
VLN equals 0 V while the input current into pin VDD is
delivered by the ringing signal. VDD has to be decoupled
The VDD regulator delivers a stabilized voltage for the
peripherals in transmission mode (nominal VLN) as well as
in ringer mode (VLN = 0 V). The regulator (see Fig.6)
consists of a sense input circuit fed by pin LN, a current
switch and a VDD output stabilizer.
by a capacitor CVDD
.
• Trickle mode: When VDD is below 2 V, the regulator is
inhibited. The current consumption of the VDD regulator
in trickle mode is very low to save most of the trickle
current for memory retention of a dialler.
The regulator function depends on the transmission, ringer
and trickle modes as follows:
• Transmission mode: The regulator operates as a current
source at the LN input; it takes a constant current of
ISUP = 4.3 mA (at nominal conditions) from pin LN.
The current switch reduces the distortion on the line at
large signal swings. Output VDD follows the DC voltage
at pin LN (with typically 0.35 V difference) up to
VDD = 3.25 V. The input current of the regulator is
constant while the output (source) current is determined
by the consumption of the peripherals. The difference
between input and output currents is shunted by the
internal VDD stabilizer.
R
R
I
line
CC
line
I
I
LN
CC
V
LN
CC
C
VCC
V
DD
100 µF
R
I
EXCH
I
SUP
DD
SENSE
SWITCH
peripherals
V
EXCH
V
regulator
DD
C
VDD
220 µF
TEA1111A
V
EE
FCA055
Fig.6 VDD regulator configuration.
7
1999 Nov 22
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
LED control (pin LEDC)
The TEA1111A gives an on-hook/off-hook status
indication. This is achieved by a current made available at
pin LEDC to drive an external LED circuit connected
between pins SLPE and LN (see Fig.7). In the low voltage
area, which corresponds to low line current conditions, no
current is available for this LED. For line currents higher
than a threshold, the LEDC current increases
proportionally to the line current (with a ratio of 1:150).
The LEDC current is internally limited to 470 µA
(see Fig.8).
LN
24
Ω
2.4
kΩ
LEDC
BC858B
I
line – 12
For 12 mA < Iline < 82 mA:
ILEDC
=
--------------------
150
This LED circuit is referenced to SLPE. Consequently, all
the LED supply current will flow through the RSLPE resistor,
and does not affect the behaviour of the AGC.
SLPE
FCA056
Set impedance
In the audio frequency range, the dynamic impedance is
mainly determined by the RCC resistor. The equivalent
impedance of the circuit is illustrated in Fig.9.
Fig.7 LED circuit configuration.
FCA057
500
handbook, halfpage
I
LEDC
(µA)
LN
handbook, halfpage
400
R
CC
R
L
P
EQ
619 Ω
V
REG
V
CC
ref
300
200
100
0
SLPE
R
C
C
SLPE
20 Ω
REG
VCC
4.7 µF
100 µF
V
EE
MBE788
0
20
40
60
80
(mA)
100
I
line
LEQ = CREG × RSLPE × RP.
RP = internal resistance.
RP = 17.5 kΩ.
Fig.8 LEDC current versus line current.
Fig.9 Equivalent impedance between LN and VEE.
1999 Nov 22
8
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
Transmit stage (pins MIC+, MIC− and DTMF)
MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
Automatic gain control is provided on this amplifier for line
loss compensation.
The TEA1111A has symmetrical microphone inputs.
The input impedance between pins MIC+ and MIC− is
68 kΩ (2 × 34 kΩ). The voltage gain from pins MIC+/MIC−
to pin LN is set at 44.2 dB (typical) at 600 Ω line load.
VOLUME CONTROL (PIN VCI)
A positive DC voltage applied to pin VCI allows the gain of
the earpiece amplifier to be increased in steps of 4.85 dB.
The volume control range is 27.4 to 41.9 dB (14.5 dB
typical). A proportional voltage decoder at pin VCI defines
a gain of 27.4 dB when VVCI equals VEE and a gain of
Automatic gain control is provided on this amplifier for line
loss compensation.
41.9 dB when VVCI equals VDD
.
DTMF AMPLIFIER (PIN DTMF)
1
--
3
The intermediate steps correspond to: VVCI
2
=
V
DD
When the DTMF amplifier is enabled, dialling tones may
be sent on line. These tones are also sent to the receive
output QR at a low level (confidence tone), the level is
controlled by pin VCI.
and VVCI
=
V
.
