TEA1733MT [NXP]
GreenChip SMPS control IC Adjustable overpower time-out; 的GreenChip开关电源控制IC可调的过载超时
| 型号： | TEA1733MT |
| 厂家： | 
NXP |
| 描述： | GreenChip SMPS control IC Adjustable overpower time-out |
| 文件： | 总20页 (文件大小：189K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TEA1733MT
GreenChip SMPS control IC
Rev. 1 — 4 February 2011
Preliminary data sheet
1. General description
The TEA1733MT is a low cost Switched Mode Power Supply (SMPS) controller IC
intended for flyback topologies. It operates in fixed frequency mode. Frequency jitter has
been implemented to reduce ElectroMagnetic Interference (EMI). Slope compensation is
integrated for Continuous Conduction Mode (CCM) operation.
The TEA1733MT IC includes OverPower Protection (OPP). This enables the controller to
operate under overpower situations for a limited amount of time.
Two pins, VINSENSE and PROTECT, are reserved for protection purposes. Input
UnderVoltage Protection (UVP) and OverVoltage Protection (OVP), output OVP and
OverTemperature Protection (OTP) can be implemented using a minimal number of
external components.
At low power levels the primary peak current is set to 25 % of the maximum peak current
and the switching frequency is reduced to limit switching losses. The combination of fixed
frequency operation at high output power and frequency reduction at low output power
provides high-efficiency over the total load range.
The TEA1733MT enables low-cost, highly efficient and reliable supplies for power
requirements up to 75 W to be designed easily and with a minimum number of external
components.
2. Features and benefits
2.1 Features
SMPS controller IC enabling low-cost applications
Large input voltage range (12 V to 30 V)
Very low supply current during start-up and restart (typically 10 μA)
Low supply current during normal operation (typically 0.55 mA without load)
Overpower or high/low line compensation
Adjustable overpower time-out
Adjustable overpower restart timer
Fixed switching frequency with frequency jitter to reduce EMI
Frequency reduction with fixed minimum peak current to maintain high-efficiency at
low output power levels
Slope compensation for CCM operation
Low and adjustable OverCurrent Protection (OCP) trip level
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
Adjustable soft start operation
Two protection inputs (e.g. for input UVP and OVP, OTP and output OVP)
IC overtemperature protection
3. Applications
All applications requiring efficient and cost-effective power supply solutions up to
75 W.
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
TEA1733MT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
2 of 20
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
5. Block diagram
V
ctrl(Ipeak)
400 mV
VCCstart
VCCstop
11 μA
D
Q
21 V
12 V
8
1
OPTIMER
VCC
overpower
2.5 V
driver
22 V
6 V
OPP switch
latch reset
5 V
clamp
latch
TEMPERATURE
PROTECTION
OTP
2
GND
restart
5.4 V
set
max
OSCILLATOR
MODULATION
clamp
OPP switch
δ
7 kΩ
frequency reduction
RESTART
CONTROL
107 μA
7
ANALOG
CONTROL
SLOPE
COMPENSATION
OPTIMER
1.2 V / 4.5 V
CTRL
power down
V
ctrl(Ipeak)
DRV
VCCstop
S
R
set
prothigh
32
μA
3
overload
DRIVER
Q
stop
driver
stop
S
R
Q
δ
max
0.50 V/0.80 V
6
overpower
PROTECT
COUNT
TO 8
protlow
highvin
lowvin
δ max prot
restart
δ max
107
μA
BLANK
δ max prot
highvin
lowvin
S
55
μA
soft start
LEB
3.52 V
restart
Q
VCCstart
power down
lowvin
4
ISENSE
V
R
ctrl(Ipeak)
OCP
0.72 V/0.94 V
5
protlow
soft start
VINSENSE
VINSENSE
OTP
OVERPOWER
CORRECTION
latch
prothigh
S
protlow
overload
stop
latch
Q
R
latch reset
DIGITAL CONTROL
001aan238
Fig 1. Block diagram
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
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GreenChip SMPS control IC
6. Pinning information
6.1 Pinning
1
2
3
4
8
7
6
5
VCC
GND
OPTIMER
CTRL
TEA1733MT
DRIVER
ISENSE
PROTECT
VINSENSE
001aan247
Fig 2. Pinning diagram SOT96-1 (SO8)
6.2 Pin description
Table 2.