DD
--
3
The TEA1111A has an asymmetrical DTMF input.
The input impedance between DTMF and VEE is 20 kΩ
and it is biased at VEE. The voltage gain from pin DTMF to
pin LN is set at 25.9 dB.
Automatic gain control (pin AGC)
The TEA1111A performs automatic line loss
compensation. The automatic gain control varies the gain
of the microphone amplifier and the gain of the receive
amplifier in accordance with the DC line current.
Automatic gain control has no effect on the DTMF
amplifier.
The control range is 6.0 dB (which corresponds
approximately to a line length of 5 km for a 0.5 mm
diameter twisted-pair copper cable with a DC resistance of
176 Ω/km and an average attenuation of 1.2 dB/km).
Receiving stage (pins IR, GAR, QR and VCI)
The receive part consists of an earpiece amplifier and a
volume control block.
The IC can be used with different configurations of feeding
bridge (supply voltage and bridge resistance) by
connecting an external resistor RAGC between
EARPIECE AMPLIFIER
The earpiece amplifier has one input (IR) and one output
(QR). The input impedance between pin IR and pin VEE is
22 kΩ. When pin VCI is tied to VEE, the voltage gain from
pin IR to pin QR is set at 27.4 dB (typical) which reduces
the attenuation of the receive signal by the anti-sidetone
network from 32 dB to 4.6 dB. The gain can be decreased
by connecting an external resistor RGARext between
pins GAR and QR; the adjustment range is 6 dB.
Two external capacitors CGAR (connected between
pins GAR and QR) and CGARS (connected between
pins GAR and VEE) ensure stability. Capacitor CGAR
provides a first-order low-pass filter. The cut-off frequency
corresponds to the time constant CGAR × RGARint. Where
RGARint is the internal resistor (123 kΩ typical) which sets
the gain. The relationship CGARS = 10 × CGAR must be
complied with to ensure stability.
pins AGC and VEE. This resistor enables the Istart and Istop
line currents to be increased (the ratio between Istart and
Istop is not affected by the resistor). The AGC function is
disabled when pin AGC is left open circuit.
Mute function (pin MUTE)
The mute function performs the switching between the
speech mode and the dialling mode.
When MUTE is LOW, the DTMF input is enabled and the
microphone and receive amplifier inputs are disabled.
In this mode, the DTMF tones are sent to the receive
output at a low level (confidence tone).
When MUTE is HIGH, the microphone and receiving
amplifiers inputs are enabled while the DTMF input is
disabled. The MUTE input is provided with an internal
The output voltage of the earpiece amplifier is specified for
continuous wave drive. The maximum output swing
depends on the DC line voltage, the RCC resistor, the ICC
current consumption of the circuit, the IP current
consumption of the peripheral circuits and the load
impedance.
pull-up current source to VDD
.
1999 Nov 22
9
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
Sidetone suppression
The anti-sidetone network for the TEA1111A attenuates
the receive signal from the line by 32 dB before it enters
the receive stage. The attenuation is almost constant over
the whole audio frequency range.
The TEA1111A anti-sidetone network comprising
RCC // Zline, Rast1, Rast2, Rast3, RSLPE and Zbal (see Fig.10)
suppresses the transmitted signal in the earpiece.
Maximum compensation is obtained when the following
conditions are fulfilled:
A Wheatstone bridge configuration (see Fig.11) may also
be used.
R
SLPE × Rast1 = RCC × (Rast2 + Rast3 )
More information on the balancing of an anti-sidetone
bridge can be obtained in our publication “Semiconductors
for Wired Telecom Systems; Applications Handbook
IC03b”.
R
ast2 × (Rast3 + RSLPE
------------------------------------------------------------
ast1 × RSLPE
)
k =
R
For ordering information, please contact the Philips
Semiconductors sales office.
Z bal = k × Zline
The scale factor k is chosen to meet the compatibility with
a standard capacitor from the E6 or E12 range for Zbal
.
In practice, Zline varies considerably with the line type and
the line length. Therefore, the value of Zbal should be for an
average line length, which gives satisfactory sidetone
suppression with short and long lines. The suppression
also depends on the accuracy of the match between Zbal
and the impedance of the average line.
LN
R
R
CC
ast1
Z
line
IR
I
V
m
EE
Z
ir
R
ast2
R
SLPE
R
ast3
Z
bal
SLPE
MBE787
Fig.10 Equivalent circuit of TEA1111A anti-sidetone bridge.
1999 Nov 22
10
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
LN
R
Z
CC
bal
Z
line
IR
I
V
m
EE
Z
ir
R
SLPE
R
R
A
ast1
SLPE
MBE786
Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VLN
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
positive continuous line voltage
V
EE − 0.4 12
V
V
repetitive line voltage during switch-on or
line interruption
V
EE − 0.4 13.2
IDD
maximum input current at pin VDD
supply voltage
−
75
mA
V
VCC
V
V
V
EE − 0.4 12
VMUTE, VVCI maximum voltage on pins MUTE and VCI
EE − 0.4 VDD + 0.4 V
EE − 0.4 VCC + 0.4 V
Vn(max)
maximum voltage on all pins except
pins VDD, MUTE and VCI
Iline
Ptot
Tstg
Tamb
Tj
line current
RSLPE = 20 Ω; see Fig.12 −
140
mA
TEA1111AT total power dissipation
storage temperature
ambient temperature
junction temperature
Tamb = 75 °C; see Fig.12
−
416
mW
°C
−40
−25
−
+125
+75
°C
+125
°C
1999 Nov 22
11
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
110
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air; note 1
K/W
Note
1. Mounted on epoxy board 40.1 × 19.1 × 1.5 mm.
FCA058
150
130
I
LN
(mA)
110
90
(4)
(3)
(2)
(1)
70
50
30
2
3
4
5
6
7
8
9
10
11
− V
12
V
(V)
LN
SLPE
(1) Tamb = 45 °C; Ptot = 0.666 W.
(2) Tamb = 55 °C; Ptot = 0.583 W.
(3) Tamb = 65 °C; Ptot = 0.500 W.
(4) Tamb = 75 °C; Ptot = 0.416 W.
Fig.12 SO16 safe operating area (TEA1111AT).
12
1999 Nov 22
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
CHARACTERISTICS
Iline = 15 mA; VEE = 0 V; VVCI = 0 V; RSLPE = 20 Ω; pin AGC connected to VEE; Zline = 600 Ω; f = 1 kHz; measured
according to test circuits given in Figs 14, 15 and 16; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pins LN, VCC, SLPE, REG and VDD
)
THE LINE INTERFACE (PINS LN, SLPE AND REG)
Vref
stabilized reference voltage
between pins LN and SLPE
3.5
3.8
4.1
V
VLN
DC line voltage
Iline = 1 mA
−
1.5
2.5
4.0
6.7
3.6
−
V
V
V
V
V
I
I
line = 4 mA
line = 15 mA
−
−
3.7
−
4.3
7.2
−
Iline = 140 mA
VLN(Rext)
DC line voltage with an
external resistor RVA
RVA = 90 kΩ (between
pins LN and REG)
−
∆VLN(T)
DC line voltage variation with
temperature referenced to
25 °C
Tamb = −25 to +75 °C
−
±40
−
mV
THE INTERNAL SUPPLY POINT (PIN VCC
)
ICC
internal current consumption
VCC = 3.3 V
IP = 0 mA
−
−
1.15
3.3
1.4
mA
V
VCC
supply voltage for internal
circuitry
−
THE REGULATED SUPPLY POINT (PIN VDD
)
ISUP
input current of the VDD
regulator (current from pin LN
not flowing through pin SLPE)
I
line = 1 mA
Iline = 4 mA
line ≥ 11 mA
−
−
−
0
−
−
−
mA
mA
mA
1.2
4.3
I
VDD
regulated supply voltage in:
speech mode
IDD = −3 mA;
2.95
3.25
3.55
V
VLN > 3.6 V + 0.28 V (typ.);
I
line ≥ 11 mA
speech mode at reduced
performance
I
line = 4 mA
−
V
LN − 0.35 −
V
V
ringer mode
I
line = 0 mA; IDD = 75 mA
3.0
3.3
3.6
IDD
regulated supply current
available in:
speech mode
I
line ≥ 11 mA
−
−
−
−3
mA
mA
speech mode at reduced
performance
I
line = 4 mA
−1
−
trickle mode
I
line = 0 mA;
−
−
100
nA
VCC discharging;
VDD = 1.2 V
1999 Nov 22
13
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
LED control (pin LEDC)