Pin description
Symbol
VCC
Pin
1
Description
supply voltage
ground
GND
2
DRIVER
ISENSE
VINSENSE
PROTECT
CTRL
3
gate driver output
current sense input
4
5
input voltage protection input
general purpose protection input
control input
6
7
OPTIMER
8
overpower and restart timer
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
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GreenChip SMPS control IC
7. Functional description
7.1 General control
The TEA1733MT contains a flyback circuit controller, a typical configuration of which is
shown in Figure 3.
C1
R1
C2
TEA1733MT
R2
VINSENSE
PROTECT
ISENSE
DRIVER
GND
5
6
7
8
4
3
2
1
S1
R5
R3
R10
R4
CTRL
Θ
OPTIMER
R6
C6
VCC
Z1
C3
C4
R8
C5
R9
R7
001aan248
Fig 3. Typical configuration
7.2 Start-up and UnderVoltage LockOut (UVLO)
Initially, the capacitor on the VCC pin is charged from the high voltage mains via resistor
R3.
If VCC is lower than Vstartup, the IC current consumption is low (typically 10 μA). When VCC
reaches Vstartup the IC first waits for pin VINSENSE to reach the Vstart(VINSENSE) voltage
and for pin PROTECT to reach the Vdet(L)(PROTECT) voltage. When both levels are
reached, the IC charges the ISENSE pin to the Vstart(soft) level and starts switching. In a
typical application the supply voltage is taken over by the auxiliary winding of the
transformer.
If a protection is triggered the controller stops switching. Depending on the protection
triggered, the protection causes a restart or latches the converter to an off-state.
A restart caused by a protection rapidly charges the OPTIMER pin to 4.5 V (typical). The
TEA1733MT enters the Power-down mode until the OPTIMER pin discharges down to
1.2 V (typical). In Power-down mode, the IC consumes a very low supply current
(10 μA typical) and the VCC pin is clamped at 22 V (typical) by an internal clamp circuit.
When the voltage on pin OPTIMER drops below 1.2 V (typical) and the VCC pin voltage is
above the VCC start-up voltage (See Figure 4), the IC restarts.
When a latched protection is triggered, the TEA1733MT immediately enters Power-down
mode. The VCC pin is clamped to a voltage just above the latch protection reset voltage
(Vrst(latch) + 1 V).
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
5 of 20
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
V
V
startup
th(UVLO)
V
CC
soft start
soft start
ISENSE
V
det(H)(VINSENSE)
VINSENSE
V
V
det(H)(PROTECT)
det(L)(PROTECT)
PROTECT
OPTIMER
4.5 V
1.2 V
V
O
(power down)
protection
starting
converter
normal
operation
charging VCC
capacitor
restart
014aaa929
Fig 4. Start-up sequence, normal operation and restart sequence
When the voltage on pin VCC drops below the Vth(UVLO) level during normal operation, the
controller stops switching. A VCC undervoltage causes the TEA1733MT to be latched in
the off-state.
7.3 Supply management
All internal reference voltages are derived from a temperature compensated on-chip band
gap circuit. Internal reference currents are derived from a trimmed and temperature
compensated current reference circuit.
7.4 Input voltage detection (VINSENSE pin)
In a typical application the mains input voltage can be detected by the VINSENSE pin.
Switching will not take place until the voltage on VINSENSE has reached the
V
start(VINSENSE) voltage (typically 0.94 V).
When the VINSENSE voltage drops below Vdet(L)(VINSENSE) (typically 0.72 V) or exceeds
det(H)(VINSENSE) (typically 3.52 V), the converter stops switching and performs a restart.
V
If pin VINSENSE is left open or disconnected, the pin is pulled up by the internal 20 nA
(typical) current source to reach the Vdet(H)(VINSENSE) level. This triggers a restart
protection.
An internal clamp of 5.2 V (typical) protects this pin from excessive voltages.
7.5 Protection input (PROTECT pin)
Pin PROTECT is a general purpose input pin, which can be used to switch off the
converter (latched protection). The converter is stopped when the voltage on this pin is
pulled above Vdet(H)(PROTECT) (typically 0.8 V) or below Vdet(L)(PROTECT) (typically 0.5 V). A
current of 32 μA (typical) flows out of the chip when the pin voltage is at the
V
det(L)(PROTECT) level. A current of 107 μA (typical) flows into the chip when the pin voltage
is at the Vdet(H)(PROTECT) level.
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
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The PROTECT input can be used to create an overvoltage detection and OTP functions.
A small capacitor can be connected to the pin if the protections on this pin are not used.
An internal clamp of 4.1 V (typical) protects this pin from excessive voltages.
7.6 Duty cycle control (CTRL pin)
The output power of the converter is regulated by the CTRL pin. This pin is connected to
an internal 5.4 V supply using an internal 7 kΩ resistor.
The CTRL pin voltage sets the peak current which is measured using the ISENSE pin
(see Section 7.10). At low output power, the switching frequency is also reduced (see
Section 7.12). The maximum duty cycle is limited to 72 % (typical).
After eight consecutive converter strokes at the maximum duty cycle, restart protection is
activated. Typically, this will happen when the mains input supply voltage is removed.
7.7 Slope compensation (CTRL pin)
A slope compensation circuit is integrated in the IC for CCM. Slope compensation
guarantees stable operation for duty cycles greater than 50 %.
7.8 Overpower timer (OPTIMER pin)
If the OPTIMER pin is connected to capacitor C4 (see Figure 3), a temporary overload
situation is allowed. Vctrl(Ipeak) (see Figure 1) is set by pin CTRL. When Vctrl(Ipeak) is above
400 mV, the IIO(OPTIMER) current (11 μA typical) is sourced from the OPTIMER pin. If the
voltage on the OPTIMER pin reaches the Vprot(OPTIMER) voltage (2.5 V typical) the
OverPower Protection (OPP) is triggered (see Figure 5).
When the Vprot(OPTIMER) voltage is reached, the TEA1733MT is latched in the off-state.
If the overload is removed before the Vprot(OPTIMER) voltage is reached, the converter will
continue switching.
I
O
V
O
400 mV
V
ISENSE
V
prot(OPTIMER)
V
OPTIMER
normal
load
high load
high load
protection
014aaa968
Fig 5. Overpower delay: latched
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
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7.9 Current mode control (ISENSE pin)
Current mode control is used for its good line regulation.
The primary current is sensed by the ISENSE pin across an external resistor R9 (see
Figure 3) and compared with an internal control voltage. The internal control voltage is
proportional to the CTRL pin voltage (see Figure 6).
014aaa931
0.6
V
sense(max)
(V)
0.4
frequency
reduction
0.2
0
0
1
2
3
4
V
(V)
CTRL
Fig 6. Peak current control
Leading edge blanking prevents false triggering due to capacitive discharge when
switching on the external power switch (see Figure 7).
t
leb
V
sense(max)
V
ISENSE
t
014aaa932
Fig 7. Leading edge blanking
7.10 Overpower or high/low line compensation (VINSENSE and
ISENSE pins)
The overpower compensation function can be used to realize a maximum output power
which is nearly constant over the full input mains.
The overpower compensation circuit measures the input voltage on the VINSENSE pin
and outputs a proportionally dependent current on the ISENSE pin. The DC voltage
across the soft start resistor limits the maximum peak current on the current sense resistor
(see Figure 8).
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
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GreenChip SMPS control IC
2
1.7
I
ISENSE
(μA)
0.68
1
2
3
4
V
(V)
VINSENSE
014aaa933
Fig 8. Overpower compensation
At low output power levels the overpower compensation circuit is switched off.
7.11 Soft start-up (ISENSE pin)
A soft start is made to prevent audible noise during start-up or a restart condition. Before
the converter starts, the soft start capacitor C6 (see Figure 3) on the ISENSE pin is
charged. When the converter starts switching, the primary peak current slowly increases
as the soft start capacitor discharges through the soft start resistor (R6, see Figure 3).
The soft start time constant is set by the soft start capacitor value chosen. The soft start
resistor value must also be taken into account, but this value is typically defined by the
overpower compensation (see Section 7.10).