Iline(h)
highest line current for
ILEDC < 5 µA
−
−
−
13
82
−
−
−
mA
mA
µA
Iline(l)
lowest line current for
maximum ILEDC
ILEDC(max)
maximum available output
current from pin LEDC
470
Transmit stage (pins MIC+, MIC− and DTMF)
MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
Zi
input impedance
differential between
pins MIC+ and MIC−
−
−
68
−
−
kΩ
kΩ
dB
dB
dB
single-ended between
pins MIC+/MIC− and VEE
34
Gv(TX)
voltage gain from
pins MIC+/MIC− to pin LN
VMIC = 4 mV (RMS)
f = 300 to 3400 Hz
Tamb = −25 to +75 °C
43.2
−
44.2
±0.2
±0.3
45.2
−
∆Gv(TX)(f)
∆Gv(TX)(T)
voltage gain variation with
frequency referenced to 1 kHz
voltage gain variation with
temperature referenced to
25 °C
−
−
CMRR
common mode rejection ratio
−
80
−
−
−
−
dB
V
VLN(max)(rms) maximum sending signal
(RMS value)
Iline = 15 mA; THD = 2%
1.8
−
2
I
line = 4 mA; THD = 10%
0.45
−77
V
Vno(LN)
noise output voltage at pin LN psophometrically weighted
(P53 curve);
−
dBmp
pins MIC+/MIC− short
circuited through 200 Ω
DTMF AMPLIFIER (PIN DTMF)
Zi
input impedance
−
20
−
kΩ
Gv(DTMF)
voltage gain from pin DTMF to VDTMF = 20 mV (RMS);
24.9
25.9
26.9
dB
pin LN
MUTE = LOW
∆Gv(DTMF)(f) voltage gain variation with
f = 300 to 3400 Hz
−
−
±0.2
±0.4
−
−
dB
dB
frequency referenced to 1 kHz
∆Gv(DTMF)(T) voltage gain variation with
temperature referenced
to 25 °C
Tamb = −25 to +75 °C
Gv(ct)
voltage gain from pin DTMF to VDTMF = 20 mV (RMS);
−
−15.6
−
dB
pin QR (confidence tone)
RL = 150 Ω;
MUTE = LOW; VVCI = 0 V
1999 Nov 22
14
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Receive stage (pins IR, GAR, QR and VCI)
THE EARPIECE AMPLIFIER (PINS IR AND QR)
Zi
input impedance
−
22
−
kΩ
Gv(QR)
voltage gain from pin IR to
pin QR
VIR = 4 mV (RMS);
VVCI = 0 V
26.4
27.4
±0.2
±0.3
28.4
dB
∆Gv(QR)(f)
∆Gv(QR)(T)
voltage gain variation with
frequency referenced to 1 kHz
f = 300 to 3400 Hz
−
−
dB
dB
voltage gain variation with
temperature referenced to
25 °C
Tamb = −25 to +75 °C
−
−
∆Gv(QR)
voltage gain reduction range
external resistor connected
between
pins GAR and QR
−
−
6
−
−
−
dB
V
VQR(max)(rms) maximum receiving signal on
pin QR (RMS value)
IP = 0 mA; sine wave drive; 0.5
RL = 150 Ω; THD = 2%;
VVCI = VDD
0.6
0.9
−90
IP = 0 mA; sine wave drive; 0.8
RL = 450 Ω; THD = 2%;
VVCI = VDD
V
Vno(QR)(rms) noise output voltage at pin QR IR open circuit;
−
dBVp
(RMS value)
RL = 150 Ω; VVCI = 0 V;
psophometrically weighted
(P53 curve)
VVCI = VDD
−
−75
−
dBVp
VOLUME CONTROL (PIN VCI)
∆Gv(QR)max maximum increase in voltage
VIR = 4 mV (RMS);
VVCI = VDD
12
14.5
4.85
17
dB
dB
gain
∆Gv(QR)step step voltage gain
VIR = 4 mV (RMS)
3.85
5.85
Automatic gain control (pin AGC)
∆Gv(trx)
voltage gain control range for
microphone and earpiece
amplifiers w.r.t. Iline = 15 mA
Iline = 85 mA
−
6.0
−
dB
Istart
Istop
highest line current for
maximum gain
−
−
23
59
−
−
mA
mA
lowest line current for min. gain
Mute function (pin MUTE)
VIL
LOW-level input voltage
VEE − 0.4
−
VEE + 0.3
V
VIH
HIGH-level input voltage
input current