7.12 Low power operation
In low power operation switching losses are reduced by lowering the switching frequency.
The converter switching frequency is reduced and the peak current is set to 25 % of the
maximum peak current (see Figure 6 and Figure 9).
f
sw
(kHz)
switching
frequency
1
2
V
(V)
CTRL
014aaa934
Fig 9. Frequency control
TEA1733MT
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Preliminary data sheet
Rev. 1 — 4 February 2011
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7.13 Driver (DRIVER pin)
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
typically −300 mA and a current sink capability of typically 750 mA. This allows for a fast
turn-on and turn-off of the power MOSFET for efficient operation.
7.14 OverTemperature Protection (OTP)
Integrated temperature protection ensures the IC stops switching if the junction
temperature exceeds the thermal shutdown temperature limit.
OTP is a latched protection and it can be reset by removing the voltage on pin VCC.
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
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8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Voltages
VCC
Parameter
Conditions
Min
Max
Unit
supply voltage
continuous
t < 100 ms
−0.4
-
+30
35
V
V
V
V
V
V
VVINSENSE
VPROTECT
VCTRL
voltage on pin VINSENSE current limited
voltage on pin PROTECT current limited
voltage on pin CTRL
−0.4
−0.4
−0.4
−0.4
+5.5
+5
+5
VIO(OPTIMER)
input/output voltage on pin
OPTIMER
+5
VISENSE
Currents
ICC
voltage on pin ISENSE
current limited
−0.4
+5
V
supply current
δ < 10 %
-
0.4
+1
A
II(VINSENSE)
input current on pin
VINSENSE
−1
mA
II(PROTECT)
input current on pin
PROTECT
−1
+1
mA
ICTRL
IISENSE
IDRIVER
General
Ptot
current on pin CTRL
current on pin ISENSE
current on pin DRIVER
−3
0
mA
mA
A
−10
−0.4
+1
+1
δ < 10 %
total power dissipation
storage temperature
junction temperature
Tamb < 75 °C
-
0.5
W
Tstg
−55
−40
+150
+150
°C
°C
Tj
ESD
VESD
electrostatic discharge
voltage
class 1
[1]
[2]
human body
model
-
4000
V
machine model
-
-
300
750
V
V
charged device
model
[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[2] Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor.
9. Thermal characteristics
Table 4.
Thermal characteristics
Symbol Parameter
Conditions
Typ Unit
Rth(j-a)
Rth(j-c)
thermal resistance from junction to ambient in free air; JEDEC test
board
150 K/W
thermal resistance from junction to case
in free air; JEDEC test
board
79
K/W
TEA1733MT
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Preliminary data sheet
Rev. 1 — 4 February 2011
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10. Characteristics
Table 5.
amb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Characteristics
T
Symbol Parameter
Supply voltage management (pin VCC
Conditions
Min
Typ
Max
Unit
)
Vstartup
start-up voltage
18.6
11.2
20.6
12.2
22.6
13.2
V
V
Vth(UVLO)
undervoltage lockout
threshold voltage
Vclamp(VCC)
clamp voltage on pin VCC activated during restart
-
-
Vstartup + 1
-
V
V
activated during latched
protection
Vrst(latch) + 1 -
Vhys
hysteresis voltage
Vstartup − Vth(UVLO)
VCC < Vstartup
8
9
10
V
ICC(startup)
ICC(oper)
Vrst(latch)
start-up supply current
operating supply current
latched reset voltage
5
10
0.55
5
15
0.65
6
μA
mA
V
no load on pin DRIVER
0.45
4
Input voltage sensing (pin VINSENSE)
Vstart(VINSENSE)
start voltage on pin
VINSENSE
detection level
0.89
0.68
3.39
-
0.94
0.72
3.52
−20
5.2
0.99
0.76
3.65
-
V
Vdet(L)(VINSENSE) LOW-level detection
voltage on pin VINSENSE
V
Vdet(H)(VINSENSE) HIGH-level detection
voltage on pin VINSENSE
V
IO(VINSENSE)
output current on pin
VINSENSE
nA
V
Vclamp(VINSENSE) clamp voltage on pin
VINSENSE
II(VINSENSE) = 50 μA
-
-
Protection input (pin PROTECT)
Vdet(L)(PROTECT)
Vdet(H)(PROTECT)
IO(PROTECT)
LOW-level detection
voltage on pin PROTECT
0.47
0.75
0.50
0.8
0.53
0.85
V
V
HIGH-level detection
voltage on pin PROTECT
output current on pin
PROTECT
VVINSENSE = Vlow(PROTECT)
VVINSENSE = Vhigh(PROTECT)
II(PROTECT) = 200 μA
−34
87
−32
107
4.1
−30
127
4.7
μA
μA
V
[1]
Vclamp(PROTECT)
clamp voltage on pin
PROTECT
3.5
Peak current control (pin CTRL)
VCTRL
voltage on pin CTRL
for minimum flyback peak
current
1.5
3.4
5
1.8
3.9
7
2.1
4.3
9
V
for maximum flyback peak
current
V
Rint(CTRL)
IO(CTRL)
internal resistance on pin
CTRL
kΩ
output current on pin CTRL VCTRL = 1.4 V
VCTRL = 3.7 V
−0.7
−0.5
−0.2
−0.3
mA
mA
−0.28
−0.12
TEA1733MT
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
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Table 5.
Characteristics …continued
Tamb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Pulse width modulator
fosc
oscillator frequency
85.5
210
4
91.5
280
5
97.5
350
6
kHz
Hz
fmod
Δfmod
modulation frequency
modulation frequency
variation
kHz
δmax
maximum duty cycle
68.5
-
72
-
79
8
%
Ncy(sw)δmax
number of switching cycles
with maximum duty cycle
Vstart(red)f
frequency reduction start
voltage
pin CTRL
pin CTRL
1.5
1.8
2.1
V
V
Vδ(zero)
zero duty cycle voltage
1.25
1.55
1.85
Overpower protection (pin OPTIMER)
Vprot(OPTIMER)
protection voltage on pin
OPTIMER
2.4
2.5
2.6
V
Iprot(OPTIMER)
protection current on pin
OPTIMER
no overpower situation
overpower situation
100
150
200
μA
μA
−12.2
−10.7
−9.2
Restart timer (pin OPTIMER)
Vrestart(OPTIMER) restart voltage on pin
low level
0.8
1.2
1.6
4.9
−87
V
OPTIMER
high level
4.1
4.5
V
Irestart(OPTIMER)
restart current on pin
OPTIMER
charging OPTIMER
capacitor
−127
−107
μA
discharging OPTIMER
capacitor
−0.1
0
0.1
μA
Current sense (pin ISENSE)
Vsense(max)
maximum sense voltage
ΔV/Δt = 50 mV/μs;
0.48
0.50
370
20
0.51
0.53
400
33
0.54
0.56
430
46
V
VVINSENSE = 0.78 V
ΔV/Δt = 200 mV/μs;
V
VVINSENSE = 0.78 V
Vth(sense)opp
ΔVISENSE/Δt
tleb
overpower protection sense
threshold voltage
mV
mV/μs
ns
slope compensation
voltage on pin ISENSE
ΔV/Δt = 50 mV/μs
leading edge blanking time
250
300
350
Overpower compensation (pin VINSENSE and pin ISENSE)
Iopc(ISENSE)
overpower compensation
current on pin ISENSE
VVINSENSE = 1 V;
Vsense(max) > 400 mV
-
-
0.28
1.7
-
-
μA
μA
VVINSENSE=3 V;
Vsense(max) > 400 mV
Soft start (pin ISENSE)
Istart(soft)
soft start current
−63
−55
−47
μA
Vstart(soft)
soft start voltage
VCTRL = 4 V; enable
voltage
-
Vsense(max)
-
V
Rstart(soft)
soft start resistance
12
-
-
kΩ
TEA1733MT
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Preliminary data sheet
Rev. 1 — 4 February 2011
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TEA1733MT
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Table 5.