VEE + 1.5 −
VDD + 0.4 V
IMUTE
∆Gv(trx)(m)
−10
−2
−
µA
voltage gain reduction for:
microphone amplifier
earpiece amplifier
DTMF amplifier
MUTE = LOW
MUTE = LOW
MUTE = HIGH
−
−
−
80
80
80
−
−
−
dB
dB
dB
1999 Nov 22
15
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
TEST AND APPLICATION INFORMATION
R
prot
Cz
Rz
R
CC
D1
1N4004
D3
D2
D4
Dz
C
2.4
kΩ
emc
10 nF
24 Ω
V
AB
BA
d
619 Ω
10 V
C
VCC
100 µF
V
BC858
LN
SLPE
REG
IR
CC
LEDC
C
C
R
R
MIC−
MIC−
TX1
R
C
REG
ast1
MIC−
130 kΩ
R
TX3
4.7 µF
C
IR
MIC+
MIC+
TX2
MIC+
100 nF
C
R
TEA1111A
EAR
AGC
AGC
DTMF
QR
R
ast2
R
GARext
3.92 kΩ
C
10 µF
C
GAR
DTMF
earpiece
GAR
R
100 pF
1 nF
DTMF
ast3
220 nF
V
V
392 Ω
DD
EE
C
GARS
V
DD
R
R
R
bal1
130 Ω
SLPE
20 Ω
VCI
VCI
1
0
peripheral
supply
MUTE
VCI
C
VDD
2R
220 µF
FCA059
C
R
bal
bal2
820 Ω
V
EE
220 nF
MUTE
Fig.13 Basic application diagram.
1999 Nov 22
16
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
I
line
C
R
VCC
CC
619 Ω
100 µF
3 mA
24 Ω
2.4 kΩ
C
VDD
I
I
I
DD
220 µF
LN
CC
LN
V
V
DD
CC
10 µF
R
LEDC
IR
BC858
100
L
QR
µF
C
GAR
R
I
GARext
V
line
O
MIC−
GAR
TEA1111A
V
MIC
C
GARS
MIC+
DTMF
SLPE
V
REG
AGC
MUTE VCI
S1
EE
600 Ω
C
V
R
REG
4.7 µF
DTMF
SLPE
20 Ω
FCA060
VO
Voltage gain defined as Gv = 20 log
Microphone gain: S1 = open.
DTMF gain: S1 = closed.
; VI = VMIC or VDTMF.
-------
VI
Inputs not being tested should be open circuit.
Fig.14 Test circuit for defining transmit gains.
1999 Nov 22
17
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
I
C
line
R
VCC
CC
619 Ω
100 µF
3 mA
24 Ω
2.4 kΩ
C
VDD
I
I
I
DD
220 µF
LN
CC
LN
V
V
DD
V
CC
O
BC858
LEDC
IR
10 µF
R
L
QR
100
µF
C
GAR
R
GARext
MIC−
I
TEA1111A
line
GAR
C
GARS
MIC+
V
IR
DTMF
SLPE
220
nF
V
REG
AGC
MUTE VCI
S1
EE
600 Ω
C
V
R
REG
4.7 µF
DTMF
SLPE
E
VCI
20 Ω
FCA061
VO
Voltage gain defined as Gv = 20 log
Earpiece gain: S1 = open.
; VI = VIR or VDTMF.
-------
VI
Confidence tone: S1 = closed.
Inputs not being tested should be open circuit.
Fig.15 Test circuit for defining earpiece gains.
1999 Nov 22
18
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
R
CC
619 Ω
LN
V
V
DD
CC
IR
QR
MIC−
MIC+
DTMF
LEDC
GAR
VCI
TEA1111A
V
V
10 µF
I
DD
CC
DD
V
REG
AGC SLPE
MUTE
EE
C
R
REG
4.7 µF
SLPE
20 Ω
FCA062
Inputs not being tested should be open circuit.
Fig.16 Test circuit for defining regulated supply (VDD) performance in ringer and trickle modes.
1999 Nov 22
19
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
PACKAGE OUTLINE
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-23
97-05-22
SOT109-1
076E07S
MS-012AC
1999 Nov 22
20
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
SOLDERING
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Nov 22
21
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Nov 22
22
Philips Semiconductors
Product specification
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
NOTES
1999 Nov 22
23
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
465002/02/pp24
Date of release: 1999 Nov 22
Document order number: 9397 750 06482
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