Characteristics …continued
Tamb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Driver (pin DRIVER)
Isource(DRIVER) source current on pin
DRIVER
Parameter
Conditions
Min
Typ
Max
Unit
VDRIVER = 2 V
-
−0.3
−0.25
A
Isink(DRIVER)
sink current on pin DRIVER VDRIVER = 2 V
VDRIVER = 10 V
0.25
0.6
9
0.3
-
A
A
V
0.75
10.5
-
VO(DRIVER)max
maximum output voltage on
pin DRIVER
12
Temperature protection
Tpl(IC) IC protection level
temperature
130
140
150
°C
[1] The clamp voltage on the PROTECT pin is lowered when the IC is in power-down (latched or restart protection).
TEA1733MT
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Preliminary data sheet
Rev. 1 — 4 February 2011
14 of 20
TEA1733MT
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11. Application information
A power supply with the TEA1733MT is a flyback converter operating in Continuous
conduction mode (see Figure 10).
Capacitor C5 buffers the IC supply voltage, which is powered via resistor R3 at start-up
and via the auxiliary winding during normal operation. Sense resistor R9 converts the
current through the MOSFET S1 into a voltage on pin ISENSE. The value of R9 defines
the maximum primary peak current on MOSFET S1. Resistor R7 reduces the peak
current to capacitor C5.
In the example shown in Figure 10, the PROTECT pin is used for OVP and OTP. The
OVP level is set by diode Z1 to VCC = 25.8 V. The OTP level is set by Negative
Temperature Coefficient (NTC) resistor R4. The VINSENSE pin is used for mains voltage
detection and resistors R1 and R2 set the start voltage to about 80 V (AC). The overpower
protection time is defined by capacitor C4 at 60 ms.
The restart time is defined by capacitor C4 and resistor R8 at 0.5 s.
Resistor R6 and capacitor C6 define the soft start time. Resistor R5 prevents the soft start
capacitor C6 from being charged during normal operation caused by negative voltage
spikes across the current sense resistor R9.
Capacitor C3 reduces noise on the CTRL pin.
C1
68 μF
R1
10 MΩ
C2
100 nF
R2
82 kΩ
TEA1733MT
R5
VINSENSE
PROTECT
ISENSE
DRIVER
GND
5
6
7
8
4
3
2
1
S1
470 Ω
R10
R3
1 MΩ
10 Ω
R4
200 kΩ
CTRL
R6
Θ
OPTIMER
22 kΩ
C6
VCC
Z1
25 V
C3
1 nF
R8
C4
220 nF
C5
220 nF
R9
2.2 MΩ
4.7 μF
0.25 Ω
R7
10 Ω
001aan249
Fig 10. Typical application
TEA1733MT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
15 of 20
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 11. Package outline SOT96-1 (SO8)
TEA1733MT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
16 of 20
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
13. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1733MT v.1
20110204
Preliminary data sheet
-
-
TEA1733MT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
17 of 20
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
14.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
14.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
TEA1733MT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
18 of 20
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
GreenChip — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TEA1733MT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 1 — 4 February 2011
19 of 20
TEA1733MT
NXP Semiconductors
GreenChip SMPS control IC
16. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
2.1
3
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4
5
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 5
General control. . . . . . . . . . . . . . . . . . . . . . . . . 5
Start-up and UnderVoltage LockOut (UVLO) . . 5
Supply management. . . . . . . . . . . . . . . . . . . . . 6
Input voltage detection (VINSENSE pin) . . . . . 6
Protection input (PROTECT pin) . . . . . . . . . . . 6
Duty cycle control (CTRL pin). . . . . . . . . . . . . . 7
Slope compensation (CTRL pin). . . . . . . . . . . . 7
Overpower timer (OPTIMER pin) . . . . . . . . . . . 7
Current mode control (ISENSE pin) . . . . . . . . . 8
Overpower or high/low line compensation
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
(VINSENSE and ISENSE pins) . . . . . . . . . . . . 8
Soft start-up (ISENSE pin) . . . . . . . . . . . . . . . . 9
Low power operation . . . . . . . . . . . . . . . . . . . . 9
Driver (DRIVER pin) . . . . . . . . . . . . . . . . . . . . 10
OverTemperature Protection (OTP) . . . . . . . . 10
7.11
7.12
7.13
7.14
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics . . . . . . . . . . . . . . . . . 11
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
9
10
11
12
13
14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
14.1
14.2
14.3
14.4
15
16
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 February 2011
Document identifier: TEA1733MT
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